Circuit board structure based on flexible circuit board and substrate pressing technology

Abstract

The utility model discloses a circuit board structure based on a flexible circuit board and a substrate pressing technology, which comprises a panel to be pressed and a flexible circuit board, the panel to be pressed is provided with a plurality of conductive contacts, the flexible circuit board is provided with a plurality of wiring contact mounting grooves capable of being mounted in the conductive contacts, and the wiring contact mounting grooves are connected with the flexible circuit board. The inner wall of the wiring contact installation groove and the outer wall of the conductive contact are respectively provided with a reverse trapezoid open groove, a material filling groove is formed between the conductive contact and the flexible circuit board after the conductive contact and the flexible circuit board are installed in a matched mode, and the space between the material filling groove and the reverse trapezoid open grooves is filled with conductive adhesive. The reverse trapezoidal slot is arranged between the flexible circuit board and the to-be-laminated panel, after the conductive adhesive is filled, the conductive adhesive enters the reverse trapezoidal slot and is not easy to fall off after being solidified, a clamping hook structure is formed, and the connection strength and the use stability are improved.

Description

Technical Field

[0001] The utility model relates to a circuit board based on a pressing technology, in particular to a circuit board structure based on a flexible circuit board and a substrate pressing technology. Background Art

[0002] The flexible circuit board and the panel to be pressed together are pressed together using conductive adhesive to achieve a conductive connection between the conductive contacts and the wiring contacts. During long-term use, the connection may become loose due to aging, loose due to external force, or break. Therefore, it is necessary to design a circuit board structure that improves the connection strength of the conductive adhesive.

[0003] Therefore, the existing circuit boards based on press-fit technology need to be further improved. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board structure based on the flexible circuit board and substrate pressing technology, which can improve the strength of the conductive adhesive pressing connection.

[0005] In order to achieve the above purpose, the present invention adopts the following scheme:

[0006] A circuit board structure based on flexible circuit board and substrate lamination technology includes a panel to be laminated and a flexible circuit board, the panel to be laminated is provided with multiple conductive contacts, the flexible circuit board is provided with multiple wiring contact mounting grooves that can be installed in the conductive contacts, the inner wall of the wiring contact mounting groove and the outer wall of the conductive contact are each provided with a reverse trapezoidal groove, a material filling groove is formed between the conductive contact and the flexible circuit board after they are assembled, and conductive glue is filled between the material filling groove and the reverse trapezoidal groove.

[0007] Furthermore, the wiring contact mounting slot includes a groove adapted to the conductive contact, and a wiring contact structure is provided in the groove.

[0008] Furthermore, the number of the conductive contacts is the same as the number of the wiring contact mounting slots.

[0009] Furthermore, the reverse trapezoidal slot includes an inner cavity slot and an input slot connected to the inner cavity slot.

[0010] Furthermore, the width of the input groove is smaller than the width of the inner cavity groove.

[0011] Furthermore, the flexible circuit board includes a main body portion and a binding portion.

[0012] In summary, the present invention has the following beneficial effects compared to the prior art:

[0013] The utility model solves the shortcomings of existing circuit boards based on pressing technology. Through the structural setting of the utility model, it has the following advantages: a reverse trapezoidal groove is provided between the flexible circuit board and the panel to be pressed. After filling with conductive glue, the conductive glue enters the reverse trapezoidal groove and is not easy to fall off after solidification, forming a hook structure, thereby improving the connection strength and stability of use, and the structure is simple and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of the utility model;

[0015] Figure 2 This is an exploded view of the utility model;

[0016] Figure 3 It is a schematic diagram of the internal structure of the utility model. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] See also Figure 1-3 The present invention provides a circuit board structure based on the flexible circuit board and substrate lamination technology, comprising a panel 1 to be laminated and a flexible circuit board 2, wherein the panel 1 to be laminated is provided with a plurality of conductive contacts 3, and the flexible circuit board 2 is provided with a plurality of wiring contact mounting grooves 4 that can be mounted in the conductive contacts 3, wherein the inner wall of the wiring contact mounting groove 4 and the outer wall of the conductive contact 3 are respectively provided with reverse trapezoidal grooves 5, and a material filling groove 6 is formed between the conductive contact 3 and the flexible circuit board 2 after being assembled, and a conductive adhesive 7 is filled between the material filling groove 6 and the reverse trapezoidal groove 5;

[0019] Put the conductive glue 7 on the surface of the plurality of conductive contacts 3;

[0020] Then align the plurality of wiring contact mounting slots 4 with the plurality of conductive contacts 3 for installation;

[0021] Perform the pressing work. At this time, the conductive glue 7 in between is filled into the material filling groove 6 and the reverse trapezoidal groove 5 due to the pressing;

[0022] The solidified conductive adhesive 7 forms a T-shaped structure which is stuck in the reverse trapezoidal slot 5 , forming a structure with a small head and a large tail, thereby improving stability and preventing it from falling off.

[0023] The wiring contact mounting groove 4 of the present invention includes a groove adapted to the conductive contact 3, and a wiring contact structure is provided in the groove.

[0024] In the present invention, the number of the conductive contacts 3 is the same as the number of the wiring contact mounting slots 4 .

[0025] The reverse trapezoidal slot 5 of the present invention includes an inner cavity slot 501 and an input slot 502 connected to the inner cavity slot 501 .

[0026] In the present invention, the width of the input groove 502 is smaller than the width of the inner cavity groove 501 .

[0027] The flexible circuit board 2 of the present invention includes a main body portion 201 and a binding portion 202 .

[0028] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrative purposes. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board structure based on flexible circuit board and substrate lamination technology, comprising a panel to be laminated (1) and a flexible circuit board (2), wherein a plurality of conductive contacts (3) are provided on the panel to be laminated (1), and characterized in that: The flexible circuit board (2) is provided with a plurality of wiring contact mounting grooves (4) that can be mounted in the conductive contacts (3); the inner wall of the wiring contact mounting groove (4) and the outer wall of the conductive contacts (3) are each provided with a reverse trapezoidal slot (5); a material filling slot (6) is formed between the conductive contacts (3) and the flexible circuit board (2) after they are mounted together; and a conductive adhesive (7) is filled between the material filling slot (6) and the reverse trapezoidal slot (5).

2. The circuit board structure based on the flexible circuit board and substrate lamination technology according to claim 1, characterized in that: The wiring contact mounting groove (4) comprises a groove adapted to the conductive contact (3), and a wiring contact structure is provided in the groove.

3. The circuit board structure based on the flexible circuit board and substrate lamination technology according to claim 2, characterized in that: The number of the conductive contacts (3) is the same as the number of the wiring contact mounting slots (4).

4. The circuit board structure based on the flexible circuit board and substrate lamination technology according to claim 3, characterized in that: The reverse trapezoidal slot (5) comprises an inner cavity slot (501) and an input slot (502) connected to the inner cavity slot (501).

5. The circuit board structure based on the flexible circuit board and substrate lamination technology according to claim 4, characterized in that: The width of the input groove (502) is smaller than the width of the inner cavity groove (501).

6. The circuit board structure based on the flexible circuit board and substrate lamination technology according to claim 5, characterized in that: The flexible circuit board (2) comprises a main body portion (201) and a binding portion (202).

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