Semi-dry type transfer printing box with heat dissipation device
By introducing a heat dissipation device and a temperature control system into the semi-dry transfer box, the problem of insufficient heat dissipation of the semi-dry transfer equipment is solved, stable temperature control is achieved, and the transfer efficiency and stability of biopolymers are improved.
Patent Information
- Application Number
- CN202422737135.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-11-11
AI Technical Summary
Existing semi-dry transfer equipment has poor heat dissipation effect, resulting in problems such as strip deformation, colloid deformation and reduced transfer efficiency.
A semi-dry transfer box with a heat dissipation device is designed, which includes a box body, a transfer device and a heat dissipation device. It adopts an insulating thermal conductive sheet and a radiator, combines the heat dissipation method of air cooling, water cooling or refrigeration sheet, and is equipped with a temperature control device to monitor and control the temperature in real time.
Effectively reduce the temperature of the transfer process, stabilize experimental conditions, protect the properties of biopolymers, and avoid problems caused by excessive temperature.
Smart Images

Figure CN223314649U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semi-dry transfer printing, in particular to a semi-dry transfer printing box with a heat dissipation device. Background Art
[0002] Semi-dry transfer involves transferring biomacromolecules (proteins or nucleic acids) separated by electrophoresis in a gel to a polymer membrane (such as PVDF, nitrocellulose, or nylon) for immobilization by applying an electric field. The typical transfer method involves placing a sandwich (comprising a buffered absorbent material, gel, polymer membrane, and buffered absorbent material in this order) between a cathode and an anode plate. Transfer is then achieved by applying a current and voltage across the two electrodes. Compared to the more classic wet transfer method, semi-dry transfer utilizes less buffer, allowing for higher currents. For reference, wet transfer typically uses a current of 0.3-0.4 amps at a voltage of 30-50 volts, while semi-dry transfer typically uses a current of 1.5-2.0 amps at a voltage of 25 volts. Both methods utilize higher power. Furthermore, wet transfer typically includes an 800ml-1000ml container of buffer to dissipate heat. Semi-dry transfer buffers typically do not exceed 5ml and lack the ability to dissipate heat. This indicates that semi-dry transfers have poor overall heat dissipation, potentially leading to problems such as strip deformation, decreased transfer efficiency due to colloid deformation, and agglomeration and adsorption of the transfer buffer. Utility Model Content
[0003] The technical problem to be solved by the present invention is: in order to solve the problem that the semi-dry transfer equipment in the prior art cannot dissipate heat, the present invention provides a semi-dry transfer box with a heat dissipation device.
[0004] The technical solution adopted by the utility model to solve its technical problems is: a semi-dry transfer box with a heat dissipation device, comprising a box body, a transfer device and a heat dissipation device; the transfer device is arranged inside the box body, the heat dissipation device is arranged below the transfer device, and the heat dissipation device includes an insulating heat conductive sheet and a radiator arranged below the insulating heat conductive sheet.
[0005] Furthermore, the transfer device includes a cathode plate, a sandwich composite, and an anode plate arranged in sequence from top to bottom, and an insulating heat conductive sheet is connected below the anode plate.
[0006] Furthermore, the sandwich composite includes a first water absorbing layer, a gel layer, a transfer film layer and a second water absorbing layer arranged from top to bottom.
[0007] Furthermore, the first water-absorbing layer and the second water-absorbing layer are both absorbent papers containing a buffer solution, and the transfer membrane layer is a polymer membrane, which can be NC membrane (nitrocellulose membrane) and PVDF membrane (polyvinylidene fluoride membrane).
[0008] Furthermore, the radiator adopts air cooling, water cooling, refrigeration plate or a composite form of heat dissipation. The area of the insulating heat conductive plate is equal to the area of the anode plate. The insulating heat conductive plate is cooled by the radiator. When the transfer box starts working, the heat dissipation device is also started at the same time. After the transfer is completed, the heat dissipation device is turned off.
[0009] Furthermore, the heat dissipation device is connected to a temperature control device, which is used to monitor the temperature of the insulating thermal conductive plate. The temperature control device is set to monitor the temperature of the insulating thermal conductive plate in real time. When the temperature of the insulating thermal conductive plate reaches a certain value, the heat dissipation device is started to cool it down. When it drops to a certain temperature, the heat dissipation device is turned off.
[0010] Furthermore, the temperature control device includes a temperature sensor and a temperature controller; the temperature sensor is disposed on the anode plate or cathode plate; one end of the temperature controller is connected to the temperature sensor and the other end is connected to the heat sink; the temperature sensor contacts the anode plate or cathode plate, and its signal is transmitted via a circuit to the temperature controller. After receiving the signal, the temperature controller compares it with a preset value. If the temperature exceeds the preset value, the temperature controller activates the heat sink (refrigerator) to dissipate heat, and the entire structure of the anode plate (or cathode plate, or both) and the insulating heat conductive sheet begins to dissipate heat. When the temperature value falls below the preset value, the temperature sensor transmits a signal to the temperature controller, which, upon receiving the signal, shuts down the heat sink (refrigerator).
[0011] Beneficial effects of the utility model:
[0012] The semi-dry transfer box with a heat dissipation device described in the present invention effectively solves the problem of heat dissipation failure caused by defects in existing semi-dry transfer equipment during the semi-dry transfer process. It can effectively reduce the process temperature of the semi-dry transfer to achieve stable experimental conditions, avoid a series of problems caused by excessively high temperatures, and ensure the stability of the properties of the biopolymers being tested. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0014] Figure 1 This is a schematic diagram of a semi-dry transfer box with a heat dissipation device according to Example 1 of the present invention;
[0015] Figure 2 This is a cross-sectional view of the semi-dry transfer box with a heat dissipation device according to Example 1 of the present utility model;
[0016] Figure 3 This is a schematic structural diagram of the transfer device described in Example 1 of the present utility model;
[0017] Figure 4 This is a schematic structural diagram of the sandwich composite described in Example 1 of the present invention;
[0018] Figure 5 This is a schematic diagram of the temperature control device according to Example 2 of the present utility model;
[0019] In the figure, 1. box body, 2. transfer device, 21. cathode plate, 22. sandwich composite, 221. first water absorption layer, 222. gel layer, 223. transfer film layer, 224. second water absorption layer, 23. anode plate, 3. heat dissipation device, 4. insulating thermal conductive sheet, 5. radiator, 6. temperature control device, 61. temperature sensor, 62. temperature controller. DETAILED DESCRIPTION
[0020] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.
[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "horizontal", "top", "inner", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0022] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the term "connection" should be understood in a broad sense. For example, it can mean fixed connection, detachable connection, or integral connection; it can mean mechanical connection or electrical connection; it can mean direct connection or indirect connection through an intermediary. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.
[0023] Example 1
[0024] like Figure 1-4As shown, a semi-dry transfer box with a heat dissipation device includes a box body 1, a transfer device 2 and a heat dissipation device 3; the transfer device 2 is arranged inside the box body 1, and the heat dissipation device 3 is arranged below the transfer device 2, and the heat dissipation device 3 includes an insulating heat conductive sheet 4 and a radiator 5 arranged below the insulating heat conductive sheet 4.
[0025] The transfer device 2 includes, from top to bottom, a cathode plate 21, a sandwich composite 22, and an anode plate 23. The anode plate 23 is connected to an insulating heat conductive sheet 4 below. The sandwich composite 22 includes, from top to bottom, a first water-absorbing layer 221, a gel layer 222, a transfer film layer 223, and a second water-absorbing layer 224.
[0026] The first water-absorbing layer 221 and the second water-absorbing layer 224 are both absorbent papers containing a buffer solution. The transfer film layer 223 is made of a polymer film, which can be NC film (nitrocellulose film) or PVDF film (polyvinylidene fluoride film).
[0027] The radiator 5 adopts air cooling, water cooling, refrigeration plate or a combination thereof. The area of the insulating heat conductive plate is equal to the area of the anode plate 23. The insulating heat conductive plate is cooled by the radiator 5. When the transfer box starts working, the heat dissipation device 3 is also started at the same time. After the transfer is completed, the heat dissipation device 3 is turned off.
[0028] During use, an electric field is applied between the cathode plate 21 and the anode plate 23. At this time, the anode plate 23 is in contact with the insulating thermal conductive material plate, and the transfer heat is transferred from the anode plate 23 to the insulating thermal conductive material plate. The insulating thermal conductive material plate is in contact with the heat sink 3. The heat sink 3 starts to operate while the transfer is running, and the overall temperature of the transfer system is reduced.
[0029] Example 2
[0030] This embodiment further provides a semi-dry transfer box with a heat dissipation device on the basis of embodiment 1. Its structure is substantially the same as that of the semi-dry transfer box with a heat dissipation device described in embodiment 1. The difference is that the heat dissipation device 3 is connected to the temperature control device 6. The temperature control device 6 is used to monitor the temperature of the insulating heat conductive sheet. The temperature control device 6 can monitor the temperature of the insulating heat conductive sheet in real time. When the temperature of the insulating heat conductive sheet reaches a certain value, the heat dissipation device 3 is started to cool it. When it drops to a certain temperature, the heat dissipation device 3 is turned off. Figure 5 As shown, the temperature control device 6 includes a temperature sensor 61 and a temperature controller 62; the temperature sensor 61 is arranged on the anode plate 23 or the cathode plate 21; one end of the temperature controller 62 is connected to the temperature sensor 61, and the other end is connected to the heat dissipation device 3.
[0031] In this specification, the schematic representations of the terms do not necessarily refer to the same embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments.
[0032] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.
Claims
1. A semi-dry transfer box with a heat dissipation device, characterized in that: The invention comprises a box body (1), a transfer device (2) and a heat dissipation device (3); the transfer device (2) is arranged inside the box body (1), the heat dissipation device (3) is arranged below the transfer device (2), and the heat dissipation device (3) comprises an insulating heat conductive sheet (4) and a radiator (5) arranged below the insulating heat conductive sheet (4).
2. The semi-dry transfer box with a heat dissipation device according to claim 1, characterized in that: The transfer device (2) comprises a cathode plate (21), a sandwich composite (22), and an anode plate (23) arranged in sequence from top to bottom, and an insulating heat-conducting sheet (4) is connected below the anode plate (23).
3. The semi-dry transfer box with a heat dissipation device according to claim 2, characterized in that: The sandwich composite (22) comprises a first water absorbing layer (221), a gel layer (222), a transfer film layer (223), and a second water absorbing layer (224) arranged from top to bottom.
4. The semi-dry transfer box with a heat dissipation device according to claim 3, characterized in that: The first water-absorbing layer (221) and the second water-absorbing layer (224) are both absorbent papers containing a buffer solution, and the transfer film layer (223) is a polymer film.
5. The semi-dry transfer box with a heat dissipation device according to claim 1, characterized in that: The radiator (5) adopts a heat dissipation method of air cooling, water cooling, refrigeration plate or a combination thereof, and the area of the insulating heat conductive plate (4) is equal to the area of the anode plate (23).
6. The semi-dry transfer box with a heat dissipation device according to claim 1, characterized in that: The heat dissipation device (3) is connected to a temperature control device (6), and the temperature control device (6) is used to monitor the temperature of the insulating heat conducting plate.
7. The semi-dry transfer box with a heat dissipation device according to claim 6, characterized in that: The temperature control device (6) comprises a temperature sensor (61) and a temperature controller (62); the temperature sensor (61) is arranged on the anode plate (23) or the cathode plate (21); one end of the temperature controller (62) is connected to the temperature sensor (61), and the other end is connected to the heat dissipation device (3).