Cleaning device and wafer processing device with same

Abstract

The utility model provides a cleaning device and a wafer processing device with the same, the cleaning device is used for the wafer processing device, and the cleaning device comprises a driving mechanism which is provided with a driving shaft; the connecting seat is fixed with the driving shaft; the cleaning piece is connected with the connecting base, the driving shaft drives the cleaning piece to rotate through the connecting base, the cleaning piece is provided with a cleaning face, and the cleaning piece can move relative to the driving shaft so as to adjust the included angle between the cleaning face and the axis of the driving shaft; and the limiting piece is arranged between the connecting base and the cleaning piece, and the limiting piece is used for limiting the rotating angle between the cleaning face and the axis of the driving shaft. According to the cleaning device, the cleaning piece can incline relative to the axis of the driving shaft, so that the cleaning face is attached to the table top of the bearing table, the cleaning tidiness of the cleaning piece can be guaranteed, and the cleaning effect of the cleaning device is effectively guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing device manufacturing, in particular to a cleaning device and a wafer processing device having the same. Background Art

[0002] In the wafer processing device in the existing solution, due to manufacturing errors and assembly errors, the axis of rotation of the cleaning device may be tilted relative to the table top of the carrier. In addition, the table top of the carrier is a conical surface with a small protrusion in the center. Therefore, when the cleaning device cleans the surface of the carrier, the cleaning surface of the cleaning device may not fit with the table top of the carrier, thereby failing to ensure the cleaning effect and affecting the service life of the carrier. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems in the prior art. To this end, the present invention proposes a cleaning device that can ensure a cleaning effect.

[0004] The utility model also provides a wafer processing device with the cleaning device.

[0005] According to an embodiment of the utility model, the cleaning device is used for a wafer processing device, and the cleaning device includes: a driving mechanism, the driving mechanism is provided with a driving shaft; a connecting seat, the connecting seat is fixed to the driving shaft; a cleaning piece, the cleaning piece is connected to the connecting seat, and the driving shaft drives the cleaning piece to rotate through the connecting seat, the cleaning piece has a cleaning surface, and the cleaning piece is movable relative to the driving shaft to adjust the angle between the cleaning surface and the axis of the driving shaft; a limiting piece, the limiting piece is provided between the connecting seat and the cleaning piece, and the limiting piece is used to limit the rotation angle between the cleaning surface and the axis of the driving shaft.

[0006] According to the cleaning device of the present invention, the cleaning piece can be tilted relative to the axis of the driving shaft so that the cleaning surface fits onto the surface of the carrier platform, thereby ensuring the cleaning neatness of the cleaning piece and effectively ensuring the cleaning effect of the cleaning device. At the same time, it can avoid the cleaning device from tilting relative to the carrier platform, and improve the accuracy of the cleaning surface fitting to the surface of the carrier platform, thereby improving the cleaning effect and effectively protecting the carrier platform.

[0007] According to some embodiments of the present utility model, the cleaning device includes: a connecting plate, which is fixed to the cleaning piece; a plurality of connecting rods, which are arranged at intervals along the circumference of the drive shaft, the connecting seat is provided with a first through-hole, and the connecting plate is provided with a second through-hole, one end of the connecting rod is passed through the first through-hole and the other end is passed through the second through-hole to connect the connecting plate and the connecting seat, wherein the connecting rod is loosely matched with at least one of the first through-hole and the second through-hole so as to be movable along the axial direction of the drive shaft relative to at least one of the connecting plate and the connecting seat.

[0008] According to some optional embodiments of the present invention, the cleaning device includes: an elastic member, which is sleeved on the connecting rod, and two ends of the elastic member respectively abut against the connecting plate and the connecting seat.

[0009] According to some embodiments of the present invention, the cleaning device includes: a connecting head, which is arranged on a side of the connecting plate away from the connecting seat.

[0010] According to some embodiments of the present invention, the limiting member includes: a limiting cylinder, which is formed into a ring shape along the circumference of the drive shaft, and is sleeved on the outer side of the connecting seat, and the limiting cylinder is clearance-matched with the connecting seat.

[0011] According to some optional embodiments of the present invention, the limiting member also includes: a bottom plate, the bottom plate is sealed on the side of the limiting cylinder facing the connecting plate, the bottom plate is fixed to the connecting plate, a third through-hole is provided on the bottom plate, the connecting rod is passed through the third through-hole and is gap-matched with the third through-hole.

[0012] According to some embodiments of the present invention, the connecting plate is configured to be elastically deformable.

[0013] According to some optional embodiments of the present invention, the connecting plate includes: a first plate, which is arranged perpendicular to the axial direction of the drive shaft; a second plate, which is formed into a ring along the circumference of the first plate, one end of the second plate is connected to the first plate, and the other end of the second plate extends toward the cleaning piece along the axial direction of the drive shaft, and the end of the second plate facing away from the first plate is provided with a flange, and the flange is connected to the cleaning piece.

[0014] According to some embodiments of the present invention, a first driving member and a second driving member are included, wherein the first driving member is used to drive the cleaning member (30) to move in the up and down directions, and the second driving member is used to drive the cleaning member (30) to rotate.

[0015] According to an embodiment of the second aspect of the present invention, the wafer processing device includes: a carrier platform, which is suitable for carrying wafers; and a cleaning device according to the first aspect of the present invention, which is used to clean the carrier platform.

[0016] According to the wafer processing device of the present invention, by setting the cleaning device of the above-mentioned first embodiment, the cleaning piece can be tilted relative to the axis of the driving shaft so that the cleaning surface is attached to the table surface of the carrier, thereby ensuring the cleaning neatness of the cleaning piece and effectively ensuring the cleaning effect of the cleaning device. At the same time, it can avoid the cleaning device from tilting relative to the carrier, and improve the accuracy of the cleaning surface being attached to the table surface of the carrier, thereby improving the cleaning effect and effectively protecting the carrier.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of a cleaning device according to an embodiment of the present utility model;

[0019] Figure 2 yes Figure 1 A schematic diagram of a portion of the cleaning device shown in FIG;

[0020] Figure 3 yes Figure 2 A schematic diagram of a partial structure of a cleaning device shown in FIG, wherein the cleaning member is horizontal;

[0021] Figure 4 yes Figure 2 A schematic diagram of a partial structure of a cleaning device shown in FIG, wherein the cleaning member is tilted;

[0022] Figure 5 yes Figure 4 A partial enlarged view of point A in the middle.

[0023] Reference numerals:

[0024] 100. Cleaning device;

[0025] 10. Driving mechanism; 11. Driving shaft; 12. Fixing bracket; 13. Cylinder; 14. Connecting bracket; 15. Driving motor; 16. Coupling;

[0026] 20. Connecting seat;

[0027] 30. Cleaning parts; 31. Cleaning surface;

[0028] 40. Limiting member; 41. Limiting cylinder; 42. Bottom plate;

[0029] 50. Connecting plate; 51. First plate; 52. Second plate;

[0030] 60. Connecting rod;

[0031] 70. Elastic parts;

[0032] 80. Connector;

[0033] 200. Carrying platform. DETAILED DESCRIPTION

[0034] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0035] Please refer to the following Figure 1-5 A cleaning device 100 according to an embodiment of the present invention is described.

[0036] Reference Figure 1 、 Figure 2 and Figure 3 According to an embodiment of the present invention, a cleaning device 100 is used in a wafer processing device. The cleaning device 100 includes: a driving mechanism 10, a connecting seat 20, a cleaning member 30, and a limiting member 40. Specifically, the driving mechanism 10 is provided with a driving shaft 11; the connecting seat 20 is fixed to the driving shaft 11; the cleaning member 30 is connected to the connecting seat 20, and the driving shaft 11 drives the cleaning member 30 to rotate through the connecting seat 20. The cleaning member 30 has a cleaning surface 31, and the cleaning member 30 is movable relative to the driving shaft 11 to adjust the angle between the cleaning surface 31 and the axis of the driving shaft 11; the limiting member 40 is provided between the connecting seat 20 and the cleaning member 30, and the limiting member 40 is used to limit the rotation angle between the cleaning surface 31 and the axis of the driving shaft 11.

[0037] For example, Figure 1 、 Figure 2 and Figure 3 As shown, a driving shaft 11 is provided at the lower end of the driving mechanism 10, a connecting seat 20 is fixed to the lower end of the driving shaft 11, a cleaning piece 30 is provided on the lower side of the connecting seat 20, and a cleaning surface 31 is formed on the lower side of the cleaning piece 30. The cleaning surface 31 is used to clean wafer debris on the wafer processing device. The cleaning piece 30 can be tilted relative to the axis of the driving shaft 11 to adjust the angle between the cleaning surface 31 and the axis of the driving shaft 11, so that the cleaning surface 31 can be fitted with the carrier table 200 of the wafer processing device.

[0038] When the wafer processing device processes the wafer, wafer debris is likely to remain on the carrier 200 of the wafer processing device. At this time, the cleaning device 100 is started to clean the debris on the carrier 200. During the cleaning process, the table top of the carrier 200 has a conical surface with a small protrusion in the center. Therefore, when the cleaning device 100 cleans the surface of the carrier 200, the cleaning surface 31 of the cleaning device 100 may not be able to fit with the table top of the carrier 200, and thus the cleaning effect cannot be guaranteed.

[0039] In the cleaning device 100 of the present invention, the cleaning piece 30 can be tilted relative to the axis of the drive shaft 11, that is, the cleaning surface 31 is tilted relative to the axis of the drive shaft 11, so that the gap between the cleaning surface 31 and the carrier 200 can be reduced, so that the cleaning surface 31 is attached to the surface of the carrier 200, thereby ensuring the cleaning neatness of the cleaning piece 30 and effectively ensuring the cleaning effect of the cleaning device 100. At the same time, the cleaning piece 30 can adjust the tilt angle according to the actual situation of the surface of the carrier 200, which can avoid the cleaning device 100 from tilting relative to the carrier 200 and improve the accuracy of the cleaning surface 31 being attached to the surface of the carrier 200, thereby improving the cleaning effect and effectively protecting the carrier 200.

[0040] According to some embodiments of the present invention, referring to Figure 2 and Figure 3 The cleaning device 100 includes: a connecting plate 50 and a plurality of connecting rods 60, that is, the cleaning device 100 includes two, three or four or more connecting rods 60, the connecting plate 50 is fixed to the cleaning member 30; the plurality of connecting rods 60 are arranged at intervals along the circumference of the drive shaft 11, the connecting seat 20 is provided with a first through-hole, the connecting plate 50 is provided with a second through-hole, and one end of the connecting rod 60 (such as Figure 2 The upper end of the connecting rod 60 shown in FIG. 6A is passed through the first through hole and the other end is passed through the second through hole (as shown in FIG. Figure 2 The lower end of the connecting rod 60 is shown in the figure) to connect the connecting plate 50 and the connecting seat 20.

[0041] In which, the connecting rod 60 is clearance-matched with at least one of the first perforation and the second perforation so as to be movable along the axial direction of the drive shaft 11 relative to at least one of the connecting plate 50 and the connecting seat 20. That is, the connecting rod 60 can be clearance-matched with the first perforation so as to be movable along the axial direction of the drive shaft 11 relative to the connecting seat 20. The connecting rod 60 can also be clearance-matched with the second perforation so as to be movable along the axial direction of the drive shaft 11 relative to the connecting plate 50. The connecting rod 60 can also be clearance-matched with both the first perforation and the second perforation.

[0042] In this way, by setting up the connecting plate 50, the cleaning piece 30 can be fixed to the connecting seat 20 through the connecting rod 60, so that the cleaning piece 30 can be driven to rotate under the action of the driving mechanism 10, thereby realizing the cleaning function. At the same time, multiple connecting rods 60 can not only strengthen the connection strength between the connecting seat 20 and the connecting plate 50, but also ensure that the connecting rod 60 can move normally relative to the connecting plate 50 or the connecting seat 20 along the axial direction of the drive shaft 11.

[0043] Furthermore, when the connecting rod 60 is engaged with the first perforated gap, the connecting seat 20 can be tilted along the axial direction of the drive shaft 11, and the connecting seat 20 drives the cleaning piece 30 to tilt through the connecting plate 50, so that the cleaning piece 30 can be fitted with the supporting platform 200. Similarly, when the connecting rod 60 is engaged with the second perforated gap, the connecting plate 50 can be tilted along the axial direction of the drive shaft 11, and the connecting plate 50 drives the cleaning piece 30 to tilt, so that the cleaning piece 30 can be fitted with the supporting platform 200.

[0044] For example, Figure 2 and Figure 3 As shown, the connecting plate 50 is arranged on the lower side of the connecting seat 20, the cleaning piece 30 is arranged on the lower side of the connecting plate 50, the connecting rod 60 extends in the up and down directions, the upper end of the connecting rod 60 passes through the first perforation, and the lower end of the connecting rod 60 passes through the second perforation. The connecting rod 60 is clearance-fitted with the first perforation and the second perforation. There are two connecting rods 60, and the two connecting rods 60 are arranged on both sides of the drive shaft 11 along the radial direction of the drive shaft 11.

[0045] According to some optional embodiments of the present invention, referring to Figure 2 and Figure 3 The cleaning device 100 may include: an elastic member 70, the elastic member 70 is sleeved on the connecting rod 60, and both ends of the elastic member 70 (such as Figure 3 The upper and lower ends of the elastic member 70 shown in the figure abut against the connecting plate 50 and the connecting seat 20, respectively. As a result, when the cleaning member 30 is in contact with the support platform, the cleaning member 30 pushes the connecting plate 50 to move along the extension direction of the connecting rod 60, and the elastic member 70 elastically deforms to keep the cleaning surface 31 in contact with the surface of the support platform 200. At the same time, this prevents the contact force between the cleaning member 30 and the support platform 200 from being too large, which could cause the cleaning member 30 to damage the support platform 200, thereby effectively protecting the support platform 200.

[0046] For example, Figure 2 and Figure 3 As shown, the elastic member 70 is sleeved on the connecting rod 60, the upper end of the elastic member 70 abuts the connecting seat 20, and the lower end of the elastic member 70 abuts the connecting plate 50. Preferably, the elastic member 70 is a spring.

[0047] According to some embodiments of the present invention, referring to Figure 2 and Figure 3 The cleaning device 100 may include: a connector 80, the connector 80 being disposed on a side of the connecting plate 50 away from the connecting seat 20 (eg Figure 2 As shown in FIG. 1 , the connector 80 can limit the connection plate 50 at the end of the connecting rod 60, thereby effectively preventing the connection plate 50 from separating from the connecting rod 60, thereby ensuring the connection stability between the connection plate 50 and the connecting seat 20. At the same time, the bolt structure is simple and low in cost, thus facilitating mass production.

[0048] For example, Figure 2 and Figure 3 As shown, the connecting head 80 is detachably connected to the connecting rod, for example, the connecting head 80 is a nut, and the end of the connecting rod 60 is threadedly connected to the nut; or, the connecting head 80 and the connecting rod 60 are an integral structure, for example, both are bolts, and the connecting head 80 is a large head.

[0049] According to some embodiments of the present invention, referring to Figure 2 and Figure 3 The limiting member 40 includes a limiting cylinder 41, which is formed in an annular shape along the circumference of the drive shaft 11. The limiting cylinder 41 is sleeved on the outer side of the connecting seat 20, and the limiting cylinder 41 is clearance-matched with the connecting seat 20. As a result, the limiting cylinder 41 can limit the inclination angle of the connecting seat 20 and the connecting plate 50, thereby preventing the connecting seat 20 or the connecting plate 50 from tilting too much, thereby reducing the phase difference between the drive shaft and the cleaning member during the rotation process, thereby increasing the stability and service life of the cleaning device. Without the limitation of the limiting cylinder 41, when the drive shaft drives the cleaning member to rotate, the phase difference between the two is large, and the working stability is poor.

[0050] For example, Figure 2 and Figure 3 As shown, the limiting cylinder 41 extends in the up and down directions, and the limiting cylinder 41 is formed into a ring along the circumference of the drive shaft 11, and is sleeved on the outer side of the connecting seat 20. The connecting seat 20 and the limiting cylinder 41 are clearance-matched, so that the connecting seat 20 can move toward the limiting cylinder 41 along the radial direction of the limiting cylinder 41.

[0051] Furthermore, if Figure 5 As shown, the gaps between the connecting seat 20 and the limiting cylinder 41 are at X and Y in the figure. When the cleaning member 30 is kept horizontal in the left and right directions, the gaps at X and Y are equal. When the cleaning member 30 has an angle with the axis of the drive shaft 11, for example, when the cleaning surface 31 is lower on the left and higher on the right, the gap at X is smaller than the gap at Y.

[0052] According to some optional embodiments of the present invention, referring to Figure 3 and Figure 4The limiting member 40 further includes a bottom plate 42, which is sealed on one side of the limiting cylinder 41 facing the connecting plate 50 (such as Figure 3 The bottom plate 42 is fixed to the connecting plate 50, and a third through-hole is provided in the bottom plate 42. The connecting rod 60 is passed through the third through-hole and is loosely fitted therewith. Thus, the provision of the bottom plate 42 increases the contact area between the limiting cylinder 41 and the connecting plate 50, thereby facilitating the connection between the limiting member 40 and the connecting plate 50 and increasing the rigidity of the connection between the connecting base 20 and the connecting plate 50.

[0053] In addition, the connecting rod 60 passes through the third through-hole to fix the limiting member 40 and the connecting plate 50, thereby improving the functional integration of the connecting rod 60 and eliminating the need for an additional fixing structure to fix the limiting member 40, thereby reducing production costs.

[0054] For example, Figure 3 and Figure 4 As shown, the bottom plate 42 is sealed on the lower side of the connecting plate 50, and a third through-hole is provided on the bottom plate 42 which passes through the bottom plate 42 in the up-down direction. The connecting rod 60 passes through the first through-hole, the third through-hole and the second through-hole in sequence from top to bottom to fix the limit member 40 and the connecting plate 50 to the connecting seat 20.

[0055] According to some embodiments of the present invention, referring to Figure 2 and Figure 3 The connecting plate 50 is configured to be elastically deformable. Thus, the connecting plate 50 can further adjust the axial inclination angle of the cleaning member 30 relative to the drive shaft 11, thereby compensating for the inclination angle of the entire cleaning device 100, thereby ensuring that the cleaning surface 31 can accurately fit the carrier 200.

[0056] According to some optional embodiments of the present invention, referring to Figure 2 and Figure 3 The connecting plate 50 includes a first plate 51 and a second plate 52. The first plate 51 is arranged perpendicular to the axial direction of the drive shaft 11; the second plate 52 is formed into a ring shape along the circumference of the first plate 51, and one end of the second plate 52 (such as Figure 2 The upper end of the second plate 52 shown in FIG. 5 is connected to the first plate 51, and the other end of the second plate 52 (as shown in FIG. Figure 2 The lower end of the second plate 52 shown in FIG. 1 extends along the axial direction of the drive shaft 11 toward the cleaning member 30, and the second plate 52 faces away from the end of the first plate 51 (as shown in FIG. Figure 2 The lower end of the second plate 52 shown is provided with a flange, which is connected to the cleaning piece 30.

[0057] In this way, the first plate 51 and the second plate 52 cooperate to form a structure with one side open, which can facilitate the elastic deformation of the connecting plate 50, and then the inclination angle of the cleaning piece 30 can be compensated by the connecting plate 50. At the same time, the flange on the second plate 52 can increase the contact area between the second plate 52 and the cleaning piece 30, thereby facilitating the connection between the second plate 52 and the cleaning piece 30 and improving the fixing strength.

[0058] For example, Figure 2 and Figure 3 As shown, the first plate 51 extends horizontally in the left-right direction, the second plate 52 extends vertically in the up-down direction, and the lower end of the second plate 52 is provided with a flange extending in the left-right direction, and the flange is connected to the cleaning piece 30.

[0059] According to some embodiments of the present invention, referring to Figure 2 and Figure 3 The cleaning device 100 includes a first driving member and a second driving member. The first driving member is used to drive the cleaning member 30 to move in the vertical direction, and the second driving member is used to drive the cleaning member 30 to rotate. Therefore, the position of the cleaning member 30 can be adjusted by the first driving member, so that the cleaning member 30 can clean wafer debris more conveniently. The cleaning member 30 can be driven to operate by the second driving member, so that the cleaning effect of the cleaning member 30 can be ensured.

[0060] Furthermore, if Figure 2 and Figure 3 As shown, the cleaning member 30 is made of an oilstone material, and the cleaning surface 31 of the cleaning member 30 is configured to remove wafer debris. As a result, the oilstone material has a simple structure, low cost, and is convenient for batch use. At the same time, the cleaning process of the cleaning member 30 is relatively gentle, thereby preventing the cleaning member 30 from damaging the carrier 200 or the wafer.

[0061] Furthermore, if Figure 1 As shown, the driving mechanism 10 further includes: a fixed frame 12, a cylinder 13, a connecting bracket 14, a driving motor 15 and a coupling 16. The cylinder 13 is fixed to the fixed frame 12, and the cylinder 13 is connected to the driving motor 15 via the connecting bracket 14. The driving motor 15 is provided with a coupling 16, and the driving shaft 11 is connected to the driving motor 15 via the coupling 16. Thus, the driving mechanism 10 can control the cleaning member 30 to move up and down through the cylinder 13, thereby enabling the cleaning device 100 to adapt to a variety of heights of the carrier platform 200, thereby improving the versatility of the cleaning device 100.

[0062] According to the wafer processing device of the second embodiment of the present invention, Figure 1 、 Figure 2 and Figure 3, comprising: a carrier 200 and a cleaning device 100 according to the first aspect of this embodiment. The carrier 200 is suitable for carrying wafers; the cleaning device 100 is used to clean the carrier 200. For example, a wafer is placed on the carrier 200, and the cleaning device 100 is located on the upper side of the carrier 200.

[0063] According to the wafer processing device of the embodiment of the present invention, by setting the cleaning device 100 of the above-mentioned first embodiment, the cleaning piece 30 can be tilted relative to the axis of the driving shaft 11, so that the cleaning surface 31 is attached to the table surface of the carrier 200, thereby ensuring the cleaning neatness of the cleaning piece 30 and effectively ensuring the cleaning effect of the cleaning device 100. At the same time, it can avoid the cleaning device 100 from tilting relative to the carrier 200, and improve the accuracy of the cleaning surface 31 being attached to the table surface of the carrier 200, thereby improving the cleaning effect and effectively protecting the carrier 200.

[0064] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0066] In this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0067] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0068] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A cleaning device (100) for a wafer processing device, characterized in that: include: A driving mechanism (10), wherein the driving mechanism (10) is provided with a driving shaft (11); A connecting seat (20), wherein the connecting seat (20) is fixed to the driving shaft (11); A cleaning member (30), the cleaning member (30) is connected to the connecting seat (20), the driving shaft (11) drives the cleaning member (30) to rotate through the connecting seat (20), the cleaning member (30) has a cleaning surface (31), and the cleaning member (30) is movable relative to the driving shaft (11) to adjust the angle between the cleaning surface (31) and the axis of the driving shaft (11); A limiting member (40) is provided between the connecting seat (20) and the cleaning member (30), and the limiting member (40) is used to limit the rotation angle between the cleaning surface (31) and the axis of the driving shaft (11).

2. The cleaning device (100) according to claim 1, characterized in that include: a connecting plate (50), the connecting plate (50) being fixed to the cleaning member (30); A plurality of connecting rods (60), wherein the plurality of connecting rods (60) are arranged at intervals along the circumference of the drive shaft (11), the connecting seat (20) is provided with a first through hole, the connecting plate (50) is provided with a second through hole, one end of the connecting rod (60) is passed through the first through hole and the other end is passed through the second through hole to connect the connecting plate (50) and the connecting seat (20), The connecting rod (60) is loosely fitted with at least one of the first through hole and the second through hole so as to be movable along the axial direction of the drive shaft (11) relative to at least one of the connecting plate (50) and the connecting seat (20).

3. The cleaning device (100) according to claim 2, characterized in that include: An elastic member (70) is sleeved on the connecting rod (60), and two ends of the elastic member (70) respectively abut against the connecting plate (50) and the connecting seat (20).

4. The cleaning device (100) according to claim 2, characterized in that include: A connecting head (80) is provided on a side of the connecting plate (50) facing away from the connecting seat (20).

5. The cleaning device (100) according to claim 2, characterized in that The limiting member (40) comprises a limiting cylinder (41), the limiting cylinder (41) is formed into a ring shape along the circumference of the drive shaft (11), the limiting cylinder (41) is sleeved on the outside of the connecting seat (20), and the limiting cylinder (41) and the connecting seat (20) are clearance-matched.

6. The cleaning device (100) according to claim 5, characterized in that The limiting member (40) further includes a bottom plate (42), the bottom plate (42) being sealed on a side of the limiting cylinder (41) facing the connecting plate (50), the bottom plate (42) being fixed to the connecting plate (50), A third through hole is provided on the bottom plate (42), and the connecting rod (60) is passed through the third through hole and is gap-fitted with the third through hole.

7. The cleaning device (100) according to claim 2, characterized in that The connecting plate (50) is configured to be elastically deformable.

8. The cleaning device (100) according to claim 7, characterized in that The connecting plate (50) comprises: a first plate (51), the first plate (51) being arranged perpendicular to the axial direction of the drive shaft (11); A second plate (52), the second plate (52) is formed into a ring shape along the circumference of the first plate (51), one end of the second plate (52) is connected to the first plate (51), the other end of the second plate (52) extends toward the cleaning member (30) along the axial direction of the drive shaft (11), and the end of the second plate (52) facing away from the first plate (51) is provided with a flange, and the flange is connected to the cleaning member (30).

9. The cleaning device (100) according to claim 1, characterized in that It comprises a first driving member and a second driving member, wherein the first driving member is used for driving the cleaning member (30) to move in the up and down directions, and the second driving member is used for driving the cleaning member (30) to rotate.

10. A wafer processing device, characterized in that: include: A carrying platform (200), wherein the carrying platform (200) is suitable for carrying a wafer; The cleaning device (100) according to any one of claims 1 to 9, wherein the cleaning device (100) is used to clean the supporting platform (200).

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