VCSEL chip moisture resistance testing device

Abstract

A VCSEL chip moisture resistance testing device is used for being matched with a constant temperature and humidity chamber for use and comprises a carrier plate and a plurality of chip testing plates, the carrier plate is vertically arranged in the constant temperature and humidity chamber, a plurality of supporting rods are detachably and transversely arranged on the side wall of the carrier plate, positioning rods are arranged on the side wall of the carrier plate, and the supporting rods are detachably connected with the positioning rods; a plurality of clamping grooves are formed in the upper end of the supporting rod, buckles are arranged at the upper end of the rear side of the chip testing plate, and the buckles are embedded into the clamping grooves and matched with the clamping grooves, so that the chip testing plate is vertically hung on the supporting rod. The carrier plate is vertically arranged, and the chip test plate is vertically placed through the supporting rods, the clamping grooves and the buckles, so that the condition that water drops are condensed at the light outlet holes in the front surface of the VCSEL chip can be effectively avoided, and the accuracy of an experiment result is ensured; through detachable connection of the supporting rods and the carrier plate, when the chip test plates are taken down from the carrier plate, the supporting rods can be directly detached, a plurality of chip test plates can be taken at a time, and the working efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the field of chip testing, in particular to a device for testing the moisture resistance of a VCSEL chip. Background Art

[0002] VCSEL, short for vertical-cavity surface-emitting laser, is a relatively new type of semiconductor laser. It represents a significant breakthrough in the integration of photonic devices and is attracting increasing attention.

[0003] With the continuous advancement of process technology, the cost reduction space for VCSEL laser chips is shrinking, making packaging cost reduction a key priority. Hermetic packaging is complex and expensive. Therefore, non-hermetic packaging has become a very popular laser chip packaging method. However, non-hermetic packaging requires the laser chip to operate in a high-humidity environment, which places higher demands on chip reliability. To verify that the laser chip can withstand the high humidity requirements of non-hermetic packaging, moisture resistance testing is required.

[0004] During the experiment, non-hermetic packaging samples are inserted onto a test board, which is then placed on a carrier in a constant temperature and humidity chamber for high-temperature and high-humidity testing. Existing test boards are typically placed flat on the carrier, each one independently. This can easily cause condensation on the light-emitting apertures on the front of the VCSEL chip, affecting the experimental results. Furthermore, each board needs to be removed individually after testing, which reduces work efficiency. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a device for testing the moisture resistance of a VCSEL chip.

[0006] The utility model provides the following technical solutions: a VCSEL chip moisture resistance testing device for use with a constant temperature and humidity chamber, comprising a carrier board and several chip test boards, wherein the carrier board is vertically arranged in the constant temperature and humidity chamber, and the side walls of the carrier board are detachably provided with several support rods laterally, the side walls of the carrier board are provided with positioning rods, and the support rods are detachably connected to the positioning rods; the upper ends of the support rods are provided with several card slots, and the upper end of the rear side of the chip test board is provided with a snap, which is embedded in the card slot and adapted thereto, so that the chip test board is vertically suspended on the support rods.

[0007] The VCSEL chip moisture resistance testing device of the present utility model has at least the following beneficial effects:

[0008] 1. By setting the carrier board vertically and placing the chip test board vertically through support rods, slots and buckles, it can effectively avoid condensation of water droplets on the light output hole on the front of the VCSEL chip, ensuring accurate experimental results;

[0009] 2. Through the detachable connection between the support rod and the carrier board, when removing the chip test board from the carrier board, the support rod can be directly removed, so that multiple chip test boards can be taken at one time, which effectively improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0011] Figure 1 This is a side structural diagram of a VCSEL chip moisture resistance testing device of the present invention;

[0012] Figure 2 This is a schematic diagram of the front structure of the VCSEL chip moisture resistance test device of the present invention;

[0013] Figure 3 This is a side view of a chip test board in the VCSEL chip moisture resistance test device of the present invention;

[0014] Figure 4 This is a front view of a chip test board in the VCSEL chip moisture resistance test device of the present invention;

[0015] Figure 5 This is a schematic diagram of the front structure of the carrier board in the VCSEL chip moisture resistance test device of the present invention;

[0016] Figure 6 for Figure 5 A magnified schematic diagram of part A in the middle;

[0017] Figure 7 This is a schematic diagram of the back structure of the support rod in the VCSEL chip moisture resistance test device of the present invention;

[0018] Figure 8 for Figure 7 A magnified schematic diagram of part B in the middle;

[0019] Figure 9 This is a schematic structural diagram of a positioning rod in the VCSEL chip moisture resistance test device of the present invention;

[0020] Figure 10This is a top view schematic diagram of the support rod in the VCSEL chip moisture resistance testing device of the present invention.

[0021] Description of reference numerals:

[0022] 10. Carrier board; 11. Support rod; 111. Slot; 112. Jack; 113. Second magnetic ring; 12. Positioning rod; 121. Boss; 122. First magnetic ring; 13. Long through hole; 14. Roller; 15. Support base; 16. Handle; 20. Chip test board; 21. Buckle. DETAILED DESCRIPTION

[0023] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0024] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0026] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0027] Reference Figures 1 to 10In one embodiment of the present invention, a VCSEL chip moisture resistance testing device is used in conjunction with a constant temperature and humidity chamber, and includes a carrier board 10 and multiple chip test boards 20. The carrier board 10 is vertically arranged in the constant temperature and humidity chamber, and multiple horizontally arranged support rods 11 are symmetrically provided on the front and rear sides of the carrier board 10. The support rods 11 are detachably connected to the positioning rods 12 provided on the side walls of the carrier board 10, and the support rods 11 are connected to at least two positioning rods 12. The upper ends of the support rods 11 are provided with multiple card slots 111. The chip test boards 20 are vertically arranged and the upper end of the rear side of the chip test boards 20 is provided with a snap 21. The snap 21 is embedded in the card slot 111 and adapted thereto, so that the chip test boards 20 are vertically suspended on the support rods 11.

[0028] The VCSEL chip moisture resistance testing device of one embodiment of the present invention is configured by vertically arranging a carrier board 10, then arranging a positioning rod 12 on the side wall of the carrier board 10 to position the support rod 11, and finally inserting the clip 21 on the chip test board 20 into the card slot 111, so that the chip test board 20 is placed vertically, thereby effectively avoiding the condensation of water droplets at the light output hole on the front side of the VCSEL chip, thereby ensuring the accuracy of the experimental results; when the chip test board 20 is removed from the carrier board 10, since the support rod 11 and the positioning rod 12 are detachably connected, the support rod 11 can be directly removed, so that multiple chip test boards 20 can be taken at one time, which effectively improves work efficiency; in this embodiment, the VCSEL chip is inserted into the chip test board 20 from the side end, and its specific connection structure is well known to those skilled in the art, so it is not described in detail here.

[0029] Reference Figure 1 The longitudinally adjacent positioning rods 12 are staggered with one long and one short; the positioning rods 12 are one long and one short in the up and down directions, so that the two adjacent support rods 11 installed on the positioning rods 12 are staggered front and back, that is, the chip test boards 20 on the adjacent support rods 11 can be staggered front and back, so that the moisture in the constant temperature and humidity chamber can flow more smoothly up and down, and the moisture received by the VCSEL chip is more evenly, thereby ensuring the accuracy of the VCSEL chip moisture resistance experiment.

[0030] Reference Figures 7 to 9 The positioning rod 12 is provided with a boss 121 at the end away from the carrier 10, and the support rod 11 is provided with a socket 112, and the boss 121 is embedded in the socket 112 and adapted thereto; the boss 121 cooperates with the socket 112 to effectively connect the support rod 11 with the positioning rod 12; in this embodiment, a single support rod 11 corresponds to three positioning rods 12, and every three positioning rods 12 are in a row, and nine support rods 11 are provided on a single side of the carrier 10, which can effectively increase the number of VCSEL chip samples placed and improve the space utilization of the carrier 10.

[0031] Reference Figures 6 to 8The surface of the boss 121 is surrounded by a first magnetic ring 122, and the inner wall of the insertion hole 112 is surrounded by a second magnetic ring 113, and the first magnetic ring 122 is magnetically connected to the second magnetic ring 113; by arranging the first magnetic ring 122 and the second magnetic ring 113, the support rod 11 and the positioning rod 12 are not only plug-in connected, but also have a magnetic connection, which not only improves the stability of the connection between the support rod 11 and the positioning rod 12, but also does not affect the convenience of its detachable connection.

[0032] Reference Figure 1 、 Figure 2 A plurality of long through holes 13 are provided on the side wall of the carrier board 10. The positions of the long through holes 13 correspond to the chip test boards 20 in the longitudinal direction, so that each long through hole 13 is aligned with a row of chip test boards 20. Since multiple carrier boards 10 are vertically installed in the constant temperature and humidity chamber, the long through holes 13 can prevent the carrier boards 10 from dividing the constant temperature and humidity chamber into multiple cavities, so that the air in the constant temperature and humidity chamber can circulate smoothly. Moreover, each long through hole 13 corresponds to a row of chip test boards 20, further ensuring that the VCSEL chips on the chip test boards 20 can evenly contact the air in the constant temperature and humidity chamber.

[0033] Reference Figure 3 、 Figure 10 The cross-section of the buckle 21 is in the shape of a "7", and the buckle 21 is made of rubber; the structure of the buckle 21 is convenient for disassembly and assembly, and the rubber material can increase the friction between the buckle 21 and the slot 111, thereby improving the stability of the connection between the chip test board 20 and the support rod 11; in this embodiment, six slots 111 are provided on a single support rod 11, that is, six chip test boards 20 are provided.

[0034] Reference Figure 1 、 Figure 2 The upper end of the carrier plate 10 is provided with a roller 14, and the top wall of the constant temperature and humidity chamber is provided with a slide groove adapted to the roller 14. The provision of the roller 14 can reduce friction between the upper end of the carrier plate 10 and the constant temperature and humidity chamber, making it easier to push the carrier plate 10 into the constant temperature and humidity chamber. The lower end of the carrier plate 10 is provided with a support base 15, which can ensure the stability of the carrier plate 10 and prevent it from tipping over. The side edge of the carrier plate 10 is provided with a handle 16, which facilitates the staff to pull the carrier plate 10 out of the constant temperature and humidity chamber. In specific implementation, a pulley can also be provided at the lower end of the support base 15.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A VCSEL chip moisture resistance test device for use with a constant temperature and humidity chamber, comprising a carrier board (10) and a plurality of chip test boards (20), characterized in that: The carrier plate (10) is vertically arranged in a constant temperature and humidity chamber, and a plurality of support rods (11) are detachably and laterally arranged on the side wall of the carrier plate (10). Positioning rods (12) are provided on the side wall of the carrier plate (10), and the support rods (11) and the positioning rods (12) are detachably connected; a plurality of slots (111) are provided on the upper ends of the support rods (11), and a buckle (21) is provided on the upper end of the rear side of the chip test board (20), and the buckle (21) is embedded in the slot (111) and matched therewith, so that the chip test board (20) is vertically suspended on the support rods (11).

2. The VCSEL chip moisture resistance testing device according to claim 1, characterized in that: The support rod (11) is connected to at least two positioning rods (12).

3. The VCSEL chip moisture resistance testing device according to claim 2, characterized in that: The longitudinally adjacent positioning rods (12) are arranged in a staggered manner, one long and one short.

4. The VCSEL chip moisture resistance testing device according to claim 2, characterized in that: A convex column (121) is provided at one end of the positioning rod (12) away from the carrier plate (10), and a socket (112) is provided on the support rod (11), and the convex column (121) is embedded in the socket (112) and matched therewith.

5. The VCSEL chip moisture resistance testing device according to claim 4, characterized in that: A first magnetic ring (122) is disposed around the surface of the protruding column (121), and a second magnetic ring (113) is disposed around the inner wall of the insertion hole (112). The first magnetic ring (122) and the second magnetic ring (113) are magnetically connected.

6. The VCSEL chip moisture resistance testing device according to claim 1, characterized in that: A plurality of long through holes (13) are provided on the side wall of the carrier board (10), and the positions of the long through holes (13) correspond to the chip test board (20) in the longitudinal direction.

7. The VCSEL chip moisture resistance testing device according to claim 1, characterized in that: The buckle (21) is made of rubber.

8. The VCSEL chip moisture resistance testing device according to claim 1, characterized in that: A roller (14) is provided at the upper end of the carrier plate (10), and a sliding groove adapted to the roller (14) is provided on the top wall of the constant temperature and humidity chamber.

9. The VCSEL chip moisture resistance testing device according to claim 1, characterized in that: A supporting bottom plate (15) is provided at the lower end of the carrier plate (10).

10. The VCSEL chip moisture resistance testing device according to claim 1, characterized in that: A handle (16) is provided on the side edge of the carrier plate (10).

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