Hot pasting head with positioning function and pasting device

Abstract

The utility model belongs to the technical field of element assembly part manufacturing equipment, and particularly relates to a hot pasting head with a positioning function and a pasting device, and the hot pasting head comprises a controller, a pasting head mechanism and a positioning mechanism, the pasting head mechanism and the positioning mechanism are connected in sequence, and the pasting head mechanism is communicated with the positioning mechanism; the positioning mechanism is electrically connected with the controller; the pasting head mechanism is suitable for sucking an element into the positioning mechanism, so that the controller obtains a corresponding positioning signal; according to the utility model, the positioning mechanism is additionally arranged on the pasting head mechanism, and the positioning mechanism is matched with the controller to directly position the position and the state of an element in real time, so that the problem that a traditional thermal pasting head shifts and inclines when sucking the element and cannot sense the element in time is solved, and the element can be directly sucked in the positioning mechanism; and the effects of limiting the element and reducing the element separation risk are achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of component installation, specifically relates to equipment for manufacturing component assemblies, and in particular to a thermal mounting head and mounting device with a positioning function. Background Art

[0002] The placement head needs to move in multiple directions to absorb components. Due to the small size of the small placement head, it is impossible to directly install a camera on the placement head, and an external vision system is needed. However, there are blind spots and distance between the placement head and the external vision system. When the placement head absorbs components, there will be problems such as displacement and tilt, and it is impossible to directly locate the position and status of the component on the placement head.

[0003] Therefore, it is urgent to develop a new thermal bonding head and bonding device with positioning function to solve the technical problem of how to overcome the traditional bonding head requiring the help of an external visual system, which causes displacement and tilt when picking up components and cannot be sensed in time.

[0004] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Utility Model Content

[0005] The embodiments of the present disclosure at least provide a thermal bonding head and a bonding device with a positioning function.

[0006] In the first aspect, an embodiment of the present disclosure provides a thermal bonding head with a positioning function, which includes: a controller, a bonding head mechanism and a positioning mechanism; the bonding head mechanism and the positioning mechanism are connected in sequence, and the bonding head mechanism is connected to the positioning mechanism; the positioning mechanism is electrically connected to the controller; the bonding head mechanism is suitable for sucking the component into the positioning mechanism so that the controller obtains the corresponding positioning signal.

[0007] In an optional embodiment, the positioning mechanism includes: a positioning block, at least two first pressure collection components and at least two second pressure collection components; the top of the positioning block is connected to the head-attaching mechanism, and a positioning groove is provided at the bottom of the positioning block, and the positioning groove is connected to the head-attaching mechanism; each first pressure collection component is located in the positioning groove, and each first pressure collection component is electrically connected to the controller; each second pressure collection component is arranged at the bottom of the positioning block and is located next to the positioning groove, and each second pressure collection component is electrically connected to the controller.

[0008] In an optional embodiment, the first pressure collection component includes: a first strain gauge, a first compression spring and a first ball; a plurality of first limit grooves are provided on the positioning block, and each of the first limit grooves is connected to the positioning groove; the first strain gauge is connected to the bottom of the first limit groove, and the first strain gauge, the first compression spring and the first ball are connected in sequence, and the first ball is exposed at the notch of the first limit groove; the first strain gauge is electrically connected to the controller.

[0009] In an optional embodiment, the second pressure collection component includes: a second strain gauge, a second compression spring and a second ball; a plurality of second limiting grooves are provided on the positioning block, and each second limiting groove is located next to the positioning groove; the second strain gauge is connected to the bottom of the second limiting groove, and the second strain gauge, the second compression spring and the second ball are connected in sequence, and the second ball is exposed at the notch of the second limiting groove; the second strain gauge is electrically connected to the controller.

[0010] In an optional embodiment, the head-attaching mechanism includes: a driving component and an adsorption component; the driving component is connected to the positioning mechanism, and the adsorption component is connected to the positioning mechanism through the driving component; the driving component is suitable for driving the positioning mechanism to rotate, and the adsorption component is suitable for sucking or blowing air into the positioning mechanism.

[0011] In an optional embodiment, the driving assembly includes: an adapter 1, a stator and a rotor; the stator is connected to the adapter 1, and the rotor is movably connected to the stator; the rotor is suitable for driving the positioning mechanism to rotate.

[0012] In an optional embodiment, the head-attaching mechanism further includes: a heating component; the heating component is installed between the rotor and the positioning mechanism to heat the positioning mechanism.

[0013] In an optional embodiment, the heating assembly includes: a heating block and a heating element; the rotor and the positioning mechanism are respectively located on both sides of the heating block, and the rotor and the positioning mechanism are respectively connected to the heating block; the heating elements are distributed in the heating block to heat the heating block.

[0014] In an optional embodiment, the adsorption component includes: an air pipe and an air pump; the air pipe passes through adapter 1, a stator, a rotor, and a heating block, the air pipe is connected to a positioning mechanism, and the air pipe is connected to an air pump; the air pump is suitable for extracting air from the trachea or ventilating air into the trachea.

[0015] In a second aspect, an embodiment of the present disclosure further provides a patch device, which includes: a movable track and a thermal bonding head as described above; wherein the thermal bonding head is installed on the movable track so that the movable track drives the thermal bonding head to move.

[0016] The beneficial effect of the present invention is that the present invention adds a positioning mechanism to the head bonding mechanism, and the positioning mechanism cooperates with the controller to directly locate the position and status of the component in real time, thereby overcoming the problem that the traditional thermal bonding head shifts and tilts when absorbing components and cannot be sensed in time, and can directly absorb the component into the positioning mechanism, thereby limiting the component and reducing the risk of component detachment.

[0017] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The objectives and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited herein and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A structural diagram of a thermal bonding head with a positioning function provided in an embodiment of the present disclosure;

[0021] Figure 2 A block diagram of the principle of a thermal head with positioning function provided in an embodiment of the present disclosure;

[0022] Figure 3 A circuit diagram of a thermal head with a positioning function provided by an embodiment of the present disclosure;

[0023] Figure 4 A structural diagram of a patch device provided in an embodiment of the present disclosure.

[0024] In the picture:

[0025] 1. Head-attaching mechanism; 11. Drive assembly; 111. Adapter 1; 112. Stator; 113. Rotor; 12. Adsorption assembly; 121. Air pump; 122. Air pipe; 13. Heating assembly; 131. Heating block; 132. Heating element;

[0026] 2. Positioning mechanism; 21. Positioning block; 211. Positioning slot; 22. First pressure collection assembly; 221. First strain gauge; 222. First compression spring; 223. First ball; 23. Second pressure collection assembly; 231. Second strain gauge; 232. Second compression spring; 233. Second ball;

[0027] 3. Components;

[0028] 4. Move the track. DETAILED DESCRIPTION

[0029] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0030] In this document, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or that a third component may be interposed between the first component and the second component. In addition, in the drawings, the thickness of components may be exaggerated or reduced in order to effectively describe technical content.

[0031] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Instead, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0033] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0034] like Figures 1 to 3At least one embodiment provides a thermal bonding head with a positioning function, which includes: a controller, a bonding head mechanism 1 and a positioning mechanism 2; the bonding head mechanism 1 and the positioning mechanism 2 are connected in sequence, and the bonding head mechanism 1 is connected to the positioning mechanism 2; the positioning mechanism 2 is electrically connected to the controller; the bonding head mechanism 1 is suitable for sucking the component 3 into the positioning mechanism 2, so that the controller obtains the corresponding positioning signal.

[0035] Specifically, the controller may adopt an STM32 series single chip microcomputer.

[0036] In at least one embodiment, a positioning mechanism 2 is added to the head attachment mechanism 1, and the positioning mechanism 2 cooperates with the controller to directly locate the position and status of the component 3 in real time, thereby overcoming the problem that the traditional thermal attachment head shifts and tilts when absorbing the component 3 and cannot sense it in time, and the component 3 can be directly absorbed into the positioning mechanism 2, which plays a role in limiting the component 3 and reducing the risk of the component 3 detaching.

[0037] In at least one embodiment, the head-attaching mechanism 1 includes: a driving component 11 and an adsorption component 12; the driving component 11 is connected to the positioning mechanism 2, and the adsorption component 12 is connected to the positioning mechanism 2 through the driving component 11; the driving component 11 is suitable for driving the positioning mechanism 2 to rotate, and the adsorption component 12 is suitable for sucking or blowing air into the positioning mechanism 2.

[0038] Specifically, the driving component 11 can drive the positioning mechanism 2 to rotate, and at the same time the adsorption component 12 can adsorb the component 3, thereby driving the component 3 to rotate.

[0039] In at least one embodiment, the driving assembly 11 includes: an adapter 111, a stator 112 and a rotor 113; the stator 112 is connected to the adapter 111, and the rotor 113 is movably connected to the stator 112; the rotor 113 is suitable for driving the positioning mechanism 2 to rotate.

[0040] Specifically, the function of the adapter 111 is to be installed on the movable track 4 to play a role in installation.

[0041] Specifically, the stator 112 cooperates with the rotor 113 to rotate, thereby driving the positioning mechanism 2 to rotate.

[0042] In at least one embodiment, the head-attaching mechanism 1 further includes: a heating component 13 ; the heating component 13 is installed between the rotor 113 and the positioning mechanism 2 to heat the positioning mechanism 2 .

[0043] Specifically, the heating assembly 13 plays a heating role and can heat the element 3 through the positioning mechanism 2 .

[0044] In at least one embodiment, the heating assembly 13 includes: a heating block 131 and a heating element 132; the rotor 113 and the positioning mechanism 2 are respectively located on both sides of the heating block 131, and the rotor 113 and the positioning mechanism 2 are respectively connected to the heating block 131; the heating element 132 is distributed in the heating block 131 to heat the heating block 131.

[0045] Specifically, the heating element 132 may be a heating wire, a heating resistor, or the like.

[0046] Specifically, the heating block 131 can conduct heat to the positioning mechanism 2 , thereby heating the component 3 .

[0047] In at least one embodiment, the adsorption component 12 includes: an air pipe 122 and an air pump 121; the air pipe 122 passes through the adapter 111, the stator 112, the rotor 113, and the heating block 131, the air pipe 122 is connected to the positioning mechanism 2, and the air pipe 122 is connected to the air pump 121; the air pump 121 is suitable for extracting air from the air pipe 122 or ventilating air into the air pipe 122.

[0048] Specifically, the air pump 121 can control the air pipe 122 to evacuate or ventilate, thereby achieving adsorption or release of the element 3.

[0049] In at least one embodiment, the positioning mechanism 2 includes: a positioning block 21, at least two first pressure collection components 22 and at least two second pressure collection components 23; the top of the positioning block 21 is connected to the heating block 131, and the bottom of the positioning block 21 is provided with a positioning groove 211, and the positioning groove 211 is connected to the trachea 122; each first pressure collection component 22 is located in the positioning groove 211, and each first pressure collection component 22 is electrically connected to the controller; each second pressure collection component 23 is arranged at the bottom of the positioning block 21 and is located next to the positioning groove 211, and each second pressure collection component 23 is electrically connected to the controller.

[0050] Specifically, if the component 3 completely enters the positioning groove 211 , the component 3 triggers all the first pressure collection components 22 at the same time, and the controller can determine that the component 3 is accurately positioned at this time.

[0051] Specifically, if the element 3 is tilted or displaced, the element 3 cannot trigger all the first pressure collection components 22 at the same time, and the controller can determine that the element 3 has a positioning failure at this time.

[0052] Specifically, if the component 3 completely enters the positioning groove 211, the positioning block 21 contacts the platform horizontally, and all the second pressure collection components 23 are triggered simultaneously, so that the controller can determine that the component 3 is accurately positioned at this time.

[0053] Specifically, if the component 3 is tilted or shifted, the positioning block 21 cannot contact the platform horizontally, and all the second pressure collection components 23 are not triggered simultaneously, so the controller can determine that the component 3 is accurately positioned at this time.

[0054] In at least one embodiment, the first pressure collection component 22 includes: a first strain gauge 221, a first compression spring 222 and a first ball 223; a plurality of first limiting grooves are provided on the positioning block 21, and each of the first limiting grooves is connected to the positioning groove 211; the first strain gauge 221 is connected to the bottom of the first limiting groove, and the first strain gauge 221, the first compression spring 222, and the first ball 223 are connected in sequence, and the first ball 223 is exposed at the notch of the first limiting groove; the first strain gauge 221 is electrically connected to the controller.

[0055] Specifically, the first ball 223 is squeezed, and the pressure is transmitted to the first strain gauge 221 via the first compression spring 222 , and the controller can collect corresponding pressure data.

[0056] In at least one embodiment, the second pressure collection component 23 includes: a second strain gauge 231, a second compression spring 232 and a second ball 233; a plurality of second limiting grooves are provided on the positioning block 21, and each second limiting groove is located next to the positioning groove 211; the second strain gauge 231 is connected to the bottom of the second limiting groove, and the second strain gauge 231, the second compression spring 232 and the second ball 233 are connected in sequence, and the second ball 233 is exposed at the notch of the second limiting groove; the second strain gauge 231 is electrically connected to the controller.

[0057] Specifically, the second ball 233 is squeezed, and the pressure is transmitted to the second strain gauge 231 via the second compression spring 232 , and the controller can collect corresponding pressure data.

[0058] like Figures 1 to 4 At least one embodiment further provides a patch device, which includes: a movable track 4 and a thermal bonding head as described above; wherein the thermal bonding head is installed on the movable track 4 so that the movable track 4 drives the thermal bonding head to move.

[0059] To sum up, the present invention adds a positioning mechanism to the head attachment mechanism, and the positioning mechanism cooperates with the controller to directly locate the position and status of the component in real time, thereby overcoming the problem that the traditional thermal attachment head shifts and tilts when absorbing components and cannot be sensed in time, and can directly absorb the component into the positioning mechanism, thereby limiting the component and reducing the risk of component detachment.

[0060] In the description of the embodiments of the present invention, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0061] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used herein unless expressly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0062] Spatially relative terms, such as "inside," "outside," "below," "beneath," "down," "above," "on," etc., may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, spatially relative terms may be intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as being "below" or "below" other elements or features will be oriented to be "above" the other elements or features. Thus, the example term "below" may encompass both above and below orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0063] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.

Claims

1. A thermal bonding head with positioning function, characterized in that: include: Controller, head-attaching mechanism (1) and positioning mechanism (2); The head-attaching mechanism (1) is connected to the positioning mechanism (2), and the head-attaching mechanism (1) is in communication with the positioning mechanism (2); The positioning mechanism (2) is electrically connected to the controller; The head-attaching mechanism (1) is suitable for sucking the component (3) into the positioning mechanism (2) so that the controller can obtain a corresponding positioning signal.

2. The thermal bonding head with positioning function according to claim 1, characterized in that: The positioning mechanism (2) comprises: a positioning block (21), at least two first pressure collection components (22) and at least two second pressure collection components (23); The top of the positioning block (21) is connected to the head attachment mechanism (1), and the bottom of the positioning block (21) is provided with a positioning groove (211), and the positioning groove (211) is communicated with the head attachment mechanism (1); Each of the first pressure collection components (22) is located in the positioning groove (211), and each of the first pressure collection components (22) is electrically connected to the controller; Each second pressure collection component (23) is arranged at the bottom of the positioning block (21) and is located next to the positioning groove (211), and each second pressure collection component (23) is electrically connected to the controller.

3. The thermal bonding head with positioning function as claimed in claim 2, characterized in that: The first pressure collection assembly (22) comprises: a first strain gauge (221), a first compression spring (222) and a first ball (223); The positioning block (21) is provided with a plurality of first limiting grooves, and each of the first limiting grooves is connected to the positioning groove (211); The first strain gauge (221) is connected to the bottom of the first limiting groove, the first strain gauge (221), the first compression spring (222), and the first ball (223) are connected in sequence, and the first ball (223) is exposed at the notch of the first limiting groove; The first strain gauge (221) is electrically connected to the controller.

4. The thermal bonding head with positioning function as claimed in claim 2, characterized in that: The second pressure collection assembly (23) comprises: a second strain gauge (231), a second compression spring (232), and a second ball (233); The positioning block (21) is provided with a plurality of second limiting grooves, and each of the second limiting grooves is located beside the positioning groove (211); The second strain gauge (231) is connected to the bottom of the second limiting groove, the second strain gauge (231), the second compression spring (232), and the second ball (233) are connected in sequence, and the second ball (233) is exposed at the notch of the second limiting groove; The second strain gauge (231) is electrically connected to the controller.

5. The thermal bonding head with positioning function according to claim 1, characterized in that: The head-attaching mechanism (1) comprises: a driving component (11) and an adsorption component (12); The driving component (11) is connected to the positioning mechanism (2), and the adsorption component (12) passes through the driving component (11) and is in communication with the positioning mechanism (2); The driving component (11) is suitable for driving the positioning mechanism (2) to rotate, and the adsorption component (12) is suitable for sucking or blowing air toward the positioning mechanism (2).

6. The thermal bonding head with positioning function according to claim 5, characterized in that: The driving assembly (11) comprises: an adapter 1 (111), a stator (112) and a rotor (113); The stator (112) is connected to the adapter (111), and the rotor (113) is movably connected to the stator (112); The rotor (113) is suitable for driving the positioning mechanism (2) to rotate.

7. The thermal bonding head with positioning function according to claim 6, characterized in that: The head-attaching mechanism (1) further includes: a heating component (13); The heating component (13) is installed between the rotor (113) and the positioning mechanism (2) to heat the positioning mechanism (2).

8. The thermal bonding head with positioning function according to claim 7, characterized in that: The heating assembly (13) comprises: a heating block (131) and a heating element (132); The rotor (113) and the positioning mechanism (2) are respectively located on both sides of the heating block (131), and the rotor (113) and the positioning mechanism (2) are respectively connected to the heating block (131); The heating elements (132) are distributed on the heating block (131) to heat the heating block (131).

9. The thermal bonding head with positioning function according to claim 8, characterized in that: The adsorption component (12) comprises: an air pipe (122) and an air pump (121); The air pipe (122) passes through the adapter 1 (111), the stator (112), the rotor (113), and the heating block (131), the air pipe (122) is communicated with the positioning mechanism (2), and the air pipe (122) is connected to the air pump (121); The air pump (121) is suitable for extracting air from the trachea (122) or ventilating air into the trachea (122).

10. A patch device, characterized in that: include: A movable track (4) and a thermal bonding head as claimed in any one of claims 1 to 9; in The thermal bonding head is mounted on a movable track (4) so ​​that the movable track (4) drives the thermal bonding head to move.

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