Vacuum wetting device for square substrate
By designing the structure of the spray pool and overflow pool, and combining the spray pipe unit and the vacuum unit, uniform wetting of the square substrate is achieved, the problem of residual bubbles is solved, and the electroplating quality is improved.
Patent Information
- Application Number
- CN202423246454.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-12-27
AI Technical Summary
In existing wafer wetting processes, bubbles within the microstructure of square substrates are difficult to completely expel, affecting the electroplating quality. In particular, bubbles gather at the orifice under negative pressure, resulting in unsatisfactory wetting effects.
A vacuum wetting device for square substrates was designed. By using a spray pipe unit and a vacuum unit in the design of the spray pool and overflow pool, a negative pressure environment was formed, allowing the spray water to flow from bottom to top, removing bubbles in the micropores and ensuring uniform wetting of both sides of the substrate.
It significantly improves the wetting effect of the substrate, reduces the residual cavitation in the microstructure, ensures the quality of electroplating, and improves the utilization rate of the substrate.
Smart Images
Figure CN223316600U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging wet process, in particular to a square substrate vacuum wetting device. Background Art
[0002] Current chips are usually cut into multiple pieces after being electroplated and packaged on wafers. Since chips are usually square, a certain area of the curved edge of the wafer becomes a waste area.
[0003] With the development of semiconductor packaging technology, glass substrates are expected to replace silicon interposers and carriers due to their low power consumption and excellent heat dissipation performance. Glass substrates can be directly designed into a square shape, which will significantly improve the utilization rate of square substrates.
[0004] Electroplating is a process of forming a thin film of metal or other materials on the surface of a substrate. From a microscopic point of view, before electroplating, a large number of microstructures with a pore size of 5-100μm and a depth of 50-500μm are gathered on the surface of the substrate. The electroplating solution must be fully immersed in the microstructure to ensure the quality of electroplating. If there are air pockets in the microstructure that are not fully immersed in the electroplating liquid, the reliability of the coating will be affected. Currently, in the existing wafer wetting process, there is a solution of using vacuum to remove bubbles. However, in the existing vacuum method, under the action of negative pressure, a large number of bubbles inside the microstructure will only run from the micropores to the orifice position, such as the attached Figure 1 As shown, the bubbles 92 accumulate at the openings of the micropores 91 and cannot escape from the micropores, so the pre-wetting effect is not ideal.
[0005] Therefore, it is necessary to propose a technical solution that can wet both sides of a square substrate at the same time and improve the defoaming effect. Utility Model Content
[0006] In order to overcome the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a vacuum wetting device for a square substrate.
[0007] To achieve the above-mentioned purpose, the technical solution adopted by the present invention to solve the technical problem is: a square substrate vacuum wetting device, comprising:
[0008] A main box body, the upper end of which is open, and a vertical partition is provided in the main box body, the partition dividing the internal space of the main box body into a spray pool and an overflow pool, a hanger mounting frame for vertically placing a hanger is provided in the middle of the spray pool, and the square substrate to be wetted is mounted on the hanger, and a spray pipe unit is provided on each side of the hanger mounting frame, each of the spray pipe units includes a spray inlet pipe and a plurality of spray pipes connected to the spray inlet pipe, and each of the spray pipes is provided with a plurality of spray holes distributed at intervals, and the spray holes are obliquely upward toward the substrate to be wetted;
[0009] An upper cover plate is installed at the upper opening of the main box body in an openable and closable manner, and a sealing structure is provided between the upper cover plate and the main box body;
[0010] a circulating spray pump, used to pump the spray water in the overflow tank out to the spray pipe unit;
[0011] The vacuum unit is used to extract a vacuum from the enclosed space formed between the upper cover and the main box body.
[0012] When in use, first fill the spray pool and overflow pool in the main box with water. The circulating spray pump forms a spray water circulation between the spray pool and the overflow pool. The hanger loaded with the square substrate is placed vertically in the spray pool. Both sides of the square substrate are immersed in the circulating water in the spray pool. The vacuum unit continuously forms a negative pressure in the main box to help discharge bubbles.
[0013] By adopting the technical solution of the present invention, under the action of negative pressure, the bubbles in the micropores of the substrate can be smoothly transferred to the mouth of the micropores. The spray holes of the spray pipe units on both sides of the square substrate face upward, which can generate a liquid flow from bottom to top on both sides of the substrate. The driving force of the liquid flow can smoothly bring the bubbles accumulated at the mouth of the micropores of the substrate out of the micropores and discharge them upward with the liquid flow, which can significantly reduce or avoid residual air pockets in the microstructures on both surfaces of the square substrate, significantly improve the wetting effect, and ensure the subsequent electroplating quality of the substrate.
[0014] Furthermore, the angle between the axis of the spray hole and the horizontal plane is set to be 5-85 degrees.
[0015] The above preferred solution can provide a relatively stable bottom-up liquid flow.
[0016] Furthermore, a nozzle is installed on the spray hole, and a V-shaped groove is provided at the mouth of the nozzle.
[0017] Furthermore, the projections of the spray holes on adjacent spray pipes on the horizontal plane are arranged in a staggered state.
[0018] By adopting the above preferred solution, the spraying uniformity on the substrate is improved, and the residual bubbles at various places on the surface of the substrate can be smoothly discharged.
[0019] Furthermore, the two spray pipe units on both sides of the hanger mounting frame are arranged in mirror symmetry to ensure that both sides of the substrate are covered by the spray.
[0020] Furthermore, the height of the vacuum port is higher than the height of the top of the partition.
[0021] Furthermore, it also includes a liquid level monitoring device for detecting the liquid level in the overflow tank.
[0022] Furthermore, the liquid level monitoring device includes a liquid level tube and a liquid level monitoring sensor. The liquid level tube is installed on the outside of the main box. The lower end of the liquid level tube is connected to the lower part of the overflow tank, and the upper end of the liquid level tube is connected to the top of the overflow tank. The height of the upper end of the liquid level tube is higher than the height of the partition.
[0023] The above preferred solution is adopted to facilitate the control of the liquid addition water level and the monitoring of the circulating water operation status.
[0024] Furthermore, the upper cover is hinged to one side of the upper opening of the main box body, and an opening and closing drive mechanism is installed between the upper cover and the outer wall of the main box body, and the opening and closing drive mechanism is used to drive the upper cover to open or close.
[0025] Furthermore, the opening and closing drive mechanism is a linear drive component, the telescopic end of the linear drive component is hinged to the upper cover plate, and the base of the linear drive component is hinged to the bracket on the outer wall of the main box body.
[0026] Furthermore, a pressing mechanism for pressing the upper cover against the upper opening of the main box body is installed on the side of the main box body opposite to the opening and closing drive mechanism.
[0027] Furthermore, the clamping mechanism includes a pressing block and a linear drive cylinder, the telescopic rod of the linear drive cylinder is connected to the pressing block, and the cylinder body of the linear drive cylinder is fixedly connected to the outer wall of the main box body.
[0028] The above preferred solution is adopted to realize automated processing. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0030] Figure 1 This is a schematic diagram of the state in which it is difficult to remove bubbles from the wafer during vacuum wetting in the prior art.
[0031] Figure 2 It is a structural diagram of an embodiment of the present invention.
[0032] Figure 3 It is a cross-sectional view of an embodiment of the present invention.
[0033] Figure 4 This is a schematic diagram of the principle of liquid flow carrying away bubbles in the micropores of the square substrate in the utility model.
[0034] Figure 5 It is a structural diagram of a square substrate hanger.
[0035] Figure 6 This is one of the structural diagrams of the spray pipe unit.
[0036] Figure 7 This is the second structural diagram of the spray pipe unit.
[0037] The numbers and letters in the figure represent the names of the corresponding parts:
[0038] 10-main box; 11-partition; 12-spray tank; 13-overflow tank; 14-circulating water outlet; 15-circulating water inlet; 16-vacuum interface; 17-water inlet; 18-drain outlet; 20-hanger mounting bracket; 21-hanger; 211-square base plate; 30-spray pipe unit; 31-spray inlet pipe; 32-spray pipe; 321-spray hole; 322-nozzle; 40-upper cover; 41-opening and closing drive mechanism; 42-pressing mechanism; 50-liquid level monitoring device; 81-micropore; 82-bubble; 83-liquid flow; 91-micropore; 92-bubble. DETAILED DESCRIPTION
[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0040] like Figure 2-7 As shown, one embodiment of the present invention is: a square substrate vacuum wetting device, comprising:
[0041] The main box 10 has an open top, and a vertical partition 11 is provided inside the main box 10. The partition 11 divides the internal space of the main box 10 into a spray pool 12 and an overflow pool 13. A hanger mounting frame 20 for vertically inserting a hanger 21 is provided in the middle of the spray pool 12. The square substrate to be wetted is mounted on the hanger. The hanger 21 has a square opening for leaking out of the two surfaces of the square substrate. A spray pipe unit 30 is provided on each side of the hanger mounting frame 20. Each spray pipe unit 30 includes a spray inlet pipe 31 and multiple Spray pipes 32 are arranged horizontally and parallel to each other. Each end of each spray pipe 32 is connected to the spray inlet pipe 31. The spray pipes 32 are provided with a plurality of spray holes 321 spaced apart from each other. The spray holes 321 on each spray pipe are obliquely upward toward the square substrate to be wetted. A circulating water outlet 14 is provided at the lower portion of the main housing 10 and is connected to the lower portion of the overflow tank 13. A circulating water inlet 15 is provided on the main housing 10 and is connected to the water inlet of the spray pipe unit 30. A vacuum port 16 is provided at the upper portion of the main housing 10 above the partition 11.
[0042] An upper cover plate 40 is openably mounted on the upper opening of the main housing 10 , with a sealing structure provided between the upper cover plate 40 and the main housing 10 ;
[0043] A circulating spray pump is provided outside the main housing 10, the water inlet of the circulating spray pump is connected to the circulating water outlet 14 of the main housing via a pipeline, and the water outlet of the circulating spray pump is connected to the circulating water inlet 15 of the main housing via a pipeline;
[0044] The vacuum unit is arranged on the outside of the main box body 10. The air intake of the vacuum unit is connected to the vacuum interface 16 of the main box body through a pipeline. The vacuum unit is used to vacuum the enclosed space formed between the upper cover plate 40 and the main box body 10.
[0045] When in use, first fill the spray pool and overflow pool in the main box with water. The circulating spray pump forms a spray water circulation between the spray pool and the overflow pool. The hanger loaded with the square substrate is placed vertically in the spray pool. Both sides of the square substrate are immersed in the circulating water in the spray pool. The vacuum unit continuously forms a negative pressure in the main box to help discharge bubbles.
[0046] The beneficial effect of adopting the above technical solution is that under the action of negative pressure, the bubbles in the micropores of the substrate can be smoothly transferred to the mouth of the micropores, and the spray holes of the spray pipe units on both sides of the square substrate face upward, which can generate liquid flows from bottom to top on both sides of the substrate. Figure 4 As shown, the driving force of the liquid flow 83 can smoothly bring the bubbles 82 accumulated at the mouth of the substrate micropores 81 out of the micropores and discharge them upward with the liquid flow, which can significantly reduce or avoid residual air pockets in the microstructures on both surfaces of the square substrate, significantly improve the wetting effect, and ensure the subsequent electroplating quality of the substrate.
[0047] like Figure 6As shown, in some other embodiments of the present invention, the angle between the axis of the spray hole 321 and the horizontal plane is 5-85 degrees.
[0048] like Figure 7 As shown, in some other embodiments of the present invention, a nozzle 322 is installed on the spray hole 321, and a V-shaped groove is provided at the mouth of the nozzle 322.
[0049] In other embodiments of the present invention, a water inlet 17 for injecting water into the main box body is provided on the main box body 10, and a water inlet control valve is installed at the water inlet 17 of the main box body 10; a drain outlet 18 connected to the spray pool 12 and the overflow pool 13 is provided at the bottom of the main box body 10, and the drain control valve is installed at the drain outlet 18 of the main box body 10.
[0050] In other embodiments of the present invention, a vertical slot for placing the hanger 21 is provided on the hanger mounting frame 20, and the two sides of the hanger 21 are inserted into the slot. A plurality of rollers are arranged at intervals in the slot to improve the smoothness of the hanger insertion.
[0051] In other embodiments of the present invention, the two spray pipe units 30 on both sides of the hanger mounting frame 20 are arranged in mirror symmetry. The beneficial effect of adopting the above technical solution is: ensuring the consistency of spraying on both sides of the substrate.
[0052] In other embodiments of the present invention, the projections of the spray holes 321 on the horizontal plane of adjacent spray pipes 32 are arranged in a staggered state. The beneficial effect of adopting the above technical solution is: improving the uniformity of spraying and helping to generate a stable upward liquid flow.
[0053] In other embodiments of the present invention, the height of the vacuum port 16 is higher than the top of the partition 11 .
[0054] In other embodiments of the present invention, a liquid level monitoring device 50 for detecting the liquid level in the overflow tank 13 is also included. The specific form of the liquid level monitoring device 50 is not limited and can be selected from the existing technology. For example, the liquid level monitoring device includes a liquid level tube and a liquid level monitoring sensor. The liquid level tube is installed on the outside of the main box, the lower end of the liquid level tube is connected to the lower part of the overflow tank, and the upper end of the liquid level tube is connected to the top of the overflow tank. The height of the upper end of the liquid level tube is higher than the height of the partition. The beneficial effect of adopting the above technical solution is: convenient control of the liquid addition water level and monitoring of the circulating water operation status.
[0055] In other embodiments of the present invention, the upper cover 40 is hinged to one side of the upper opening of the main box body 10, and an opening and closing drive mechanism 41 is also installed between the upper cover 40 and the outer wall of the main box body. The opening and closing drive mechanism 41 is used to drive the upper cover 40 to open or close. The specific structural form of the opening and closing drive mechanism is not limited and can be selected from the existing technology. For example, the opening and closing drive mechanism is a linear drive device, the telescopic end of the linear drive device is hinged to the upper cover, and the base of the linear drive device is hinged to the bracket on the outer wall of the main box body. The beneficial effect of adopting the above technical solution is: realizing automatic opening and closing of the upper cover.
[0056] In other embodiments of the present invention, a clamping mechanism 42 for pressing the upper cover against the upper opening of the main box 10 is installed on the side of the main box 10 opposite to the opening and closing drive mechanism 41. The specific structural form of the clamping mechanism is not limited and can be selected from the existing technology. For example, the clamping mechanism includes a clamping block and a linear drive cylinder, the telescopic rod of the linear drive cylinder is connected to the clamping block, and the cylinder body of the linear drive cylinder is fixedly connected to the outer wall of the main box. The beneficial effect of adopting the above technical solution is: automatic clamping of the upper cover is achieved, and the sealing between the upper cover and the main box is improved.
[0057] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable ordinary technicians in this field to understand the content of the present invention and implement it. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.
Claims
1. A square substrate vacuum wetting device, characterized in that: include: A main box body, the upper end of which is open, and a vertical partition is provided in the main box body, the partition dividing the internal space of the main box body into a spray pool and an overflow pool, a hanger mounting frame for vertically placing a hanger is provided in the middle of the spray pool, and the square substrate to be wetted is mounted on the hanger, and a spray pipe unit is provided on each side of the hanger mounting frame, each of the spray pipe units includes a spray inlet pipe and a plurality of spray pipes connected to the spray inlet pipe, and each of the spray pipes is provided with a plurality of spray holes distributed at intervals, and the spray holes are obliquely upward toward the substrate to be wetted; An upper cover plate, which is openably and closably mounted on the upper opening of the main box body; a circulating spray pump, used to pump the spray water in the overflow tank out to the spray pipe unit; The vacuum unit is used to extract a vacuum from the enclosed space formed between the upper cover and the main box body.
2. The square substrate vacuum wetting device according to claim 1, characterized in that: The angle between the axis of the spray hole and the horizontal plane is 5-85 degrees.
3. The square substrate vacuum wetting device according to claim 2, characterized in that: A nozzle is installed on the spray hole, and a V-shaped groove is provided at the mouth of the nozzle.
4. The square substrate vacuum wetting device according to claim 2, characterized in that: The projections of the spray holes on the adjacent spray pipes on the horizontal plane are arranged in a staggered state.
5. The square substrate vacuum wetting device according to claim 1, characterized in that: It also includes a liquid level monitoring device for detecting the liquid level in the overflow tank.
6. The square substrate vacuum wetting device according to claim 5, characterized in that: The liquid level monitoring device includes a liquid level tube and a liquid level monitoring sensor. The liquid level tube is installed on the outside of the main box. The lower end of the liquid level tube is connected to the lower part of the overflow tank, and the upper end of the liquid level tube is connected to the top of the overflow tank. The upper end of the liquid level tube is higher than the height of the partition.
7. The square substrate vacuum wetting device according to claim 1, characterized in that: The upper cover is hinged to one side of the upper opening of the main box body. An opening and closing drive mechanism is installed between the upper cover and the outer wall of the main box body. The opening and closing drive mechanism is used to drive the upper cover to open or close.
8. The square substrate vacuum wetting device according to claim 7, characterized in that: The opening and closing drive mechanism is a linear drive component, the telescopic end of the linear drive component is hinged to the upper cover plate, and the base of the linear drive component is hinged to the bracket on the outer wall of the main box body.
9. The square substrate vacuum wetting device according to claim 1, characterized in that: A pressing mechanism for pressing the upper cover against the upper opening of the main box body is installed on a side of the main box body opposite to the opening and closing drive mechanism.
10. The square substrate vacuum wetting device according to claim 9, characterized in that: The pressing mechanism includes a pressing block and a linear drive cylinder, the telescopic rod of the linear drive cylinder is connected to the pressing block, and the cylinder body of the linear drive cylinder is fixedly connected to the outer wall of the main box body.