Acoustic vibration temperature sensor and monitoring system for two-wire Ethernet power supply and communication

Abstract

The utility model discloses a two-wire Ethernet power supply and communication acoustic vibration temperature sensor and a monitoring system, and relates to the technical field of intelligent industrial monitoring. The device comprises a processing module, the processing module is respectively connected with a sound module, a vibration module, a temperature module, a storage module and a magnetic field intensity module, the sound module is used for collecting sound signals and transmitting the sound signals to the processing module, and the vibration module is used for collecting vibration signals of the device and transmitting the vibration signals to the processing module. The temperature sensor is used for collecting equipment temperature signals and transmitting the equipment temperature signals to the processing module; according to the utility model, the three-axis vibration sensor, the voiceprint sensor, the temperature sensor and the magnetic sensor are integrated, the element acquisition is more comprehensive, the diagnosis conclusion is more accurate, the comprehensive advantage is more obvious compared with the single function of the traditional IEPE (Integrated Electrical and Power Element) sensor, the high-speed transmission rate of the traditional Ethernet technology is inherited, and the high-speed transmission rate of the traditional Ethernet technology is realized. And the interface complexity of the traditional Ethernet is simplified, and high-speed (10Mbps) and long-distance (1KM) transmission is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of intelligent industrial monitoring, in particular to an acoustic vibration temperature sensor and a monitoring system for two-wire Ethernet power supply and communication. Background Art

[0002] The convenience of wireless sensors has become popular and widely used. However, they also have a fatal drawback: the real-time monitoring cannot be guaranteed. For some non-steady-state equipment, such as machine tools and elevators, or special scenarios such as underwater pump monitoring, wireless sensors are insufficient in these scenarios, and wired sensors must be used. IEPE piezoelectric accelerometers occupy half of the industrial predictive maintenance market. Their principle is to output the dynamic acceleration of the sensing device and send it to the collector for high-speed real-time sampling. The total acceleration value, waveform, spectrum, envelope, etc. of the device are collected and calculated for equipment fault diagnosis and analysis. However, this sensor requires a multi-channel collector for use and is expensive. The overall cost is very high, making it difficult to fully promote. To this end, we propose a two-wire Ethernet power supply and communication acoustic vibration temperature sensor and monitoring system. Utility Model Content

[0003] The purpose of the present invention is to provide an acoustic vibration temperature sensor and a monitoring system with two-wire Ethernet power supply and communication, so as to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention provides the following technical solutions: a two-wire Ethernet power supply and communication acoustic vibration temperature sensor, comprising a processing module, to which a sound module, a vibration module, a temperature module, and a magnetic field strength module are connected, respectively; the sound module is used to collect sound signals and transmit them to the processing module; the vibration module is used to collect vibration signals of the device and transmit them to the processing module; and the temperature sensor is used to collect temperature signals of the device and transmit them to the processing module;

[0005] The processing module is equipped with a MAC interface chip and a PHY interface chip.

[0006] Furthermore, it also includes a storage module for caching data.

[0007] Furthermore, the processing module and the sound module, vibration module, temperature module, storage module and magnetic field strength module all use a digital communication SPI interface or an I2C interface.

[0008] Furthermore, the sound module is configured as a MEMS (Micro-Electro Mechanical System) digital microphone.

[0009] Furthermore, the vibration module is configured as a MEMS (Micro-Electro Mechanical System) acceleration sensor, and the vibration frequency response is 8K in three axes.

[0010] Furthermore, the temperature module is configured as a temperature sensor.

[0011] Furthermore, the storage module is configured as a FLASH memory.

[0012] Furthermore, the magnetic field strength module is configured as a magnetic field strength sensor for collecting magnetic field waveforms when the motor is running, and calculating the motor's speed and load conditions through the waveforms.

[0013] Furthermore, the processing module is a 160MHz CortexM33 MCU (Microcontroller Unit), and a digital communication SPI interface or I2C interface is used between the processing module and the storage module.

[0014] According to a first aspect of the present invention, the present invention provides an industrial equipment monitoring system, comprising the acoustic vibration temperature sensor with two-wire Ethernet power supply and communication.

[0015] The utility model has at least the following beneficial effects:

[0016] 1. This utility model adopts two-wire Ethernet technology, based on the latest 10BASE-T1L global specification. It inherits the high-speed transmission rate of traditional Ethernet technology and simplifies the interface complexity of traditional Ethernet, realizing high-speed (10Mbps), long-distance (1KM) transmission, intrinsic safety and explosion-proof certification, and other extremely important functions in the field of industrial applications. Due to high-speed transmission, indicators can be transmitted in seconds, and waveforms and frequencies are transmitted as defined, thus ensuring the real-time nature of industrial monitoring.

[0017] 2. This new device integrates three-axis vibration, voiceprint, temperature, and magnetic sensors, collecting more comprehensive elements and making diagnostic conclusions more accurate. Compared with the single function of traditional IEPE (Integrated Electronics Piezo-Electric) sensors, it not only reduces costs but also improves overall performance, with particularly obvious comprehensive advantages.

[0018] 3. This utility model integrates the MQTT (Message Queuing Telemetry Transport) protocol, and directly connects the hardware with the platform software for rapid integration.

[0019] 4. This utility model adopts Ethernet-APL communication technology, two-core twisted pair cable, high speed, long distance, compatible with Ethernet port, no need for acquisition station, super cost-effective, the two-core cable integrates communication and power supply functions, wiring and maintenance become very easy, and wiring cost is advantageous.

[0020] 5. This utility model has a built-in high-performance MCU processing module, which can set a variety of alarm modes and upload the alarm waveform spectrum when the alarm is triggered.

[0021] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0023] Reference numerals:

[0024] 1. Processing module; 2. Sound module; 3. Vibration module; 4. Temperature module; 5. Storage module; 6. Magnetic field strength module; 7. MAC interface chip and PHY interface chip. DETAILED DESCRIPTION

[0025] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0026] See also Figure 1 The utility model provides a technical solution: a two-wire Ethernet power supply and communication acoustic vibration temperature sensor, comprising a processing module 1, to which are respectively connected a sound module 2, a vibration module 3, a temperature module 4, a storage module 5 and a magnetic field strength module 6; the sound module 2 is used to collect sound signals and transmit them to the processing module 1; the vibration module 3 is used to collect vibration signals of the device and transmit them to the processing module 1; the temperature sensor is used to collect temperature signals of the device and transmit them to the processing module 1; and the memory is used to cache data;

[0027] The processing module 1 is equipped with a MAC interface chip and a PHY interface chip 7 .

[0028] According to the technical solution of this application, the processing module 1 adopts a high-performance, low-power 160MHz CortexM33 MCU (Microcontroller Unit). Considering that the power supply adopts a two-core cable, it is necessary to balance performance and power consumption.

[0029] It should be noted that the processing module 1 and the storage module 5, the sound module 2, the vibration module 3, the temperature module 4, the storage module 5 and the magnetic field strength module 6 are all digital communication SPI (Serial Peripheral Interface) or I2C (Inter-Integrated Circuit bidirectional two-wire synchronous serial bus) interfaces.

[0030] The SPI (Serial Peripheral Interface) bus is a synchronous serial interface technology introduced by Motorola. The SPI bus system is a synchronous serial external interface that allows the MCU to communicate and exchange data with various peripheral devices in a serial manner. Peripheral devices include FLASHRAM, A / D converters, network controllers, MCUs, etc. SPI is a high-speed, full-duplex, synchronous communication bus.

[0031] IIC (Inter-Integrated Circuit) is actually short for IICBus, so its Chinese name should be Integrated Circuit Bus. It is a serial communication bus using a multi-master-slave architecture. It was developed by Philips in the 1980s to allow motherboards, embedded systems, or mobile phones to connect low-speed peripheral devices. The I2C serial bus generally has two signal lines: a bidirectional data line (SDA) and a clock line (SCL). All serial data SDA lines connected to the I2C bus are connected to the bus's SDA line, and the clock line SCL of each device is connected to the bus's SCL line.

[0032] According to the technical solution of this application, the sound module 2 is set as a MEMS (Micro-Electro Mechanical System) digital microphone, which is convenient for collecting on-site noise, identifying abnormal sounds of the equipment, and then transmitting the sound signal to the processing module 1.

[0033] It should be further explained that the sound module 2 supports a sampling frequency of at least 11025 and a maximum of 44100, and the audio sampling accuracy is 24 bits.

[0034] After the sound module 2 collects the data, it uses DMA, direct memory access, to transfer the data in the audio module directly to the MCU. This method reduces the pressure on the MCU, has a fast transmission speed, and can support the collection of higher frequency sounds.

[0035] To facilitate data processing, the sound module 2 scales down the collected original data to 16 bits to obtain data with minimal loss.

[0036] There are two ways to process the collected data:

[0037] a. Directly upload the original data, you can hear the complete audio and calculate the current decibel value based on the audio waveform data;

[0038] b. Collect audio waveforms over a shorter period of time to calculate the current ambient noise.

[0039] Further, audio decibel algorithm

[0040] 1. Remove the mean of the original data;

[0041] 2. Take the maximum value (maxValue) in the raw data and calculate the current sound pressure based on the sensor coefficient (coe) and the maximum output value of the hardware power supply;

[0042] P = maxValueCoe

[0043] 3. Use the standard sound pressure and the current sound pressure for calculation. Use the log function to get the ratio, and after correction, get the current decibel value;

[0044]

[0045] dB stands for decibel, P stands for actual sound pressure level, P0 is the reference sound pressure level, generally 20 μPa (0.00002); Log is the logarithm. Coe is the sensor coefficient.

[0046] Furthermore, the vibration module 3 is configured as a MEMS (Micro-Electro Mechanical System) acceleration sensor with a vibration frequency response of 8K in three axes and a low frequency of 0.1 Hz, covering common equipment failures. Compared with three-axis piezoelectric products, the cost and volume are particularly significant.

[0047] It should be further explained that the original value collected by the vibration module 3 is acceleration, which supports a sampling frequency of at least 8000 and at most 32000, and an audio sampling accuracy of 16 bits;

[0048] After the vibration module 3 collects the data, the SPI bus is used to read the data from the vibration module 3 into the MCU;

[0049] There are three ways to process the collected data:

[0050] a. Directly upload the original data to obtain the current vibration waveform;

[0051] b. Collect the vibration waveform for a short period of time to calculate the current vibration index;

[0052] c. According to the acceleration vibration waveform, integrate to obtain the velocity waveform.

[0053] The data processing algorithm for vibration module 3 includes the following:

[0054] 1. Indicators include traditional effective value, speed value, maximum value, minimum value, peak value, peak-to-peak value, etc.

[0055] 2. Classic indicators: original data, after one-to-one comparison, obtain maximum value, minimum value, peak value, and peak-to-peak value.

[0056] 3. Effective value: Take the average of the original vibration waveform, calculate the sum of squares, and then take the square root to get the effective value:

[0057]

[0058] 4. Speed ​​value: Perform a fast Fourier transform on the data, extract the speed value from 10-1000 Hz, and then calculate its RMS.

[0059] Furthermore, the temperature module 4 is configured as a digital temperature sensor for measuring and monitoring the operating temperature of the equipment. In some embodiments, the temperature sensor can be configured as a thermocouple, a thermistor, a platinum resistor (RTD) or a temperature IC sensor. For the technical solution of the present application, the temperature sensor is configured as a thermocouple sensor; the thermocouple is composed of two metal wires of different materials, welded together at the ends. By measuring the ambient temperature of the unheated part, the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities are also different. The sensitivity of a thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1°C. For most thermocouples supported by metal materials, this value is approximately between 5 and 40 microvolts / °C.

[0060] Since the sensitivity of thermocouple temperature sensors has nothing to do with the thickness of the material, temperature sensors can be made with very fine materials. Also, because the metal material used to make thermocouples has good ductility, this fine temperature measuring element has an extremely high response speed and can measure rapidly changing processes.

[0061] Temperature module 4 supports temperature reading from -40 to +125 degrees. After collecting data, the temperature module 4 uses the I2C bus to read the data from the temperature module into the MCU.

[0062] For the data collected by temperature module 4, directly upload the original data to get the current temperature value; the specific processing can be based on the coefficients provided in the chip manual to calculate the current temperature value:

[0063] TempvalueCoe

[0064] Temp: Actual temperature. Value: Sensor raw data. Coe: Sensor coefficient.

[0065] Furthermore, the storage module 5 is configured as a FLASH memory. Flash memory (English: flash memory) is a form of electronically erasable programmable read-only memory that allows it to be erased or written multiple times during operation. This technology is mainly used for general data storage and for exchanging and transmitting data between computers and other digital products, such as memory cards and USB flash drives. Flash memory is a special EPROM that is erased and written in macroblocks.

[0066] Furthermore, the magnetic field strength module 6 is configured as a magnetic field strength sensor, which is mainly used to collect the magnetic field waveform when the motor is running, and calculate the motor speed and load condition through the waveform. For the technical solution of this application, the magnetic field strength sensor used is the German Nada EHP50F magnetic field sensor 1Hz-400kHz (550g).

[0067] The original value collected by the magnetic field strength module 6 is the magnetic field signal. After the magnetic field module 6 collects the data, it uses the I2C bus to read the data of the magnetic field module into the MCU;

[0068] There are two ways to process the collected data:

[0069] a. Directly upload the original data to obtain the current magnetic field waveform;

[0070] b. Collect magnetic field waveforms for a short period of time to calculate the current magnetic field indicators.

[0071] Specific processing algorithm:

[0072] 1. Indicators include traditional effective value and rotation frequency;

[0073] 2. Effective value: The effective value is obtained by taking the average of the original magnetic field waveform, calculating the sum of squares, and taking the square root;

[0074] 3. Frequency conversion: Perform a fast Fourier transform on the data. Obtain the value in the frequency domain, take the highest point, and obtain the current frequency.

[0075] 4. Speed: The speed is obtained based on the slip rate, pole pair number, and rotation frequency;

[0076] Speed ​​= rotational frequency × 60 × (1-slip) / number of pole pairs.

[0077] Specifically, the utility model adopts two-wire Ethernet technology based on the latest 10BASE-T1L global specification. It inherits the high-speed transmission rate of traditional Ethernet technology and simplifies the interface complexity of traditional Ethernet, realizing high-speed (10Mbps), long-distance (1KM) transmission, intrinsically safe explosion-proof certification and other extremely important functions in the field of industrial applications. Due to high-speed transmission, indicators can be transmitted in seconds, and waveforms and frequencies are transmitted as defined, thereby ensuring the real-time nature of industrial monitoring. In addition, the utility model integrates 3-axis vibration, voiceprint, temperature, and magnetic field sensors, with more comprehensive collection elements and more accurate diagnostic conclusions. Compared with the single function of traditional IEPE (Integrated Electronics Piezo-Electric piezoelectric integrated circuit) sensors, the comprehensive advantages are particularly obvious.

[0078] According to one aspect of the present invention, the present invention provides an industrial equipment monitoring system, comprising the two-wire Ethernet power supply and communication acoustic vibration temperature sensor.

[0079] To sum up, the utility model integrates three-axis vibration, voiceprint, temperature, and magnetic sensors, collects more comprehensive elements, and makes the diagnostic conclusions more accurate. Compared with the single function of traditional IEPE (Integrated Electronics Piezo-Electrical Integrated Circuit) sensors, it not only reduces costs but also improves comprehensive performance, and its comprehensive advantages are particularly obvious.

[0080] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0081] For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances. When an element is referred to as being "assembled on", "installed on", "fixed on" or "set on" another element, it can be directly on the other element or there can be a central element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be a central element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0082] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

[0083] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims

1. An acoustic vibration temperature sensor with two-wire Ethernet power supply and communication, comprising a processing module (1), characterized in that: The processing module (1) is respectively connected to a sound module (2), a vibration module (3), a temperature module (4), and a magnetic field strength module (6); the sound module (2) is used to collect sound signals and transmit them to the processing module (1); the vibration module (3) is used to collect vibration signals of the device and transmit them to the processing module (1); and the temperature module is used to collect temperature signals of the device and transmit them to the processing module (1); A MAC interface chip and a PHY interface chip (7) are installed on the processing module (1).

2. The two-wire Ethernet power supply and communication acoustic vibration temperature sensor according to claim 1, characterized in that: It also includes a storage module (5) for caching data.

3. The two-wire Ethernet power supply and communication acoustic vibration temperature sensor according to claim 2, characterized in that: The processing module (1), the sound module (2), the vibration module (3), the temperature module (4), the storage module (5) and the magnetic field strength module (6) all use a digital communication SPI interface or an I2C interface.

4. The two-wire Ethernet power supply and communication acoustic vibration temperature sensor according to claim 2, characterized in that: The sound module (2) is configured as a MEMS digital microphone.

5. The two-wire Ethernet power supply and communication acoustic vibration temperature sensor according to claim 4, characterized in that: The vibration module (3) is configured as a MEMS acceleration sensor, and the vibration frequency response is 8K on three axes.

6. The two-wire Ethernet power supply and communication acoustic vibration temperature sensor according to claim 5, characterized in that: The temperature module (4) is configured as a temperature sensor.

7. The two-wire Ethernet power supply and communication acoustic vibration temperature sensor according to claim 6, characterized in that: The storage module (5) is configured as a FLASH memory.

8. The two-wire Ethernet power supply and communication acoustic vibration temperature sensor according to claim 6, characterized in that: The magnetic field strength module (6) is configured as a magnetic field strength sensor, and is used to collect magnetic field waveforms when the motor is running, and calculate the rotation speed and load condition of the motor through the waveforms.

9. The two-wire Ethernet power supply and communication acoustic vibration temperature sensor according to claim 8, characterized in that: The processing module (1) is a 160MHz CortexM33 MCU, and a digital communication SPI interface or I2C interface is used between the processing module (1) and the storage module (5).

10. A monitoring system, characterized in that: An acoustic vibration temperature sensor with two-wire Ethernet power supply and communication according to any one of claims 1 to 8.

Images