Simple insulation and voltage resistance testing device

Abstract

The utility model discloses a simple insulation and voltage resistance testing device, which is characterized in that all PINs in a power semiconductor module comprising a plurality of ceramic substrates are connected in series through a contact chip, a lead and a switch on an insulating plate, are cut off and grouped according to the ceramic substrates to which the PINs belong, and form a complete current loop together with a power supply, a current tester and a metal plate; according to the invention, which ceramic substrate in a power semiconductor module comprising a plurality of ceramic substrates has poor insulation points can be accurately detected in an insulation and voltage resistance test, the overall structure is simple, the manufacture is convenient, the cost is low, and in addition, the contact sheet matched with the shape of the PIN is adopted, so that the damage risk of the PIN is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of power semiconductor module detection, in particular to a simple insulation withstand voltage testing device. Background Art

[0002] A power semiconductor module in the prior art includes multiple ceramic substrates, on which multiple PIN pins are packaged. The currently used insulation and voltage withstand tester uses a power source to drive a probe group to press down and contact all the PIN pins, and then applies voltage to measure the current. This verifies whether the insulation performance of the entire power semiconductor module is good. If there are poor insulation points, it is impossible to accurately determine which ceramic substrate they are on. In addition, the insulation and voltage withstand tester needs to replace different probe groups when testing different power semiconductor modules, which is costly, and the power source needs to fully press the probe group to ensure that it is in good contact with all the PIN pins, which can easily cause damage to the PIN pins. Utility Model Content

[0003] In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a simple insulation withstand voltage test device, which can accurately detect which ceramic substrate in a power semiconductor module comprising multiple ceramic substrates has an insulation defect point.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention to solve its technical problems is a simple insulation and voltage withstand test device for testing a power semiconductor module. The power semiconductor module includes at least two ceramic substrates, and a plurality of PIN pins are provided on the ceramic substrates. The simple insulation and voltage withstand test device includes a power supply, a current detector, a metal plate and an insulating plate. The metal plate is used to support the ceramic substrate and is connected to the negative pole of the power supply. The insulating plate is provided with a plurality of contact pieces, a plurality of wires and a plurality of switches. The number of contact pieces and the plurality of PIN pins are the same and correspond one to one. The plurality of wires connect the plurality of contact pieces in series and connect them to the positive pole of the power supply. The plurality of contact pieces are divided into a plurality of groups according to the plurality of ceramic substrates to which the corresponding plurality of PIN pins belong. The plurality of switches are sequentially arranged between the power supply and the first group of contact pieces and between two adjacent groups of contact pieces. The current detector is connected between the power supply and the first group of contact pieces.

[0005] In some embodiments, the contact piece is a tube spring, which is a metal piece with a single end in a tube shape.

[0006] In some embodiments, the contact pads in the same group are integrally formed and directly connected.

[0007] In some embodiments, the contact piece is a spring piece, which is a pair of metal pieces with arc-shaped ends and symmetrically abutting against each other.

[0008] In some embodiments, the contact pads in the same group are connected sequentially through wires.

[0009] In some embodiments, a plurality of circuit boards are further provided on the insulating board, and the plurality of contact pieces, the plurality of wires and the plurality of switches are all fixed on the same side of the insulating board through the plurality of circuit boards.

[0010] In some embodiments, the plurality of circuit boards are fixed to the surface of the insulating plate by bolts.

[0011] In some embodiments, ends of the plurality of contact pieces penetrate the insulating plate and extend to the other side thereof.

[0012] In some embodiments, the insulating plate is a transparent plate.

[0013] In some embodiments, the power source is a voltage source.

[0014] Due to the application of the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0015] The utility model connects all PIN pins in a power semiconductor module comprising multiple ceramic substrates in series through contact pieces, wires and switches on an insulating plate, and cuts and groups them according to the ceramic substrates to which they belong. Together with a power supply, a current tester and a metal plate, a complete current loop is formed. The utility model can accurately detect which ceramic substrate in a power semiconductor module comprising multiple ceramic substrates has a poor insulation point during an insulation withstand voltage test. The overall structure is simple, the manufacture is convenient and the cost is low. In addition, contact pieces adapted to the shape of the PIN pins are used to reduce the risk of PIN pin damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure is a schematic structural diagram of a power semiconductor module in the prior art.

[0017] Figure 2 The first embodiment of the simple insulation withstand voltage test device proposed by the utility model is loaded Figure 1 Schematic diagram of the structure of the semiconductor power module.

[0018] Figure 3 This is a circuit diagram of Example 1 of the simple insulation withstand voltage test device proposed by the present invention.

[0019] Figure 4 This is a structural diagram of the second embodiment of the simple insulation and voltage withstand test device proposed by the present invention, in which the same group of spring sheet contact pieces are sequentially connected through wires and clamp the flat terminal PIN needles.

[0020] In the figure: 1-power semiconductor module; 2-ceramic substrate; 3-PIN; 4-power supply; 5-current detector; 6-metal plate; 7-insulating plate; 8-contact piece; 9-wire; 10-switch; 11-circuit board; 12-bolt. DETAILED DESCRIPTION

[0021] The following is a further detailed description of the present invention in conjunction with specific embodiments:

[0022] Figure 1 and Figure 2 The figure shows a power semiconductor module 1 in the prior art, which includes three ceramic substrates 2 . Three PIN pins 3 arranged in a straight line are provided on each ceramic substrate 2 . The PIN pins 3 are needle-shaped terminals.

[0023] Figure 2 and Figure 3 Shown for testing Figure 1 The first embodiment of a simple insulation withstand voltage test device for a medium power semiconductor module 1 includes a power supply 4, a current detector 5, a metal plate 6, and an insulating plate 7. The power semiconductor module 1 is placed on the metal plate 6, on which the back of the ceramic substrate 2 is attached to the metal plate 6, the PIN pin 3 on the ceramic substrate 2 is vertically facing upward, the metal plate 6 is connected to the negative pole of the power supply 4, and the insulating plate 7 is provided with a plurality of contact pieces 8, a plurality of wires 9, and a plurality of switches 10 ( Figure 2 The switch 10 is not shown in the figure. The contact piece 8 is a tube reed piece, which is a metal piece with a single tubular end. The contact pieces 8 of the same group are integrally formed and directly connected. The number of contact pieces 8 and the number of PIN pins 3 are the same, one-to-one corresponding, and plugged and fixed. The plurality of wires 9 connect the plurality of contact pieces 8 in series and connect them to the positive pole of the power supply 4. The plurality of contact pieces 8 are divided into a plurality of groups according to the plurality of ceramic substrates 2 to which the corresponding plurality of PIN pins 3 belong. The plurality of switches 10 are sequentially arranged between the power supply 4 and the first group of contact pieces 8 and between two adjacent groups of contact pieces 8. The current detector 5 is connected to the power supply 4. Between the first group of contact pieces 8, several circuit boards 11 are also provided on the insulating plate 7. Several contact pieces 8, several wires 9 and several switches 10 are fixed to the same side of the insulating plate 7 through several circuit boards 11. Several circuit boards 11 are fixed to the surface of the insulating plate 7 by bolts 12. The ends of several contact pieces 8 pass through the insulating plate 7 and extend to the other side thereof. Among them, the insulating plate 7 is a transparent plate, such as an epoxy resin plate or an acrylic plate, which is convenient for observing whether the contact pieces 8 and the PIN needles 3 are all plugged in place. The power supply 4 is a voltage source that can provide an adjustable and stable voltage.

[0024] Example 1 In the Figure 1 When performing an insulation withstand voltage test on a medium-power semiconductor module 1, first start the power supply 4, turn on all switches 10, and observe whether current flows through the current detector 5. If no current flows, it indicates that the module insulation performance is good. If current flows, it indicates that there is an insulation defect in the module. Then, disconnect the switch 10 farthest from the power supply 4 to verify whether the insulation defect is on the last ceramic substrate 2. If current still flows, disconnect the switches 10 from farthest to closest to observe whether current flows.

[0025] above Figure 1The PIN pin 3 in the medium power semiconductor module 1 is a pin-shaped terminal, and the contact piece 8 in the first embodiment is a tube spring piece, and the two are adapted to each other. Figure 4 In the second embodiment shown, when the PIN needle 3 in the power semiconductor module 1 is a flat terminal, the contact piece 8 is a spring piece, which is a pair of metal pieces with arc-shaped ends and symmetrically abutting each other. The PIN needle 3 is inserted between the ends of the pair of metal pieces, and the contact pieces 8 in the same group are connected in sequence through wires 9.

[0026] In other embodiments of the present invention, when the ends of the PIN pins 3 in the power semiconductor module 1 are unevenly spaced, or when both pin-shaped and flat-shaped terminals coexist and are irregularly distributed, the extension length of the contact blades 8, the type of spring blades, and their distribution can be adaptively adjusted. If there are more than three ceramic substrates 2 in the power semiconductor module 1, and insulation withstand voltage testing may reveal poor insulation on two ceramic substrates 2 simultaneously, making it difficult to distinguish them, rewiring the target ceramic substrate 2 can be performed separately.

[0027] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A simple insulation withstand voltage test device for testing a power semiconductor module (1), wherein the power semiconductor module (1) comprises at least two ceramic substrates (2), wherein the ceramic substrates (2) are provided with a plurality of PIN pins (3), and wherein: The simple insulation withstand voltage test device comprises a power supply (4), a current detector (5), a metal plate (6) and an insulating plate (7), wherein the metal plate (6) is used to support the ceramic substrate (2) and connect to the negative pole of the power supply (4), and the insulating plate (7) is provided with a plurality of contact pieces (8), a plurality of wires (9) and a plurality of switches (10), wherein the plurality of contact pieces (8) and the plurality of PIN pins (3) are the same in number and correspond to each other, and the plurality of wires (9) connect the plurality of contact pieces (8) in series and connect them to the positive pole of the power supply (4), and the plurality of contact pieces (8) are divided into a plurality of groups according to the plurality of ceramic substrates (2) to which the corresponding plurality of PIN pins (3) belong, and the plurality of switches (10) are sequentially arranged between the power supply (4) and the first group of contact pieces (8) and between two adjacent groups of contact pieces (8), and the current detector (5) is connected between the power supply (4) and the first group of contact pieces (8).

2. The simple insulation withstand voltage test device according to claim 1, characterized in that: The contact piece (8) is a tube reed, which is a metal piece with a single end in a tube shape.

3. The simple insulation withstand voltage test device according to claim 2, characterized in that: The contact pieces (8) in the same group are integrally formed and directly connected.

4. The simple insulation withstand voltage test device according to claim 1, characterized in that: The contact piece (8) is a spring piece, which is a pair of metal pieces with arc-shaped ends and symmetrically abutting against each other.

5. The simple insulation withstand voltage test device according to claim 4, characterized in that: The contact pieces (8) in the same group are connected in sequence via wires (9).

6. The simplified insulation withstand voltage test device according to claim 1, characterized in that: The insulating plate (7) is further provided with a plurality of circuit boards (11), and the plurality of contact pieces (8), the plurality of wires (9) and the plurality of switches (10) are all fixed to the same side of the insulating plate (7) via the plurality of circuit boards (11).

7. The simplified insulation withstand voltage test device according to claim 6, characterized in that: The plurality of circuit boards (11) are fixed to the surface of the insulating plate (7) by means of bolts (12).

8. The simplified insulation withstand voltage test device according to claim 6, characterized in that: The ends of the plurality of contact pieces (8) pass through the insulating plate (7) and extend to the other side thereof.

9. The simplified insulation withstand voltage test device according to claim 1, characterized in that: The insulating plate (7) is a transparent plate.

10. The simplified insulation withstand voltage test device according to claim 1, characterized in that: The power supply (4) is a voltage source.

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