Suction pen capable of sensing and triggering vacuum

Abstract

The utility model discloses a suction pen capable of sensing and triggering vacuum, and relates to the technical field of vacuum adsorption devices. The vacuum suction pen specifically comprises a vacuum suction pen body capable of generating negative pressure suction force; the first position sensor is connected to the vacuum chuck body and is used for detecting the position of a wafer; the second position sensor is connected to the vacuum chuck body, and the second position sensor and the first position sensor are oppositely arranged in the length direction of the vacuum chuck, so that a detection area is formed between the first position sensor and the second position sensor; and when the boundary of the wafer is located between the first position sensor and the second position sensor, the control unit controls the vacuum suction pen body to generate negative pressure suction force. Therefore, the vacuum suction pen can be accurately adsorbed at the central position of the wafer, and the risk that the wafer falls off or is damaged is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum adsorption devices, in particular to a suction pen capable of induction triggering vacuum. Background Art

[0002] With the rapid development of the semiconductor industry, wafer production and processing are becoming increasingly sophisticated, and wafer handling and processing play a crucial role in the entire production process. Wafers are extremely fragile and delicate materials, and the quality of their handling throughout production, testing, and handling directly impacts the yield and performance of the final product. To ensure wafer integrity and safety during handling, a variety of jigs for wafer handling and manipulation have been developed. Among these, vacuum pens, a common wafer handling tool, are widely used in high-precision manufacturing processes in semiconductors, optoelectronics, and other fields.

[0003] The vacuum suction pen uses the principle of negative pressure adsorption to fix the wafer using the adsorption force generated after the suction pen head contacts the wafer, thereby realizing operations such as wafer handling, inspection or transfer. The existing vacuum suction pen will immediately generate negative pressure adsorption force after being removed from the pen holder, which means that the suction pen head starts to adsorb the wafer the moment it contacts the wafer. Although this design is convenient, it brings certain operational risks. Since the suction pen head cannot automatically align with the center position of the wafer during the adsorption process, if the contact point between the suction pen head and the wafer is not at the center point of the wafer, the adsorption process will be unbalanced, resulting in uneven force on the wafer. In order to prevent the wafer from falling or being damaged, the operator must manually adjust the contact point between the suction pen head and the wafer. This process not only increases the complexity of the operation, but may also cause secondary damage to the wafer or wafer falling.

[0004] Therefore, how to ensure that the vacuum pen can accurately adsorb to the center of the wafer and reduce the risk of the wafer falling or being damaged has become a technical problem that needs to be solved urgently. Utility Model Content

[0005] The main purpose of the utility model is to provide a vacuum suction pen that can sense and trigger vacuum, aiming to ensure that the vacuum suction pen can accurately adsorb to the center position of the wafer, reducing the risk of the wafer falling or being damaged.

[0006] In order to achieve the above-mentioned object, the present invention provides a vacuum-triggering suction pen, comprising:

[0007] The vacuum pen body can generate negative pressure suction;

[0008] A first position sensor is connected to the vacuum pen body and is used to detect the position of the wafer;

[0009] a second position sensor connected to the vacuum pen body and arranged opposite to the first position sensor along the length direction of the vacuum pen to form a detection area between the first position sensor and the second position sensor; and

[0010] The control unit controls the vacuum pen body to generate negative pressure suction when the boundary of the wafer is located between the first position sensor and the second position sensor.

[0011] In one embodiment of the present application, the vacuum pen body includes:

[0012] The suction pen head is equipped with vacuum air holes for sucking wafers;

[0013] A pen holder, wherein a first end of the pen holder is connected to the pen suction head;

[0014] a handle portion, the second end of the pen barrel portion being connected to the handle portion, the first position sensor and the second position sensor being connected to the pen barrel portion; and

[0015] The negative pressure pump is connected to the vacuum air hole and can generate negative pressure in the vacuum air hole.

[0016] In one embodiment of the present application, a vacuum groove is provided on the working plane of the suction pen head, and the vacuum air hole is located in the vacuum groove.

[0017] In one embodiment of the present application, the vacuum groove is composed of a plurality of first grooves arranged in parallel and a second groove connecting the plurality of first grooves, wherein the length direction of the first groove is parallel to the length direction of the pen body.

[0018] In one embodiment of the present application, a vacuum switch button for turning on or off the negative pressure pump is provided on the handle.

[0019] In one embodiment of the present application, the distance between the first position sensor and the second position sensor is A, 16 mm ≥ A ≥ 14 mm.

[0020] In one embodiment of the present application, the distance between the first position sensor and the second position sensor is 15 mm.

[0021] In one embodiment of the present application, the distance between the first position sensor and the center of the vacuum air hole is 57 mm.

[0022] In one embodiment of the present application, the distance between the second position sensor and the vacuum switch button is 53 mm.

[0023] The above technical solution, by installing two sensors, can more accurately determine the position of the wafer, improve the precision of the adsorption, and prevent accidents caused by incomplete wafer alignment, thereby improving the safety and reliability of the operation. The use of a control unit makes the adsorption process more automated, reducing manual intervention and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be described in detail below with reference to specific embodiments and accompanying drawings, wherein:

[0025] Figure 1 This is a schematic structural diagram of the first embodiment of the present utility model;

[0026] 11. First position sensor; 12. Second position sensor; 21. Suction pen head; 22. Pen shaft; 23. Handle; 40. Vacuum switch button; 50. Vacuum air hole; 61. First groove; 62. Second groove. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the following specific embodiments are only used to explain the present invention and do not constitute a limitation to the present invention.

[0028] like Figure 1 As shown, in order to achieve the above-mentioned purpose, the present invention provides a vacuum-triggering suction pen, comprising:

[0029] The vacuum pen body can generate negative pressure suction;

[0030] A first position sensor 11 is connected to the vacuum pen body and is used to detect the position of the wafer;

[0031] a second position sensor 12 connected to the vacuum pen body and arranged opposite to the first position sensor 11 along the length direction of the vacuum pen to form a detection area between the first position sensor 11 and the second position sensor 12; and

[0032] The control unit controls the vacuum pen body to generate negative pressure suction when the boundary of the wafer is located between the first position sensor 11 and the second position sensor 12 .

[0033] Specifically, the vacuum pen body can generate negative pressure suction for adsorbing and transporting wafers. The first position sensor 11 is installed on the vacuum pen body and is responsible for detecting the position of the wafer. When the wafer approaches this sensor, the sensor will send a signal. The second position sensor 12 is also connected to the vacuum pen body and is arranged opposite to the first position sensor 11 in the length direction of the vacuum pen body. A detection area is formed between the two for monitoring the position of the wafer. When the boundary of the wafer is within the detection area, the vacuum pen body is controlled to generate suction that can adsorb the wafer.

[0034] The control unit receives signals from the first position sensor 11 and the second position sensor 12. When the edge of the wafer is located between the two sensors, the control unit instructs the vacuum pen body to generate negative pressure suction to achieve adsorption of the wafer.

[0035] The first position sensor 11 and the second position sensor 12 are arranged along the length of the vacuum wand body, forming a detection area between them. This design enables precise determination of the wafer's position, ensuring that the suction point is located in the center of the wafer during suction. The first and second position sensors 11, 12 are both detachably connected to the vacuum wand body, such as by screws or bolts. This detachable connection facilitates adjustment of the positions of the first and second position sensors 11, 12, and the location of the detection area, thereby accommodating wafers of varying sizes. Depending on the design requirements, the first and second position sensors 11, 12 can also be fixedly connected to the vacuum wand body, such as by integral molding or welding. This fixed connection improves the connection strength between the first and second position sensors 11, 12 and the vacuum wand body, ensuring operational stability. It is also conceivable that the first and second position sensors 11, 12 can be slidably connected to the vacuum wand body, thereby adjusting the size of the detection area between them to accommodate wafers of varying sizes.

[0036] The above technical solution, by installing two sensors, can more accurately determine the position of the wafer, improve the precision of the adsorption, and prevent accidents caused by incomplete wafer alignment, thereby improving the safety and reliability of the operation. The use of a control unit makes the adsorption process more automated, reducing manual intervention and improving production efficiency.

[0037] In one embodiment of the present application, the vacuum pen body includes:

[0038] The suction pen head 21 is provided with a vacuum air hole 50 for sucking the wafer;

[0039] A pen holder 22 , wherein a first end of the pen holder 22 is connected to the pen suction head 21 ;

[0040] a handle portion 23 , to which the second end of the pen barrel portion 22 is connected, and to which the first position sensor 11 and the second position sensor 12 are connected; and

[0041] The negative pressure pump is connected to the vacuum air hole 50 to generate negative pressure in the vacuum air hole 50 .

[0042] Specifically, the suction pen tip 21 has vacuum air holes 50, which are directly responsible for contacting and adsorbing the wafer surface. The pen shaft 22 connects the suction pen tip 21 to the handle 23, providing support and conduction. The handle 23 is located at the second end of the pen shaft 22, making it easy for the operator to grip and control the movement of the suction pen. A negative pressure pump is connected to the vacuum air holes 50, generating negative pressure within the suction pen tip 21, enabling the adsorption function.

[0043] The suction pen head 21 is connected to the handle portion 23 through the pen shaft portion 22 to form an integrated operating tool. The negative pressure pump is connected to the vacuum air hole 50 through a pipeline so that the negative pressure generated by the pump can directly act on the suction pen head 21.

[0044] The above-mentioned technical solution combines the design of vacuum vents 50 with a negative pressure pump to ensure fast and stable wafer adsorption, improving work efficiency. The handle 23 is designed for easy gripping by the operator, reducing fatigue and enhancing user comfort. The integrated negative pressure pump and sensor automatically automate the adsorption process, reducing the complexity of manual operation.

[0045] In one embodiment of the present application, a vacuum groove is provided on the working plane of the suction pen head 21 , and the vacuum air hole 50 is located in the vacuum groove.

[0046] The above technical solution provides a larger surface area for the vacuum tank, which increases the suction area and effectively improves the stability of the suction pen head 21 when adsorbing the wafer. The vacuum tank can evenly distribute the negative pressure, reducing the possibility of local overpressure causing damage to the wafer.

[0047] In one embodiment of the present application, the vacuum groove is composed of a plurality of first grooves 61 arranged in parallel and a second groove 62 connecting the plurality of first grooves 61 , wherein the length direction of the first groove 61 is parallel to the length direction of the pen body.

[0048] Specifically, multiple first grooves 61 are arranged in parallel, with the length of the first grooves 61 being parallel to the length of the pen barrel, and are mainly responsible for forming the negative pressure area. The second groove 62 connects the multiple first grooves 61 and acts as a conductor, ensuring that the negative pressure is evenly distributed among the grooves.

[0049] By adopting the above technical solution, the parallel first grooves 61 increase the adsorption area, while the conductive second grooves 62 ensure the uniform distribution of negative pressure, making the adsorption more efficient.

[0050] In one embodiment of the present application, a vacuum switch button 40 is provided on the handle portion 23 for turning on or off the negative pressure pump.

[0051] The above technical solution allows operators to stop negative pressure adsorption at any time, reducing the risk of accidents and ensuring safety during operation. At the same time, it allows operators to adjust the adsorption state as needed to adapt to different working scenarios and enhance operational flexibility.

[0052] In one embodiment of the present application, the distance between the first position sensor 11 and the second position sensor 12 is A, 16 mm ≥ A ≥ 14 mm.

[0053] Using the above technical solution, when the distance between the first position sensor 11 and the second position sensor 12 is 16 mm, the larger distance allows a wider detection area, which can more effectively adapt to wafers of different sizes, reduce the possibility of false detection, and ensure that negative pressure adsorption can still be correctly triggered when the wafer boundary is close to the sensor.

[0054] When the distance between the first position sensor 11 and the second position sensor 12 is 14 mm, the smaller distance improves the detection sensitivity and the operation accuracy.

[0055] In one embodiment of the present application, the distance between the first position sensor 11 and the second position sensor 12 is 15 mm.

[0056] With the above technical solution, the distance between the first position sensor 11 and the second position sensor 12 is 15mm, which can provide a wider detection area, improve the sensitivity of detection, and improve the operation accuracy.

[0057] In one embodiment of the present application, the distance between the first position sensor 11 and the center of the vacuum air hole 50 is 57 mm.

[0058] The above technical solution ensures that the vacuum air hole 50 can be located at the center of the 4 / 6 inch wafer.

[0059] In one embodiment of the present application, the distance between the second position sensor 12 and the vacuum switch button 40 is 53 mm.

[0060] The above technical solution can ensure that the operator will not affect the detection of the sensor when touching the switch, thereby enhancing the stability of the system.

[0061] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A vacuum-triggering suction pen, characterized in that: include: The vacuum pen body can generate negative pressure suction; A first position sensor is connected to the vacuum pen body and is used to detect the position of the wafer; a second position sensor connected to the vacuum pen body and arranged opposite to the first position sensor along the length direction of the vacuum pen to form a detection area between the first position sensor and the second position sensor; as well as The control unit controls the vacuum pen body to generate negative pressure suction when the boundary of the wafer is located between the first position sensor and the second position sensor.

2. The vacuum-triggerable suction pen according to claim 1, wherein: The vacuum pen body comprises: The suction pen head is equipped with vacuum air holes for sucking wafers; A pen holder, wherein a first end of the pen holder is connected to the pen suction head; a handle portion, the second end of the pen barrel portion being connected to the handle portion, the first position sensor and the second position sensor being connected to the pen barrel portion; and The negative pressure pump is connected to the vacuum air hole and can generate negative pressure in the vacuum air hole.

3. The vacuum-triggerable suction pen according to claim 2, wherein: A vacuum groove is provided on the working plane of the suction pen head, and the vacuum air hole is located in the vacuum groove.

4. The vacuum-triggerable suction pen according to claim 3, wherein: The vacuum groove is composed of a plurality of first grooves arranged in parallel and a second groove connecting the plurality of first grooves, wherein the length direction of the first groove is parallel to the length direction of the pen body.

5. The vacuum-triggerable suction pen according to claim 2, wherein: The handle is provided with a vacuum switch button which can turn on or off the negative pressure pump.

6. The vacuum-triggerable suction pen according to claim 1, wherein: The distance between the first position sensor and the second position sensor is A, 16 mm ≥ A ≥ 14 mm.

7. The vacuum-triggerable suction pen according to claim 6, wherein: The distance between the first position sensor and the second position sensor is 15 mm.

8. The vacuum-triggerable suction pen according to claim 2, wherein: The distance between the first position sensor and the center of the vacuum air hole is 57 mm.

9. The vacuum-triggerable suction pen according to claim 5, wherein: The distance between the second position sensor and the vacuum switch button is 53 mm.

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