DFN1006-2L packaging frame convenient to process and adsorb soldering tin

Abstract

The utility model provides a DFN1006-2L packaging frame convenient to process and adsorb soldering tin, which comprises two base islands, a gap is reserved between the two base islands, one sides, far away from each other, of the two base islands are folded inwards to form a soldering tin adsorption part, the soldering tin adsorption part extends outwards to form a part to be processed, and two sides of the soldering tin adsorption part are respectively provided with a first packaging limiting edge. According to the utility model, the edge of the base island is semi-etched to form the soldering tin adsorption part, so that the strength of the edge part of the base island is reduced, the groove can be conveniently processed on the end face of the packaging body after processing is completed, redundant soldering tin can enter the groove along the side wall of the packaging body in the use process of subsequent products, the redundant soldering tin is prevented from overflowing, and the service life of the packaging body is prolonged. And the peripheral circuit on the circuit board is influenced.

Description

Technical Field

[0001] The utility model belongs to the field of integrated circuit packaging, in particular to a DFN1006-2L packaging frame which is convenient for processing the solder adsorption function. Background Art

[0002] Existing DFN products mostly have pins located on the bottom surface. However, the DFN1006 also has pins on the side due to certain usage requirements. However, during production, to ensure the connection reliability between the epoxy and the frame, the side pins are separated from the bottom pins by epoxy. However, because the epoxy and tin layers cannot be wetted by solder, and because DFN is a flat, pinless package, excess solder during the soldering process can be squeezed out, forming solder balls or deformed shapes. Due to the small spacing between individual circuits on the circuit board, these solder balls can cause other circuits on the board to connect incorrectly, posing a safety hazard on the circuit board. Utility Model Content

[0003] In view of this, the present invention aims to propose a DFN1006-2L packaging frame that is easy to process and has a solder adsorption function, so as to provide a structure that can adsorb surrounding solder after packaging.

[0004] In order to achieve the above-mentioned purpose, the technical solution of the utility model is achieved as follows:

[0005] A DFN1006-2L packaging frame with a solder adsorption function that is easy to process includes two base islands with a gap between the two base islands. The sides of the two base islands that are away from each other are retracted inward to form a solder adsorption portion. The solder adsorption portion extends outward to a portion to be processed, and first packaging limiting edges are respectively provided on both sides of the solder adsorption portion.

[0006] Furthermore, the first packaging reinforcement area is formed at both ends of the solder adsorption portion by half etching.

[0007] Furthermore, a second packaging reinforcement region is formed by half etching on the side where the two base islands are close to each other.

[0008] Furthermore, connecting portions are extended outward from both sides of each base island, and the connecting portions are half-etched so that the thickness of the connecting portions is the same as that of the second packaging reinforcement region.

[0009] Furthermore, second packaging limiting edges are respectively provided on both sides of the second packaging reinforcement area.

[0010] Furthermore, epoxy connection spaces are respectively provided on both sides of each base island, and the epoxy connection spaces are formed by semi-enclosing the side edge of the base island and the connection portion.

[0011] Furthermore, a surface of the base island facing away from the first packaging reinforcement area is provided with an electroplated metal layer.

[0012] Furthermore, a fool-proof identification chamfer is formed at a corner of one of the base islands by half etching, and the fool-proof identification chamfer is placed on a side where the two base islands are close to each other.

[0013] Compared with the prior art, the DFN1006-2L packaging frame described in the present invention, which is easy to process and has the function of adsorbing solder, has the following advantages:

[0014] The utility model adopts half-etching to form a solder adsorption part on the edge of the base island to reduce the strength of the edge of the base island, making it easier to process a groove on the end face of the package after processing is completed. In the subsequent use of the product, excess solder can enter the groove along the side wall of the package, avoiding excess solder overflow and affecting the surrounding circuits on the circuit board.

[0015] A first package limiting edge is provided on both sides of the solder adsorption portion, and a first package reinforcement area is provided at the end of the first package limiting edge to prevent the epoxy and frame connection strength from being reduced after the package end is processed, resulting in a loose package.

[0016] A second package reinforcement area is provided on one side of the base island and second package limiting edges are provided on both sides of the base island and the second package reinforcement area to improve the positioning effect of the base island and prevent the base island from vibrating during subsequent processing and causing the package body to become loose. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 Schematic diagram of the packaging frame structure;

[0019] Figure 2 It is a schematic cross-sectional view of the packaging structure frame;

[0020] Figure 3 This is a schematic diagram of the silver plating area of ​​the package frame base island;

[0021] Figure 4 This is a schematic diagram of the production framework structure;

[0022] Figure 5 This is a schematic diagram of the packaging product structure.

[0023] Description of reference numerals:

[0024] 1-base island; 11-electroplated metal layer; 2-connecting part; 3-second package reinforcement area; 31-second package limiting edge; 4-solder adsorption part; 41-first package limiting edge; 42-first package reinforcement area; 43-part to be processed; 5-first epoxy connection space; 6-second epoxy connection space; 7-production frame; 8-groove; 9-foolproof identification chamfer. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0027] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0028] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0029] The DFN1006-2L packaging frame described in the present invention, which is easy to process and has the function of adsorbing solder, includes two base islands 1, with a gap left between the two base islands 1, and the adjacent sides of the base islands 1 are formed with a second packaging reinforcement area 3 by half-etching, and the edges of the sides away from each other are retracted inward to form a solder adsorption portion 4, and first packaging limiting edges 41 are respectively provided on both sides of the solder adsorption portion 4, and the two ends of the solder adsorption portion 4 are respectively processed by half-etching to form a first packaging reinforcement area 42, so that during the packaging process, the packaging media of the upper and lower layers of the packaging frame pass through the packaging media from both sides of the solder adsorption portion 4, wrapping the main part of the base island 1 in the packaging medium to prevent the base island 1 from falling out.

[0030] The adjacent side of the two base islands 1 is half-etched to form a second packaging reinforcement area 3, and a second packaging limiting edge 31 is provided on both sides of the second packaging reinforcement area 3. In this embodiment, the second packaging limiting edge 31 is placed at a position of the second packaging reinforcement area 3 away from the side of the base island 1. The second packaging reinforcement area 3 extends outward from the side close to the base island 1, and the connecting portion 2 is also connected to the base island 1. The thickness of the connecting portion 2 is the same as the thickness of the second packaging reinforcement area 3, so that the thickness of the connecting portion 2 is less than the thickness of the base island 1. The thickness difference formed between the base island 1 and the second packaging reinforcement area 3 and the base island 1 further prevents the base island 1 from shifting in its own plane. In the production frame 7 of the present packaging frame, the connecting portion 2 is connected to the production frame 7 or the adjacent packaging frame, so that the multiple packaging frames in the production frame 7 are connected into a whole for easy packaging processing.

[0031] A plated metal layer 11 is provided on the side of the island 1 facing away from the first package reinforcement region 42 to facilitate electrical connection between the die and the island 1. In this embodiment, the plated metal layer is silver; alternative materials include gold, nickel-palladium-gold, and the like, as needed. To facilitate distinguishing and identifying the positions of the two islands 1 during the connection process, a half-etched corner 9 is formed at the edge of one of the islands 1 to provide a foolproof identification feature.

[0032] Each base island 1 has a first epoxy connection space 5 and a second epoxy connection space 6 on both sides, and the first epoxy connection space 5 is formed by the side edge of the base island 1 and the semi-enclosed connection portion 2, and the second epoxy connection space 6 is formed by the side edge of the second packaging reinforcement area 3 and the semi-enclosed connection portion 2. Figure 3As shown, multiple packaging frames are arranged as a whole within a production frame 7. The packaging medium wraps the base island 1 inside from the first epoxy connection space 5 and the second epoxy connection space 6. After the packaging is completed, the individual packaged products can be divided according to a predetermined route by a cutting machine. Then, the ends of the packaged products close to the base island 1 are polished to form grooves 8. The various packaging reinforcement areas and packaging fixing edges prevent the end face of the to-be-processed portion 43 inside the end face of the package from being exposed to the outside of the package during the polishing process. The end face of the solder adsorption portion 4 is electrically connected to the lower surface of the solder adsorption portion 4 through the electroplating process. During use, the position to be soldered on the circuit board is tin-plated. Since the solder temperature is high at this time and it is in a liquid state, when the product contacts the tin-plated position, the solder expands outward until it expands outside the end face of the product. Since the groove 8 is formed on the end face of the product at this time, the solder can extend upward along the electroplating area, thereby adsorbing excess solder on the end face of the product, preventing the excessive outward expansion of the solder, which may affect other connection points around the product and cause circuit problems.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. The DFN1006-2L package frame with solder adsorption function is easy to process, and its characteristics are: It includes two base islands with a gap between them, and the sides of the two base islands that are away from each other are gathered inward to form a solder adsorption portion, the solder adsorption portion extends outward to form a portion to be processed, and first packaging limiting edges are respectively provided on both sides of the solder adsorption portion.

2. The DFN1006-2L package frame with solder adsorption function for easy processing according to claim 1, characterized in that: The first packaging reinforcement area is formed at both ends of the solder adsorption portion by half etching.

3. The DFN1006-2L package frame with solder adsorption function for easy processing according to claim 1, characterized in that: A second packaging reinforcement area is formed by half etching on one side of the two base islands that are close to each other.

4. The DFN1006-2L package frame with solder adsorption function for easy processing according to claim 3, characterized in that: Connecting portions are extended outward from both sides of each base island, and the connecting portions are half-etched so that the thickness of the connecting portions is the same as that of the second packaging reinforcement area.

5. The DFN1006-2L package frame with solder adsorption function for easy processing according to claim 3, characterized in that: Second packaging limiting edges are respectively provided on both sides of the second packaging reinforcement area.

6. The DFN1006-2L package frame with solder adsorption function for easy processing according to claim 4, characterized in that: A first epoxy connection space and a second epoxy connection space are respectively provided on both sides of each base island, and the first epoxy connection space and the second epoxy connection space are respectively placed on both sides of the connection portion.

7. The DFN1006-2L package frame with solder adsorption function for easy processing according to claim 1, characterized in that: A surface of the base island facing away from the first packaging reinforcement area is provided with an electroplated metal layer.

8. The DFN1006-2L package frame with solder adsorption function for easy processing according to claim 1, characterized in that: A fool-proof identification chamfer is formed at a corner of one of the base islands by half etching, and the fool-proof identification chamfer is placed on a side where the two base islands are close to each other.

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