Chamfering machining device

Abstract

The utility model discloses a chamfer machining device, which is applied to the field of workpiece chamfer grinding and comprises a workpiece bearing component, a grinding component and a moving component. A workpiece mounting area is formed on the outer side of the mounting surface of the workpiece bearing component; the grinding component comprises a grinding wheel and a first rotary supporting sub-component; the moving part is connected with the workpiece bearing part, and / or the moving part is connected with the grinding part, so that the grinding wheel is moved to correspond to the workpiece mounting area; a first sensor for detecting a first inclination angle formed by the workpiece mounting area relative to the standard plane is arranged at the workpiece bearing part, and / or a second sensor for detecting a second inclination angle formed by the grinding wheel relative to the standard plane is arranged at the grinding part. According to the first inclination angle measured by the first sensor and / or the second inclination angle measured by the second sensor, and by utilizing the included angle of the grinding wheel relative to the workpiece mounting interval, the chamfering grinding accuracy of the workpiece is improved.

Description

Technical Field

[0001] The utility model relates to the field of workpiece chamfering and grinding, in particular to a chamfering processing device. Background Art

[0002] Taking wafer preparation as an example, after the existing crystal rod is sliced ​​to form a wafer, the edge is a neat vertical cross-section, which is prone to problems such as wafer edge cracking and thermal stress concentration, and affects the flatness of the epitaxial layer and photoresist layer at the wafer edge. To address the above problems, the edge corners of the wafer need to be chamfered. The current chamfering process uses a grinding wheel with a chamfer-shaped groove to process the wafer edge to form a chamfer. However, because the chamfer-shaped groove formed in the existing grinding wheel has a fixed shape, the existing grinding wheel can only process one specification of chamfer. Processing different specifications of chamfers requires changing the grinding wheel, which increases the complexity of processing the chamfer structure at the corner of the wafer edge.

[0003] Therefore, how to provide a process for completing the chamfering structure at the edge of the wafer without replacing the grinding wheel is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of the present invention is to provide a chamfering processing device, which solves the problem in the prior art that the grinding wheel can only process chamfers of one specification, and the chamfering process of different specifications requires replacing the grinding wheel, which increases the complexity of processing the chamfer structure at the corners of the wafer edge.

[0005] In order to solve the above technical problems, the utility model provides a chamfering processing device, comprising:

[0006] A workpiece bearing component, a grinding component and a moving component; the workpiece bearing component includes a mounting surface for mounting the workpiece to be processed, and a workpiece mounting area is formed on the outer side of the mounting surface;

[0007] The grinding component includes a grinding wheel and a first rotating support subcomponent that drives the grinding wheel to rotate;

[0008] The moving component is connected to the workpiece carrying component, and / or the moving component is connected to the grinding component, so as to move the grinding component and / or the workpiece carrying component to a position corresponding to the grinding wheel and the workpiece mounting area;

[0009] The workpiece supporting component is provided with a first sensor for detecting a first inclination angle formed by the workpiece mounting area relative to the standard plane, and / or the grinding component is provided with a second sensor for detecting a second inclination angle formed by the grinding wheel relative to the standard plane.

[0010] Optionally, the first sensor and / or the second sensor is a sensor including at least two ranging sub-sensors.

[0011] Optionally, the first sensor and / or the second sensor is a tilt sensor.

[0012] Optionally, the workpiece bearing component includes a bearing subcomponent and a second rotation supporting subcomponent;

[0013] The bearing subcomponent includes the mounting surface.

[0014] Optionally, the second rotation support subassembly includes a workpiece support frame and a workpiece rotation axis connected to the workpiece support frame;

[0015] The first sensor is connected to the workpiece support.

[0016] Optionally, the first rotation support sub-component includes a grinding wheel support frame and a grinding wheel rotation shaft connected to the grinding wheel support frame;

[0017] The second sensor is connected to the grinding wheel support frame.

[0018] Optionally, the surface of the grinding wheel perpendicular to the rotation axis of the grinding wheel serves as the grinding surface in contact with the workpiece to be processed.

[0019] Optionally, a control component is also included;

[0020] The control component is in communication with the moving component, and the first sensor and / or the second sensor are connected to the control component.

[0021] Optionally, an edge of the workpiece mounting area exceeds an edge of the mounting surface.

[0022] Optionally, the method further includes a camera component for photographing the contact position between the grinding wheel and the workpiece to be processed.

[0023] It can be seen that the chamfering processing device provided by the present invention includes a workpiece carrying component, a grinding component and a moving component, the workpiece carrying component includes a mounting surface for mounting the workpiece to be processed, the outer side of the mounting surface is formed with a workpiece mounting area, the grinding component includes a grinding wheel and a first rotating support subcomponent that drives the grinding wheel to rotate, the moving component is connected to the workpiece carrying component, and / or the moving component is connected to the grinding component to move the grinding component and / or the workpiece carrying component to a position corresponding to the grinding wheel and the workpiece mounting area, the workpiece carrying component is provided with a first sensor for detecting a first inclination angle formed by the workpiece mounting area relative to a standard plane, and / or the grinding component is provided with a second sensor for detecting a second inclination angle formed by the grinding wheel relative to the standard plane. The present invention utilizes the first sensor provided on the workpiece carrying component and / or the second sensor provided on the grinding component, based on the first inclination angle formed by the workpiece mounting area relative to the standard plane measured by the first sensor, and / or based on the second inclination angle formed by the grinding wheel relative to the standard plane measured by the second sensor, so as to monitor the workpiece chamfering grinding process or guide the workpiece chamfering grinding by utilizing the angle between the grinding wheel and the workpiece mounting area, thereby improving the accuracy of the workpiece chamfering grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0025] Figure 1 A schematic structural diagram of a chamfering processing device provided in an embodiment of the present utility model;

[0026] Figure 2 A schematic diagram of the structure of an existing chamfering processing device for preparing a chamfer structure on the edge of a workpiece to be processed;

[0027] Figure 3 This is an example diagram of the principle of determining the relative angle between the grinding wheel and the workpiece mounting area in a chamfering processing device provided by an embodiment of the utility model;

[0028] Figure 4 A schematic structural diagram of another chamfering device provided in an embodiment of the present utility model;

[0029] Figure 1 、 Figure 2 and Figure 4 In the figure, the reference numerals are described as follows:

[0030] 1- workpiece to be processed, 2- edge of workpiece to be processed, 3- chamfer structure, 4- existing grinding wheel;

[0031] 10-workpiece carrying component, 11-first sensor, 12-carrying subcomponent, 131-workpiece support frame, 132-workpiece rotation axis;

[0032] 20 - grinding component, 21 - second sensor, 22 - grinding wheel, 231 - grinding wheel support frame, 232 - grinding wheel rotation axis. DETAILED DESCRIPTION

[0033] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0034] Example 1:

[0035] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a chamfering processing device provided in an embodiment of the present invention. The chamfering processing device may include:

[0036] A workpiece bearing component 10, a grinding component 20 and a moving component; the workpiece bearing component 10 includes a mounting surface for mounting the workpiece 1 to be processed, and a workpiece mounting area is formed on the outer side of the mounting surface;

[0037] The grinding component 20 includes a grinding wheel and a first rotating support subcomponent that drives the grinding wheel to rotate;

[0038] The moving component is connected to the workpiece supporting component 10 and / or the moving component is connected to the grinding component 20 to move the grinding component 20 and / or the workpiece supporting component 10 to a position corresponding to the grinding wheel and the workpiece mounting area;

[0039] The workpiece supporting component 10 is provided with a first sensor 11 for detecting a first inclination angle formed by the workpiece mounting area relative to the standard plane, and / or the grinding component 20 is provided with a second sensor 21 for detecting a second inclination angle formed by the grinding wheel relative to the standard plane.

[0040] This embodiment can be specifically applied to the field of wafer preparation. In order to solve the problem that when preparing chamfers at the edges of existing wafers, it is necessary to use a grinding wheel with specific grooves to process the edges of the wafers. Therefore, corresponding to wafers of different sizes, it is necessary to set up grinding wheels of various sizes for processing, which leads to a complicated method for preparing chamfers on the edges of wafers and a high preparation cost. Figure 2 , Figure 2 The schematic diagram of the structure of the existing chamfering processing device for preparing the chamfer structure at the edge of the workpiece to be processed is shown in FIG. Figure 2 The edge of the workpiece to be processed 2 is formed after processing. Figure 2 The chamfer structure 3, wherein the existing grinding wheel 4 is as Figure 2 As shown in , a groove for forming a chamfer structure is provided. In the present application, a workpiece supporting component 10 is used to support the workpiece 1 to be processed, and the workpiece 1 to be processed is specifically arranged in the workpiece mounting area outside the mounting surface of the workpiece supporting component 10. In this embodiment, the outside of the mounting surface of the workpiece supporting component 10 may not be provided with other structures, that is, the workpiece mounting area may be an open area corresponding only to the workpiece 1 to be processed placed outside the mounting surface, or the outside of the mounting surface of the workpiece supporting component 10 may also be provided with a limiting structure for limiting and fixing the workpiece 1 to be processed placed outside the mounting surface, or the mounting surface formed by the workpiece supporting component 10 itself may be used to limit and fix the workpiece 1 to be processed. The grinding wheel in this embodiment is a conventional grinding wheel that does not require a special notch structure. In addition, in this embodiment, the rotation axis of the first rotating support subcomponent can be coaxially arranged with the grinding wheel. This embodiment Figure 1 The location of the component 1 to be processed can be identified as the workpiece installation area.

[0041] In this embodiment, the moving part is connected to the workpiece supporting part 10, or the moving part is connected to the grinding part 20, or the moving part is connected to both the workpiece supporting part 10 and the grinding part 20. As long as the grinding wheel in the grinding part 20 can correspond to the workpiece mounting area in the workpiece supporting part 10, the grinding wheel can process the edge of the workpiece 1 to be processed placed in the workpiece mounting area to form a chamfered structure. In a feasible and simple implementation, this embodiment can only set the moving part to be connected to the grinding part 20, that is, the workpiece supporting part 10 is fixed and only serves as a component for supporting the workpiece 1 to be processed. When the workpiece 1 to be processed is processed, the moving part is used to drive the grinding part 20 to move to the corresponding position of the edge of the workpiece 1 to be processed, so as to ensure that the workpiece 1 to be processed is stably placed in the workpiece mounting area during processing, thereby improving the stability of the process. At the same time, only the grinding part 20 is moved, while the workpiece supporting part 10 is fixed, which can reduce the complexity of the process. Only the relative position of the grinding part 20 relative to the fixed target needs to be adjusted. This embodiment does not limit the specific structure of the moving part, as long as it can drive the target object to move. For example, the moving component may be a cylinder component, or may be a component with other structures.

[0042] In this embodiment, the first rotating support sub-component is connected to the grinding wheel to drive the grinding wheel to rotate. That is, the first rotating support sub-component may include a motor, which can be specifically set as a servo motor, or the first rotating support sub-component may be externally connected to a motor. Further, in this embodiment, the grinding wheel and the workpiece mounting area are moved to corresponding positions by using a moving component, but in order to ensure that the grinding surface of the grinding wheel is set correspondingly to the workpiece 1 to be processed in the workpiece mounting area, so that the grinding wheel can accurately process the edge of the workpiece 1 to be processed to form a chamfered structure, in this embodiment, a first sensor 11 is set at the workpiece supporting component 10 and / or a second sensor 21 is set at the grinding component 20, that is, in this embodiment, the first sensor 11 can be set only at the workpiece supporting component 10, or in this embodiment, the second sensor 21 can be set only at the grinding component 20, or in this embodiment, the first sensor 11 can also be set at the workpiece supporting component 10, and the second sensor 21 can be set at the grinding component 20. Specifically, corresponding to when the angle of the workpiece supporting component 10 is fixed, the second sensor 21 can be set only at the grinding component 20, that is, it can determine the angle of the grinding surface in the grinding wheel relative to the edge of the workpiece 1 to be processed, and realize the processing and preparation of the chamfered structure at the edge of the component to be processed; or, corresponding to when the angle of the grinding component 20 is fixed, the first sensor 11 can be set only at the workpiece supporting component 10, that is, it can determine the angle of the grinding surface in the grinding wheel relative to the edge of the workpiece 1 to be processed, and realize the processing and preparation of the chamfered structure at the edge of the component to be processed; or, corresponding to when the angle of the workpiece supporting component 10 and the angle of the grinding component 20 are not fixed, the first sensor 11 can be set at the workpiece supporting component 10 at the same time, and the second sensor 21 can be set at the grinding component 20, so as to determine the angle of the grinding surface in the grinding wheel relative to the edge of the workpiece 1 to be processed, and realize the processing and preparation of the chamfered structure at the edge of the component to be processed. Further, when the first sensor 11 is set at the workpiece supporting component 10 and the second sensor 21 is set at the grinding component 20 at the same time, the method of determining the relative angle between the grinding wheel and the workpiece mounting area can refer to Figure 3 , Figure 3 This is an example diagram of the principle of determining the relative angle between the grinding wheel and the workpiece installation area in a chamfering processing device provided by an embodiment of the utility model. Among them, position 1 can be the position representing the workpiece installation area, position 2 can be the position representing the grinding wheel, and the horizontal position can be the standard plane. At this time, based on the angle between position 1 and the horizontal position determined by the first sensor 11 and the second sensor 21, and the angle between position 2 and the horizontal position, the angle between position 1 and position 2 can be determined, that is, Figure 3 The relative position angle is the relative angle between the grinding wheel and the workpiece mounting area.

[0043] In this embodiment, the first sensor 11 is used to detect a first inclination angle formed by the workpiece mounting area relative to the standard plane. This first inclination angle can be detected between any side of the workpiece mounting area and the standard plane. The standard plane is not limited in this embodiment, and any fixed surface in space can be used. For example, the standard plane can be a horizontal plane. Accordingly, in this embodiment, the second sensor 21 is used to detect a second inclination angle formed by the grinding wheel relative to the standard plane. Specifically, the second inclination angle of the grinding surface of the grinding wheel relative to the standard plane can be set.

[0044] Furthermore, in order to ensure that the first sensor 11 and the second sensor 21 can detect the angle with the standard plane, the first sensor 11 and / or the second sensor 21 may be configured as a sensor including at least two distance measuring sub-sensors.

[0045] It should be noted that in this embodiment, the first sensor 11 and / or the second sensor 21 are configured to include at least two ranging sub-sensors. Specifically, the ranging sub-sensors can be arranged side by side, and the angle between the surface on which each ranging sub-sensor is arranged and the standard plane can be determined using the distance between each ranging sub-sensor and the standard plane, as well as the spacing between the ranging sub-sensors. In this embodiment, the detection surface of the ranging sub-sensors can be the same as the surface on which each ranging sub-sensor is arranged. This embodiment does not limit the specific number of ranging sub-sensors provided in the first sensor 11 and the second sensor 21. It should be noted that the greater the number of ranging sub-sensors provided in the first sensor 11 and the second sensor 21, the more accurate the detection results. This embodiment also does not limit the specific type of ranging sub-sensors. For example, the ranging sub-sensors can be one or more of an ultrasonic ranging sensor, an infrared ranging sensor, a laser ranging sensor, a piezoelectric ranging sensor, an inductive ranging sensor, and a Doppler ranging sensor.

[0046] Furthermore, in order to ensure the convenience of using the first sensor 11 and / or the second sensor 21 to detect the angle with the standard plane, the first sensor 11 and / or the second sensor 21 can be set as an inclination sensor.

[0047] It should be noted that in this embodiment, the first sensor 11 and / or the second sensor 21 can be set as an inclination sensor, which can directly detect the angle between the first sensor 11 and the second sensor 21 and the standard plane, and then determine the first inclination angle of the workpiece installation area relative to the standard plane, and the second inclination angle of the grinding wheel relative to the standard plane, thereby improving the convenience of inclination detection.

[0048] Furthermore, in order to improve the convenience of preparing the chamfering processing device, the chamfering processing device may further include a control component;

[0049] The control component is in communication with the moving component, and the first sensor 11 and / or the second sensor 21 are connected to the control component.

[0050] It should be noted that in this embodiment, the first sensor 11, the second sensor 21, and the moving parts are all communicated with the control part, so that the moving parts can be controlled by the control part, and the moving parts can be adjusted based on the angle information detected by the first sensor 11 and / or the second sensor 21 to improve the convenience and accuracy of chamfering processing.

[0051] Furthermore, in order to ensure the convenience of the grinding wheel in processing the chamfer structure of the edge of the workpiece 1 to be processed in the workpiece installation area, the edge of the workpiece installation area can be set to exceed the edge of the installation surface.

[0052] It should be noted that in this embodiment, the edge of the workpiece mounting area is set to extend beyond the edge of the mounting surface. In particular, when the workpiece 1 to be processed is a wafer that requires chamfering structure on the edge, in order to avoid the workpiece supporting component 10 affecting the edge contact between the grinding wheel and the wafer during processing, the edge of the above-mentioned workpiece mounting area is set to extend beyond the edge of the mounting surface. This can facilitate the grinding wheel to act on the workpiece 1 to be processed, such as the wafer, that requires chamfering structure at the edge, thereby improving the convenience of processing.

[0053] Furthermore, in order to ensure the accuracy of the chamfer structure formed by the grinding wheel in processing the workpiece 1 to be processed, the chamfer processing device may further include a camera component for photographing the contact position between the grinding wheel and the workpiece 1 to be processed.

[0054] In this embodiment, the camera component is used to capture the contact position between the grinding wheel and the workpiece 1 to be processed, which can ensure the accuracy of setting the relative position between the grinding wheel and the workpiece 1 to be processed, thereby improving the accuracy of the prepared chamfered structure.

[0055] The chamfering processing device provided by the embodiment of the present utility model includes a workpiece supporting component 10, a grinding component 20 and a moving component. The workpiece supporting component 10 includes a mounting surface for mounting the workpiece 1 to be processed, and a workpiece mounting area is formed on the outer side of the mounting surface. The grinding component 20 includes a grinding wheel and a first rotating support sub-component for driving the grinding wheel to rotate. The moving component is connected to the workpiece supporting component 10, and / or the moving component is connected to the grinding component 20 to move the grinding component 20 and / or the workpiece supporting component 10 to a position corresponding to the grinding wheel and the workpiece mounting area. A first sensor 11 for detecting the first inclination angle formed by the workpiece mounting area relative to the standard plane is provided at the workpiece supporting component 10, and / or a second sensor 21 for detecting the second inclination angle formed by the grinding wheel relative to the standard plane is provided at the grinding component 20. The utility model utilizes a first sensor 11 arranged at the workpiece supporting component 10, and / or a second sensor 21 arranged at the grinding component 20, and measures a first inclination angle formed by the workpiece mounting area relative to the standard plane according to the first sensor 11, and / or measures a second inclination angle formed by the grinding wheel relative to the standard plane according to the second sensor 21, so as to utilize the angle between the grinding wheel and the workpiece mounting area to monitor the workpiece chamfer grinding process or guide the workpiece chamfer grinding, thereby improving the accuracy of the workpiece chamfer grinding.

[0056] In addition, the embodiment of the present invention is capable of determining the angle between the surface on which each ranging sub-sensor is arranged and the standard plane by configuring the first sensor 11 and / or the second sensor 21 to include at least two ranging sub-sensors; configuring the first sensor 11 and / or the second sensor 21 as an inclination sensor can improve the convenience of inclination detection; configuring the first sensor 11, the second sensor 21, and the moving component to be communicated with the control component can realize control of the moving component by the control component, and adjust the moving component based on the angle information detected by the first sensor 11 and / or the second sensor 21 to improve the convenience and accuracy of chamfering processing; configuring the edge of the workpiece mounting area to extend beyond the edge of the mounting surface can ensure that the grinding wheel can smoothly act on the workpiece 1 to be processed, such as the wafer, which requires chamfering structure processing at the edge; utilizing the camera component to capture the contact position between the grinding wheel and the workpiece 1 to be processed can ensure the accuracy of the relative position between the grinding wheel and the workpiece 1 to be processed, thereby improving the accuracy of the prepared chamfered structure.

[0057] Example 2:

[0058] Please refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of another chamfering device provided by an embodiment of the present invention. Compared with the above embodiment 1, the difference between this chamfering device and the embodiment 1 is that:

[0059] The workpiece bearing component 10 may include a bearing subcomponent 12 and a second rotation support subcomponent;

[0060] The carrier subassembly 12 may include a mounting surface.

[0061] It should be noted that in this embodiment, the workpiece support component 10 is configured to include a support sub-component 12 and a second rotating support sub-component. The second rotating support sub-component can be used to drive the support sub-component 12 to rotate, thereby driving the workpiece 1 to be processed in the workpiece installation area to rotate, so that the edge of the workpiece 1 to be processed fully contacts the grinding wheel 22 through rotation, thereby improving the convenience and flexibility of chamfering structure processing. In this embodiment, the rotation axis of the second rotating support sub-component can be arranged coaxially with the support sub-component 12.

[0062] Furthermore, in order to ensure that the first sensor 11 is smoothly arranged at the workpiece supporting component 10, a second rotating support subcomponent may be provided, including a workpiece supporting frame 131 and a workpiece rotating shaft 132 connected to the workpiece supporting frame 131;

[0063] The first sensor 11 is connected to the workpiece support 131 .

[0064] It should be noted that in this embodiment, the second rotating support sub-component includes a workpiece support frame 131 and a workpiece rotating shaft 132 connected to the workpiece support frame 131, so that the workpiece rotating shaft 132 can be used to drive the bearing sub-component 12 to rotate, and in this embodiment, the first sensor 11 is connected to the workpiece support frame 131 to ensure that the first sensor 11 is stably arranged on the workpiece bearing component 10.

[0065] Furthermore, in order to ensure that the second sensor 21 is stably arranged at the grinding component 20, a first rotating support subcomponent may be provided, including a grinding wheel support frame 231 and a grinding wheel rotating shaft 232 connected to the grinding wheel support frame 231;

[0066] The second sensor 21 is connected to the grinding wheel support 231 .

[0067] In this embodiment, the grinding wheel 22 is connected to the grinding wheel rotating shaft 232 to drive the grinding wheel 22 to rotate. In this embodiment, the second sensor 21 is connected to the grinding wheel support frame 231 to ensure the stability of the layout of the second sensor 21 and prevent the second sensor 21 from rotating with the grinding wheel rotating shaft 232, thereby improving the accuracy of inclination detection.

[0068] Furthermore, in order to ensure that the grinding wheel 22 can smoothly complete the process of processing the chamfer structure of the workpiece 1, the surface of the grinding wheel 22 perpendicular to the grinding wheel rotation axis 232 can be set as the grinding surface in contact with the workpiece 1.

[0069] In this embodiment, the surface of the grinding wheel 22 perpendicular to the grinding wheel rotation axis 232 is set as the grinding surface, which can ensure the accuracy of the grinding wheel 22 in grinding the workpiece 1 to be processed and improve the yield rate of workpiece processing.

[0070] The chamfering processing device provided in the embodiment of the present invention is applied, and the workpiece supporting component 10 is set to include a supporting sub-component 12 and a second rotating support sub-component. The second rotating support sub-component can be used to drive the supporting sub-component 12 to rotate, and then drive the workpiece 1 to be processed in the workpiece installation area to rotate, so that the edge of the workpiece 1 to be processed is fully in contact with the grinding wheel 22 through rotation, thereby improving the convenience and flexibility of chamfering structure processing. In addition, the embodiment of the present invention utilizes the workpiece rotating shaft 132 to drive the bearing sub-component 12 to rotate, and connects the first sensor 11 to the workpiece support frame 131 to ensure that the first sensor 11 is stably arranged on the workpiece bearing component 10; by utilizing the grinding wheel rotating shaft 232 to connect with the grinding wheel 22 to drive the grinding wheel 22 to rotate, and by setting the second sensor 21 to be connected to the grinding wheel support frame 231, the stability of the arrangement of the second sensor 21 can be guaranteed, and the second sensor 21 can be prevented from rotating with the grinding wheel rotating shaft 232, thereby improving the accuracy of inclination detection; by setting the surface of the grinding wheel 22 perpendicular to the grinding wheel rotating shaft 232 as the grinding surface, the accuracy of the grinding wheel 22 in grinding the workpiece 1 to be processed can be guaranteed, thereby improving the yield rate of workpiece processing.

[0071] In a feasible embodiment, the chamfering processing device may specifically include the following structure:

[0072] A workpiece bearing component, a grinding component, a moving component, a control component, and a camera component; the workpiece bearing component includes a bearing sub-component and a second rotating support sub-component, the bearing sub-component includes a mounting surface for mounting the workpiece to be processed, and a workpiece mounting area is formed on the outer side of the mounting surface; the second rotating support sub-component includes a workpiece support frame and a workpiece rotating shaft connected to the workpiece support frame;

[0073] The grinding component includes a grinding wheel and a first rotating support subcomponent that drives the grinding wheel to rotate; the first rotating support subcomponent includes a grinding wheel support frame and a grinding wheel rotation axis connected to the grinding wheel support frame, and the second sensor is connected to the grinding wheel support frame. The surface of the grinding wheel perpendicular to the grinding wheel rotation axis serves as a grinding surface that contacts the workpiece to be processed;

[0074] The moving component is connected to the workpiece supporting component, and / or the moving component is connected to the grinding component to move the grinding component and / or the workpiece supporting component to a position corresponding to the grinding wheel and the workpiece mounting area;

[0075] A first sensor for detecting a first inclination angle formed by the workpiece mounting area relative to the standard plane is provided on the workpiece supporting member, and / or a second sensor for detecting a second inclination angle formed by the grinding wheel relative to the standard plane is provided on the grinding member; both the first sensor and the second sensor are inclination sensors, and the first sensor is connected to the workpiece supporting frame;

[0076] The control component is communicatively connected to the moving component, and the first sensor and / or the second sensor are connected to the control component. The edge of the workpiece mounting area exceeds the edge of the mounting surface. The camera component is used to capture the contact position between the grinding wheel and the workpiece to be processed.

[0077] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0078] In addition, it should be noted that, in this document, relationships such as first and second, etc., are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include," "comprises," or any other variations thereof are intended to cover non-exclusive inclusion.

[0079] The above is a detailed introduction to a chamfering processing device provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the structure and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A chamfering processing device, characterized in that: include: Workpiece-carrying components, grinding components, and moving components; The workpiece bearing component includes a mounting surface for mounting the workpiece to be processed, and a workpiece mounting area is formed on the outer side of the mounting surface; The grinding component includes a grinding wheel and a first rotating support subcomponent that drives the grinding wheel to rotate; The moving component is connected to the workpiece carrying component, and / or the moving component is connected to the grinding component, so as to move the grinding component and / or the workpiece carrying component to a position corresponding to the grinding wheel and the workpiece mounting area; The workpiece supporting component is provided with a first sensor for detecting a first inclination angle formed by the workpiece mounting area relative to the standard plane, and / or the grinding component is provided with a second sensor for detecting a second inclination angle formed by the grinding wheel relative to the standard plane.

2. The chamfering processing device according to claim 1, characterized in that: The first sensor and / or the second sensor is a sensor including at least two distance measuring sub-sensors.

3. The chamfering processing device according to claim 1, characterized in that: The first sensor and / or the second sensor is a tilt sensor.

4. The chamfering processing device according to claim 1, characterized in that: The workpiece bearing component includes a bearing subcomponent and a second rotation supporting subcomponent; The bearing subcomponent includes the mounting surface.

5. The chamfering processing device according to claim 4, characterized in that: The second rotation support subassembly includes a workpiece support frame and a workpiece rotation axis connected to the workpiece support frame; The first sensor is connected to the workpiece support.

6. The chamfering processing device according to claim 1, characterized in that: The first rotation support sub-component includes a grinding wheel support frame and a grinding wheel rotation shaft connected to the grinding wheel support frame; The second sensor is connected to the grinding wheel support frame.

7. The chamfering processing device according to claim 6, characterized in that: The surface of the grinding wheel perpendicular to the rotation axis of the grinding wheel serves as a grinding surface in contact with the workpiece to be processed.

8. The chamfering processing device according to claim 1, characterized in that: Also includes control components; The control component is in communication with the moving component, and the first sensor and / or the second sensor are connected to the control component.

9. The chamfering processing device according to claim 1, characterized in that: The edge of the workpiece mounting area exceeds the edge of the mounting surface.

10. The chamfering processing device according to claim 1, characterized in that: The device also includes a camera component for photographing the contact position between the grinding wheel and the workpiece to be processed.

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