Building board stamping device

Abstract

The utility model discloses a building board stamping device, which relates to the technical field of board stamping, and comprises a processing table, a support frame is arranged on the processing table, a servo electric cylinder is arranged on the support frame, the output end of the servo electric cylinder is connected with an upper template, and a lower template is arranged on the processing table; a cleaning mechanism is installed on the machining table, a sweeping mechanism is installed on the supporting frame, a supporting rod is installed on the machining table, and a buffering assembly is arranged on the supporting rod. Mounting blocks are mounted on the two sides of the supporting frame, and optical fiber sensors are mounted on the mounting blocks; by arranging the cleaning mechanism and the sweeping mechanism, a double waste treatment system is constructed, waste on the machining table can be cleaned in time, the situation that the flatness of the working table is affected by waste accumulation is avoided, optical fiber sensors installed on the two sides of the supporting frame can accurately detect whether residues are left on the lower die plate or not, and once the residues are detected, the optical fiber sensors can accurately detect whether the residues are left on the lower die plate. And the cleaning mechanism is linked for automatic cleaning.

Description

Technical Field

[0001] The utility model relates to the technical field of plate stamping, in particular to a building plate stamping device. Background Art

[0002] In the construction industry, building sheet metal stamping devices are widely used in sheet metal forming, hole punching, trimming, and other processing processes. Their performance directly determines the precision and efficiency of sheet metal processing. With the acceleration of the construction industrialization process, the demand for automated and efficient sheet metal processing is increasing, but existing stamping devices still have significant shortcomings in their structural design.

[0003] At present, most building board stamping devices focus on the optimization of core functions such as the stamping power system and mold structure, but ignore the design of the waste treatment link. The sources of debris and scraps generated during the stamping process of building boards are mainly the following: First, when the board is stamped and formed, the extrusion of the upper and lower molds will cause the edges of the board to tear or deform, thus forming scraps; second, some building boards may have oxide layers, coatings, etc. on the surface. During the stamping process, these surface materials will fall off due to friction and extrusion, forming debris; third, for non-cutting metal sheet stamping, even for non-cutting metal sheet stamping, during the stamping process, due to the plastic deformation of the metal sheet under pressure, the surface of the sheet may show slight peeling phenomenon. At the same time, the friction between the mold and the sheet will also produce some metal powder debris. Although the amount of debris generated is relatively small compared to cutting stamping, if these debris are not cleaned in time, they will still cause many problems. In actual production, the debris, scraps and other waste generated by the stamping process cannot be discharged in time and often accumulate on the work surface. This waste not only affects the flatness of the work surface, resulting in reduced accuracy in subsequent plate positioning and machining errors, but can also jam the mold during operation, damaging it and even causing equipment failure, increasing repair costs and downtime. Furthermore, manual waste removal is inefficient, labor-intensive, and poses safety risks, making it difficult to meet the requirements of continuous, intelligent production in modern industrialized construction. Utility Model Content

[0004] The purpose of the present utility model is to provide a building board punching device to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A building board punching device, comprising:

[0007] A processing table, wherein a support frame is installed on the processing table, a servo electric cylinder is installed on the support frame, an upper template is connected to the output end of the servo electric cylinder, and a lower template is installed on the processing table;

[0008] A cleaning mechanism is installed on the processing table, a cleaning mechanism is installed on the support frame, a support rod is installed on the processing table, and a buffer assembly is provided on the support rod;

[0009] Mounting blocks are installed on both sides of the support frame, and optical fiber sensors are installed on the mounting blocks.

[0010] Preferably, the cleaning mechanism includes a collecting hood, a collecting box and an adsorption assembly. The collecting port of the collecting hood is connected to the lower template, and one end of the collecting hood away from the lower template passes through the processing table and is connected to the collecting box.

[0011] Preferably, the adsorption assembly includes a fan, a connecting pipe and an adsorption hood, the adsorption hood is installed on the collection box, both ends of the connecting pipe are connected to the adsorption hood and the fan respectively, and a dustproof net is installed on the adsorption hood.

[0012] Preferably, an ultrasonic sensor is installed in the inner cavity of the collection box, and a box door is installed on the collection box.

[0013] Preferably, the cleaning mechanism includes two electric slides, two connecting plates and a cleaning brush. The two connecting plates are installed on the support frame through the electric slide. The connecting plates are connected to both ends of the cleaning brush through bolts, and the cleaning brush is in contact with the lower template.

[0014] Preferably, the buffer assembly includes a return spring, a support block, a damper and a limit plate, the limit plate is connected to the support rod, the support block is provided with a mounting groove, the return spring is sleeved on the outside of the damper, and the return spring and the damper are respectively connected at both ends to the limit plate and the support block.

[0015] Preferably, a controller is installed on the support frame, and the controller is electrically connected to the servo cylinder, the optical fiber sensor, the fan, the ultrasonic sensor and the electric slide respectively.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. The utility model constructs a dual waste treatment system by providing a cleaning mechanism and a sweeping mechanism. The cleaning mechanism can promptly clean the waste on the processing table to prevent waste accumulation from affecting the flatness of the work surface; the sweeping mechanism can sweep away the remaining fine debris. The two work together to achieve efficient removal of stamping waste. Compared with the traditional stamping device that requires manual waste cleaning, this greatly improves cleaning efficiency and reduces labor intensity. At the same time, it effectively reduces positioning errors and mold jams caused by waste accumulation, ensures plate processing accuracy and equipment operation stability, and extends the service life of the mold.

[0018] 2. The utility model sets a support rod on the processing table and is equipped with a buffer component. During the stamping process, the buffer component can effectively absorb the impact force generated by the stamping, reduce the vibration amplitude of the device, and reduce the risk of equipment resonance, thereby improving processing stability and ensuring the stamping accuracy of the plate. At the same time, the optical fiber sensors installed on both sides of the support frame can accurately detect whether there is any residue left on the lower template. Once the residue is detected, the cleaning mechanism is linked to automatically clean it to avoid subsequent plate positioning deviation, mold wear and other problems caused by residual residue. Compared with the existing technology that lacks such detection devices, the utility model significantly improves the degree of automation and fault prevention capabilities of the device, reduces the cost of manual inspections, and meets the continuous, efficient and intelligent production needs of modern building industrialization. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural schematic diagram of a building board punching device in an embodiment of the present application;

[0020] Figure 2 This is a schematic cross-sectional view of a building board punching device according to an embodiment of the present application;

[0021] Figure 3 This is a schematic cross-sectional view of a support rod, support block, processing table, and support frame of a building board punching device according to an embodiment of the present application;

[0022] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0023] Figure 5 for Figure 3 Enlarged view of point B in the middle.

[0024] In the figure: 1. Processing table; 2. Support frame; 3. Servo cylinder; 4. Upper template; 5. Lower template; 6. Support rod; 7. Mounting block; 8. Fiber optic sensor; 9. Collection cover; 10. Collection box; 11. Fan; 12. Connecting pipe; 13. Adsorption cover; 14. Dust net; 15. Ultrasonic sensor; 16. Box door; 17. Electric slide; 18. Connecting plate; 19. Cleaning brush; 20. Reset spring; 21. Support block; 22. Limit plate; 23. Mounting slot; 24. Controller; 25. Damper. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figure 1-Figure 5 , the utility model provides a technical solution:

[0027] A building board punching device, comprising:

[0028] A processing table 1 is provided with a support frame 2, a servo electric cylinder 3 is provided on the support frame 2, an upper template 4 is connected to the output end of the servo electric cylinder 3, and a lower template 5 is provided on the processing table 1;

[0029] When stamping the building board, the building metal board is placed on the lower template 5. The controller 24 controls the servo electric cylinder 3 to accurately control the stamping stroke and pressure of the upper template 4 according to the preset program to stamp the metal board on the lower template 5.

[0030] A cleaning mechanism is installed on the processing table 1, which includes a collection hood 9, a collection box 10 and an adsorption assembly. The collection port of the collection hood 9 is connected to the lower template 5, and the end of the collection hood 9 away from the lower template 5 passes through the processing table 1 and is connected to the collection box 10. The adsorption assembly includes a fan 11, a connecting pipe 12 and an adsorption hood 13. The adsorption hood 13 is installed on the collection box 10, and the two ends of the connecting pipe 12 are respectively connected to the adsorption hood 13 and the fan 11. A dustproof net 14 is installed on the adsorption hood 13. An ultrasonic sensor 15 is installed in the inner cavity of the collection box 10, and a box door 16 is installed on the collection box 10.

[0031] After the stamping is completed, the cleaning mechanism and the sweeping mechanism work together to clean the waste. The fan 11 in the adsorption assembly is started, and a negative pressure is formed in the collection hood 9 through the connecting pipe 12 and the adsorption hood 13, so that the debris, scraps and other waste materials around the lower template 5 are sucked into the collection box 10 through the collection hood 9. During the operation of the cleaning mechanism, the ultrasonic sensor 15 regularly emits ultrasonic pulses. The ultrasonic waves propagate in the air in the collection box 10 and are reflected back after encountering the surface of the waste. The ultrasonic sensor 15 receives the reflected wave and measures the time difference between the transmitted wave and the reflected wave. Combined with the propagation speed of the ultrasonic wave in the air, the distance from the ultrasonic sensor 15 to the surface of the waste can be accurately calculated. Since the internal dimensions of the collection box 10 are fixed, the effective height of the collection box 10 and the set threshold for waste accumulation are pre-set in the controller 24. As the waste continues to accumulate, the distance from the ultrasonic sensor 15 to the surface of the waste gradually decreases. When the distance decreases to a set threshold, the ultrasonic sensor 15 sends a signal back to the controller 24, which stops the blower 11 and reminds the operator to open the door 16 to remove the waste. The ultrasonic sensor 15 within the collection box 10 monitors the waste accumulation height in real time. When the waste reaches a set threshold, the ultrasonic sensor 15 sends a signal back to the controller 24, which stops the blower 11 and reminds the operator to open the door 16 to remove the waste.

[0032] A cleaning mechanism is installed on the support frame 2, which includes two electric slides 17, two connecting plates 18 and a cleaning brush 19. The two connecting plates 18 are installed on the support frame 2 through the electric slides 17. The connecting plates 18 are connected to both ends of the cleaning brush 19 by bolts. The cleaning brush 19 is in contact with the lower template 5.

[0033] The optical fiber sensors 8 installed on both sides of the support frame 2 can accurately detect whether there is any residue left on the lower template 5. Once residue is detected, the cleaning mechanism is linked to automatically clean it to avoid subsequent problems such as metal sheet positioning deviation and mold wear caused by residual residue. The two electric slides 17 of the cleaning mechanism drive the connecting plate 18 to drive the cleaning brush 19 to move back and forth along the surface of the lower template 5 to clean up the remaining small debris and ensure that the surface of the lower template 5 is clean.

[0034] The optical fiber sensor 8 uses the transmission characteristics of light to detect debris. It consists of a light source, an optical fiber, and a light detector. The light source emits a light signal, which is transmitted to the surface of the lower template 5 through the optical fiber. When there is no debris on the surface of the lower template 5, the light signal is reflected back to the optical fiber along the original path and transmitted to the light detector, which receives a stable light signal intensity. When there is debris on the surface of the lower template 5, the residue will change the reflection path and reflection intensity of the light signal, causing the light signal intensity received by the light detector to change. The optical fiber sensor 8 converts this change in light signal intensity into an electrical signal and feeds the electrical signal back to the controller 24. Once debris is detected, the controller 24 links the cleaning mechanism to automatically clean it to avoid subsequent problems such as metal sheet positioning deviation and mold wear caused by residual debris. The two electric slides 17 of the cleaning mechanism drive the connecting plate 18 to drive the cleaning brush 19 to move back and forth along the surface of the lower template 5 to clean up the remaining fine debris and ensure that the surface of the lower template 5 is clean.

[0035] A support rod 6 is mounted on the processing table 1. A buffer assembly is provided on the support rod 6. The buffer assembly includes a return spring 20, a support block 21, a damper 25 and a limit plate 22. The limit plate 22 is connected to the support rod 6. A mounting groove 23 is provided on the support block 21. The return spring 20 is sleeved on the outside of the damper 25. The two ends of the return spring 20 and the damper 25 are respectively connected to the limit plate 22 and the support block 21.

[0036] During stamping, the impact force generated by the upper platen is transmitted to the buffer assembly via support rod 6. At this point, the return spring 20, sleeved on the outside of the damper 25, undergoes elastic deformation, absorbing some of the impact energy and converting it into elastic potential energy. After stamping is complete, the return spring 20 releases this elastic potential energy, pushing the support block 21 back into its original position. Simultaneously, the damper 25 generates a counter-damping force, suppressing spring oscillations and allowing the support block 21 to return smoothly to its original position. This effectively reduces vibration and ensures stamping stability.

[0037] Mounting blocks 7 are installed on both sides of the support frame 2 , and optical fiber sensors 8 are installed on the mounting blocks 7 .

[0038] In the above embodiment, a controller 24 is installed on the support frame 2 , and the controller 24 is electrically connected to the servo cylinder 3 , the optical fiber sensor 8 , the fan 11 , the ultrasonic sensor 15 and the electric slide 17 .

[0039] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A building board punching device, characterized in that: include: A processing table (1), wherein a support frame (2) is mounted on the processing table (1), a servo electric cylinder (3) is mounted on the support frame (2), an output end of the servo electric cylinder (3) is connected to an upper template (4), and a lower template (5) is mounted on the processing table (1); A cleaning mechanism is installed on the processing table (1), a sweeping mechanism is installed on the support frame (2), a support rod (6) is installed on the processing table (1), and a buffer assembly is provided on the support rod (6); Mounting blocks (7) are installed on both sides of the support frame (2), and optical fiber sensors (8) are installed on the mounting blocks (7).

2. A building board punching device according to claim 1, characterized in that: The cleaning mechanism comprises a collecting hood (9), a collecting box (10) and an adsorption assembly. The collecting port of the collecting hood (9) is connected to the lower template (5), and the end of the collecting hood (9) away from the lower template (5) passes through the processing table (1) and is connected to the collecting box (10).

3. A building board punching device according to claim 2, characterized in that: The adsorption assembly comprises a fan (11), a connecting pipe (12) and an adsorption cover (13); the adsorption cover (13) is mounted on the collection box (10); both ends of the connecting pipe (12) are connected to the adsorption cover (13) and the fan (11) respectively; and a dustproof net (14) is mounted on the adsorption cover (13).

4. A building board punching device according to claim 3, characterized in that: An ultrasonic sensor (15) is installed in the inner cavity of the collection box (10), and a box door (16) is installed on the collection box (10).

5. A building board punching device according to claim 4, characterized in that: The cleaning mechanism comprises two electric slides (17), two connecting plates (18) and a cleaning brush (19); the two connecting plates (18) are mounted on the support frame (2) via the electric slides (17); the connecting plates (18) are connected to both ends of the cleaning brush (19) via bolts; and the cleaning brush (19) is in contact with the lower template (5).

6. The building board punching device according to claim 1, characterized in that: The buffer assembly comprises a return spring (20), a support block (21), a damper (25) and a limit plate (22); the limit plate (22) is connected to the support rod (6); a mounting groove (23) is provided on the support block (21); the return spring (20) is sleeved on the outside of the damper (25); and the two ends of the return spring (20) and the damper (25) are respectively connected to the limit plate (22) and the support block (21).

7. The building board punching device according to claim 5, characterized in that: A controller (24) is installed on the support frame (2), and the controller (24) is electrically connected to the servo electric cylinder (3), the optical fiber sensor (8), the fan (11), the ultrasonic sensor (15) and the electric slide (17).

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