High-temperature pressing and fastening tool

Abstract

The utility model relates to a high-temperature pressing and fastening tool, which is designed on the basis of the requirement of the subsequent process of filling epoxy glue into a probe, and comprises a bottom plate, four fixing feet are arranged on one side of the bottom plate and are used for supporting a glue filling and curing tool; meanwhile, a plurality of probe working positions are arranged on the other side of the bottom plate; wherein the probe working position comprises a cross rod, a plurality of fixing holes are formed in one cross rod, the two ends of the cross rod are connected with hexagon socket screws arranged on the bottom plate through extension rods, and meanwhile pull rods are arranged in the fixing holes; a pressing rod is arranged at one end of the pull rod, a shaft sleeve structure is arranged between the pull rod and the pressing rod, and a spring is further arranged between the pull rod and the pressing rod. A probe shell is arranged at the intersection point of the axis where the pressing rod is located and the bottom plate, and the probe shell and the probe wafer are coaxial and move up and down in the curing working process. The novel curing tool can improve the labor efficiency of operators, and is simple in structure, reliable in high-temperature curing quality and good in safety performance.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit processing equipment, in particular to a high-temperature pressing and curing tool. Background Art

[0002] Under existing processing conditions, epoxy adhesive bonding is provided after sensor processing, in which the chip is pressed so that it is located in the center of the probe housing after high-temperature curing without shifting. Therefore, a solution is urgently needed to improve operator labor efficiency while ensuring product quality and preventing the high-temperature cured chip from shifting and affecting the probe. Utility Model Content

[0003] To solve the above technical problems, the utility model provides a high-temperature pressing and curing tooling, which is designed based on the requirements of the subsequent process after the probe is filled with epoxy glue, and includes: a base plate, one side of which is provided with four fixed legs for supporting the glue filling and curing tooling; and the other side of the base plate is provided with a plurality of probe working positions;

[0004] The probe working position includes a cross bar, one of which is provided with a plurality of fixing holes, and the two ends of the cross bar are connected to the hexagonal bolts provided on the bottom plate through extension rods, and a pull rod is provided in the fixing hole; a pressure rod is provided at one end of the pull rod, so there is a shaft sleeve structure between the pull rod and the pressure rod, and a spring is also provided between the two; a characteristic body of a raised ring is provided at one end of the pressure rod, and a probe chip is provided at the working contact surface end of the raised ring, and a probe shell is provided at the intersection of the axis of the pressure rod and the bottom plate, and the probe shell and the probe chip are coaxial and move up and down during the curing process.

[0005] In one embodiment of the present invention, the bottom plate is used to connect the fixed legs and the crossbar, and plays a role in supporting the pressing force transmitted from the pressure rod.

[0006] In one embodiment of the present invention, the hexagon socket bolts are used to simultaneously lock and connect the base plate to the fixed legs and the fixed ends of the crossbars.

[0007] In one embodiment of the present invention, the probe housing is used to be tightly bonded to the main body of the probe being processed.

[0008] In one embodiment of the present invention, the pressure rod is inserted into the spring and then screwed into the pull rod with a thread to form a telescopic component. At the same time, the height of the raised ring of the pressure rod is 1 mm, which is used to ensure that the appropriate clamping force is transmitted to the probe chip. That is, the spring is used to protect and compress the probe chip to prevent the pressure rod from transmitting excessive force to damage the probe chip.

[0009] In one embodiment of the present invention, the pull rod is used to pull up the probe housing and the probe wafer after the glue is injected during operation, and then release the pull rod so that the pressure rod can press the probe wafer under the force provided by the spring.

[0010] In one embodiment of the present invention, the cross bar is used to support the pull rod and the spring, and to provide the space required for the extension and retraction of the pressure rod.

[0011] The above technical solution of the present invention has the following advantages over the prior art: the curing tooling described in the present invention uses epoxy glue to bond 40 probes at a time and then fix and press them for high-temperature curing; this technical solution can improve the operator's labor efficiency, has a simple structure, reliable high-temperature curing quality, and good safety performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0013] Figure 1 This is a schematic diagram of the three-dimensional structure of the high-temperature pressing and curing tooling of the present invention;

[0014] Figure 2 This is a side view of the curing tooling described in the present invention;

[0015] Figure 3 It is a cross-sectional view of the curing tooling of the present invention.

[0016] As shown in the figure, 1. Fixed foot, 2. Base plate, 3. Hexagon socket bolt, 4. Probe housing, 5. Probe wafer, 6. Pressure rod, 7. Spring, 8. Pull rod, 9. Cross bar. DETAILED DESCRIPTION

[0017] like Figure 1 and Figure 2 As shown, this embodiment provides a high-temperature pressing and curing tooling, which is designed based on the requirements of the subsequent process after the probe is filled with epoxy glue, and includes: a base plate 2, one side of which is provided with four fixed legs 1 for supporting the glue filling and curing tooling; and the other side of the base plate 2 is provided with a plurality of probe working positions;

[0018] The probe working position includes a cross bar 9, a cross bar 9 is provided with a plurality of fixing holes, and the two ends of the cross bar are connected to the hexagon socket bolts 3 provided on the bottom plate through an extension rod, and a pull rod 8 is provided in the fixing hole; Figure 3As shown, a pressure rod 6 is provided at one end of the pull rod 8, so a sleeve structure is provided between the pull rod 8 and the pressure rod 6, and a spring 7 is also provided between the two; a characteristic body of a raised ring is provided at one end of the pressure rod 6, and a probe chip 5 is provided at the working contact surface end of the raised ring, and a probe shell 4 is provided at the intersection of the axis of the pressure rod 6 and the base plate 2, wherein the probe shell 4 and the probe chip 5 are coaxial and move up and down during the curing process.

[0019] Specifically, the bottom plate is used to connect the fixed legs and the crossbar, and plays a role in supporting the pressing force transmitted from the pressure rod.

[0020] Specifically, the hexagon socket bolts are used to simultaneously lock and connect the base plate to the fixed legs and the fixed ends of the crossbars.

[0021] Specifically, the probe housing is used to be tightly bonded to the main body of the probe being processed.

[0022] Specifically, the pressure rod is inserted into the spring and then screwed into the pull rod with a thread to form a telescopic component. At the same time, the height of the raised ring of the pressure rod is 1mm, which is used to ensure that the appropriate clamping force is transmitted to the probe chip. That is, the spring is used to protect and compress the probe chip to prevent the pressure rod from transmitting excessive force and damaging the probe chip.

[0023] Specifically, the pull rod is used to pull up the probe housing and the probe wafer after the glue is injected during operation, and then release the pull rod so that the pressure rod can press the probe wafer under the force provided by the spring.

[0024] Specifically, the cross bar is used to support the pull rod and the spring, and to provide the space required for the extension and retraction of the pressure rod.

[0025] During use of the curing tooling described in this embodiment, first pull up the pull rod 8 and hold it so that the pressure rod 6 leaves enough space in the probe housing 4 for the probe wafer 5 to be installed after the glue is injected. Then, the probe housing 4 after the glue is injected and the probe wafer 5 is installed is placed on the bottom plate 2 under the pressure rod 6. At this time, the pull rod 8 is released to drive the pressure rod 6 to transmit the force of the spring 7 to press the probe wafer 5 tightly to ensure that it is in the probe housing 4 and does not shift during the curing process.

[0026] The technical solution of this embodiment can reduce the labor intensity of the operator, does not require tightening by means of screws, and is convenient for replacement and use. It also improves the efficiency of the operator, reduces production costs, has reliable quality, and good safety performance.

[0027] At the same time, compared with similar tooling currently on the market, this new curing tooling has significantly simplified the number of mechanical parts in structure for the first time, maximizing the function of each part, and through the coordinated movements during the working process, it can excellently complete the high-temperature curing work between the probe housing and the wafer.

[0028] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A high-temperature pressing and curing tool, which is designed based on the requirements of the subsequent process after the probe is filled with epoxy glue, and is characterized by: include: A bottom plate (2), wherein one side of the bottom plate (2) is provided with four fixed legs (1) for supporting the glue pouring and curing tooling; and the other side of the bottom plate (2) is provided with a plurality of probe working positions; The probe working position includes a cross bar (9), one of the cross bars (9) is provided with a plurality of fixing holes, and the two ends of the cross bar are connected to the hexagon socket bolts (3) provided on the bottom plate through extension rods, and a pull rod (8) is provided in the fixing hole; one end of the pull rod (8) is provided with a pressure rod (6), so there is a shaft sleeve structure between the pull rod (8) and the pressure rod (6), and a spring (7) is also provided between the two; one end of the pressure rod (6) is provided with a characteristic body of a raised ring, and the working contact surface end of the raised ring is provided with a probe chip (5), and a probe shell (4) is provided at the intersection of the axis of the pressure rod (6) and the bottom plate (2), wherein the probe shell (4) and the probe chip (5) are coaxial and move up and down during the curing process.

2. The curing tool according to claim 1, characterized in that: The bottom plate (2) is used to connect the fixed foot (1) and the cross bar (9), and plays a supporting role for the pressing force transmitted by the pressure rod (6).

3. The curing tool according to claim 1, characterized in that: The hexagon socket bolt (3) is used to simultaneously lock and connect the base plate (2) with the fixed end of the fixed foot (1) and the crossbar (9).

4. The curing tool according to claim 1, characterized in that: The probe housing (4) is used to be tightly bonded to the main body of the probe being processed.

5. The curing tool according to claim 1, characterized in that: The pressure rod (6) is inserted into the spring (7) and then screwed into the pull rod (8) to form a telescopic component. At the same time, the height of the raised ring of the pressure rod (6) is 1 mm, which is used to ensure that a suitable pressing force is transmitted to the probe chip (5). That is, the spring (7) is used to protect and compress the probe chip (5) to prevent the pressure rod (6) from transmitting excessive force to damage the probe chip (5).

6. The curing tool according to claim 1, characterized in that: The pull rod (8) is used to pull up the probe housing (4) and the probe chip (5) after the glue is injected during operation, and then release the pull rod (8) so that the pressure rod (6) presses the probe chip (5) under the force provided by the spring (7).

7. The curing tool according to claim 1, characterized in that: The cross bar (9) is used to support the pull rod (8) and the spring (7), and to provide the space required for the telescopic operation of the pressure rod (6).

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