Gas pipeline system
By setting up multiple outlet pipes and outlet holes in the DSSL chamber, the problem of uneven cooling of the glass substrate is solved, and rapid and uniform cooling and efficient sealing connection are achieved to meet the installation requirements of large-size chambers.
Patent Information
- Application Number
- CN202422105705.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-08-29
AI Technical Summary
In existing liquid crystal display panel thin film deposition equipment, the nitrogen diffusion rate in the DSSL chamber is slow, resulting in uneven cooling of the glass substrate, which is especially obvious on large-sized glass substrates and increases process time.
Multiple air outlet pipes are arranged in the DSSL chamber, and each air outlet pipe is provided with multiple air outlet holes. The air outlet holes are arranged at intervals along the extension direction of the air outlet pipe, and the air outlet holes blow air in multiple directions. One end of the air outlet pipe is fixedly connected and the other end is movably connected, and is sealed with the flange through a pan sealing ring.
It achieves rapid and uniform cooling of the glass substrate, improves cooling efficiency, reduces temperature differences, adapts to the installation requirements of larger chambers, and maintains good sealing.
Smart Images

Figure CN223319328U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of glass substrate cooling equipment, and more specifically, to a gas pipeline system. Background Art
[0002] The DSSL chamber (atmosphere / vacuum conversion chamber) of the liquid crystal display panel thin film deposition equipment mainly functions as a transfer station. It continuously switches between vacuum and atmospheric states to load and unload the "glass substrate".
[0003] During loading, the DSSL chamber simultaneously cools the glass substrate. However, existing equipment utilizes gas ventilation and diffusion holes in the top of the DSSL chamber. During loading, nitrogen is injected through these holes, achieving both the transition from vacuum to atmospheric conditions and the cooling effect. This approach, due to the limited number of nitrogen inlets and outlets, results in slow gas diffusion. Furthermore, for large glass substrates, uniform nitrogen diffusion is difficult to ensure, resulting in uneven cooling of the glass substrate and increased process time. Utility Model Content
[0004] The utility model provides a gas pipeline system, which is combined with a DSSL chamber to cool a glass substrate. The cooling gas can be quickly diffused through the gas pipeline system, thereby improving the cooling uniformity of the glass substrate.
[0005] In order to achieve the above-mentioned purpose, the technical solution provided by the present utility model is:
[0006] A gas pipeline system includes a plurality of gas outlet pipes, wherein the gas outlet pipes are located in a chamber, and the two ends of the gas outlet pipes are respectively connected to two opposite side walls of the chamber;
[0007] At least one end of the air outlet pipe is connected to the main air inlet pipe; an air flow channel is provided in the air outlet pipe, and a plurality of air outlet holes connected to the air flow channel are provided on one side of the air outlet pipe close to the center of the chamber.
[0008] Furthermore, the air outlet holes are arranged at intervals along the extension direction of the air outlet pipe.
[0009] Furthermore, the air outlet holes are arranged in multiple rows along the extension direction of the air outlet pipe; one row of the air outlet holes is located directly below the air outlet pipe, and the other rows of the air outlet holes are located on the side of the row of the air outlet holes and are offset at an angle α relative to the row of the air outlet holes.
[0010] Preferably, the air outlet pipe is arranged close to the top of the chamber.
[0011] In one embodiment, one end of the air outlet pipe is connected to the chamber side wall via a first flange, and the other end is connected to the other opposite chamber side wall via a second flange.
[0012] Furthermore, the air outlet pipe is fixedly connected to the first flange, and the air outlet pipe is movably connected to the second flange.
[0013] Furthermore, a pan sealing ring is provided between the air outlet pipe and the second flange, retaining rings are provided on both sides of the pan sealing ring, and the retaining rings are embedded on the second flange.
[0014] In another embodiment, sealing rings are provided between the first flange and the second flange and the side wall of the chamber for sealing connection.
[0015] Furthermore, a groove is formed on one side of the first flange and the second flange close to the side wall of the chamber for mounting the sealing ring.
[0016] Furthermore, the space between the opening and the bottom of the groove gradually increases.
[0017] Compared with the prior art, the technical solution provided by this utility model has the following beneficial effects:
[0018] (1) A gas pipeline system of the present invention is provided with a plurality of gas outlet pipes in a chamber, and a plurality of gas outlet holes are provided on each gas outlet pipe, so that the gas outlet holes are dispersed in different parts of the chamber. The cooling gas blown out through the gas outlet holes can diffuse rapidly in the chamber, thereby evenly cooling the glass substrate.
[0019] (2) The utility model provides a gas pipeline system, in which the air outlet holes are arranged at intervals along the extension direction of the air outlet pipe, and the air outlet holes are arranged in multiple rows, thereby increasing the number of the air outlet holes and making the air outlet holes blow air in multiple directions, thereby promoting the rapid diffusion of the cooling gas and improving the cooling effect.
[0020] (3) The utility model provides a gas pipeline system in which one end of the gas outlet pipe is fixedly connected and the other end is movably connected. When the gas outlet pipe is installed in a larger chamber, when the installation tolerance is relatively large, the gas outlet pipe can be easily installed.
[0021] (4) In a gas pipeline system of the present invention, a pan-seal ring is provided between the gas outlet pipe and the second flange. The pan-seal ring can seal the gas outlet pipe and the second flange on the one hand, and can also realize a movable connection between the gas outlet pipe and the second flange on the other hand, thereby realizing dynamic sealing between the gas outlet pipe and the second flange. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a schematic diagram of the overall layout of the gas pipeline system;
[0023] Figure 2 This is a schematic diagram of the enlarged structure of the exhaust pipe;
[0024] Figure 3 Schematic diagram of the exhaust pipe;
[0025] Figure 4 for Figure 3 Schematic diagram of the cross section of the middle outlet pipe BB;
[0026] Figure 5 for Figure 3 Schematic diagram of the AA section of the middle outlet pipe;
[0027] Figure 6 for Figure 4 The enlarged schematic diagram of point C in the middle;
[0028] Figure 7 for Figure 6 Enlarged schematic diagram at point D in the middle.
[0029] Description of labels:
[0030] 1. Main air inlet pipe; 2. Air outlet pipe; 21. Air flow channel; 22. Air outlet hole; 23. First flange; 231. Groove; 24. Second flange; 25. Sealing ring; 26. Pan sealing ring; 27. Retaining ring; 3. Chamber side wall; 4. Tail pipe. DETAILED DESCRIPTION
[0031] In order to further understand the content of the present invention, the present invention is described in detail with reference to the accompanying drawings and embodiments.
[0032] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in this specification so as to facilitate understanding and reading by those familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, without affecting the efficacy and objectives that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed in the present invention.
[0033] At the same time, the terms such as "upper," "lower," "inner," "outer," and "middle" cited in this specification are only for the convenience of description and are not intended to limit the scope of implementation. Changes or adjustments to their relative relationships, without substantially changing the technical content, should also be considered as the scope of implementation of this utility model. In addition, in addition to being used to indicate orientation or positional relationships, some of the above terms may also be used to express other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to the specific circumstances.
[0034] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, for the purposes of describing the embodiments of the present application herein.
[0035] like Figure 1 As shown, this embodiment provides a gas pipeline system installed on a liquid crystal display panel thin film deposition equipment platform, specifically integrated with the equipment's DSSL chamber. Cooling gas is passed through the pipeline to cool the glass substrate in the DSSL chamber. The cooling gas in this embodiment is nitrogen, but other cooling gases can also be used in other embodiments.
[0036] Specifically, a gas piping system includes a plurality of outlet pipes 2 located within a chamber, with both ends of the outlet pipes 2 connected to two opposing chamber sidewalls 3. The outlet pipes 2 are arranged horizontally between the two opposing chamber sidewalls 3, with multiple outlet pipes 2 arranged in parallel. Furthermore, both ends of the outlet pipes 2 extend through the chamber sidewalls 3 to the outside of the chamber.
[0037] The ends of the outlet pipe 2 are connected to the main inlet pipe 1. An airflow channel 21 is provided within the outlet pipe 2. Several outlet holes 22 are provided on one side of the outlet pipe 2, near the center of the chamber, and communicate with the airflow channel 21. Cooling gas enters through the main inlet pipe 1 at both ends of the outlet pipe 2, is then divided into the airflow channels 21 within each outlet pipe 2, and is blown out through the outlet holes 22.
[0038] In this embodiment, a plurality of air outlet pipes 2 are provided in the chamber, and a plurality of air outlet holes 22 are provided on each air outlet pipe 2. The cooling gas blown out through the air outlet holes 22 can diffuse rapidly in the chamber, thereby evenly cooling the glass substrate.
[0039] Both ends of the outlet pipe 2 are connected to the main inlet pipe 1, allowing cooling gas to be input from both ends of the outlet pipe 2, allowing cold air to quickly flow into the outlet pipe 2, thereby improving cooling efficiency. This also reduces the temperature difference between the two ends of the outlet pipe 2, thereby improving the uniformity of cooling the glass substrate. However, in other embodiments, one end of the outlet pipe 2 can be connected to the main inlet pipe 1, while the other end of the outlet pipe 2 is connected to the tail pipe 4, which then communicates with the other end of the outlet pipe 2.
[0040] Combine Figure 3 and Figure 5 As shown, the air outlet holes 22 are arranged at intervals along the extension direction of the air outlet pipe 2. In a preferred embodiment, the air outlet holes 22 are arranged at equal intervals along the extension direction of the air outlet pipe 2. More specifically, the air outlet holes 22 are arranged in three rows along the extension direction of the air outlet pipe 2, one of which is located directly below the air outlet pipe 2 (with Figure 1Taking the view orientation as an example, the other two rows are located on either side of the row and offset from it by an angle α, with angle α being no greater than 50°. Specifically, angle α can be set to 30°, 45°, etc. Providing multiple rows of air outlets 22 increases the number of air outlets 22 and allows the air outlets 22 to blow air in multiple directions, thereby enhancing the cooling effect. In other embodiments, other numbers of rows of air outlets 22 may also be provided, depending on cooling requirements.
[0041] In this embodiment, the air outlet pipe 2 is positioned near the top of the chamber, and the air outlet holes 22 are all oriented toward the center of the chamber. After the glass substrate is loaded into the chamber, the air outlet holes 22 are all oriented toward the glass substrate. The air outlet holes 22 are evenly distributed within the chamber, allowing the cold air blown through the air outlet holes 22 to quickly diffuse within the chamber, rapidly cooling the glass substrate. The even distribution of the air outlet holes 22 minimizes temperature differences between different locations within the chamber, resulting in uniform cooling of the glass substrate.
[0042] In addition, the inside of the outlet pipe 2 is surface treated to increase the corrosion resistance of the pipe and thus prolong its service life. For example, the inside of the outlet pipe 2 may be surface blackened.
[0043] Combine Figure 2 、 Figure 3 and Figure 4 As shown, one end of the outlet pipe 2 is connected to the chamber sidewall 3 via a first flange 23, and the other end is connected to the opposite chamber sidewall 3 via a second flange 24. The first flange 23 and the second flange 24 can be fixedly connected to the chamber sidewall 3 by bolts, making it easy to disassemble the outlet pipe 2 for maintenance.
[0044] In a preferred embodiment, the outlet pipe 2 is fixedly connected to the first flange 23 and flexibly connected to the second flange 24. The fixed connection at one end and the flexibly connected at the other end of the outlet pipe 2 facilitate installation of the outlet pipe 2 in a larger chamber with larger installation tolerances. Specifically, a pan seal 26 is disposed between the outlet pipe 2 and the second flange 24, with retaining rings 27 disposed on either side of the pan seal 26. The retaining rings 27 are embedded in the second flange 24 and are elastic, facilitating their removal and installation. The outlet pipe 2 passes through the pan seal 26, positioning the pan seal 26 between the two flanges. The retaining rings 27 prevent the pan seal 26 from being dislodged. The pan seal 26 provides a seal between the outlet pipe 2 and the second flange 24 while also enabling a flexibly connected connection between the two flanges.
[0045] In order to improve the sealing performance of the chamber, a sealing ring 25 is provided between the first flange 23 and the second flange 24 and the chamber side wall 3 for sealing connection. Figure 6 and Figure 7As shown, specifically, a groove 231 is formed on one side of the first flange 23 and the second flange 24 near the chamber sidewall 3, and a sealing ring 25 is installed in the groove 231. Moreover, the space between the opening and the bottom of the groove 231 gradually increases, which can effectively prevent the sealing ring 25 from falling out of the groove 231.
[0046] The terms "installed," "disposed," "equipped with," and "connected" as used herein should be interpreted broadly. For example, they may refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.
[0047] The above is a schematic description of the present invention and its embodiments, which is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. Therefore, if a person skilled in the art is inspired by this and, without departing from the inventive purpose of the present invention, designs a structure and embodiment similar to the technical solution without inventiveness, they shall fall within the scope of protection of the present invention.
Claims
1. A gas piping system, installed on a liquid crystal display panel thin film deposition equipment platform, is used to cool the glass substrate in the DSSL chamber, characterized by: It comprises a plurality of air outlet pipes (2), the air outlet pipes (2) being located in the chamber and arranged above the glass substrate, and the two ends of the air outlet pipes (2) being respectively connected to two opposite chamber side walls (3) of the chamber; At least one end of the air outlet pipe (2) is connected to the main air inlet pipe (1); an air flow channel (21) is provided in the air outlet pipe (2); a plurality of air outlet holes (22) in communication with the air flow channel (21) are provided on one side of the air outlet pipe (2) close to the center of the chamber, and the air outlet holes (22) are arranged toward the glass substrate; The air outlet holes (22) are arranged at intervals along the extension direction of the air outlet pipe (2); The air outlet holes (22) are arranged in multiple rows along the extension direction of the air outlet pipe (2); one row of the air outlet holes (22) is located directly below the air outlet pipe (2), and the other rows of the air outlet holes (22) are located on the side of the row of the air outlet holes (22) and are offset at an angle α relative to the row of the air outlet holes (22), and the angle α is not greater than 50°.
2. The gas pipeline system according to claim 1, characterized in that: The air outlet pipe (2) is arranged close to the top of the chamber.
3. The gas pipeline system according to claim 1, characterized in that: One end of the air outlet pipe (2) is connected to the chamber side wall (3) via a first flange (23), and the other end is connected to the other opposite chamber side wall (3) via a second flange (24).
4. The gas pipeline system according to claim 3, characterized in that: The air outlet pipe (2) is fixedly connected to the first flange (23), and the air outlet pipe (2) is movably connected to the second flange (24).
5. The gas pipeline system according to claim 4, characterized in that: A pan seal ring (26) is provided between the air outlet pipe (2) and the second flange (24), retaining rings (27) are provided on both sides of the pan seal ring (26), and the retaining rings (27) are embedded in the second flange (24).
6. The gas pipeline system according to claim 3, characterized in that: A sealing ring (25) is provided between the first flange (23) and the second flange (24) and the chamber side wall (3) for sealing connection.
7. The gas pipeline system according to claim 6, characterized in that: A groove (231) is provided on one side of the first flange (23) and the second flange (24) close to the chamber side wall (3) for mounting the sealing ring (25).
8. The gas pipeline system according to claim 7, characterized in that: The space between the opening and the bottom of the groove (231) gradually increases.