High-density PCB semi-finished product electrical testing equipment

Abstract

The utility model belongs to the technical field of circuit board manufacturing, and relates to a high-density PCB semi-finished product electrical testing device which comprises a feeding unit, a positioning unit, an electrical testing unit and a discharging unit which are sequentially arranged in the X direction. The electrical testing unit comprises a base station, an electrical testing probe assembly, an electrical testing lifting mechanism and a movable semi-finished product plate translation assembly, a semi-finished product plate is provided with a plurality of product areas which are distributed in an array mode, and the detection range of the electrical testing probe assembly covers the product areas. The electrical testing probe assembly can detect a plurality of product areas each time, so that the time spent on detection is reduced exponentially, the tool cost is reduced, and the detection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to a high-density PCB semi-finished product electrical testing device. Background Art

[0002] Electrical testing of printed circuit boards (PCBs) refers to a series of electrical performance tests performed during the PCB manufacturing process to ensure the quality and proper function of the board. This helps identify any design and manufacturing issues, ensuring the board's performance and reliability. For example, a probe is used to contact each circuit endpoint on the PCB to verify the correct electrical connections between the wires, vias, and pads, and to verify any unintended shorts or opens. To improve manufacturing efficiency, existing PCBs are typically manufactured by stacking large semi-finished boards. These boards are then arrayed with numerous product areas. After all the layers are stacked, they are then divided into individual pieces according to the product area. Electrical testing is typically performed only after the products have been sliced. Therefore, the typical manufacturing inspection process involves circuitry, visual inspection, solder masking, surface treatment, molding, electrical testing of the finished product, quality inspection of the finished product, and packaging.

[0003] Chinese patent CN113286432A discloses a method for processing printed circuit boards (PCBs). This method involves cutting the PCBs into the desired dimensions using a CNC molding machine before conducting electrical testing. However, with increasing circuit density, decreasing product size, and improving production efficiency, this conventional process is increasingly unsuitable for current production conditions. High circuit density increases the density of probes, placing stringent requirements on probe positioning accuracy. Furthermore, with small product sizes, the detection area is very limited, making it difficult to lay out the components of the electrical testing mechanism, resulting in low detection efficiency and difficulty in improving accuracy.

[0004] Therefore, a new electrical measuring equipment and processing detection method are needed to overcome the above problems. Utility Model Content

[0005] The main purpose of the utility model is to provide a high-density PCB semi-finished product electrical testing device, which can perform electrical testing on semi-finished boards that are not prepared with solder mask layers.

[0006] The utility model achieves the above-mentioned object through the following technical solutions: A high-density PCB semi-finished product electrical testing device comprises a loading unit, a positioning unit, an electrical testing unit and a unloading unit arranged in sequence along the X direction;

[0007] A first transfer mechanism is provided on the upper portion of the loading unit, a second transfer mechanism is provided on the upper portion of the unloading unit, a first transfer assembly is provided above the positioning unit and the electric measuring unit, and a second transfer assembly is provided above the electric measuring unit and the unloading unit;

[0008] The electrical measurement unit includes a hollow base, an electrical measurement probe assembly located in the hollow part of the base, an electrical measurement lifting mechanism located below the electrical measurement probe assembly and driving the electrical measurement probe assembly to move up and down along the Z axis, and a semi-finished plate translation assembly provided on the base and carrying the semi-finished plate to move in the XY plane above the electrical measurement probe assembly. The semi-finished plate translation assembly includes two sets of side clamping mechanisms arranged opposite to each other in the Y direction, an X-direction translation mechanism driving the two side clamping mechanisms to move synchronously along the X axis, and a Y-direction translation mechanism driving the two side clamping mechanisms to move synchronously along the Y axis.

[0009] The semi-finished product board has a plurality of product areas distributed in an array, and the detection range of the electrical measuring probe assembly covers several product areas.

[0010] Specifically, each side clamping mechanism is provided with at least two automatic clamping jaws, and the distance between the automatic clamping jaws is adjustable.

[0011] Specifically, a cleaning and dust-binding mechanism is provided between the loading unit and the positioning unit.

[0012] Specifically, the loading unit includes a paper separator recovery position, a loading position and a loading conveyor line that are arranged in sequence, and the first transfer mechanism extends from above the paper separator recovery position to above the loading conveyor line.

[0013] Furthermore, the first transfer mechanism includes an X-axis moving module, a transfer rotating mechanism driven by the X-axis moving module to move along the X-axis, and a suction cup assembly driven by the transfer rotating mechanism to rotate around the Z-axis; the unloading unit includes a unloading position and a paper separation discharge position arranged in sequence, and the second transfer mechanism extends from above the unloading position to above the paper separation discharge position, and the second transfer mechanism has the same structure as the first transfer mechanism.

[0014] Specifically, the positioning unit includes a positioning conveyor line, an in-position sensor, a positioning camera and a pair of centering mechanisms. The in-position sensor is located below the discharge side of the positioning conveyor line, a pair of centering mechanisms are located on both sides of the Y direction of the positioning conveyor line, and the positioning camera is located behind the in-position sensor and detects the semi-finished board upward.

[0015] Specifically, the first transfer assembly includes a first X-direction moving mechanism, a Y-direction moving mechanism, a first Z-direction lifting mechanism, a first rotating mechanism and a first suction cup mechanism. The first X-direction moving mechanism drives the first suction cup mechanism to move along the X-direction, the Y-direction moving mechanism drives the first suction cup mechanism to move along the Y-direction, the first Z-direction lifting mechanism drives the first suction cup mechanism to rise and fall along the Z-direction, and the first rotating mechanism drives the first suction cup mechanism to rotate around the Z-axis.

[0016] Specifically, the second transfer assembly includes a second X-direction moving mechanism, a second Z-direction lifting mechanism, a second rotating mechanism and a second suction cup mechanism. The second X-direction moving mechanism drives the second suction cup mechanism to move along the X-direction, the second Z-direction lifting mechanism drives the second suction cup mechanism to rise and fall along the Z-direction, and the second rotating mechanism drives the second suction cup mechanism to rotate around the Z-axis.

[0017] The beneficial effects of the technical solution of this utility model are:

[0018] 1. The electrical test probe assembly can test multiple product areas at a time, which reduces the time spent on testing by several times compared to testing only one piece at a time.

[0019] 2. Semi-finished boards are tested on a circuit-by-circuit basis, rather than at the end of the circuit, which significantly reduces probe density.

[0020] 3. The scope of probe detection can be extended to various positions on a section of line, not just to the endpoints, so the accuracy and strength requirements of the probe are greatly reduced, and the cost of parts can be reduced by 60-80%; BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a front view of the electrical testing equipment for high-density semi-finished PCBs according to an embodiment;

[0022] Figure 2 This is a three-dimensional diagram of the core components of the high-density PCB semi-finished electrical testing equipment;

[0023] Figure 3 for Figure 2 A partial enlarged view of position A in the middle;

[0024] Figure 4 for Figure 2 A partial enlarged view of position B in the middle;

[0025] Figure 5 This is an overall three-dimensional diagram of the base and semi-finished plate translation assembly in working condition;

[0026] Figure 6 is a partial three-dimensional diagram of the first transfer mechanism;

[0027] Figure 7 is a partial three-dimensional diagram of the second transfer mechanism;

[0028] Figure 8 This is the relationship diagram between the detection range and the product area;

[0029] Figure 9 This is a schematic diagram of the electrical measurement locations in the product area.

[0030] The numbers in the figure represent:

[0031] 1-High-density PCB semi-finished product electrical testing equipment;

[0032] 11- loading unit, 111- separator paper recovery position, 112- loading position, 113- loading conveyor line;

[0033] 12- Clean the dust sticking mechanism,

[0034] 13-positioning unit, 131-positioning conveyor line, 132-positioning sensor, 133-centering mechanism, 134-positioning camera,

[0035] 14-electrical measuring unit, 141-base, 142-electrical measuring probe assembly, 1421-electrical measuring lifting mechanism, 143-semi-finished plate translation assembly, 1431-side clamping mechanism, 14311-automatic clamping claw, 1432-X-axis translation mechanism, 1433-Y-axis translation mechanism,

[0036] 15-unloading unit, 151-unloading position, 152-paper discharge position,

[0037] 16a-first transfer mechanism, 16b-second transfer mechanism, 161-X-axis moving module, 162-transfer rotation mechanism, 163-transfer suction cup assembly;

[0038] 17-first transfer assembly, 171-first X-direction moving mechanism, 172-Y-direction moving mechanism, 173-first Z-direction lifting mechanism, 174-first rotating mechanism, 175-first suction cup mechanism;

[0039] 18-second transfer assembly, 181-second X-direction moving mechanism, 182-second Z-direction lifting mechanism, 183-second rotating mechanism, 184-second suction cup mechanism;

[0040] 2-semi-finished board, 21-product area, 22-circuit, 23-solder mask area, 24-detection range, 25-probe contact position. DETAILED DESCRIPTION

[0041] The present invention will be further described in detail below with reference to specific embodiments.

[0042] Example:

[0043] like Figure 1 and Figure 2As shown, the utility model provides a high-density PCB semi-finished product electrical testing device 1, comprising a loading unit 11, a cleaning and dust-binding mechanism 12, a positioning unit 13, an electrical measuring unit 14 and a unloading unit 15 arranged in sequence along the X direction, wherein the cleaning and dust-binding mechanism 12 is located between the loading unit 11 and the positioning unit 13, a first transfer mechanism 16a is provided on the upper portion of the loading unit 11, a second transfer mechanism 16b is provided on the upper portion of the unloading unit 15, a first transfer assembly 17 is provided above the positioning unit 13 and the electrical measuring unit 14, and a second transfer assembly 18 is provided above the electrical measuring unit 14 and the unloading unit 15.

[0044] like Figure 1 and Figure 2 As shown, the loading unit 11 includes a sequentially arranged spacer paper recovery position 111, a loading position 112, and a loading conveyor line 113. A first transfer mechanism 16a is provided above the loading unit 11 for moving the spacer paper and the semi-finished board 2 to be tested. The first transfer mechanism 16a extends from above the spacer paper recovery position 111 to above the loading conveyor line 113. The unloading unit 15 includes a sequentially arranged unloading position 151 and a spacer paper discharge position 152. The second transfer mechanism 15b extends from above the unloading position 14 to above the spacer paper discharge position 152. The dust cleaning mechanism 12 can remove dust and dirt that has fallen on the surface of the semi-finished board 2 before electrical testing, preventing dust and dirt from affecting the accuracy of the electrical testing.

[0045] In order to prevent the semi-finished boards 2 from being scratched due to hard contact when stacked, the semi-finished boards 2 are generally separated by separators. Therefore, the first transfer mechanism 16a is not only responsible for moving the semi-finished boards 2 one by one from the loading position 112 to the loading conveyor line 113 for electrical testing, but also for moving the separators from the loading position 112 to the separator recovery position 111 for stacking and recycling. When the semi-finished boards 2 that have completed electrical testing are stacked again, the separator discharge position 152 must also prepare separators in advance. Then, the second transfer mechanism 16b moves the semi-finished boards 2 that have completed electrical testing from the electrical testing unit 14 to the unloading position 151 and places them one by one with the separators taken from the separator discharge position 152.

[0046] like Figure 1 and Figure 2 As shown, the first transfer mechanism 16a includes an X-axis moving module 161, a transfer rotation mechanism 162 driven by the X-axis moving module 161 to move along the X axis, and a suction cup assembly 163 driven by the transfer rotation mechanism 162 to rotate around the Z axis. The second transfer mechanism 16b has the same structure as the first transfer mechanism 16a.

[0047] The first transfer mechanism 16a is responsible for removing the separator paper and loading the semi-finished PCB 2, while the second transfer mechanism 16b is responsible for loading the separator paper. The suction cup assembly 163 is used to hold the semi-finished PCB 2 or separator paper. In this embodiment, the semi-finished PCB 2 is initially positioned with its wide side along the X-direction. During electrical testing, it rotates to its long side along the X-direction, and then returns to the wide side in the X-direction during unloading. Because transporting along the wide side shortens the distance between workstations compared to transporting along the long side, the total transport length of the high-density PCB semi-finished PCB electrical testing equipment 1 can be shortened. However, during electrical testing, to avoid interfering with the entry and exit of the semi-finished PCB 2, the semi-finished PCB 2 must be clamped from both sides in the Y-direction. This requires a certain amount of width on both sides of the electrical testing unit 14 for the clamping mechanism. To reduce the width of the electrical testing unit 14, the semi-finished PCB 2 must be rotated to its long side along the X-direction within the electrical testing unit 14. Therefore, the first and second transfer mechanisms 16a, 16b each require a transfer rotation mechanism 162 to reverse the orientation of the semi-finished PCB 2 or separator paper.

[0048] like Figure 4 As shown, the positioning unit 13 includes a positioning conveyor line 131, an in-position sensor 132, a positioning camera 134 and a pair of centering mechanisms 133. The in-position sensor 132 is located below the discharge side of the positioning conveyor line 131, and the pair of centering mechanisms 133 are located on both sides of the Y direction of the positioning conveyor line 131. The positioning camera 134 is located behind the in-position sensor 132 and detects the semi-finished board 2 upward.

[0049] When the semi-finished board 2 moves from the loading unit 11 to the positioning conveyor line 131, there is a high probability that the direction will be deflected. At this time, it cannot be sent directly to the electrical test, because the probes on the electrical test probe assembly 142 must correspond one-to-one with the detection position. Therefore, once the semi-finished board 2 is in the wrong direction, the probes cannot be normally connected with the circuits on the semi-finished board 2, which will lead to misjudgment. The two centering mechanisms 133 are initially in a state of separation, and the distance between them is greater than the horizontal length of the semi-finished board 2. When the semi-finished board 2 moves to be sensed by the in-position sensor 132, the centering mechanisms 133 move closer to each other. In the process of clamping the semi-finished board 2, the semi-finished board 2 will be adjusted to the appropriate angle, so that the first transfer assembly 17 will be more accurate when taking the semi-finished board 2 again. Then the first transfer component 17 moves the semi-finished board 2 over the positioning camera 134 and uses the target on the semi-finished board 2 for precise positioning. The first transfer component 17 will fine-tune the angle of the semi-finished board 2 to meet the positional relationship between the electrical measurement position of the semi-finished board 2 and the position of each probe on the electrical measurement probe component 142.

[0050] like Figure 6As shown, the first transfer assembly 17 includes a first X-direction moving mechanism 171, a Y-direction moving mechanism 172, a first Z-direction lifting mechanism 173, a first rotating mechanism 174 and a first suction cup mechanism 175. The first X-direction moving mechanism 171 drives the first suction cup mechanism 175 to move along the X-direction, the Y-direction moving mechanism 172 drives the first suction cup mechanism 174 to move along the Y-direction, the first Z-direction lifting mechanism 173 drives the first suction cup mechanism 175 to rise and fall along the Z-direction, and the first rotating mechanism 174 drives the first suction cup mechanism 175 to rotate around the Z-axis.

[0051] The first transfer assembly 17 is responsible for moving the semi-finished board 2 from the positioning conveyor line 131 into the electrical measurement unit 14 and has four degrees of freedom: X, Y, Z, and Z-axis rotation. The first suction cup mechanism 175 is used to suck the upper surface of the semi-finished board 2, thereby moving it. The first X-axis moving mechanism 171 is used to fine-tune the X-axis position of the semi-finished board 2 and translate it between the two side clamping mechanisms 1431. The Y-axis moving mechanism 172 is used to fine-tune the Y-axis position of the semi-finished board 2. The first Z-axis lifting mechanism 173 is used to achieve the placement and lifting of the semi-finished board 2. The first rotating mechanism 174 is used to fine-tune the angle of the semi-finished board 2. Because the first transfer assembly 17 carries the semi-finished board 2 over the positioning camera 134, the positioning camera 134 determines the relative position of the semi-finished board 2, thereby controlling the first transfer assembly 17 to make corresponding fine adjustments, ultimately allowing the semi-finished board 2 to reach the correct detection position.

[0052] like Figure 7 As shown, the second transfer assembly 18 includes a second X-direction moving mechanism 181, a second Z-direction lifting mechanism 182, a second rotating mechanism 183 and a second suction cup mechanism 184. The second X-direction moving mechanism 181 drives the second suction cup mechanism 184 to move along the X-direction, the second Z-direction lifting mechanism 182 drives the second suction cup mechanism 184 to rise and fall along the Z-direction, and the second rotating mechanism 183 drives the second suction cup mechanism 184 to rotate around the Z-axis.

[0053] The second transfer assembly 18 is responsible for moving the semi-finished board 2 from the electrical measurement unit 14 to the unloading position 151 , and has three degrees of freedom in the X-axis, Z-axis, and Z-axis rotation. The second transfer assembly 18 can directly place the inspected semi-finished board 2 at the unloading position 151 .

[0054] like Figure 3 and Figure 5As shown, the electrical measurement unit 14 includes a hollow base 141, an electrical measurement probe assembly 141 located in the hollow portion of the base 141, an electrical measurement lifting mechanism 142 located below the electrical measurement probe assembly 141 and driving the electrical measurement probe assembly 141 up and down along the Z-axis, and a semi-finished board translation assembly 143 mounted on the base 141 and carrying the semi-finished board 2 above the electrical measurement probe assembly 141 in the XY plane. The semi-finished board translation assembly 143 includes two sets of side clamping mechanisms 1431 arranged opposite each other in the Y direction, an X-axis translation mechanism 1432 that drives the two side clamping mechanisms 1431 to move synchronously along the X-axis, and a Y-axis translation mechanism 1433 that drives the two side clamping mechanisms 1431 to move synchronously along the Y-axis. Each side clamping mechanism 1431 is equipped with at least two automatic grippers 14311, and the spacing between the automatic grippers 14311 is adjustable.

[0055] Before electrical testing, the automatic grippers 14311 are fully opened, allowing the semi-finished board 2 to be translated along the X-axis between the automatic grippers 14311, driven by the first transfer assembly 17. After the automatic grippers 14311 clamp the semi-finished board 2, the first transfer assembly 17 releases the semi-finished board 2 and removes it. The X-axis translation mechanism 1432 and the Y-axis translation mechanism 1433 then adjust the position of the semi-finished board 2 on the XY plane, thereby coordinating the raising and lowering of the electrical testing probe assembly 142 to complete the electrical testing.

[0056] like Figure 8 and Figure 9 As shown, the semi-finished board 2 has multiple product areas 21 distributed in an array. The detection range 24 of the electrical testing probe assembly 142 covers at least two product areas 21. The detection surface of the semi-finished board 2 has several independent copper wires 22 without solder mask covering. Each probe of the electrical testing probe assembly 142 (corresponding to the probe position 25) completes the detection by contacting different copper wires 22.

[0057] Figure 9 The solid oblique line represents copper wire 22, the solid circle represents probe contact position 25, and the dotted line represents the solder mask design area 23. The solder mask design area 23 is the theoretical area covered by the solder mask. However, when the semi-finished board 2 is electrically tested, the solder mask has not yet been applied, so the probe contact position 25 can be located within the solder mask area 23. This embodiment targets a semi-finished board 2 with product areas 21 arranged in a 4×3 pattern. The electrical testing probe assembly 142 can test 2×1 product areas 21. In other words, if a semi-finished board 2 has 12 product areas 21, the electrical testing probe assembly 142 can test two product areas 21 at a time. The semi-finished board 2 needs to be moved horizontally six times, and the electrical testing probe assembly 142 needs to be raised and lowered six times to complete the testing of the entire board 2. This reduces the testing time by half compared to testing only the entire board at a time. In practice, the detection range 24 can also cover 1×3 product areas 21, allowing fewer electrical tests to be performed on the same number of product areas 21.

[0058] The PCB manufacturing and testing process includes: circuit inspection, visual inspection, electrical testing of semi-finished boards, flying probe inspection, solder mask inspection, surface treatment, molding, finished product quality inspection and packaging.

[0059] The circuit step involves etching the desired circuit 22 onto the copper surface of the substrate through exposure and development. The visual inspection step involves using a camera to detect any cosmetic defects on the circuit surface and screen out defective products. The semi-finished board electrical testing step involves performing electrical testing on multiple product locations 21 of the semi-finished board 2, which does not yet have a solder mask, and screening out defective products. Flying probe testing involves re-evaluating the defective network points generated by the fixture electrical testing to confirm whether open circuits or short circuits are true defective points. The solder mask step involves preparing a solder mask on the circuit surface, exposing the end pads of the circuit 22 to obtain a large board. The surface treatment step involves applying nickel-gold or other treatments to the pads exposed by the solder mask window to prevent oxidation of the copper surface. The forming step involves cutting the large board into small pieces according to the product area 21. The flying probe sampling step involves using flying probes to test the conductivity between specific locations during the movement of the pieces to determine whether they meet the requirements and screen out defective products. The finished product quality inspection step involves performing another quality inspection on the pieces and screening out defective products.

[0060] The difference between this process and the previous process is that the electrical testing step is placed before the solder mask step, and the flying probe detection step is added after the electrical testing step of the semi-finished board. Compared with the traditional manual point finding, it is more efficient and accurate.

[0061] Because the target is not a finished sheet, but a semi-finished board 2 with multiple product areas 21. The electrical probe assembly 142 can detect multiple product areas 21 each time, and the time spent on detection is reduced by several times compared to detecting only one finished sheet at a time.

[0062] like Figure 9 As shown, because the finished board has a solder mask, only the ends of the circuit 22 are exposed from the solder mask, with the dimensions of the ends being approximately 0.1mm x 0.1mm. However, when the solder mask is not present, the circuit 22 on the semi-finished board 2 is exposed in sections, and the length of the circuit 22 is generally greater than 1mm. Therefore, as long as the probe touches any position on the circuit 22, it can be determined whether there is any abnormality in this section of the circuit 22. The semi-finished board 2 is electrically tested based on the circuit 22 as a unit, rather than the end of the circuit 22. Therefore, although the detection range 24 is increased, the probe density can be significantly reduced, and the total number of probes does not increase significantly. The probe detection range can be extended to various positions on a section of the circuit 22, not just the end points, so the accuracy and strength requirements of the probe are greatly reduced, and the tooling cost can be reduced by 60-80%.

[0063] The above descriptions are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A high-density PCB semi-finished product electrical testing device, characterized by: It includes a loading unit, a positioning unit, an electrical measuring unit and a unloading unit arranged in sequence along the X direction; A first transfer mechanism is provided on the upper portion of the loading unit, a second transfer mechanism is provided on the upper portion of the unloading unit, a first transfer assembly is provided above the positioning unit and the electric measuring unit, and a second transfer assembly is provided above the electric measuring unit and the unloading unit; The electrical measurement unit includes a hollow base, an electrical measurement probe assembly located in the hollow part of the base, an electrical measurement lifting mechanism located below the electrical measurement probe assembly and driving the electrical measurement probe assembly to move up and down along the Z axis, and a semi-finished plate translation assembly provided on the base and carrying the semi-finished plate to move in the XY plane above the electrical measurement probe assembly. The semi-finished plate translation assembly includes two sets of side clamping mechanisms arranged opposite to each other in the Y direction, an X-direction translation mechanism driving the two side clamping mechanisms to move synchronously along the X axis, and a Y-direction translation mechanism driving the two side clamping mechanisms to move synchronously along the Y axis. The semi-finished product board has a plurality of product areas distributed in an array, and the detection range of the electrical measuring probe assembly covers several product areas.

2. The high-density semi-finished PCB electrical testing device according to claim 1, characterized in that: Each side clamping mechanism is provided with at least two automatic clamping jaws, and the distance between the automatic clamping jaws is adjustable.

3. The high-density semi-finished PCB electrical testing device according to claim 1, characterized in that: A cleaning and dust-binding mechanism is provided between the feeding unit and the positioning unit.

4. The high-density semi-finished PCB electrical testing device according to claim 1, characterized in that: The loading unit includes a paper separation recovery position, a loading position and a loading conveyor line which are arranged in sequence, and the first transfer mechanism extends from above the paper separation recovery position to above the loading conveyor line.

5. The high-density semi-finished PCB electrical testing device according to claim 4, characterized in that: The first transfer mechanism includes an X-axis moving module, a transfer rotating mechanism driven by the X-axis moving module to move along the X-axis, and a suction cup assembly driven by the transfer rotating mechanism to rotate around the Z-axis; the unloading unit includes a unloading position and a paper separation discharge position arranged in sequence, and the second transfer mechanism extends from above the unloading position to above the paper separation discharge position. The second transfer mechanism has the same structure as the first transfer mechanism.

6. The high-density semi-finished PCB electrical testing device according to claim 1, characterized in that: The positioning unit includes a positioning conveyor line, an in-position sensor, a positioning camera and a pair of centering mechanisms. The in-position sensor is located below the discharge side of the positioning conveyor line, a pair of centering mechanisms are located on both sides of the Y direction of the positioning conveyor line, and the positioning camera is located behind the in-position sensor and detects the semi-finished board upward.

7. The high-density semi-finished PCB electrical testing device according to claim 1, characterized in that: The first transfer assembly includes a first X-direction moving mechanism, a Y-direction moving mechanism, a first Z-direction lifting mechanism, a first rotating mechanism, and a first suction cup mechanism. The first X-direction moving mechanism drives the first suction cup mechanism to move along the X-direction, the Y-direction moving mechanism drives the first suction cup mechanism to move along the Y-direction, the first Z-direction lifting mechanism drives the first suction cup mechanism to rise and fall along the Z-direction, and the first rotating mechanism drives the first suction cup mechanism to rotate around the Z-axis.

8. The high-density semi-finished PCB electrical testing device according to claim 1, characterized in that: The second transfer assembly includes a second X-direction moving mechanism, a second Z-direction lifting mechanism, a second rotating mechanism and a second suction cup mechanism. The second X-direction moving mechanism drives the second suction cup mechanism to move along the X-direction, the second Z-direction lifting mechanism drives the second suction cup mechanism to rise and fall along the Z-direction, and the second rotating mechanism drives the second suction cup mechanism to rotate around the Z-axis.

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