Heat dissipation type precision mold for manufacturing circuit board

Abstract

The utility model discloses a heat dissipation type precision mold for manufacturing a circuit board, which comprises a lower mold, the bottom of the lower mold is fixedly connected with a lower bottom plate, the top of the lower bottom plate is fixedly connected with a limiting shaft, the outer side of the limiting shaft is movably connected with an upper bottom plate, and the top of the upper bottom plate is respectively provided with a through hole and a heat dissipation groove. The lower bottom plate and the upper bottom plate are both fixedly connected with a heat dissipation body through heat dissipation grooves, the interior of the heat dissipation body is fixedly connected with a heat dissipation fan and a semiconductor chilling plate, the bottom of the upper bottom plate is fixedly connected with an upper mold, the front face of the lower mold and the front face of the upper mold are both provided with installation grooves, and the inner side of the lower mold is movably connected with a lower clamping plate through the installation groove. According to the heat dissipation type precision mold for circuit board manufacturing, the heat dissipation effect is improved through the heat dissipation body, the heat dissipation fan and the semiconductor chilling plate, the mold does not need to be overall disassembled and replaced through the installation groove, the lower clamping plate, the lower mold base, the upper clamping plate and the upper mold base, and the replacement difficulty and the production cost are further reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board molds, in particular to a heat dissipation type precision mold for manufacturing circuit boards. Background Art

[0002] A printed circuit board (PCB), also known as a printed circuit board (FPC), or a flexible printed circuit board (FPC), is a highly reliable and flexible printed circuit board made from polyimide or polyester film. It features high wiring density, light weight, thinness, and excellent flexibility. Therefore, precision mold-making machinery is crucial, and precision molds are essential in the production of PCBs.

[0003] After searching, Chinese patent announcement number CN209676609U discloses a heat dissipation precision mold for circuit board manufacturing, including a main body, a mold slot and a fixed plate. Wheels are passed through the interior of the main body, and a rolling fit device is provided between the main body and the wheels. Nut columns are provided on both sides of the wheels. The mold slot is fixed to the top of the main body, and the mold slot and the main body are welded. A hydraulic rod is provided inside the mold slot, and a soft board is connected to the right side of the hydraulic rod. The fixed plate is installed above the mold slot, and a fixed block is installed on the outer surface of the fixed plate. A telescopic frame is connected to the left side of the fixed block, and the fixed block and the telescopic frame are connected by screws. The heat dissipation precision mold for circuit board manufacturing is provided with a hydraulic rod, which makes the soft board more firmly fixed, avoiding loosening and deviation during the production process. At the same time, the soft board can play a protective role for the circuit board, avoiding damage to the circuit board caused by excessive clamping.

[0004] However, during the use of the existing heat dissipation precision mold for circuit board manufacturing, although the heat dissipation fan can play a role in heat dissipation, the heat dissipation effect of this heat dissipation method is poor, resulting in the precision mold being unable to quickly reduce the temperature during use. In addition, since different circuit boards have different sizes and shapes, when different circuit boards need to be processed, the staff needs to replace the entire mold, and the core components cannot be replaced, resulting in great difficulty in replacement and increasing the production cost of the enterprise. Therefore, it is very necessary to design a heat dissipation precision mold for circuit board manufacturing. Utility Model Content

[0005] The main purpose of the utility model is to provide a heat dissipation precision mold for circuit board manufacturing, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A heat dissipation precision mold for manufacturing circuit boards, comprising a lower mold, the bottom of the lower mold is fixedly connected to a lower base plate, the top of the lower base plate is fixedly connected to a limiting shaft, the outer side of the limiting shaft is movably connected to an upper base plate, the top of the upper base plate is respectively provided with a through opening and a heat dissipation groove, the lower base plate and the upper base plate are both fixedly connected to a heat dissipation body through the heat dissipation groove, the interior of the heat dissipation body is respectively fixedly connected to a heat dissipation fan and a semiconductor refrigeration plate, the bottom of the upper base plate is fixedly connected to an upper mold, the front sides of the lower mold and the upper mold are both provided with mounting grooves, the inner side of the lower mold is movably connected to a lower clamping plate through the mounting groove, the top of the lower clamping plate is fixedly connected to a lower mold base, the inner side of the upper mold is movably connected to an upper clamping plate through the mounting groove, and the bottom of the upper clamping plate is fixedly connected to an upper mold base.

[0008] In order to make it easier for staff to adjust the position of the fixed block, as a heat dissipation precision mold for circuit board manufacturing of the utility model, both sides of the lower mold and the upper mold are threaded with adjustment bolts, and one end of the adjustment bolt is movably connected to the fixed block.

[0009] In order to enable the fixing block to play the role of fixing and loosening, as a heat dissipation precision mold for circuit board manufacturing of the utility model, a movable opening is opened on the inner side of the installation groove, and the movable opening is movably connected to the fixing block.

[0010] In order to prevent dust from entering the heat dissipation body and ensure heat dissipation efficiency, the utility model is a heat dissipation precision mold for circuit board manufacturing. The inner side of the heat dissipation body is fixedly connected to a heat dissipation net, which has a mesh structure.

[0011] In order to make the lower mold and the upper mold only able to be separated and combined up and down, as a heat dissipation precision mold for circuit board manufacturing of the utility model, four limit shafts and through ports are provided, the diameter of the limit shaft is adapted to the inner diameter of the through port, and the limit shaft is movably connected to the through port.

[0012] In order to make the precision mold more sturdy and durable, as a heat dissipating precision mold for circuit board manufacturing of the utility model, the lower mold and the upper mold are both made of metal materials, the outer surfaces of the lower mold and the upper mold are smooth, and the shapes of the lower mold and the upper mold are the same.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. In the utility model, by providing a heat dissipation body, a heat dissipation fan and a semiconductor refrigeration sheet, when using a heat dissipation type precision mold for circuit board manufacturing, when the precision mold generates heat after long-term use, the staff starts the heat dissipation fan and the semiconductor refrigeration sheet in the heat dissipation body. At this time, the cooling surface of the semiconductor refrigeration sheet will be cooled. Because the cooling surface is attached to the lower mold and the upper mold, the heat will be neutralized by the cold air, thereby playing a cooling role. At the same time, the heat dissipation fan emits suction, which will absorb the heat emitted by the heating surface of the semiconductor refrigeration sheet and the lower mold and the upper mold and discharge it through the heat dissipation net, thereby improving the heat dissipation effect of the heat dissipation type precision mold for circuit board manufacturing.

[0015] 2. In the utility model, through the provision of the mounting groove, lower card plate, lower die base, upper card plate and upper die base, when processing circuit boards of different shapes and sizes, the staff rotates the adjusting bolt, and the adjusting bolt drives the fixed block to retract into the movable opening, and then the staff pushes the lower die base and the upper die base outward. At this time, the lower card plate and the upper card plate can be moved out of the mounting groove. At this time, the staff will install the adapted lower die base and the upper die base in the reverse order to replace them. Therefore, there is no need to disassemble and replace the entire mold, and it also reduces the difficulty of replacement and production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a cross-sectional view of the heat dissipation body of the utility model;

[0018] Figure 3 This is a schematic diagram of the partial structure of the lower mold of the utility model;

[0019] Figure 4 It is a schematic diagram of the partial structure of the upper mold of the utility model.

[0020] In the figure: 1. Lower base plate; 2. Lower mold; 3. Mounting groove; 4. Movable opening; 5. Fixed block; 6. Adjusting bolt; 7. Lower clamping plate; 8. Lower mold base; 9. Limiting shaft; 10. Upper base plate; 11. Through opening; 12. Heat dissipation groove; 13. Heat dissipation body; 1301. Heat dissipation fan; 1302. Semiconductor refrigeration plate; 14. Heat dissipation net; 15. Upper mold; 16. Upper clamping plate; 17. Upper mold base. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example

[0023] like Figure 1-4 As shown, a heat dissipation precision mold for circuit board manufacturing includes a lower mold 2, the bottom of the lower mold 2 is fixedly connected to the lower base plate 1, the top of the lower base plate 1 is fixedly connected to the limiting shaft 9, the outer side of the limiting shaft 9 is movably connected to the upper base plate 10, the top of the upper base plate 10 is respectively provided with a through opening 11 and a heat dissipation groove 12, the lower base plate 1 and the upper base plate 10 are both fixedly connected to the heat dissipation body 13 through the heat dissipation groove 12, the interior of the heat dissipation body 13 is respectively fixedly connected to a heat dissipation fan 1301 and a semiconductor refrigeration plate 1302, the bottom of the upper base plate 10 is fixedly connected to an upper mold 15, the front of the lower mold 2 and the upper mold 15 are both provided with an installation groove 3, the inner side of the lower mold 2 is movably connected to the lower card plate 7 through the installation groove 3, the top of the lower card plate 7 is fixedly connected to the lower mold base 8, the inner side of the upper mold 15 is movably connected to the upper card plate 16 through the installation groove 3, and the bottom of the upper card plate 16 is fixedly connected to the upper mold base 17.

[0024] During specific use, by starting the heat dissipation fan 1301 and the semiconductor refrigeration plate 1302 in the heat dissipation body 13, the cooling surface of the semiconductor refrigeration plate 1302 will be cooled. Because the cooling surface is attached to the lower mold 2 and the upper mold 15, the heat will be neutralized by the cold air, thereby playing a cooling role. At the same time, the heat dissipation fan 1301 emits suction, which will absorb the heat emitted by the heating surface of the semiconductor refrigeration plate 1302 and the lower mold 2 and the upper mold 15 and discharge it through the heat dissipation net 14.

[0025] In this embodiment, both sides of the lower mold 2 and the upper mold 15 are threadedly connected with adjusting bolts 6 , and one end of the adjusting bolts 6 is movably connected to a fixing block 5 .

[0026] During specific use, by rotating the adjusting bolt 6, the adjusting bolt 6 drives the fixing block 5 to retract into or move out of the movable opening 4, thereby playing the role of locking and unlocking.

[0027] In this embodiment, a movable opening 4 is formed on the inner side of the installation groove 3 , and the movable opening 4 is movably connected to the fixing block 5 .

[0028] During specific use, the movable opening 4 facilitates the movement of the fixing block 5 and can also be stored.

[0029] In this embodiment, a heat dissipation net 14 is fixedly connected to the inner side of the heat dissipation body 13 , and the heat dissipation net 14 has a mesh structure.

[0030] During specific use, the heat dissipation net 14 can prevent dust from entering the heat dissipation body 13 while ensuring heat dissipation efficiency.

[0031] In this embodiment, four limiting shafts 9 and four through-holes 11 are provided. The diameter of the limiting shaft 9 is adapted to the inner diameter of the through-hole 11 , and the limiting shaft 9 is movably connected to the through-hole 11 .

[0032] During specific use, the lower mold 2 and the upper mold 15 can only be separated and combined up and down.

[0033] In this embodiment, the lower mold 2 and the upper mold 15 are both made of metal materials. The outer surfaces of the lower mold 2 and the upper mold 15 are smooth, and the lower mold 2 and the upper mold 15 have the same shape.

[0034] During specific use, the lower mold 2 and the upper mold 15 made of metal materials are more durable and less prone to damage.

[0035] Working principle: When using heat-dissipating precision molds for circuit board manufacturing, when the precision molds emit heat after long-term use, the staff starts the heat dissipation fan 1301 and the semiconductor refrigeration plate 1302 in the heat dissipation body 13. At this time, the cooling surface of the semiconductor refrigeration plate 1302 will be cooled. Because the cooling surface is attached to the lower mold 2 and the upper mold 15, the heat will be neutralized by the cold air, thereby playing a cooling role. At the same time, the heat dissipation fan 1301 emits suction, which will absorb the heat emitted by the heating surface of the semiconductor refrigeration plate 1302 and the lower mold 2 and the upper mold 15 and discharge it through the heat dissipation net 14. When processing circuit boards of different shapes and sizes, the staff turns the adjusting bolt 6, and the adjusting bolt 6 drives the fixed block 5 to shrink into the movable opening 4, and then the staff pushes the lower mold base 8 and the upper mold base 17 outward. At this time, the lower card plate 7 and the upper card plate 16 can be moved out of the installation slot 3. At this time, the staff will install the matching lower mold base 8 and the upper mold base 17 in the reverse order to replace them.

[0036] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation precision mold for manufacturing circuit boards, comprising a lower mold (2), characterized in that: The bottom of the lower mold (2) is fixedly connected to a lower base plate (1), the top of the lower base plate (1) is fixedly connected to a limiting shaft (9), the outer side of the limiting shaft (9) is movably connected to an upper base plate (10), the top of the upper base plate (10) is respectively provided with a through opening (11) and a heat dissipation groove (12), the lower base plate (1) and the upper base plate (10) are both fixedly connected to a heat dissipation body (13) through the heat dissipation groove (12), and the interior of the heat dissipation body (13) is respectively fixedly connected to a heat dissipation fan (1301) and a semiconductor device. The cold plate (1302) is fixedly connected to the bottom of the upper base plate (10) with an upper mold (15), and the front faces of the lower mold (2) and the upper mold (15) are both provided with mounting grooves (3). The inner side of the lower mold (2) is movably connected to a lower clamping plate (7) through the mounting groove (3), and the top of the lower clamping plate (7) is fixedly connected to a lower mold base (8). The inner side of the upper mold (15) is movably connected to an upper clamping plate (16) through the mounting groove (3), and the bottom of the upper clamping plate (16) is fixedly connected to an upper mold base (17).

2. The heat dissipation precision mold for circuit board manufacturing according to claim 1, characterized in that: Both sides of the lower mold (2) and the upper mold (15) are threadedly connected with an adjusting bolt (6), and one end of the adjusting bolt (6) is movably connected to a fixing block (5).

3. The heat dissipation precision mold for circuit board manufacturing according to claim 1, characterized in that: A movable opening (4) is provided on the inner side of the installation groove (3), and the movable opening (4) is movably connected to the fixing block (5).

4. The heat dissipation precision mold for circuit board manufacturing according to claim 1, characterized in that: A heat dissipation net (14) is fixedly connected to the inner side of the heat dissipation body (13), and the heat dissipation net (14) is a mesh structure.

5. The heat dissipation precision mold for circuit board manufacturing according to claim 1, characterized in that: Four of the limiting shafts (9) and the through openings (11) are provided. The diameter of the limiting shaft (9) is adapted to the inner diameter of the through opening (11). The limiting shaft (9) and the through opening (11) are movably connected.

6. The heat dissipation precision mold for circuit board manufacturing according to claim 1, characterized in that: The lower mold (2) and the upper mold (15) are both made of metal materials. The outer surfaces of the lower mold (2) and the upper mold (15) are smooth, and the shapes of the lower mold (2) and the upper mold (15) are the same.

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