Wafer processing equipment

Abstract

The utility model relates to the technical field of wafer grinding and polishing processing, and discloses wafer processing equipment, which comprises a bracket; the bearing mechanism is fixedly arranged on the support, and the bearing mechanism is used for bearing materials; the main shaft assembly is arranged on the support in a sliding mode in the first horizontal linear direction, the main shaft assembly comprises a grinding wheel, and the grinding wheel can grind or polish materials on the bearing mechanism; and the driving mechanism is connected with the main shaft assembly, and the driving mechanism can drive the main shaft assembly to move in the first horizontal linear direction. By adopting the scheme of the invention, the movement in the horizontal and vertical directions is configured on the main shaft assembly, and the bearing mechanism is fixed, so that the overall stability of the wafer processing equipment is improved, the stability of the main shaft assembly on material grinding or polishing during grinding or polishing operation is ensured, the grinding or polishing effect is ensured, the space is saved, and the working efficiency is improved. The maintenance difficulty is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of wafer grinding and polishing, and in particular to a wafer processing device. Background Art

[0002] Single-axis wafer processing equipment is a critical piece of equipment in the semiconductor manufacturing process, primarily used for wafer grinding and polishing. These processes have a decisive impact on the wafer's flatness and surface finish, and thus, the performance of the final chip. With the continuous advancement of semiconductor technology, the requirements for the precision and efficiency of wafer processing equipment are becoming increasingly higher.

[0003] Single-axis wafer processing equipment usually has a grinding wheel for grinding or polishing wafers and a supporting mechanism for supporting wafers. In the related art, horizontal movement is achieved by the supporting mechanism through a driving mechanism and a guiding mechanism, and vertical movement is achieved by the grinding wheel through a driving mechanism and a guiding mechanism. However, the separate moving mechanism will lead to a decrease in the overall stability of the single-axis wafer processing equipment. When performing grinding or polishing operations, the movable supporting mechanism has poor stability, which affects the grinding or polishing effect. In addition, the separate moving mechanism requires more space because sufficient space needs to be provided for two independent moving mechanisms. The separated moving mechanism means more mechanical parts and connection points, which will increase the difficulty of daily maintenance and troubleshooting, and may also lead to increased maintenance costs. Utility Model Content

[0004] An embodiment of the present application discloses a wafer processing device, in which both horizontal and vertical movements are configured on the spindle assembly, and the supporting mechanism is fixed, thereby improving the overall stability of the wafer processing equipment and ensuring the stability of the spindle assembly in grinding or polishing the material during grinding or polishing operations, ensuring the grinding or polishing effect, saving space, and reducing maintenance difficulty.

[0005] To achieve the above objectives, the present invention discloses a wafer processing device, comprising:

[0006] Bracket;

[0007] A carrying mechanism, the carrying mechanism is fixedly arranged on the bracket and is used for carrying materials;

[0008] a spindle assembly, the spindle assembly being slidably disposed on the bracket along a first horizontal straight line direction, the spindle assembly comprising a grinding wheel capable of grinding or polishing the material on the supporting mechanism;

[0009] A driving mechanism is connected to the main shaft assembly, and the driving mechanism can drive the main shaft assembly to move along the first horizontal straight line direction.

[0010] As an optional embodiment, the wafer processing equipment further includes a first guide member and a first sliding member, the first guide member is slidably connected to the first sliding member, the first guide member is arranged on the bracket, and the first guide member extends along the first horizontal straight line direction.

[0011] As an optional embodiment, the spindle assembly also includes a lifting bracket and a first driving member, the first sliding member is arranged on the lifting bracket, the grinding wheel is slidably connected to the lifting bracket in the vertical direction, and the first driving member is connected to the grinding wheel to drive the grinding wheel to move in the vertical direction.

[0012] As an optional embodiment, the spindle assembly also includes a second guide member and a second sliding member, the second guide member is slidably connected to the second sliding member, the second guide member is arranged on the lifting bracket, the second guide member extends in a vertical direction, and the grinding wheel is arranged on the second sliding member.

[0013] As an optional embodiment, the spindle assembly further includes a balancing member, which is disposed on the lifting bracket and connected to the grinding wheel, and the balancing member can provide a pulling force to the grinding wheel in a vertical direction away from the supporting mechanism.

[0014] As an optional embodiment, the grinding wheel includes a grinding wheel body and a rotating shaft, the grinding wheel body and the rotating shaft are connected, a detection component is provided on the rotating shaft, the detection component is arranged around the axis of the rotating shaft, and the detection component can detect the feed force applied by the grinding wheel to the material.

[0015] As an optional implementation manner, the wafer processing equipment further includes a dustproof mechanism, which is provided on the bracket and includes:

[0016] A housing, the housing being disposed on the bracket, the housing forming an accommodating cavity, the carrying mechanism being disposed in the accommodating cavity, the housing being provided with an opening communicating with the accommodating cavity on a side close to the spindle assembly, and the grinding wheel being able to extend into the accommodating cavity through the opening;

[0017] A sealing assembly is sealingly arranged at the opening, and the sealing assembly can be switched between an open state and a closed state. When the sealing assembly is in the open state, the grinding wheel can extend into the accommodating cavity through the opening; when the sealing assembly is in the closed state, the sealing assembly can be in sealing contact with the rotating shaft of the grinding wheel, and when the spindle assembly moves along the first horizontal straight line direction, the sealing assembly can be deformed along the first horizontal straight line direction.

[0018] As an optional embodiment, the sealing assembly includes a first seal and a second seal, the first seal including a first fixed portion, a first sealing portion and a first flexible connection portion, the first fixed portion is fixedly connected to the bracket, the first sealing portion is slidably connected to the bracket along the first horizontal straight direction, and the first fixed portion and the first sealing portion are connected through the first flexible connection portion; the second seal includes a second fixed portion, a second sealing portion and a second flexible connection portion, the second fixed portion is fixedly connected to the bracket, the second sealing portion is slidably connected to the bracket along the first horizontal straight direction, and the second fixed portion and the second sealing portion are connected through the second flexible connection portion; when the sealing assembly is in the open state, the first seal and the second seal move away from each other along the first horizontal straight direction so that the grinding wheel can extend into the accommodating cavity between the first seal and the second seal; when the sealing assembly is in the closed state, the first seal and the second seal move close to each other along the first horizontal straight direction so that the first seal and the second seal are in sealing contact with the rotating shaft of the grinding wheel.

[0019] As an optional implementation, the wafer processing equipment further includes a trimming mechanism, which is disposed on the bracket and is used to trim a side of the grinding wheel that contacts the material.

[0020] As an optional implementation, the trimming mechanism includes:

[0021] a support member, the support member being arranged on the bracket;

[0022] A grinding head, the grinding head being arranged on the support member and being used for trimming the side of the grinding wheel that contacts the material;

[0023] A second driving member is connected to the supporting member to drive the grinding head to move in a vertical direction.

[0024] Compared with the prior art, the present invention has the following advantages:

[0025] The wafer processing equipment provided in the embodiment of the present application includes a carrying mechanism, a spindle assembly and a bracket. The carrying mechanism is fixed on the bracket, and the driving mechanism drives the spindle assembly to move along the first horizontal direction, thereby improving the stability of the carrying mechanism in carrying materials when the spindle assembly is performing grinding or polishing operations, saving space and reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A schematic structural diagram of a wafer processing device disclosed in an embodiment of the present application;

[0028] Figure 2 for Figure 1 A schematic structural diagram of a wafer processing device (spindle assembly omitted);

[0029] Figure 3 for Figure 1 Schematic diagram of the structure of the trimming mechanism in the wafer processing equipment.

[0030] Description of reference numerals:

[0031] 100-wafer processing equipment; 1-bracket; 2-carrying mechanism; 3-spindle assembly; 31-grinding wheel; 311-grinding wheel body; 312-rotating axis; 313-detection assembly; 32-lifting bracket; 33-first driving member; 34-second guide member; 35-second sliding member; 36-balancing member; 4-driving mechanism; 51-first guide member; 6-dustproof mechanism; 61-housing; 611-accommodating chamber; 612-opening; 62-sealing assembly; 621-first sealing member; 6211-first solid member Fixed part; 6212-first sealing part; 6213-first flexible connection part; 622-second sealing part; 6221-second fixed part; 6222-second sealing part; 6223-second flexible connection part; 7-trimming mechanism; 71-support member; 711-base; 712-third sliding member; 713-third guide member; 714-first mounting plate; 715-second mounting plate; 72-grinding head; 73-second driving member; 8-thickness gauge assembly; X-first horizontal straight line direction; Z-vertical direction. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0033] In this application, terms such as "upper," "lower," "inner," and "vertical" indicate positions or locations based on those shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to specific positions, or to their construction or operation in a specific position.

[0034] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0035] Furthermore, the terms "disposed," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "first," "second," etc., are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0037] Within the semiconductor device manufacturing industry chain, single-axis wafer processing equipment is a critical process node, focusing on fine grinding and optimizing surface finish. Each of these processes profoundly impacts the wafer substrate's microstructural flatness and surface purity, directly determining the subsequent electrical characteristics and yield rate of chip components. With the continuous advancement of semiconductor technology, the requirements for wafer processing equipment are becoming increasingly demanding in terms of precision and efficiency.

[0038] In the related art of single-axis wafer processing equipment, wafer grinding or polishing is achieved by configuring a grinding wheel and a supporting mechanism to independently move horizontally and vertically. Specifically, the supporting mechanism achieves horizontal movement through the collaboration of a drive mechanism and a guide mechanism; correspondingly, the grinding wheel achieves vertical movement using the same principle. However, this split drive has structural limitations. First, it can weaken the overall stability of the equipment. Especially when performing high-precision grinding or polishing on wafers, the lack of stability in the supporting mechanism can negatively impact processing accuracy. Second, the independent moving modules require a relatively large workspace, as each degree of freedom of movement requires dedicated drive and guide facilities. Furthermore, the split structural layout increases the complexity of the mechanical system, manifesting as an increase in the number of components and connection interfaces. This increases the difficulty of routine maintenance and troubleshooting, and indirectly increases operational maintenance costs.

[0039] Based on this, an embodiment of the present application discloses a wafer processing equipment, in which both horizontal and vertical movements are configured on the spindle assembly, and the supporting mechanism is fixed, thereby improving the overall stability of the wafer processing equipment and ensuring the stability of the spindle assembly in grinding or polishing the material during grinding or polishing operations, thereby ensuring the grinding or polishing effect, saving space, and reducing maintenance difficulty.

[0040] The technical solution of the present application will be further described below with reference to the embodiments and drawings.

[0041] See also Figure 1 , Figure 1 This is a schematic structural diagram of the wafer processing equipment 100 disclosed in an embodiment of the present application.

[0042] The embodiment of the present application discloses a wafer processing device 100, comprising:

[0043] Bracket 1;

[0044] The carrying mechanism 2 is fixedly arranged on the bracket 1 and is used for carrying materials;

[0045] The spindle assembly 3 is slidably disposed on the bracket 1 along the first horizontal straight line direction X. The spindle assembly 3 includes a grinding wheel 31, which can grind or polish the material on the supporting mechanism 2;

[0046] The driving mechanism 4 is connected to the main shaft assembly 3 and can drive the main shaft assembly 3 to move along the first horizontal straight line direction X.

[0047] Specifically, the support 1 is the basic framework of the entire wafer processing equipment 100, responsible for supporting and fixing all other mechanisms, ensuring that they work together in precise positions. The support mechanism 2 is located on the grinding and polishing station of the support 1, used to place the material to be processed and ensure that it is in the ideal working position throughout the grinding or polishing process. The spindle assembly 3 is a component including the grinding wheel 31, which is installed on the support 1 and is used to actually perform the grinding or polishing operation on the material surface. The drive mechanism 4 is a power source, connected to the spindle assembly 3 on the support 1, and provides force or torque to the spindle assembly 3. Among them, the grinding and polishing station is the station where the wafer processing equipment 100 grinds or polishes wafers.

[0048] In one embodiment, when the wafer processing equipment 100 performs grinding or polishing operations, the supporting mechanism 2 is fixed to the grinding and polishing station on the bracket 1, and the spindle assembly 3 is slidably set on the bracket 1. The spindle assembly 3 is powered by the driving mechanism 4 to move back and forth along the first horizontal straight line direction X in the grinding and polishing station, or the supporting mechanism 2 is fixed to the grinding and polishing station on the bracket 1, and the spindle assembly 3 is fixed relative to the supporting mechanism 2.

[0049] In another embodiment, when the wafer processing equipment 100 is preparing for or finishing a grinding or polishing operation, the spindle assembly 3 can be powered by the driving mechanism 4 outside the grinding or polishing station and move along the first horizontal straight direction X inside the grinding or polishing station.

[0050] In the wafer processing equipment 100 provided in the embodiment of the present application, the supporting mechanism 2 is fixed, and the spindle assembly 3 can move in the first horizontal direction. The fixed supporting mechanism 2 can enhance the stability of the equipment, especially when performing high-precision grinding or high-precision polishing. Since the wafer is fixed, the vibration and displacement caused by the movement of the platform are reduced, thereby improving the accuracy of the grinding or polishing process and the flatness of the wafer surface; and the fixed supporting mechanism 2 reduces the complex moving mechanism and simplifies the structure of the wafer processing equipment 100, which not only reduces the complexity and potential failure points of the wafer processing equipment 100, but also facilitates the daily maintenance and calibration of the wafer processing equipment 100, reducing maintenance costs; the fixed design of the supporting mechanism 2 reduces the number of moving parts in the wafer processing equipment 100, which can improve the response speed and repeat positioning accuracy of the wafer processing equipment 100, thereby improving production efficiency.

[0051] It should be noted that the above-mentioned driving mechanism 4 can be a linear motor, a hydraulic cylinder, a pneumatic pump, or other device that can provide driving power. Taking the driving mechanism 4 as an example of a linear motor, the linear motor includes a contact end and an operating end. The operating end is connected to the control terminal of the wafer processing equipment 100, and the operation and stop of the linear motor are manually controlled. The contact end is connected to the spindle assembly 3 to drive the spindle assembly 3 to move. This application does not limit the choice of the driving mechanism 4.

[0052] In some embodiments, see Figure 1 The wafer processing equipment 100 further includes a first guide 51 and a first slider. The first guide 51 is slidably connected to the first slider. The first guide 51 is disposed on the bracket 1 and extends along a first horizontal linear direction X. The spindle assembly 3 is connected to the first slider, and the first guide 51 is connected to the bracket 1. The first slider and the first guide 51 cooperate to guide the spindle assembly 3. The first guide 51 extends along the first horizontal linear direction X. The spindle assembly 3 can reciprocate along the first horizontal linear direction X on the first guide 51 via the first slider.

[0053] The first guide member 51 extends along the first horizontal linear direction X, providing guidance for the movement of the spindle assembly 3 and limiting the spindle assembly 3 to linear motion in the first horizontal linear direction X, thereby ensuring the directionality and precision of the motion. Furthermore, the first guide member 51 is fixedly mounted on the bracket 1, providing stable support for the movement of the spindle assembly 3, maintaining system stability and reducing vibration and deviation even at high speeds. The first slide is connected to the spindle assembly 3 on one hand and cooperates with the first guide member 51 on the other hand, serving to connect the spindle assembly 3 and the first guide member 51. The first slide converts the power of the drive mechanism 4 into actual movement of the spindle assembly 3. The first slide also serves to fine-tune and position the spindle assembly 3, ensuring that the spindle assembly 3 reaches the desired grinding or polishing position and ensuring machining accuracy.

[0054] In one embodiment, the first guide member 51 and the first sliding member may be a linear guide rail and a slider. The linear guide rail is fixedly mounted on the bracket 1 along the first horizontal linear direction X, and the slider is connected to the spindle assembly 3. The linear guide rail and slider system is a commonly used mechanical component in precision positioning and linear motion control. The linear guide rail system achieves movement through rolling contact, has a low coefficient of friction, and can achieve micron-level positioning accuracy, which is beneficial to improving the response speed and sensitivity of the CNC system. Moreover, due to the low friction of the linear guide rail, only a small amount of power is required to move the machine, which helps to reduce energy consumption and the amount of power loss of the machine. In addition, the design of the linear guide rail system takes into account the convenience of installation. The error of the mounting screw holes of the slide rail is small, which facilitates quick installation and adjustment.

[0055] In another embodiment, the first guide member 51 and the first sliding member may be a roller screw and a nut pair, wherein the roller screw is fixedly mounted on the bracket 1, and the nut pair is connected to the wafer processing equipment 100. The roller screw and the nut pair are a precision transmission element, which realizes efficient power transmission and precise position control by the rolling of rollers between threads. The roller screw and the nut pair have high transmission efficiency because the rolling friction of the rollers is less than that of the traditional sliding screw, thereby improving the energy conversion efficiency. The roller screw and the nut pair have a compact structure and can provide high rigidity, ensuring stable transmission performance under load. In addition, due to the design of the rollers, the roller screw and the nut pair can disperse the load at multiple contact points, thereby providing a larger load-bearing capacity.

[0056] Optionally, see Figure 1 The spindle assembly 3 also includes a lifting bracket 32 ​​and a first driving member 33. The first sliding member is arranged on the lifting bracket 32. The grinding wheel 31 is slidably connected to the lifting bracket 32 ​​along the vertical direction Z. The first driving member 33 is connected to the grinding wheel 31 to drive the grinding wheel 31 to move along the vertical direction Z.

[0057] In one embodiment, when the wafer processing equipment 100 is ready to perform grinding or polishing operations, the spindle assembly 3 moves along the first horizontal straight direction X through the first sliding member set on the lifting bracket 32 ​​and the first guide member 51 set on the bracket 1. When moving to the grinding and polishing station, the spindle assembly 3 provides driving force along the vertical direction Z to the desired position through the first driving member 33. When reaching the desired position, the movement in the vertical direction Z stops.

[0058] In another embodiment, when the wafer processing equipment 100 performs grinding or polishing operations, the control terminal is manually adjusted to control the first driving member 33, and the first driving member 33 drives the spindle assembly 3 to reciprocate along the vertical direction Z or be fixed relative to the supporting mechanism 2.

[0059] The lifting bracket 32 ​​primarily supports the grinding wheel 31 and provides a platform in the vertical direction Z. The first drive member 33 drives the grinding wheel 31 in the vertical direction Z, enabling machining of surfaces at varying heights or depth-controlled grinding and polishing. The combined use of the lifting bracket 32 ​​and the first drive member 33 allows for grinding or polishing operations. The controllable capabilities of the first drive member 33 ensure fine adjustments of the grinding wheel 31 in the vertical direction Z, enabling high-quality surface treatment.

[0060] For details, please refer to Figure 1The spindle assembly 3 also includes a second guide member 34 and a second sliding member 35. The second guide member 34 is slidably connected to the second sliding member 35. The second guide member 34 is arranged on the lifting bracket 32. The second guide member 34 extends along the vertical direction Z. The grinding wheel 31 is arranged on the second sliding member 35.

[0061] Among them, the second guide member 34 and the second sliding member 35 are added to the spindle assembly 3 mainly to further optimize the control and stability of the grinding wheel 31, especially to make the movement in the vertical direction Z more precise and smooth. The second guide member 34 is arranged along the vertical direction Z, and cooperates with the second sliding member 35 to form the movement track of the grinding wheel 31 in the vertical direction Z, which increases the movement stability and reliability of the grinding wheel 31, and can remain smooth and without shaking even under high speed or heavy load conditions; and in complex grinding or polishing work, it is sometimes necessary to fine-tune or compensate the vertical position of the grinding wheel 31. The second guide member 34 can assist in completing this task to ensure that the processing effect meets high standards. In addition, during the grinding or polishing process, especially when encountering emergencies, the second guide member 34 can play a certain limiting role to prevent the grinding wheel 31 from getting out of control and protect the safety of equipment and operators.

[0062] It should be noted that the above-mentioned second guide member 34 and second sliding member 35 can be linear guide rails and sliders, roller screws and nut pairs, dovetail grooves and sliders, or ropes and pulleys, etc., which can provide guidance. This application does not limit the selection of the second guide member 34 and the second sliding member 35.

[0063] Optionally, see Figure 1 The spindle assembly 3 further includes a balancing member 36 , which is disposed on the lifting bracket 32 ​​and connected to the grinding wheel 31 . The balancing member 36 can provide a pulling force to the grinding wheel 31 in the vertical direction Z away from the supporting mechanism 2 .

[0064] In one embodiment, regardless of whether the first drive member 33 drives the grinding wheel 31 to move in the vertical direction Z, the balance member 36 always provides a pulling force to the grinding wheel 31 in the vertical direction Z away from the support mechanism 2. This can offset the stress and deformation that the relatively heavy grinding wheel 31 may cause on the various connecting components, reducing the load on the first drive member 33, thereby helping to reduce wear on the grinding wheel 31 and the support mechanism 2, maintaining the stability of the grinding wheel 31, and extending the service life of the grinding wheel 31 and the support mechanism 2. This can reduce the maintenance frequency and maintenance costs of the wafer processing equipment 100, while also improving production efficiency. The balance member 36 maintains the stability of the grinding wheel 31, preventing shaking or vibration caused by rapid separation, ensuring the stability of the grinding wheel 31 during the lifting process, and thereby improving the stability and reliability of the entire wafer processing equipment 100. Furthermore, the balance member 36, in conjunction with the first drive member 33 in providing driving force to the grinding wheel 31, can also reduce the load on the first drive member 33. In addition, by providing force along the vertical direction Z, the balancing member 36 helps reduce the wear of the grinding wheel 31 and the supporting mechanism 2, extends the service life of the grinding wheel 31 and the supporting mechanism 2, reduces the maintenance frequency of the wafer processing equipment 100, reduces maintenance costs, and improves production efficiency.

[0065] It should be noted that the above-mentioned balancing member 36 can be a device that can provide linear power, such as a linear motor, a hydraulic cylinder, or a pneumatic pump. Taking the hydraulic cylinder as an example, the hydraulic cylinder includes a fixed end and a movable end, wherein the fixed end is fixedly connected to the lifting bracket 32, and the movable end is fixedly connected to the grinding wheel 31. This application does not limit the selection of the balancing member 36.

[0066] For details, please refer to Figure 1 The grinding wheel 31 includes a grinding wheel body 311 and a rotating shaft 312. The grinding wheel body 311 and the rotating shaft 312 are connected. The rotating shaft is rotatably set on the lifting bracket 32. A detection component 313 is provided on the rotating shaft 312. The detection component 313 is set around the axis of the rotating shaft 312. The detection component 313 can detect the feed force applied by the grinding wheel 31 to the material.

[0067] Among them, the grinding wheel 31 is rotatably connected to the lifting bracket 32 ​​through the rotating shaft 312, and the detection component 313 is arranged around the axis of the rotating shaft 312, that is, it is arranged around the rotating shaft 312. The detection component 313 is specifically a piezoelectric sensor and an amplifier circuit. When the grinding wheel body 311 contacts the material and starts grinding or polishing, a feed force is applied to the spindle. This force change will cause the piezoelectric sensor to deform and produce corresponding charge changes. These tiny charge changes are amplified by the amplifier, and the PLC (programmable logic controller) performs data acquisition and logic processing to convert them into the actual feed force value borne by the spindle.

[0068] It can be understood that by setting up the detection component 313, the calculated force is transmitted to the control terminal according to the feed force calculated by the detection component 313, and the control terminal can adjust the feed speed or pressure of the grinding wheel 31 in real time to achieve fine control of the material grinding depth or polishing force. By regulating the feed force, the optimal value that is most suitable for the current processing conditions can be found, which not only ensures the surface quality of the material, but also improves the processing efficiency and consistency.

[0069] Optionally, see Figure 1 and Figure 2 , Figure 2 for Figure 1 A schematic structural diagram of a wafer processing device 100 (spindle assembly 3 omitted), the wafer processing device 100 further includes a dustproof mechanism 6, the dustproof mechanism 6 is provided on the bracket 1, and the dustproof mechanism 6 includes:

[0070] The housing 61 is disposed on the bracket 1 and defines a receiving chamber 611. The supporting mechanism 2 is disposed in the receiving chamber 611. An opening 612 communicating with the receiving chamber 611 is provided on a side of the housing 61 close to the spindle assembly 3. The grinding wheel body 311 can extend into the receiving chamber 611 through the opening 612.

[0071] The sealing component 62 is sealed at the opening 612. The sealing component 62 can be switched between an open state and a closed state. When the sealing component 62 is in the open state, the grinding wheel body 311 can extend into the accommodating cavity 611 through the opening 612; when the sealing component 62 is in the closed state, the sealing component 62 can be in sealing contact with the rotating shaft 312 of the grinding wheel 31, and when the spindle component 3 moves along the first horizontal straight line direction X, the sealing component 62 can be deformed along the first horizontal straight line direction X.

[0072] In one embodiment, when the wafer processing equipment 100 is about to begin grinding or polishing operations, the sealing assembly 62 is in an open state. The grinding wheel 31, through the drive mechanism 4 and the first drive member 33, approaches the support mechanism 2 along the first horizontal and vertical directions Z, and enters the accommodating cavity 611 within the housing 61 through the opening 612 to calibrate and position the grinding wheel body 311 before the grinding or polishing operation. After calibrating and positioning the grinding wheel body 311, the sealing assembly 62 switches from an open state to a closed state, sealingly contacting the rotating shaft 312 to seal the housing 61. When the grinding wheel 31 is performing the grinding or polishing operation, the sealing assembly 62 can deform along the first horizontal linear direction X following the movement of the rotating shaft 312.

[0073] In another embodiment, after the wafer processing equipment 100 completes the grinding or polishing operation, the sealing assembly 62 is switched from a closed state to an open state, the sealing state with the rotating shaft 312 is released, and the opening 612 is exposed, so that the grinding wheel body 311 can be driven by the driving mechanism 4 and the first driving member 33 to leave the accommodating cavity 611 in the shell 61.

[0074] It is understandable that the housing 61 is designed with a housing chamber 611 for surrounding the supporting mechanism 2, and the sealed structure cooperates with the sealing component 62 to effectively isolate external dust and impurities from entering the working area. Moreover, when the grinding wheel body 311 is working, the dust generated is confined to the housing chamber 611, which is convenient for centralized treatment by the dust removal mechanism, reducing the difficulty of cleaning and improving maintenance efficiency. The design of the sealing component 62, especially when the grinding wheel body 311 is working, can still maintain good sealing. On the one hand, it can prevent the dust generated during the processing from diffusing outward, which is beneficial to the air quality management of the workshop, and also facilitates the subsequent cleaning and maintenance. On the other hand, it also means that even during the position adjustment process of the grinding wheel 31, a good seal can be maintained, which increases the flexibility and reliability of the equipment.

[0075] For details, please refer to Figure 2 The sealing assembly 62 includes a first sealing member 621 and a second sealing member 622. The first sealing member 621 includes a first fixed portion 6211, a first sealing member 6212 and a first flexible connection portion 6213. The first fixed portion 6211 is fixedly connected to the bracket 1, and the first sealing member 6212 is slidably connected to the bracket 1 along the first horizontal straight direction X. The first fixed portion 6211 and the first sealing member 6212 are connected via the first flexible connection portion 6213. The second sealing member 622 includes a second fixed portion 6221, a second sealing member 6222 and a second flexible connection portion 6223. The second fixed portion 6221 is fixedly connected to the bracket 1, and the second sealing member 6222 is slidably connected to the bracket 1 along the first horizontal straight direction X. The second fixed portion 6221 and the second sealing member 6222 are connected via the second flexible connection portion 6223. Figure 2 In order to facilitate the display of the accommodating cavity 611 and its internal structure, the second sealing portion 6222 is separated from the second flexible connecting portion 6223); when the sealing assembly 62 is in an open state, the first sealing member 621 and the second sealing member 622 move away from each other along the first horizontal straight direction X, so that the grinding wheel body 311 can extend into the accommodating cavity 611 between the first sealing member 621 and the second sealing member 622; when the sealing assembly 62 is in a closed state, the first sealing member 621 and the second sealing member 622 move closer to each other along the first horizontal straight direction X, so that the first sealing member 621 and the second sealing member 622 are in sealing contact with the rotating shaft 312 of the grinding wheel 31.

[0076] In one embodiment, when the sealing assembly 62 is in an open state, the first sealing member 621 and the second sealing member 622 are moved away from each other, the first fixing portion 6211 and the second fixing portion 6221 are fixed to the shell 61, the first flexible connection portion 6213 and the second flexible connection portion 6223 are deformed, and the first sealing portion 6212 and the second sealing portion 6222 are moved away from each other to keep the opening 612 uncovered.

[0077] In another embodiment, when the sealing assembly 62 is in a closed state, the first sealing member 621 and the second sealing member 622 are brought into proximity with each other, the first fixing portion 6211 and the second fixing portion 6221 are fixed to the housing 61, the first flexible connection portion 6213 and the second flexible connection portion 6223 are deformed, and the first sealing member 6212 and the second sealing member 6222 are brought into proximity with each other through the deformation of the first flexible connection portion 6213 and the second flexible connection portion 6223, thereby sealingly contacting the rotating shaft 312 and sealing the accommodating chamber 611. When the grinding wheel 31 is grinding or polishing, the first sealing member 6212 and the second sealing member 6222 can move with the rotating shaft 312, and the first flexible connection portion 6213 and the second flexible connection portion 6223 deform in a first horizontal direction with the rotating shaft 312 to maintain the sealed state within the accommodating chamber 611.

[0078] The first and second sealing members 621 and 622 are connected to the corresponding first and second fixing members 6211 and 6221 via a first flexible connection 6213 and a second flexible connection 6223. This allows the first and second sealing members 6212 and 6222 to slide along the first horizontal linear direction X when the grinding wheel 31 is inserted and removed. This ensures the dynamic adaptability of the sealing assembly 62, allowing it to automatically adjust to maintain a good seal regardless of the position of the grinding wheel 31. When the sealing assembly 62 is closed, the first and second sealing members 621 and 622 are in close contact with the rotating shaft 312 of the grinding wheel 31, forming an effective sealing barrier that prevents the ingress of dust and impurities and the escape of particles during processing, ensuring a clean working environment and ensuring high-quality processing. By effectively preventing external contamination and the spread of internal particles, wear and corrosion on the interior of the wafer processing equipment 100 are reduced, indirectly extending the service life of the wafer processing equipment 100. Furthermore, the stable sealing environment ensures improved production efficiency and product quality.

[0079] It should be noted that the materials of the above-mentioned first sealing part 6212 and the second sealing part 6222 can be metal materials, rubber and other materials that can provide sufficient rigidity and wear resistance. This application does not limit the materials of the first sealing part 6212 and the second sealing part 6222.

[0080] It should also be noted that the materials of the above-mentioned first flexible connection part 6213 and the second flexible connection part 6223 can be accordion covers, silicone or rubber materials, fabric-reinforced flexible tubes and other materials with good flexibility, wear resistance and the ability to adapt to dynamic deformation. This application does not limit the materials of the first flexible connection part 6213 and the second flexible connection part 6223.

[0081] In addition, the first seal 621 can also be composed of a first fixed portion and a first deformable portion, and the second seal 622 can be composed of a second fixed portion and a second deformable portion. The first deformable portion includes a first deformable segment and a first sealing segment, and the second deformable portion includes a second deformable segment and a second sealing segment. In other words, the first seal and the first flexible connection portion are integrally formed. The integrally formed design eliminates seams or bonding points between the components, reducing the risk of debonding or separation due to long-term operation, and enhancing the stability and durability of the first and second seals 621 and 622. The seamless, integrated structure avoids potential leak paths and ensures a better sealing effect.

[0082] It should also be noted that the movement of the above-mentioned first seal 621 and the second seal 622 can be manually moved or driven to move. If manually moved, the first seal 621 and the second seal 622 are provided with handles, the first seal 621 and the second seal 622 are provided with sliders, and the shell 61 is provided with guide rails; if driven to move, the first seal 621 and the second seal 622 are provided with sliders, and the shell 61 is provided with guide rails, and the driving device is connected to the sliders or the first seal 621 and the second seal 622 to drive the first seal 621 and the second seal 622 to move. This application does not limit the movement method of the first seal 621 and the second seal 622.

[0083] Optionally, see Figure 1 and Figure 3 , Figure 3 for Figure 1 Schematic diagram of the structure of the trimming mechanism 7 in the wafer processing equipment 100 in FIG. The wafer processing equipment 100 also includes a trimming mechanism 7, which is disposed on the support 1 and is used to trim the surface of the grinding wheel 31 that contacts the material. Specifically, the trimming mechanism 7 includes: a support member 71, which is disposed on the support 1; a grinding head 72, which is slidably connected to the support member 71 and is used to trim the surface of the grinding wheel 31 that contacts the material; and a second driving member 73, which is connected to the support member 71 to drive the grinding head 72 to move in the vertical direction Z.

[0084] Specifically, the support member 71 includes a base 711, a third sliding member 712, a third guide member 713, a first mounting plate 714 and a second mounting plate 715. The second driving member 73 is arranged on the base 711, the third guide member 713 is arranged on the base 711 along the vertical direction Z, the third sliding member 712 is slidably arranged on the third guide member 713, the third sliding member 712 is connected to the first mounting plate 714, the second mounting plate 715 is arranged on the first mounting plate 714, the grinding head 72 is arranged on the second mounting plate 715, and the second driving member 73 is connected to the third sliding member 712 to drive the grinding head 72 to move along the vertical direction Z.

[0085] In one embodiment, after the grinding wheel 31 finishes the grinding or polishing operation, it is measured or manually detected whether the side of the grinding wheel 31 in contact with the material needs to be trimmed. If trimming is required, the driving mechanism 4 and the first driving member 33 provide driving force to drive the grinding wheel 31 to move to the trimming mechanism 7. The second driving member 73 drives the third sliding member 712 to drive the grinding head 72 along the vertical direction Z to approach the grinding wheel 31. The grinding wheel 31 rotates to trim the grinding or polishing surface of the grinding wheel 31.

[0086] In another embodiment, after the dressing mechanism 7 completes the dressing operation on the grinding wheel 31, the driving mechanism 4 and the first driving member 33 drive the grinding wheel 31 to leave the dressing mechanism 7, and the second driving member 73 drives the third sliding member 712 to drive the grinding head 72 along the vertical direction Z away from the grinding wheel 31.

[0087] Among them, on the one hand, the dressing mechanism 7 can regularly or as needed dress the side of the grinding wheel 31 that contacts the material to ensure the flatness and abrasive state of this side, thereby maintaining the accuracy and consistency of the grinding or polishing operation, and avoiding the degradation of processing quality due to wear or deformation of the grinding wheel 31. Through timely dressing, the debris, abrasives and wear layer accumulated on the grinding wheel 31 can be removed, the sharpness of the grinding wheel 31 can be restored, and the frequent replacement of the grinding wheel 31 due to excessive wear can be avoided, thereby effectively extending its service life and reducing production costs.

[0088] On the other hand, when the dressing mechanism 7 is dressing the grinding wheel 31, the movement of the grinding wheel 31 may not be affected by the supporting mechanism 2, because the second driving member 73 can lift the grinding head 72 to a position above the surface of the supporting mechanism 2, that is, the height of the grinding head 72 to the bracket 1 in the vertical direction Z is greater than the height of the supporting mechanism 2 to the bracket 1. In this way, the position of the dressing mechanism 7 on the bracket 1 can be set closer to the supporting mechanism 2, making the overall layout of the wafer processing equipment 100 more compact and saving space.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer processing device, characterized in that: include: Bracket; A carrying mechanism, the carrying mechanism is fixedly arranged on the bracket and is used for carrying materials; a spindle assembly, the spindle assembly being slidably disposed on the bracket along a first horizontal straight line direction, the spindle assembly comprising a grinding wheel capable of grinding or polishing the material on the supporting mechanism; A driving mechanism is connected to the main shaft assembly, and the driving mechanism can drive the main shaft assembly to move along the first horizontal straight line direction.

2. The wafer processing equipment according to claim 1, wherein: The wafer processing equipment further includes a first guide member and a first sliding member, wherein the first guide member is slidably connected to the first sliding member, the first guide member is disposed on the bracket, and the first guide member extends along the first horizontal straight line direction.

3. The wafer processing equipment according to claim 2, characterized in that The spindle assembly also includes a lifting bracket and a first driving member. The first sliding member is arranged on the lifting bracket. The grinding wheel is slidably connected to the lifting bracket along the vertical direction. The first driving member is connected to the grinding wheel to drive the grinding wheel to move along the vertical direction.

4. The wafer processing equipment according to claim 3, characterized in that: The spindle assembly also includes a second guide member and a second sliding member, the second guide member is slidably connected to the second sliding member, the second guide member is arranged on the lifting bracket, the second guide member extends in a vertical direction, and the grinding wheel is arranged on the second sliding member.

5. The wafer processing equipment according to claim 3, characterized in that: The spindle assembly further includes a balancing member, which is disposed on the lifting bracket and connected to the grinding wheel. The balancing member can provide a pulling force to the grinding wheel away from the supporting mechanism in a vertical direction.

6. The wafer processing equipment according to claim 5, characterized in that: The grinding wheel includes a grinding wheel body and a rotating shaft, the grinding wheel body is connected to the rotating shaft, the rotating shaft is rotatably arranged on the lifting bracket, a detection component is provided on the rotating shaft, the detection component is arranged around the axis of the rotating shaft, and the detection component can detect the feed force applied by the grinding wheel to the material.

7. The wafer processing equipment according to any one of claims 1 to 6, characterized in that: The wafer processing equipment further includes a dustproof mechanism, which is arranged on the bracket and includes: A housing, the housing being disposed on the bracket, the housing forming an accommodating cavity, the carrying mechanism being disposed in the accommodating cavity, the housing being provided with an opening communicating with the accommodating cavity on a side close to the spindle assembly, and the grinding wheel being able to extend into the accommodating cavity through the opening; A sealing assembly is sealingly arranged at the opening, and the sealing assembly can be switched between an open state and a closed state. When the sealing assembly is in the open state, the grinding wheel can extend into the accommodating cavity through the opening; when the sealing assembly is in the closed state, the sealing assembly can be in sealing contact with the rotating shaft of the grinding wheel, and when the spindle assembly moves along the first horizontal straight line direction, the sealing assembly can be deformed along the first horizontal straight line direction.

8. The wafer processing equipment according to claim 7, characterized in that: The sealing assembly includes a first sealing member and a second sealing member, the first sealing member includes a first fixed portion, a first sealing member and a first flexible connecting portion, the first fixed portion is fixedly connected to the bracket, the first sealing member is slidably connected to the bracket along the first horizontal straight direction, and the first fixed portion and the first sealing member are connected through the first flexible connecting portion; the second sealing member includes a second fixed portion, a second sealing member and a second flexible connecting portion, the second fixed portion is fixedly connected to the bracket, the second sealing member is slidably connected to the bracket along the first horizontal straight direction, and the second fixed portion and the second sealing member are connected through the second flexible connecting portion; when the sealing assembly is in the open state, the first seal and the second seal are moved away from each other along the first horizontal straight direction so that the grinding wheel can extend into the accommodating cavity between the first seal and the second seal; when the sealing assembly is in the closed state, the first seal and the second seal are moved close to each other along the first horizontal straight direction so that the first seal and the second seal are in sealing contact with the rotating shaft of the grinding wheel.

9. The wafer processing equipment according to claim 1, wherein: The wafer processing equipment further includes a trimming mechanism, which is disposed on the bracket and is used for trimming a side of the grinding wheel that contacts the material.

10. The wafer processing equipment according to claim 9, characterized in that: The trimming mechanism comprises: a support member, the support member being arranged on the bracket; A grinding head, the grinding head being arranged on the support member and being used for trimming the side of the grinding wheel that contacts the material; A second driving member is connected to the supporting member to drive the grinding head to move in a vertical direction.

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