Double-half-piece IV detection machine capable of improving productivity
By setting up an independently moving detection mechanism and UVW correction and alignment components in the double half-wafer IV inspection machine, the problem of the probe row being unable to be accurately aligned is solved, efficient silicon wafer IV inspection is achieved, and inspection efficiency and production capacity are improved.
Patent Information
- Application Number
- CN202422488240.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-14
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-10-14
AI Technical Summary
During inspection, the probe rows of existing double-half-wafer IV inspection equipment cannot be accurately aligned, resulting in low inspection efficiency and affecting production capacity.
Two sets of independently moving detection mechanisms are set at the detection station in front of the dividing plate assembly. The alignment adjustment is achieved through the UVW correction and alignment components and the visual system to ensure that the probe holder and the probe row are accurately connected to the silicon wafer gate line.
It improves detection efficiency, increases production capacity, and enables accurate detection of silicon wafers.
Smart Images
Figure CN223322052U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer production, in particular to a double half-wafer IV detection machine for improving production capacity. Background Art
[0002] After production, photovoltaic cells need to be inspected to meet production requirements. The inspection items include color inspection, crack detection, hidden crack detection and IV inspection (storage capacity inspection) on both sides. Color inspection, crack detection and hidden crack detection require the use of a camera to capture the surface image, and the background will detect defects in the image to judge the quality of the photovoltaic cell. IV inspection is to test the voltage and current of the photovoltaic cell with probes, and convert the obtained signal data into performance parameters as the judgment standard. Existing equipment has begun to cooperate with printing machines to perform IV inspection on double half-cells. During the inspection, the probe row of the double half-cell either moves as a whole, and cannot accurately locate the two half-cells in different positions, or a correction mechanism is added at the end position of the track to straighten the position of the double half-cell silicon wafer, and then place it on the loading station of the dividing plate. The work process is slow, affecting the inspection efficiency. Utility Model Content
[0003] One purpose of the present utility model is to provide a double half-wafer IV inspection machine for improving production capacity, wherein the alignment adjustment structure is arranged on the front inspection station of the dividing plate assembly, and the two groups of inspection mechanisms respectively control the positions and angles of the two groups of probe racks and the two groups of probe rows to align the current double half-wafer, so as to facilitate accurate connection of the gate line.
[0004] To achieve this purpose, the present invention adopts the following technical solutions:
[0005] A double-half-sheet IV inspection machine for improving production capacity includes a work platform, a graduated plate assembly and two groups of inspection mechanisms, wherein the graduated plate assembly is located in the middle of the work platform, and the two groups of inspection mechanisms are respectively located on both sides of the front workstation of the graduated plate assembly. The inspection mechanism includes a UVW base, a probe rack and a probe row. A UVW correction and alignment assembly is installed at the lower end of the UVW base, and the UVW correction and alignment assembly includes two groups of X-axis modules and one group of Y-axis modules. The probe rack and the probe row are respectively movable in the vertical direction on the UVW base, and the probe row is installed with inspection probes. The two groups of inspection mechanisms move independently of each other.
[0006] As a preferred technical solution, two front half-piece tracks and two rear half-piece tracks are respectively provided on both sides of the dividing plate assembly, and the front half-piece tracks and the rear half-piece tracks are both driven by track belts through track motors to transport silicon wafers.
[0007] As a preferred technical solution, a detection camera is installed at the front end of the front half track, and a snapping splint motor is installed on the front half track. The driving end key of the snapping splint motor is connected to the snapping splint synchronous wheel, and the snapping splint synchronous wheel is connected to the snapping splint synchronous belt, and a snapping vertical rod is fixed on the snapping splint synchronous belt.
[0008] As a preferred technical solution, a first walking arm and a second walking arm are installed on both sides of the front half track and both sides of the rear half track, and a walking linear module is provided on the first walking arm and the second walking arm. A movable plate is connected to the driving end of the walking linear module, and a negative pressure adsorption plate is fixed on the inner end of the movable plate.
[0009] As a preferred technical solution, the length direction of the walking linear module on the first walking arm is parallel to the forward direction of the half track, and the length direction of the walking linear module on the second walking arm is inclined to the forward direction of the half track.
[0010] As a preferred technical solution, the dividing plate assembly includes an electrical integrated slip ring, a dividing plate support frame and a four-station turntable. The electrical integrated slip ring is fixed on the dividing plate support frame. The electrical integrated slip ring drives the four-station turntable to rotate. The four stations of the four-station turntable are all equipped with suction nozzles.
[0011] As a preferred technical solution, the X-axis module and the Y-axis module both include a motor mounting base, a module motor, an adjustment screw and an adjustment slide. The module motor is fixed on the motor mounting base, and the driving end of the module motor is transmission-connected to the adjustment screw. The adjustment screw is threadedly connected to the adjustment nut of the adjustment slide. The adjustment slide slides along the length direction of the adjustment screw, and the adjustment slide has a connecting bearing. The connecting bearing slides on the adjustment slide, and the moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide. The edge of the UVW base is locked in the connecting bearing. The two groups of X-axis modules plus one group of Y-axis modules jointly control the T-axis steering of the UVW base on one side.
[0012] As a preferred technical solution, linear guide rails and linear sliders are used to slide between the adjustment slide and the connecting bearing, and between the adjustment slide and the motor mounting seat.
[0013] As a preferred technical solution, an upper linear module and a lower linear module are installed on the rear side of the UVW base, the upper linear module controls the vertical movement of the probe holder, and the lower linear module controls the vertical movement of the probe row.
[0014] The beneficial effects of the present invention are: providing a double half-wafer IV detection machine with improved production capacity, which improves the correction of the silicon wafer position on the track to the detection mechanism, and corrects the position of the double half-wafer silicon wafer through two groups of independently moving detection mechanisms, so that the detection probe is accurately connected to the gate line on the silicon wafer, the detection efficiency is improved, and the production capacity is increased accordingly. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The present invention will be described in further detail below with reference to the accompanying drawings and embodiments.
[0016] Figure 1 This is a schematic diagram of the overall structure of a double half-wafer IV inspection machine for improving production capacity described in an embodiment;
[0017] Figure 2 for Figure 1 A partial enlarged view of point A in the middle;
[0018] Figure 3 It is a first three-dimensional structural diagram of the detection mechanism according to the embodiment;
[0019] Figure 4 is a second three-dimensional structural diagram of the detection mechanism according to the embodiment;
[0020] Figure 5 It is a side view of the detection mechanism described in the embodiment;
[0021] Figure 6 is a three-dimensional structural diagram of the first walking arm described in the embodiment;
[0022] Figure 7 is a three-dimensional structural diagram of the second walking arm described in the embodiment;
[0023] Figure 8 It is a three-dimensional structural diagram of the indexing plate assembly described in the embodiment.
[0024] Figures 1 to 8 middle:
[0025] 1. Working platform; 2. UVW base; 3. Probe holder; 4. Probe row; 5. Detection probe; 6. Front half track; 7. Back half track; 8. Detection camera; 9. Clamping plate motor; 10. Clamping plate synchronous wheel; 11. Clamping vertical rod; 12. Walking linear module; 13. Moving plate; 14. Negative pressure adsorption plate; 15. Electrical integrated slip ring; 16. Indexing plate support frame; 17. Four-station turntable; 18. Suction nozzle; 19. Motor mounting seat; 20. Module motor; 21. Adjustment screw; 22. Adjustment slide; 23. Connecting bearing; 24. Linear guide; 25. Upper linear module; 26. Lower linear module; 27. Loading station; 28. Detection station; 29. Unloading station; 30. Refilling station; 31. X-axis module; 32. Y-axis module. DETAILED DESCRIPTION
[0026] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.
[0027] like Figures 1 to 5 As shown, in this embodiment, a double-half-sheet IV inspection machine for improving production capacity includes a working platform 1, a dividing plate assembly and two groups of inspection mechanisms, the dividing plate assembly is located in the middle of the working platform 1, and the two groups of inspection mechanisms are respectively located on both sides of the front workstation of the dividing plate assembly, the inspection mechanism includes a UVW base 2, a probe rack 3 and a probe row 4, the lower end of the UVW base 2 is equipped with a UVW correction and alignment assembly, the UVW correction and alignment assembly includes two groups of X-axis modules 31 and one group of Y-axis modules 32, the probe rack 3 and the probe row 4 are respectively movable in the vertical direction on the UVW base 2, the probe row 4 is equipped with a detection probe 5, and the two groups of inspection mechanisms move independently of each other.
[0028] The left side of the dividing plate assembly is docked with the silicon wafers transported from the front, and the right side of the dividing plate assembly is responsible for outputting the silicon wafers that have been inspected. During the inspection process, the dividing plate assembly moves the two double-half-wafer silicon wafers to the front workstation. At this time, the probe rack 3 is separated from the probe row 4. According to the visual positioning provided by the visual system, the two groups of detection mechanisms perform X-axis translation, Y-axis translation and T-axis rotation under the control of two groups of X-axis modules 31 and one group of Y-axis modules 32 under the UVW base 2. The two sides are relatively independently positioned above and below the current half-wafer. After correction, the direction and position of the current half-wafer are more accurately targeted. Then the probe rack 3 moves downward, the probe row 4 moves upward, and the detection probe 5 contacts the gate line to form a loop for IV detection.
[0029] like Figures 6 and 7 As shown, two front half-piece tracks 6 and two rear half-piece tracks 7 are respectively provided on both sides of the indexing plate assembly. The front half-piece track 6 and the rear half-piece track 7 are both driven by track belts driven by track motors to transport silicon wafers. A detection camera 8 is installed at the front end of the front half-piece track 6. A snap-fitting plate motor 9 is installed on the front half-piece track 6. The driving end key of the snap-fitting plate motor 9 is connected to a snap-fitting plate synchronous wheel 10. The snap-fitting plate synchronous wheel 10 is connected to a snap-fitting plate synchronous belt. A snap-fitting vertical rod 11 is fixed on the snap-fitting plate synchronous belt. The first walking arm and the second walking arm are installed on both sides of the front half track 6 and the back half track 7. The first walking arm and the second walking arm are both provided with a walking linear module 12. The driving end of the walking linear module 12 is connected to a movable plate 13, and a negative pressure adsorption plate 14 is fixed to the inner end of the movable plate 13. The length direction of the walking linear module 12 on the first walking arm is parallel to the forward direction of the half track, and the length direction of the walking linear module 12 on the second walking arm is inclined to the forward direction of the half track.
[0030] The front half track 6 docks with the front-end equipment to receive double half-wafers. At the front end, the snapping plate motor 9 controls the snapping vertical rod 11 to move toward the middle of the track through the snapping plate synchronous wheel 10 and the snapping plate synchronous belt. The position of the silicon wafer is corrected while the snapping plate wheel reduces friction. The two sections of the front half track 6 are placed in parallel. When the silicon wafer is transported to the end of the front half track 6, the walking linear module 12 on the left controls the negative pressure adsorption plate 14 to suck up the silicon wafer, and driven by the moving plate 13, it is grabbed to the loading station 27 of the indexing plate assembly, and then the indexing plate assembly rotates to load the wafer. The two half-wafers on station 27 are transferred to the inspection station 28 for inspection, and then the dividing plate assembly controls the transfer of the two half-wafers on the inspection station 28 to the unloading station 29. The walking linear module 12 on the right controls the pressure adsorption plate to suck up the silicon wafers, and the silicon wafers on the dividing plate assembly are grabbed into the rear half-wafer track 7 by the drive of the moving plate 13. The track belt is driven by the track motor to output the silicon wafers. Moreover, the two front half-wafer tracks 6 are arranged non-parallel (similar to the two rear half-wafer tracks 7), which are set for the placement of the two half-wafer positions on each station on the dividing plate assembly.
[0031] like Figure 8 As shown, the indexing plate assembly includes an electrical integrated slip ring 15, a indexing plate support frame 16 and a four-station turntable 17. The electrical integrated slip ring 15 is fixed on the indexing plate support frame 16. The electrical integrated slip ring 15 drives the four-station turntable 17 to rotate. The indexing plate support frame 16 installs and fixes the electrical integrated slip ring 15. The electrical integrated slip ring 15 provides power to rotate the four-station turntable 17. Suction nozzles 18 are installed on the four stations of the four-station turntable 17. Double half-cut silicon wafers are transferred from the loading station 27 to the inspection station 28 for inspection, and then transferred to the unloading station 29 for output. At the rear is the feeding station 30, which can perform the double half-cut silicon wafer patching process. The suction nozzles 18 on the four stations can effectively fix the position of the double half-cut silicon wafers, which is convenient for the alignment of the detection mechanism.
[0032] The X-axis module 31 and the Y-axis module 32 both include a motor mounting seat 19, a module motor 20, an adjustment screw 21 and an adjustment slide 22. The module motor 20 is fixed on the motor mounting seat 19. The driving end of the module motor 20 is transmission connected to the adjustment screw 21. The adjustment screw 21 is threadedly connected to the adjustment nut of the adjustment slide 22. The adjustment slide 22 slides along the length direction of the adjustment screw 21, and the adjustment slide 22 is provided with a connecting bearing 23. The connecting bearing 23 slides on the adjustment slide 22. The moving direction of the connecting bearing 23 is perpendicular to the moving direction of the adjustment slide 22. The edge of the UVW base 2 is locked in the connecting bearing 23. The two sets of X-axis modules 31 plus a set of Y-axis modules 32 jointly control the T-axis steering of the UVW base 2 on one side. Linear guides 24 and linear sliders are used between the adjustment slide 22 and the connecting bearing 23, and between the adjustment slide 22 and the motor mounting seat 19 for sliding connection.
[0033] The UVW deflection correction and alignment component is a high-precision mobile structure designed specifically for high-precision alignment equipment. It is also commonly known as the XXY platform. As a three-axis parallel motion mechanism, it can achieve rotational motion centered on any point on the plane and translation in any direction (in-plane X, Y, and θ three-axis motion) by controlling the parallel motion of three linear moving structures. The UVW deflection correction and alignment component, combined with the vision module, can achieve high-precision alignment functions and can be applied in the silicon wafer printing industry.
[0034] More specifically, the implementation process of the UVW correction and alignment component includes determining the transformation matrix from the camera coordinate system to the UVW platform coordinate system through the visual calibration method, as well as the coordinate value of the marker template based on the origin coordinate system on the UVW correction and alignment component. The x, y, and θ offsets between the marker template position and the marker to be corrected are obtained through the visual module (based on the origin coordinate system of the UVW correction and alignment component). Then, the initial coordinates of the three axes are entered according to the formula, the rotation center is set to (0, 0), and the θ offset is entered to obtain the new coordinate values of the UVW three axes, the new coordinates of the object to be corrected, and the corresponding feed amounts of the three motors. This series of operations decomposes the motion process into translation and rotation parts, and calculates the motor feed amounts separately, thereby achieving precise automatic positioning, and the alignment accuracy can reach the micron level.
[0035] An upper linear module 25 and a lower linear module 26 are installed on the rear side of the UVW base 2. The upper linear module 25 controls the vertical movement of the probe holder 3, and the lower linear module 26 controls the vertical movement of the probe row 4. The upper linear module 25 causes the probe holder 3 to move downward and press on the upper surface of the silicon wafer, while the lower linear module 26 causes the probe row 4 to push upward and contact the gate line on the silicon wafer, so that a loop is formed for IV detection.
[0036] It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the technical principles used. Within the technical scope disclosed by the present invention, any changes or replacements that can be easily thought of by technicians familiar with this technical field should be included in the scope of protection of the present invention.
Claims
1. A double half-wafer IV inspection machine for improving production capacity, characterized in that: It includes a working platform, a dividing plate assembly and two groups of detection mechanisms. The dividing plate assembly is located in the middle of the working platform. The two groups of detection mechanisms are respectively located on both sides of the front workstation of the dividing plate assembly. The detection mechanism includes a UVW base, a probe rack and a probe row. The lower end of the UVW base is equipped with a UVW correction and alignment assembly. The UVW correction and alignment assembly includes two groups of X-axis modules and one group of Y-axis modules. The probe rack and the probe row are respectively movable in the vertical direction on the UVW base. The probe row is equipped with detection probes. The two groups of detection mechanisms move independently of each other.
2. A double half-wafer IV inspection machine for improving productivity according to claim 1, characterized in that: Two front half-piece tracks and two rear half-piece tracks are respectively provided on both sides of the indexing plate assembly. The front half-piece tracks and the rear half-piece tracks are driven by track belts through track motors to transport silicon wafers.
3. A double half-wafer IV inspection machine for improving productivity according to claim 2, characterized in that: A detection camera is installed at the front end of the front half track, and a snapping splint motor is installed on the front half track. The driving end key of the snapping splint motor is connected to the snapping splint synchronous wheel, and the snapping splint synchronous wheel is connected to the snapping splint synchronous belt, and a snapping vertical rod is fixed on the snapping splint synchronous belt.
4. A double half-wafer IV inspection machine for improving productivity according to claim 2, characterized in that: A first walking arm and a second walking arm are installed on both sides of the front half track and both sides of the rear half track, and a walking linear module is provided on the first walking arm and the second walking arm. A movable plate is connected to the driving end of the walking linear module, and a negative pressure adsorption plate is fixed on the inner end of the movable plate.
5. The double half-wafer IV inspection machine for improving productivity according to claim 4, characterized in that: The length direction of the walking linear module on the first walking arm is parallel to the forward direction of the half track, and the length direction of the walking linear module on the second walking arm is inclined to the forward direction of the half track.
6. The double half-wafer IV inspection machine for improving productivity according to claim 1, characterized in that: The indexing plate assembly includes an electrical integrated slip ring, a indexing plate support frame and a four-station turntable. The electrical integrated slip ring is fixed on the indexing plate support frame. The electrical integrated slip ring drives the four-station turntable to rotate. Each of the four stations of the four-station turntable is equipped with a suction nozzle.
7. The double half-wafer IV inspection machine for improving productivity according to claim 1, characterized in that: The X-axis module and the Y-axis module both include a motor mounting base, a module motor, an adjustment screw and an adjustment slide. The module motor is fixed on the motor mounting base, and the driving end of the module motor is transmission-connected to the adjustment screw. The adjustment screw is threadedly connected to the adjustment nut of the adjustment slide. The adjustment slide slides along the length direction of the adjustment screw, and the adjustment slide is provided with a connecting bearing. The connecting bearing slides on the adjustment slide, and the moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide. The edge of the UVW base is locked in the connecting bearing. Two groups of the X-axis modules plus one group of the Y-axis modules jointly control the T-axis steering of the UVW base on one side.
8. The double half-wafer IV inspection machine for improving productivity according to claim 7, characterized in that: The adjusting slide and the connecting bearing, as well as the adjusting slide and the motor mounting seat are slidably connected by linear guide rails and linear sliders.
9. The double half-wafer IV inspection machine for improving productivity according to claim 1, characterized in that: An upper linear module and a lower linear module are installed on the rear side of the UVW base. The upper linear module controls the vertical movement of the probe rack, and the lower linear module controls the vertical movement of the probe row.