CCD (Charge Coupled Device) visual positioning inter-layer precision fusion welding device

Abstract

The utility model relates to the technical field of multilayer circuit board welding, in particular to a CCD (Charge Coupled Device) visual positioning inter-layer precision fusion welding device, which comprises a first processing table and CCD visual dispensing equipment, a hydraulic device is arranged at the side end of a fixed plate, an adjusting plate is arranged at the tail end of a hydraulic rod of the hydraulic device, and the adjusting plate is arranged on the first processing table. A sliding groove is formed in the side end of the adjusting plate block, clamping plates are slidably installed in the sliding groove, a circuit board is clamped between the clamping plates, a second electric push rod is installed on the inner wall of the side end of the adjusting plate block, an extrusion plate is installed at the tail end of a piston rod of the second electric push rod, and third electric push rods which are symmetrically distributed are installed at the lower end of the first machining table. A fixing rod is installed at the tail end of a piston rod of the third electric push rod, and an electric heater is installed at the tail end of the fixing rod. The multi-layer circuit board bonding device has the advantage that the bonding effect of the multi-layer circuit board is ensured by heating and melting the solder on each layer of single circuit board and then pressing and bonding.

Description

Technical Field

[0001] The utility model relates to the technical field of multi-layer circuit board welding, in particular to a CCD visual positioning high-level precision welding device. Background Art

[0002] A multilayer circuit board is a three-dimensional system formed by stacking multiple conductive layers on a single substrate. This design effectively increases the board's conductivity, reduces signal transmission delays, and improves the performance of electronic products. Multilayer board welding involves melting and bonding multiple circuit boards with a solder material (such as solder) that cools to create a secure connection.

[0003] When soldering multilayer printed circuit boards, the outer side of the soldering plate is usually heated to melt the solder on the inner core board, thereby bonding multiple circuit boards into a multilayer board. However, heating from the outer layer can easily cause the outer core board to burn, and the inner core board is not fully heated and bonded, which causes inconvenience in the processing of multilayer printed circuit boards. Utility Model Content

[0004] The purpose of the utility model is to provide a CCD visual positioning high-precision welding device, which has the advantages of heating and melting the solder on each layer of a single circuit board and then pressing and bonding it, thereby ensuring the bonding effect of the multi-layer circuit board, and solving the problems raised by the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a CCD vision positioning high-level precision welding device, comprising a first processing table and a CCD vision dispensing device, a rectangular opening being opened at the upper end of the first processing table, and symmetrically distributed fixed plates are installed on both sides of the upper end of the first processing table at the rectangular opening, the side ends of the fixed plates are installed with hydraulic equipment, and the end of the hydraulic rod of the hydraulic equipment is installed with an adjustment plate, the side ends of the adjustment plates are provided with sliding grooves, and a clamping plate is slidably installed in the sliding grooves, and a circuit board is clamped between the clamping plates, a second electric push rod is installed on the inner wall of the side end of the adjustment plate, and an extrusion plate is installed at the end of the piston rod of the second electric push rod, and a third electric push rod is installed at the lower end of the first processing table, and a fixed rod is installed at the end of the piston rod of the third electric push rod, and an electric heater is installed at the end of the fixed rod.

[0006] When using the CCD vision positioning high-level precision welding device of the utility model,

[0007] Place the circuit board on the placement board, control the CCD vision dispensing equipment through the CCD vision control system, the first electric push rod works to make the CCD vision positioning dispensing machine descend, and the CCD vision positioning dispensing machine adds solder glue to the circuit board. During this period, the circuit board can be moved left and right by the first lead screw, and the CCD vision positioning dispensing machine can be moved forward and backward by the second lead screw to cooperate with the addition of solder glue. The dispensing position is monitored by the CCD vision sensor. Then, the multiple circuit boards with added solder adhesive are placed between the clamping plates, and the adjustment plates are moved close to each other by the hydraulic equipment, so that the circuit boards are clamped and fixed by the clamping plates. The piston rod is shortened by the third electric push rod, so that the electric heater can be raised between the circuit boards, and the adhesive solder can be heated and melted by the electric heater. After heating is completed, the electric heater descends back to its original position, and the second electric push rod works to make the extrusion plate push the circuit board and the clamping plate, so that the multiple circuit boards fit together, and are bonded to each other under the action of the solder to complete the fusion welding work.

[0008] Preferably, the CCD vision dispensing device includes a second processing table and a CCD vision positioning dispensing machine. The second processing table is mounted at the rear end of the first processing table. A first lead screw and a drive device for the first lead screw are disposed at the upper end of the second processing table. A placement plate is mounted on the sliding block of the first lead screw. The first lead screw can move the placement plate left and right, thereby adjusting the position of the circuit board left and right.

[0009] Preferably, a support plate is mounted on the upper end of the second processing table, a top plate is mounted on the upper end of the support plate, a mounting plate is mounted at the end of the top plate, a second lead screw and a drive device for the second lead screw are mounted between the support plate and the mounting plate, and a first electric push rod is mounted on the lower end of the sliding block of the second lead screw. The operation of the second lead screw can cause the CCD vision positioning glue dispenser to move forward and backward, thereby adjusting the front and rear position of the CCD vision positioning glue dispenser to facilitate the addition of solder glue.

[0010] Preferably, the CCD visual positioning dispensing machine is installed at the end of the piston rod of the first electric push rod, and the CCD visual positioning dispensing machine includes a solder dispensing machine and a CCD visual sensor. The CCD visual sensor is set to monitor the dispensing position to ensure uniform distribution of the solder glue.

[0011] Preferably, a support leg is installed at the lower end of the first processing table, and there are four support legs in total, and the four support legs are distributed in an array with respect to the first processing table.

[0012] Preferably, there are four electric heaters in total, each comprising a frame and a heating wire, wherein the heating wire is installed in the frame. When the heating wire is powered on, it can heat the air, thereby heating and melting the solder.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the solder on the circuit board is heated and melted separately by multiple heaters, and then the multiple circuit boards are bonded to each other by extrusion. Under the action of the molten solder, they can be welded to form a multi-layer circuit board, which can effectively prevent the outer core board from burning and the inner core board from not being fully heated and bonded, thereby ensuring the quality of the multi-layer circuit board processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view structural diagram of the utility model;

[0015] Figure 2 This is a schematic diagram of a cross-sectional structure of the present invention;

[0016] Figure 3 This is a schematic diagram of the structure of the utility model when viewed from the left;

[0017] Figure 4 It is a schematic diagram of the structure of the utility model when viewed from the right.

[0018] The reference numerals and names in the figures are as follows:

[0019] 101. First processing table; 102. Support legs; 103. Rectangular opening; 200. CCD visual dispensing equipment; 201. Second processing table; 202. First lead screw; 203. Placement plate; 204. Support plate; 205. Top plate; 206. Mounting plate; 207. First electric push rod; 208. CCD visual positioning dispensing machine; 301. Fixed plate; 302. Hydraulic equipment; 303. Adjustment plate; 304. Sliding groove; 305. Clamping plate; 306. Second electric push rod; 307. Extrusion plate; 308. Circuit board; 401. Third electric push rod; 402. Fixed rod; 403. Electric heater. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example 1

[0022] See also Figures 1 to 4 The present invention provides an embodiment of a CCD vision positioning high-level precision welding device, comprising:

[0023] The first processing table 101 and the CCD visual dispensing equipment 200, the upper end of the first processing table 101 is provided with a rectangular opening 103, the upper end of the first processing table 101 is located on both sides of the rectangular opening 103 and is equipped with symmetrically distributed fixed plates 301, the side ends of the fixed plates 301 are equipped with hydraulic equipment 302, the end of the hydraulic rod of the hydraulic equipment 302 is equipped with an adjustment plate 303, the side end of the adjustment plate 303 is provided with a sliding groove 304, a clamping plate 305 is slidably installed in the sliding groove 304, and a circuit board 308 is clamped between the clamping plates 305, a second electric push rod 306 is installed on the inner wall of the side end of the adjustment plate 303, and an extrusion plate 307 is installed at the end of the piston rod of the second electric push rod 306, the lower end of the first processing table 101 is equipped with a symmetrically distributed third electric push rod 401, the end of the piston rod of the third electric push rod 401 is equipped with a fixed rod 402, and the end of the fixed rod 402 is equipped with an electric heater 403.

[0024] In this embodiment, multiple circuit boards with solder adhesive added are respectively placed between the clamping plates 305, and the hydraulic equipment 302 is operated to make the adjustment plates 303 approach each other, so that the circuit boards are clamped and fixed by the clamping plates 305. The third electric push rod 401 is operated to shorten the piston rod, so that the electric heater 403 can be raised between the circuit boards. The adhesive solder can be heated and melted by the electric heater 403. After heating is completed, the electric heater 403 descends back to its original position, and the second electric push rod 306 is operated to make the extrusion plate 307 push the circuit board and the clamping plate 305, so that the multiple circuit boards are fitted together, and under the action of the solder, they are bonded to each other to complete the welding work.

[0025] Furthermore, a support leg 102 is installed at the lower end of the first processing table 101 . There are four support legs 102 in total, and the four support legs 102 are distributed in an array with respect to the first processing table 101 .

[0026] Furthermore, there are four electric heaters 403 in total. The electric heaters 403 include a frame and a heating wire, and the heating wire is installed in the frame.

[0027] Example 2

[0028] See also Figures 1 to 4 The present invention provides an embodiment of a CCD vision positioning high-level precision welding device. Compared with the first embodiment, this embodiment further includes:

[0029] The CCD vision dispensing equipment 200 includes a second processing table 201 and a CCD vision positioning dispensing machine 208. The second processing table 201 is installed at the rear end of the first processing table 101. The upper end of the second processing table 201 is provided with a first screw 202 and a driving device of the first screw 202. A placement plate 203 is installed on the sliding block of the first screw 202. A support plate 204 is installed at the upper end of the second processing table 201. A top plate 205 is provided at the upper end of the support plate 204. A mounting plate 206 is installed at the end of the top plate 205. A second screw and a driving device of the second screw are installed between the support plate 204 and the mounting plate 206. A first electric push rod 207 is installed at the lower end of the sliding block of the second screw. The CCD vision positioning dispensing machine 208 is installed at the end of the piston rod of the first electric push rod 207. The CCD vision positioning dispensing machine 208 includes a solder dispensing machine and a CCD vision sensor.

[0030] In this embodiment, the circuit board is placed on the placement plate 203, and the CCD vision dispensing equipment 200 is controlled by the CCD vision control system. The first electric push rod 207 works to make the CCD vision positioning dispensing machine 208 descend, and the CCD vision positioning dispensing machine 208 adds solder glue to the circuit board. During this period, the first lead screw 202 works to make the circuit board move left and right, and the second lead screw works to make the CCD vision positioning dispensing machine 208 move forward and backward, which is used to cooperate with the addition of solder glue, and the dispensing position is monitored by the CCD vision sensor.

[0031] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A CCD vision positioning high-level precision welding device, comprising a first processing table (101) and a CCD vision dispensing device (200), characterized in that: A rectangular opening (103) is provided at the upper end of the first processing table (101), and symmetrically distributed fixed plates (301) are installed on both sides of the rectangular opening (103) at the upper end of the first processing table (101), a hydraulic device (302) is installed at the side end of the fixed plate (301), and an adjusting plate (303) is installed at the end of the hydraulic rod of the hydraulic device (302), and a sliding groove (304) is provided at the side end of the adjusting plate (303), and a clamping plate (301) is slidably installed in the sliding groove (304). 5), a circuit board (308) is clamped between the clamping plates (305), a second electric push rod (306) is installed on the inner wall of the side end of the adjusting plate (303), an extrusion plate (307) is installed at the end of the piston rod of the second electric push rod (306), a symmetrically distributed third electric push rod (401) is installed at the lower end of the first processing table (101), a fixed rod (402) is installed at the end of the piston rod of the third electric push rod (401), and an electric heater (403) is installed at the end of the fixed rod (402).

2. The CCD vision positioning high-level precision welding device according to claim 1 is characterized by: The CCD visual dispensing device (200) includes a second processing table (201) and a CCD visual positioning dispensing machine (208), wherein the second processing table (201) is installed at the rear end of the first processing table (101), and the upper end of the second processing table (201) is provided with a first lead screw (202) and a driving device for the first lead screw (202), and a placement plate (203) is installed on the sliding block of the first lead screw (202).

3. The CCD vision positioning high-level precision welding device according to claim 2 is characterized by: A support plate (204) is installed at the upper end of the second processing table (201), a top plate (205) is provided at the upper end of the support plate (204), a mounting plate (206) is installed at the end of the top plate (205), a second lead screw and a driving device for the second lead screw are installed between the support plate (204) and the mounting plate (206), and a first electric push rod (207) is installed at the lower end of the sliding block of the second lead screw.

4. The CCD vision positioning high-level precision welding device according to claim 2 is characterized by: The CCD visual positioning glue dispensing machine (208) is installed at the piston rod end of the first electric push rod (207), and the CCD visual positioning glue dispensing machine (208) includes a solder glue dispensing machine and a CCD visual sensor.

5. The CCD vision positioning high-level precision welding device according to claim 1 is characterized by: A support leg (102) is installed at the lower end of the first processing table (101), and there are four support legs (102) in total, and the four support legs (102) are distributed in an array with respect to the first processing table (101).

6. The CCD vision positioning high-level precision welding device according to claim 1 is characterized by: There are four electric heaters (403) in total. The electric heaters (403) include a frame and a heating wire, and the heating wire is installed in the frame.

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