Square silicon rod grinding equipment and angle grinding device thereof

Abstract

The utility model discloses a square silicon rod grinding device and an angle lapping device thereof.The grinding device comprises a machine base and a grinding guide rail which is arranged on the machine base and extends in the transverse direction, and the angle lapping device comprises an angle lapping carrier which is arranged on the grinding guide rail and can transversely move along the grinding guide rail; the angle lapping carrier is used for laterally supporting a square silicon rod to be ground, the angle lapping carrier comprises a pair of oppositely arranged bearing seats, and each bearing seat is provided with a swinging mechanism which is used for laterally supporting the square silicon rod and can drive the square silicon rod to perform reversing motion and swinging motion; the swinging mechanism is provided with a supporting assembly used for adjusting the axial lead of the square silicon rod which is laterally placed; and the first angle lapping main shaft and the second angle lapping main shaft are arranged on the two opposite sides of the grinding guide rail respectively and are used for carrying out angle lapping operation on the edges of the two opposite sides of the square silicon rod.

Description

Technical Field

[0001] The present application relates to the technical field of silicon materials, and in particular to a square silicon rod grinding device and an angle grinding device thereof. Background Art

[0002] After the single crystal silicon rod is pulled out of the single crystal furnace, it needs to continue to go through a series of processes. The early stage includes mechanical processing such as cutting, squaring, grinding, and corner grinding; subsequently, the silicon rod needs to be glued and then sliced, cleaned, chamfered, ground, corroded and cleaned again. Finally, the silicon wafer needs to be texturized, diffused, bonded, coated and sintered before manufacturing semiconductor devices or solar silicon wafers for photovoltaic power generation.

[0003] Generally, for the grinding process of silicon blocks, the semi-finished materials used to manufacture silicon wafers, rectangular silicon rods need to be ground on four sides and ground on four sides (for example, chamfered or rounded) before slicing. Among them, when grinding the silicon rods, most manufacturers use different equipment to process silicon rods of different specifications. For example, when it is necessary to grind the square rod with a square cross-section and the half rod with a rectangular cross-section formed by cutting in half, most manufacturers use different equipment to process the square rod and the half rod respectively, which will lead to an increase in production costs. Therefore, how to provide a grinding device that can be applied to silicon rods of different specifications to save production costs is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Invention

[0004] In view of the shortcomings of the related technologies described above, the purpose of this application is to provide a square silicon rod grinding device and an angle grinding device thereof, which are used to solve the technical problem that the angle grinding device in the related technology cannot be applied to the processing of silicon rods of different specifications, resulting in increased production costs.

[0005] To achieve the above-mentioned purpose and other related purposes, the first aspect of the present application provides an angle grinding device of a grinding equipment, wherein the grinding equipment includes a machine base and a grinding guide rail arranged on the machine base and extending laterally, the grinding device includes: an angle grinding carrier, which is arranged on the grinding guide rail and can move laterally along the grinding guide rail, and is used to laterally support a square silicon rod to be ground, the angle grinding carrier includes a pair of oppositely arranged supporting seats, each of the supporting seats is provided with a swing mechanism for laterally supporting the square silicon rod and driving the square silicon rod to perform reversing movement and swinging movement; the swing mechanism is provided with a support component for adjusting the axis center line of the laterally placed square silicon rod; first and second angle grinding spindles are respectively provided on opposite sides of the grinding guide rail for performing angle grinding operations on the opposite side edges of the square silicon rod.

[0006] The second aspect of the present application provides a square silicon rod grinding device, comprising: a machine base, provided with a grinding guide rail extending in the transverse direction, the grinding guide rail comprising a first section for placing the square silicon rod transversely for waiting for surface grinding and a second section for placing the square silicon rod transversely for waiting for angle grinding; a grinding device, correspondingly arranged in the first section for performing surface grinding on the square silicon rod, comprising a surface grinding carrier for clamping the two ends of the square silicon rod and capable of moving transversely along the grinding guide rail, and a first and a second surface grinding spindle respectively arranged on opposite sides of the grinding guide rail for performing surface grinding on opposite side surfaces of the square silicon rod; and an angle grinding device as described in any embodiment of the first aspect of the present application, correspondingly arranged in the second section for performing angle grinding on the opposite side edges of the square silicon rod.

[0007] In summary, the square silicon rod grinding equipment and its angle grinding device provided in the present application configure the angle grinding device to include a first and a second angle grinding spindles arranged on opposite sides of a grinding guide rail, and an angle grinding carrier arranged on the grinding guide rail and capable of moving laterally along the grinding guide rail, and a swinging mechanism is provided on the angle grinding carrier to support and drive the square silicon rod to perform reversing movement and swinging movement, thereby realizing the grinding processing of the four sides of the square silicon rod in the form of fixed angle grinding spindles and swinging silicon rods; by providing a support component that can adjust the axis of the square silicon rod on the swinging mechanism, the positioning deviation of the square silicon rod can be eliminated, thereby ensuring the processing quality; further, the provision of the support component enables the angle grinding device to be suitable for the processing of silicon rods of different specifications, thereby enhancing the versatility of the angle grinding device and reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The specific features of the present application are set forth in the appended claims. The features and advantages of the present invention can be better understood by referring to the exemplary embodiments described in detail below and the accompanying drawings. A brief description of the drawings is as follows:

[0009] Figure 1 Shown is a schematic diagram of the three-dimensional structure of a silicon rod grinding device according to one embodiment of the present application.

[0010] Figure 2 Shown is a schematic diagram of the three-dimensional structure of the silicon rod grinding equipment of the present invention, omitting the gantry.

[0011] Figure 3 Shown is a schematic structural diagram of a grinding guide rail in one embodiment of the present application.

[0012] Figure 4 Shown is a structural schematic diagram of a loading and conveying device in one embodiment of the present application.

[0013] Figure 5 Shown is a schematic structural diagram of the first gantry and the first manipulator in one embodiment of the present application.

[0014] Figure 6 Shown is a schematic structural diagram of a grinding carrier in one embodiment of the present application.

[0015] Figure 7 Shown is a structural schematic diagram of the flipping mechanism in one embodiment of the present application.

[0016] Figure 8 The figure shows a schematic diagram of the state of the flipping mechanism after turning over in one embodiment of the present application.

[0017] Figure 9 Shown is a schematic structural diagram of the second manipulator in one embodiment of the present application.

[0018] Figure 10 Shown is a structural schematic diagram of an angle grinding carrier in one embodiment of the present application.

[0019] Figure 11 FIG2 is a schematic diagram showing an angle grinding device performing an angle grinding operation according to an embodiment of the present application.

[0020] Figures 12 to 15 Displayed as Figure 11 Schematic diagram of the swing mechanism driving the square silicon rod to perform reversing motion in the embodiment shown.

[0021] Figure 16 Display as Figure 11 Schematic diagram of the swing mechanism driving the square silicon rod to swing in the embodiment shown.

[0022] Figure 17 and Figure 18 They are schematic diagrams showing how a supporting cam compensates for the axis center error of a silicon rod of the first specification in one embodiment of the present application.

[0023] Figure 19 and Figure 20 Schematic diagrams showing how a supporting cam compensates for the axis center error of a silicon rod of the second specification in one embodiment of the present application are shown respectively.

[0024] Figure 21 Shown is a schematic diagram of an angle grinding device performing an angle grinding operation in another embodiment of the present application.

[0025] Figures 22 to 25 Displayed as Figure 21 Schematic diagram of the swing mechanism driving the square silicon rod to perform reversing motion in the embodiment shown.

[0026] Figure 26 Display as Figure 21 Schematic diagram of the swing mechanism driving the square silicon rod to swing in the embodiment shown.

[0027] Figure 27 Display as Figure 21 Schematic diagram of the three-dimensional structure of the swing mechanism in the embodiment shown.

[0028] Figure 28 Shown is a schematic structural diagram of a first angle grinding spindle in one embodiment of the present application. DETAILED DESCRIPTION

[0029] The following specific embodiments of the present application are illustrated, and those familiar with the technology can easily understand the advantages of the present application and the technical effects that can be achieved from the contents disclosed in this specification. In the following description, some embodiments may refer to the accompanying drawings. It should be understood that other embodiments without accompanying drawings may also be used, and changes in specific structures, parts or mechanisms, components and operations may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims published in this application. The terms used here are only for describing specific embodiments and are not intended to limit the present application.

[0030] It should be understood that although in some embodiments the terms first, second or third etc. may be used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter, and are not used to define the order, priority or importance of multiple elements. For example, the first grinding spindle can be referred to as the second grinding spindle, and similarly, the second grinding spindle can be referred to as the first grinding spindle without departing from the scope of the various described embodiments. The first grinding spindle and the second grinding spindle are both describing a certain grinding spindle, but unless the context clearly indicates otherwise, they are not the same grinding spindle. Similar situations also include the first grinding spindle and the second grinding spindle, the first support assembly and the second support assembly, etc.

[0031] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to also include plural forms, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprising" and "including" indicate the presence of described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. For example, a process, method, system, product or device comprising a series of steps or units need not be limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or that are inherent to these processes, methods, products or devices. In addition, the term "and / or" that may be used hereinafter describes the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / ", if not otherwise specified, generally represents that the associated objects before and after are a kind of "and / or" relationship. In addition, in the description of the embodiments of the present application, "a plurality" refers to two or more than two. Furthermore, the terms "or" and "and / or" used in this document are interpreted as inclusive, or mean any one or any combination. Exceptions to this definition will only occur when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

[0032] It should also be understood that when an element such as a layer, region, or substrate is referred to as being "on" another element or extending "onto" another element, the element may be directly on the other element or directly extend onto the other element, or there may be intermediate elements. Conversely, when an element is referred to as being "directly on" another element or "directly extending onto" another element, there are no intermediate elements. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intermediate elements. Furthermore, the term "coupled" generally means a physical, mechanical, magnetic, and / or electrical coupling or connection, and in the absence of specific language to the contrary, does not exclude the presence of intermediate elements between coupled or associated items.

[0033] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe the relationship of one element, layer or region to another element, layer or region as illustrated in the figures. It will be understood that these terms are intended to cover different device orientations other than the orientation depicted in the figures. In this application, the "vertical", "horizontal" and "parallel" are defined as including situations within ±10% of the standard definition. For example, vertical usually refers to an angle of 90° relative to a reference line, but in this application, vertical refers to situations within 80° to 100°. Unless otherwise expressly stated, comparative quantitative terms (such as "above" and "below") are intended to cover the concept of equality. As an example, "above" can mean not only "greater than" in a mathematical sense, but also "equal to".

[0034] In view of the technical problems mentioned in the background technology, the present application discloses a square silicon rod grinding equipment and an angle grinding device thereof. The angle grinding device is configured to include a first and a second angle grinding spindles arranged on opposite sides of a grinding guide rail, and an angle grinding carrier arranged on the grinding guide rail and capable of moving laterally along the grinding guide rail, and a swinging mechanism is provided on the angle grinding carrier to support and drive the square silicon rod to perform reversing movement and swinging movement, thereby realizing the grinding processing of the four sides of the square silicon rod in the form of fixed angle grinding spindles and swinging silicon rods; by providing a support component that can adjust the axis of the square silicon rod on the swinging mechanism, the positioning deviation of the square silicon rod can be eliminated, thereby ensuring the processing quality; further, the provision of the support component enables the angle grinding device to be applicable to the processing of silicon rods of different specifications, thereby enhancing the versatility of the angle grinding device and reducing the production cost.

[0035] In order to clarify the definition of direction and the operation mode between different structures, a three-dimensional space defined by horizontal, vertical and vertical directions is defined in the embodiments disclosed in this application. The horizontal, vertical and vertical directions are all straight lines and are perpendicular to each other. For example, the longitudinal extension direction of the bottom of the base is defined as horizontal (for example Figure 1 The X in the middle is in the direction), and the width extension direction of the bottom of the base is defined as the longitudinal direction (for example Figure 1 The vertical direction is also called the vertical direction, or the up and down direction is defined as the vertical direction (for example Figure 1 The Z direction in the image).

[0036] In order to clearly illustrate the positional relationship between the various devices, components, structures or mechanisms in the embodiments of the present application, along the transverse direction of the machine base, the grinding device of the square silicon rod is connected to the loading and conveying device, that is, the side used for loading is defined as the proximal end, and the grinding device of the square silicon rod is connected to the unloading and conveying device, that is, the side used for unloading is defined as the distal end. It should be understood that when the square silicon rod moves from one side of the grinding device to the other side opposite to perform loading and conveying, surface grinding, angle grinding, and unloading respectively, the proximal end and the distal end respectively correspond to the opposite sides of the grinding device of the square silicon rod, and the two are opposite and away from each other. In addition, along the longitudinal direction of the machine base, the side where the loading and conveying device is set is defined as the first side, and correspondingly, the side where the flipping mechanism is set is defined as the second side. It should be understood that when the square silicon rod moves from one side of the loading and conveying device to the other side opposite to each other, the first side and the second side respectively correspond to the opposite sides in the longitudinal direction of the machine base, and the two are opposite and away from each other.

[0037] In any of the embodiments provided herein, the square silicon rods may be, for example, single crystal silicon rods and polycrystalline silicon rods. Single crystal silicon rods are rod-shaped single crystal silicon grown from a melt using a Czochralski method or a floating zone melting method, such as single crystal silicon rods of approximately 5000 mm (e.g., 5360 mm in length) or single crystal silicon rods of approximately 800 mm in length, which are commonly used in silicon rod processing. Polycrystalline silicon rods are silicon rods in which silicon is deposited on the surface of a silicon core using a precipitation technique such as chemical vapor deposition, but are not limited thereto. In the present application, the square silicon rods are formed by truncating a round cross-section original rod to form a short rod, and then squaring the short rod (removing the edge of the original rod) to form a square cross-section silicon rod. For example, in some embodiments, the square silicon rods have a cross-sectional width between 182 mm and 240 mm, a cross-sectional length between 182 mm and 240 mm, and a silicon rod length of approximately 1200 mm.

[0038] The square silicon rod grinding equipment described in this application is suitable for grinding rectangular silicon rods, but is not limited to this. For example, based on the inspiration of this application, in some examples, the square silicon rod grinding equipment can also be used for other long strips of hard materials that need to be ground. In any embodiment of the present application, the square silicon rod includes a first-specification silicon rod and a second-specification silicon rod, and the first-specification silicon rod refers to a silicon rod with a square cross-section (adjacent sides are equal in length) formed after cutting and squaring a silicon rod with a circular cross-section. The second-specification silicon rod refers to a silicon rod with a rectangular cross-section (adjacent sides are of unequal length), which can be, for example, a half rod after the first-specification silicon rod is cut along the end using a cutting device, and the end refers to the two opposite ends along the length direction of the axis of the square silicon rod. The following is an example of performing a grinding operation on a first-specification silicon rod, and should not be understood as a limitation to this application.

[0039] It should be understood that the end faces of a square silicon rod refer to two faces that are opposite to each other along the length direction of the square silicon rod. The side faces of a square silicon rod refer to the four faces other than the two end faces, and the four side faces can be divided into two groups with two of them facing each other. The edges of a square silicon rod refer to the four sides along the length direction, and the four edges can be divided into two groups along the diagonal direction of the square silicon rod. It should be noted that the opposite side edges of a square silicon rod described in subsequent embodiments refer to the two edges that are opposite to each other along the diagonal direction of the square silicon rod.

[0040] After the square silicon rod is squared and before it is sliced, in order to prevent edge collapse and improve the yield of silicon wafers, it is usually necessary to perform surface grinding and angle grinding on the square silicon rod. The surface grinding operation refers to the process of first rough grinding the four sides of the square silicon rod using a grinding wheel of a specific shape and then fine grinding. In an embodiment, the two pairs of sides can be ground separately. The angle grinding operation may include chamfering and rounding operations, wherein the chamfering operation refers to the process of grinding the edge of the square silicon rod into a certain slope from one end face to the other end face using a fine grinding wheel of a specific shape. The rounding process refers to the process of first rough grinding and then fine grinding from one end face to the other end face of the square silicon rod using a grinding wheel of a specific shape until the edge of the square silicon rod is ground into a specific arc. Generally, the processing needs can be determined according to the size of the square silicon rod, and one of the operations of chamfering or rounding can be performed on the square silicon rod.

[0041] The following combination Figures 1 to 28 The square silicon rod grinding equipment provided in the present application and the angle grinding device of the grinding equipment are described in detail.

[0042] See also Figure 1 and Figure 2 ,in, Figure 1 Shown is a schematic diagram of the three-dimensional structure of the silicon rod grinding device of the present application in one embodiment. Figure 2 The figure shows the three-dimensional structure of the grinding equipment for silicon rods of the present invention, omitting the gantry. Figure 1 and Figure 2 As shown, the square silicon rod grinding equipment includes a machine base 1, a surface grinding device 2, and an angle grinding device 3.

[0043] The machine base 1 serves as the main component of the square silicon rod grinding equipment, and is used to provide a workpiece processing platform and carry working parts. In actual applications, the machine base 1 is large in size and weight to provide a large mounting surface and firm stability of the entire machine. It should be understood that the machine base 1 can be used as the base for different structures or components that perform processing operations in the square silicon rod grinding equipment, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base includes fixed structures or limiting structures such as bases, columns, frames, etc. for receiving different components in the square silicon rod grinding equipment, which are all the machine bases described in this application. At the same time, in some examples, the machine base 1 can serve as an integrated base. In some examples, the machine base can include multiple independent bases.

[0044] The machine base includes a workpiece processing platform, which can be divided into multiple functional areas according to the specific workpiece processing operations. For example, in some embodiments, the workpiece processing platform includes a surface grinding area for performing surface grinding operations and an angle grinding area for performing angle grinding operations. In some embodiments, the workpiece processing platform includes the surface grinding area, the angle grinding area, and a loading area and an unloading area for loading and unloading materials, respectively.

[0045] It should be noted that in each example provided in this application, the functional location is defined by the travel path and range of the processing device at the functional location. For example, the surface grinding device of the square silicon rod grinding equipment is located at the surface grinding location, and the range of the surface grinding location is the range occupied by the surface grinding device during the surface grinding operation; similarly, the angle grinding device of the square silicon rod grinding equipment is located at the angle grinding location, and the range of the angle grinding location is the range occupied by the angle grinding device during the angle grinding operation. The shape of the workpiece processing platform can be determined based on the machine base, or can be determined based on the processing requirements of the machine base, the surface grinding device, and the angle grinding device.

[0046] In one embodiment, a grinding guide rail 11 extending laterally is provided on the machine base 1. Figure 3 Combined with Figure 2 ,in, Figure 3Shown is a schematic structural diagram of a grinding guide rail in one embodiment of the present application. As shown in the figure, the grinding guide rail 11 includes a first section 111 and a second section 112. The first section 111 is used for horizontally placing square silicon rods A to be subjected to surface grinding operations, and the second section 112 is used for horizontally placing square silicon rods B to be subjected to angle grinding operations. The square silicon rods B are obtained after the surface grinding device 2 performs surface grinding operations on the four sides of the square silicon rods A. It should be understood that the length of the first section 111 is the distance that the horizontally placed square silicon rods A moves on the grinding guide rail 11 when performing surface grinding operations. Similarly, the length of the second section 112 is the distance that the horizontally placed square silicon rods B move on the grinding guide rail 11 when performing angle grinding operations.

[0047] In one example, if Figure 2 As shown, the grinding guide rail 11 is arranged on the transversely extending central axis of the machine base 1. Furthermore, the first section 111 is located at the proximal end of the grinding guide rail 11, and the second section 112 is located at the distal end of the grinding guide rail 11. This makes the force on the machine base 1 balanced, thereby improving the stability of the entire grinding equipment.

[0048] In one embodiment, if Figure 1 and Figure 2 As shown, a loading and conveying device 12 is also provided on the machine base 1. The loading and conveying device 12 is parallel to the first section 111 of the grinding guide rail 11 and is located at the proximal end of the machine base 1 for loading and conveying the square silicon rods to be ground.

[0049] See also Figure 4 , which is a schematic diagram of the structure of the feeding and conveying device in one embodiment of the present application. Figure 4 As shown, the loading and conveying device 12 includes a carrier 121 and a conveyor belt 122 arranged on the carrier for loading square silicon rods. The conveyor belt 122 can be configured as two rows of roller groups arranged on opposite sides of the carrier 121. The two rows of roller groups include a plurality of rollers arranged in sequence along the length of the carrier 121. Each roller can be connected to the carrier 121 through a bearing seat and protrude from the carrier 121. The rollers in the two rows of roller groups can form a supporting surface for supporting the square silicon rods. After the square silicon rods are placed horizontally on the two rows of roller groups of the carrier 121, the two rows of roller groups can be used to directly push the square silicon rods to transport the square silicon rods and complete the square silicon rod loading operation.

[0050] In some embodiments, the conveyor belt 122 also includes a square silicon rod pushing mechanism. The square silicon rod pushing mechanism can be used to push the square silicon rods to move on the two rows of rollers alone or in combination with manpower. In some embodiments, the square silicon rod pushing mechanism can also be configured as a chain drive mechanism, including an endless chain, an ejection member provided on the endless chain, and a chain drive unit for the movement of the endless chain. The ejection member may include an ejection block or an ejection rod, and the chain drive unit may include a drive gear meshed with the endless chain and a drive motor associated with the drive gear. In actual applications, the drive motor drives the drive gear to rotate, and the drive gear drives the endless chain and the ejection block or ejection rod thereon, and the moving ejection block or ejection rod pushes the square silicon rods to move along the endless chain.

[0051] In certain embodiments, in the two rows of roller groups, in the longitudinal direction, the rollers in the first row of roller groups and the rollers in the second row of roller groups are opposite to each other in pairs to form a roller pair, and the two rollers in a roller pair can be connected by a rotating shaft. The square silicon rod pushing mechanism includes a cascade chain drive mechanism, including multiple cascade chains and a drive motor. Specifically, the square silicon rod pushing mechanism is arranged on one side of the two rows of roller groups as the drive side, and the roller on the drive side in each roller pair is configured with a double drive gear. The cascade of all rollers in the two rows of roller groups is achieved by connecting two adjacent rollers in the longitudinal direction through a cascade chain (for example, a short circular chain) to the corresponding drive rack. The drive motor is also connected to the two rows of roller groups through a short circular chain and a drive gear. In actual application, the drive motor drives the drive gear to rotate, and drives all rollers in the two rows of roller groups to roll through the cascade chain, and drives the square silicon rod to move by virtue of the friction between the rollers and the square silicon rods. Compared with ordinary chain drive mechanisms, the cascade chain drive mechanism can generate greater power, and all rollers rotate synchronously, ensuring that the square silicon rods move more smoothly and steadily.

[0052] In order to transfer the square silicon rods from the loading area to the grinding area, in one embodiment, a first gantry 13 and a first manipulator 14 are provided on the machine base 1. Figure 5 Combined with Figure 1 ,in, Figure 5 Shown is a schematic diagram of the structure of the first gantry and the first manipulator in one embodiment of the present application, as shown in FIG. Figure 1 and Figure 5As shown, the first gantry 13 is disposed on opposite sides of the grinding guide rail 11 and the loading and conveying device 12. The first manipulator 14 is disposed on the first gantry 13 and is capable of longitudinal and vertical movement. It is used to grip the square silicon ingot from opposite sides and transfer it from the loading and conveying device 12 to the grinding carriage 21. The specific structure and function of the grinding carriage 21 can be found in the description of the subsequent embodiments and will not be repeated here.

[0053] exist Figure 5 In the illustrated embodiment, the first manipulator 14 includes a first clamp 141, a second clamp 142, a clamp seat, and a clamp driving mechanism. The first clamp 141 and the second clamp 142 are provided at opposite ends of the clamp seat, and are used to clamp the square silicon rod from opposite sides of the square silicon rod. The clamp driving mechanism is used to drive at least one of the first clamp 141 and the second clamp 142 to move to adjust the clamping distance between the two clamps. In certain embodiments, the clamp driving mechanism may include: a screw rod, which is arranged in the longitudinal direction and is associated with at least one of the first clamp 141 and the second clamp 142; and a driving source, which is used to drive the screw rod to rotate so that the associated at least one clamp moves along the length direction of the clamp seat.

[0054] In certain embodiments, the clamp drive mechanism may include a bidirectional screw and a drive source. The bidirectional screw is disposed longitudinally and is associated with the first clamp 141 and the second clamp 142 at both ends of the clamp base. The drive source is configured to drive the bidirectional screw to rotate, thereby causing the first clamp 141 and the second clamp 142 to move toward or away from each other longitudinally. The clamp drive mechanism is not limited to this and may also employ a telescopic rod and a drive cylinder or a drive hydraulic cylinder.

[0055] In order to realize the lifting and lowering movement of the first manipulator 14 on the first gantry 13, and further realize the extraction or placement of the square silicon rod clamped by the first clamp 141 and the second clamp 142 in the loading area or the grinding area, the first manipulator 14 also includes a transport lifting mechanism, which is used to drive the first clamp 141 and the second clamp 142 to move up and down in the vertical direction on the first gantry 13.

[0056] In some embodiments, the transport lifting mechanism may include a transport lifting guide rail and a transport lifting drive unit, wherein the transport lifting guide rail is provided on the first gantry 13 in a vertical direction, and the transport lifting drive unit may include a transport lifting screw and a transport lifting motor, wherein the transport lifting screw is associated with the clamping seat. The transport lifting motor and the transport lifting screw can be used to drive the first clamp 141 and the second clamp 142 provided on the clamping seat to move vertically up and down along the transport lifting guide rail. For example, the transport lifting motor drives the transport lifting screw to rotate forward, driving the transport clamp to move vertically upward along the transport lifting guide rail; the transport lifting motor drives the transport lifting screw to rotate backward, driving the transport clamp to move vertically downward along the transport lifting guide rail. In some embodiments, the transport lifting mechanism may include a transport lifting guide rail, a transport lifting slider, and a transport lifting drive unit.

[0057] In order to realize the longitudinal movement of the first manipulator 14 on the first gantry 13, and then cooperate with the lifting movement of the first manipulator 14 to realize the transportation of the clamped square silicon rod between the loading area and the grinding area, the first gantry 13 may be provided with a longitudinal guide rail extending longitudinally, and correspondingly, the first manipulator 14 is provided with a longitudinal translation slider, and the longitudinal translation slider is arranged on the clamping seat and corresponds to the longitudinal guide rail. In some embodiments, the transport mechanism also includes a transport translation drive unit, and the transport translation drive unit may include: a transport translation rack, a transport translation gear and a transport translation drive motor, the transport translation rack is longitudinally arranged on the first gantry 13, the transport translation gear is arranged on the clamping seat and meshes with the transport translation rack, and the transport translation drive motor is used to drive the transport translation gear to rotate so that the associated clamping seat moves along the transport translation rack, thereby realizing the longitudinal movement of the first clamp 141 and the second clamp 142 clamping the square silicon rod. For example, the workpiece translation drive motor drives the workpiece translation gear to rotate forward, driving the first clamp 141 and the second clamp 142 to move longitudinally along the workpiece translation rack toward the grinding area; the workpiece translation drive motor drives the workpiece translation gear to rotate reversely, driving the first clamp 141 and the second clamp 142 to move longitudinally along the workpiece translation rack toward the loading area.

[0058] In some embodiments, the workpiece translation drive unit may include a workpiece translation screw and a workpiece translation drive motor, wherein the workpiece translation screw is arranged longitudinally and associated with the clamping seat, and the workpiece translation drive motor is associated with the workpiece translation screw. The workpiece translation drive motor is used to drive the workpiece translation screw to rotate forward and reverse to drive the clamping seat to move longitudinally along the workpiece translation guide rail, thereby realizing the longitudinal movement of the first clamp 141 and the second clamp 142 clamping the square silicon rod. For example, the workpiece translation drive motor drives the workpiece translation screw to rotate forward, and drives the first clamp 141 and the second clamp 142 to move longitudinally along the workpiece translation guide rail toward the grinding area; the workpiece translation drive motor drives the workpiece translation screw to reverse, and drives the first clamp 141 and the second clamp 142 to move longitudinally along the workpiece translation guide rail toward the loading area.

[0059] In order to adjust the square silicon rod so that the first clamp 141 and the second clamp 142 clamp the center positions of the two side surfaces of the square silicon rod, in one embodiment, the first manipulator 14 is further provided with a centering mechanism for determining the axis of the clamped square silicon rod.

[0060] The centering mechanism may include, for example, a first centering chuck, a second centering chuck, and a centering drive mechanism, wherein the first centering chuck is adjacent to the first clamp 141, and the second centering chuck is adjacent to the second clamp 142. The first centering chuck and the second centering chuck are symmetrically arranged to clamp the opposite sides of the two side surfaces of the square silicon rod. The centering drive mechanism is used to drive at least one of the first centering chuck and the second centering chuck to move longitudinally to adjust the spacing between the first centering chuck and the second centering chuck, respectively, and thereby adjust the axial position of the first clamp 141 and the second clamp 142 clamped on the square silicon rod.

[0061] In one embodiment, the centering drive mechanism may include: a screw and a drive source, the screw being arranged along the longitudinal direction and associated with at least one of the first centering chuck and the second centering chuck; the drive source being used to drive the screw to rotate so that the associated at least one centering chuck moves along the longitudinal direction.

[0062] In another embodiment, the centering drive mechanism may include a bidirectional screw and a drive source, the bidirectional screw being disposed longitudinally and associated with the first and second centering chucks at opposite ends of the chuck seat; the drive source being configured to drive the bidirectional screw to rotate so as to cause the first and second centering chucks to move toward or away from each other longitudinally. The centering drive mechanism is not limited to this embodiment and may also employ a telescopic rod and a drive cylinder or a drive hydraulic cylinder.

[0063] In certain embodiments of the present application, the centering mechanism further includes a sensor, which is associated with the centering drive mechanism. When the sensor detects that the clamping axes of the first clamp 141 and the second clamp 142 deviate from the axis of the square silicon rod, the centering drive mechanism adjusts the positions of the first centering clamp and the second centering clamp in the longitudinal direction, and then adjusts the clamping positions of the first clamp 141 and the second clamp 142 on the opposite sides of the square silicon rod, and finally makes the first clamp 141 and the second clamp 142 clamped at the axis position of the square silicon rod.

[0064] In one embodiment, if Figure 2 As shown, the surface grinding device 2 is correspondingly disposed in the first section 111 and is used to perform surface grinding operations on the square silicon ingot A. The surface grinding device 2 includes a surface grinding carrier 21, a first surface grinding spindle 22, and a second surface grinding spindle 23. The surface grinding carrier 21 is used to clamp the two ends of the square silicon ingot A and can move laterally along the grinding guide 11. The first surface grinding spindle 22 and the second surface grinding spindle 23 are respectively disposed on opposite sides of the grinding guide 11 to perform surface grinding operations on the square silicon ingot A.

[0065] In one embodiment, see Figure 6 , which is a schematic diagram of the structure of a grinding carrier in one embodiment of the present application. As shown in the figure, the grinding carrier 21 includes a first clamping component 212 and a second clamping component 213. The first clamping component 212 and the second clamping component 213 are opened and closed along the length direction of the square silicon rod A to clamp the two ends of the square silicon rod A. Figure 6 In the example shown, the grinding surface carrier 21 further includes a grinding surface bearing seat 211 .

[0066] The grinding surface support seat 211 can be laterally movably arranged in the first section 111 of the grinding guide rail 11, and includes a support structure 2111 for supporting the square silicon rod A to perform grinding operations under the operation of the first grinding surface spindle 22 and the second grinding surface spindle 23. In some embodiments, the grinding surface support seat 211 is provided with a plurality of support blocks of the same height, and the top surfaces of the plurality of support blocks form a horizontal bottom support surface for supporting the square silicon rod A to perform grinding operations. In some embodiments, the grinding surface support seat 211 also includes a slider and a bearing drive assembly, the slider is provided at the bottom of the grinding surface support seat 211 and is adapted to the grinding guide rail 11, and the bearing drive assembly is used to drive the grinding surface support seat 211 to move laterally along the first section 111.

[0067] In some implementations, the bearing drive assembly may further include a screw and a bearing drive motor, wherein the screw is connected to the grinding surface bearing seat 211 in the transverse direction, and the bearing drive motor (the bearing drive motor may be, for example, a servo motor) is connected to the screw. In this way, the bearing drive motor drives the screw to rotate, thereby enabling the grinding surface bearing seat 211 to move laterally along the first section 111. The implementation of the bearing drive assembly is not limited to this, and other components that can drive the grinding surface bearing seat 211 to move laterally along the first section 111 and thereby drive the first clamping assembly 212 and the second clamping assembly 213 to move laterally are still applicable. For example, the bearing drive assembly may include a rack, a drive gear meshing with the rack, and a drive motor that drives the drive gear to rotate.

[0068] The first clamping assembly 212 and the second clamping assembly 213 may have the same configuration. Taking the first clamping assembly 212 as an example, Figure 6 As shown, the first clamping assembly 212 includes a clamping structure 2121, which is vertically arranged on the supporting structure 2111 and is used to contact the end face of the proximal end of the square silicon rod A. In some embodiments, the clamping structure 2121 is further provided with an elastic element such as a rubber pad, which can be attached to the end face of the square silicon rod A, and play a buffering role while clamping the square silicon rod A to prevent damage to the silicon rod. Figure 6 In the example shown, four clamping structures 2121 are provided. The four clamping structures 2121 are located on the same plane to form a stable support for the square silicon rod A. Of course, any number of the clamping structures 2121 can be configured, and this application does not impose any limitation on this.

[0069] In one embodiment, the widths of the supporting structure 2111 and the pressing structure 2121 of the first clamping assembly 212 or the second clamping assembly 213 on opposite sides are smaller than the widths of the opposite sides of the square silicon rod A. That is, the widths of the supporting structure 2111 and the pressing structure 2121 in the longitudinal direction are smaller than the width of the square silicon rod A. It should be understood that the square silicon rod A, clamped by the first clamping assembly 212 and the second clamping assembly 213, moves laterally on the first section 111 of the grinding guide rail 11, so that the square silicon rod A is ground under the operation of the first grinding spindle 22 and the second grinding spindle 23. During this process, the first clamping assembly 212 and the second clamping assembly 213 should be prevented from interfering with the first grinding spindle 22 and the second grinding spindle 23 to avoid mechanical collision and thus damage to the equipment.

[0070] In one embodiment, the first clamping assembly 212 and the second clamping assembly 213 may include a clamping drive unit 2122, which is used to drive the first clamping assembly 212 and the second clamping assembly 213 to open and close along the length direction of the square silicon rod A to clamp the square silicon rod A.

[0071] In one example, the clamping drive unit 2122 may include a clamping translation screw 21221 and a clamping translation drive motor 21222. The clamping translation screw 21221 is connected to the first clamping assembly 212 and the second clamping assembly 213 along the length direction of the square silicon rod A. The clamping translation drive motor 21222 is associated with the clamping translation screw 21221. The clamping translation drive motor 21222 drives the clamping translation screw 21221 to rotate forward and reverse, thereby realizing the opening and closing movement of the first clamping assembly 212 and the second clamping assembly 213 along the length direction of the square silicon rod A. For example, the clamping translation drive motor 21222 drives the clamping translation screw 21221 to rotate forward, driving the first clamping component 212 and the second clamping component 213 to move relative to each other along the length direction of the square silicon rod A along the clamping translation screw 21221; the clamping translation drive motor 21222 drives the clamping translation screw 21221 to reverse, driving the first clamping component 212 and the second clamping component 213 to move away from each other along the clamping translation screw 21221.

[0072] In another example, the clamping drive unit may include: a clamping translation rack, a clamping translation gear, and a clamping translation drive motor, wherein the clamping translation rack is arranged on the first clamping component 212 and the second clamping component 213 along the length direction of the square silicon rod A, the clamping translation gear is engaged with the clamping translation rack, and the clamping translation drive motor is used to drive the clamping translation gear to rotate so that the associated first clamping component 212 and the second clamping component 213 move along the clamping translation rack, thereby realizing the opening and closing movement of the first clamping component 212 and the second clamping component 213 along the length direction of the square silicon rod A. For example, the clamping translation drive motor drives the clamping translation gear to rotate forward, driving the first clamping component 212 and the second clamping component 213 to move relative to each other along the clamping translation rack along the length direction of the square silicon rod A; the clamping translation drive motor drives the clamping translation gear to rotate reversely, driving the first clamping component 212 and the second clamping component 213 to move oppositely along the clamping translation rack along the length direction of the square silicon rod A.

[0073] like Figure 2 As shown, the square silicon rod A moves laterally from the proximal end to the distal end along the first section 111 of the grinding guide 11 under the support of the grinding carrier 21, and then performs a pair of side grinding operations through the first grinding spindle 22 and the second grinding spindle 23 of the grinding device 2. At this time, the first grinding spindle 22 and the second grinding spindle 23 can be fixed to the machine base 1, and the square silicon rod A moves laterally under the drive of the grinding carrier 21.

[0074] In one embodiment, the grinding device 2 further includes a grinding tool mounting seat and a grinding tool advance and retreat mechanism. The grinding tool mounting seat is used to mount a first grinding surface spindle 22 and a second grinding surface spindle 23. Here, the specific structure of the grinding tool mounting seat can be set in different forms based on the layout requirements of the grinding tool, such as a beam body, a plate frame, etc. In one embodiment, the first grinding surface spindle 22 and the second grinding surface spindle 23 are mounted on the grinding tool mounting seat, or are mounted on the grinding tool mounting seat via a bracket, a connecting plate, or a mounting frame. Here, the carriers used to mount the first grinding surface spindle 22 and the second grinding surface spindle 23 can be of different forms, and this application does not impose any restrictions.

[0075] The grinding tool advance and retreat mechanism is used to drive at least one of the first grinding surface spindle 22 and the second grinding surface spindle 23 to move longitudinally along the feed direction to adjust the relative distance between the first grinding surface spindle 22 and the second grinding surface spindle 23 in the longitudinal direction, thereby controlling the feed amount during the grinding process, that is, determining the grinding amount. According to the grinding requirements, the grinding tool advance and retreat mechanism drives at least one of the first grinding surface spindle 22 and the second grinding surface spindle 23 or both grinding surface spindles to move a predetermined distance in the longitudinal direction to adjust the feed amount. In this way, the grinding surface carrier 21 drives the square silicon rod A to move horizontally and contact the grinding device 2 and feed relative to it to achieve grinding of the square silicon rod A.

[0076] In certain implementations, the first grinding spindle 22 and the second grinding spindle 23 are equipped with a grinding tool advance and retreat mechanism, which includes a sliding guide rail, a drive motor, and a ball screw (not shown). The sliding guide rail is longitudinally arranged on the grinding station, and the bottom of the grinding spindle is provided with a longitudinal guide groove that cooperates with the sliding guide rail. The ball screw is arranged along the sliding guide rail and is connected to the drive motor shaft. In one embodiment of the present application, the at least one grinding spindle is equipped with the drive motor and the ball screw, and the relative distance between the first grinding spindle 22 and the second grinding spindle 23 is changed by moving one of the first grinding spindle 22 and the second grinding spindle 23 that are arranged relatively to each other.

[0077] In one embodiment of the present application, the first grinding spindle 22 and the second grinding spindle 23 are both equipped with the drive motor and the ball screw, and the drive motor can separately control the longitudinal position of the corresponding first grinding spindle 22 or the second grinding spindle 23 or, based on a certain cooperative relationship, make the two grinding spindles move away from or approach each other at the same linear speed. For example, during the grinding process, the first grinding spindle 22 and the second grinding spindle 23 feed the other silicon rod A toward each other at the same speed in the longitudinal direction to grind a pair of side surfaces.

[0078] In one embodiment, the end surfaces of the first and second grinding spindles 22, 23 of the surface grinding device 2 are each provided with a fine grinding wheel and a coarse grinding wheel that is retractably mounted within the fine grinding wheel. In one example, the coarse grinding wheel is concentrically positioned with the fine grinding wheel on the spindle end surfaces and longitudinally spans opposite sides of the first section 111. This arrangement makes the surface grinding device 2 more compact.

[0079] The second grinding spindle 23 can be configured similarly to the first grinding spindle 22. For example, the first grinding spindle 22 can include a first drive shaft (bushing) having a cylindrical structure and a second drive shaft housed within the cylindrical structure. The bushing is connected to the fine grinding wheel so that when the bushing rotates, the fine grinding wheel is driven to connect. The second drive shaft is connected to the coarse grinding wheel so that when the second drive shaft rotates, the coarse grinding wheel is driven to connect. Based on the first grinding spindle 22, the grinding device 2 performs its grinding operation in the following manner: when rough grinding of the other silicon rod A is required, the second drive shaft is moved axially, causing the coarse grinding wheel to extend outward from the fine grinding wheel, allowing the coarse grinding wheel to reach the grinding position. Rotation of the second drive shaft then drives the coarse grinding wheel to rotate. When fine grinding of the other silicon rod A is required, the second drive shaft is retracted and extended to position the coarse grinding wheel so that it does not interfere with the fine grinding wheel, allowing the fine grinding wheel to reach the grinding position. Rotation of the first drive shaft then drives the fine grinding wheel to rotate.

[0080] In another embodiment, the coarse grinding wheel and the fine grinding wheel are arranged concentrically, and the fine grinding wheel is nested within the coarse grinding wheel. In certain implementations, the first grinding spindle 22 further includes a first transmission shaft (sleeve) having a cylindrical structure and a second transmission shaft housed within the cylindrical structure. The sleeve is connected to the coarse grinding wheel so that when the sleeve rotates, the coarse grinding wheel is driven to connect, and the second transmission shaft is connected to the fine grinding wheel so that when the second transmission shaft rotates, the fine grinding wheel is driven to connect. Based on the first grinding spindle 22, the grinding device 2 performs its grinding operation by: when fine grinding of the other silicon rod A is required, the second transmission shaft is moved along its axial direction, so that the fine grinding wheel extends out of the coarse grinding wheel, causing the fine grinding wheel to reach the grinding position, thereby driving the fine grinding wheel to rotate by rotating the second transmission shaft. When rough grinding of the other silicon rod A is required, the second transmission shaft is extended and retracted to position the fine grinding wheel so that it does not interfere with the coarse grinding wheel, causing the coarse grinding wheel to reach the grinding position, thereby driving the coarse grinding wheel to rotate by rotating the first transmission shaft.

[0081] In certain embodiments of the present application, the coarse grinding wheel is circular and has a through hole in the middle. The coarse grinding wheel is formed by consolidating abrasive grains and a binder to form a surface with an abrasive portion that rotates in contact with the surface of the square silicon rod A to be ground. The coarse grinding wheel has a certain abrasive grain size and abrasive grain density, and there are pores in the coarse grinding wheel. The abrasive of the coarse grinding wheel can be set to abrasive grains such as aluminum oxide, silicon carbide, diamond cubic boron nitride, etc., whose hardness is greater than the hardness of the material of the square silicon rod A, according to the needs of grinding the square silicon rod A. The abrasive size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the general configuration of the remaining grinding wheels is basically the same as that of the coarse grinding wheel.

[0082] In certain other embodiments, the surface grinding device 2 further includes a cooling device to cool the rough grinding wheel and the fine grinding wheel, thereby reducing surface damage to the square silicon rod A during grinding and improving the grinding efficiency and service life of the grinding wheel. In one implementation, the cooling device includes a cooling water pipe, a diversion groove, and a diversion hole.

[0083] In another embodiment, a protective cover for the rotating drive motor for cooling water entering the grinding wheel is provided on the outer circumference of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The guide groove is provided on the protective cover, serving as the contact point between the protective cover and the cooling water pipe, and the guide hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source. The cooling water is sucked through the cooling water pipe to the guide groove and guide hole on the surface of the grinding wheel, and is guided directly to the contact surface between the grinding wheel and the square silicon rod A being ground for cooling. During the grinding of the grinding wheel, the cooling water from the guide hole of the grinding wheel is centrifugally cooled to the interior of the grinding wheel for sufficient cooling.

[0084] In one embodiment, a detection device is provided at the distal ends of the first and second grinding spindles 22, 23. The detection device is used to detect the flatness of the square silicon ingot A undergoing grinding in real time. In one implementation, the detection device is associated with the grinding device and calculates the remaining number of machining operations based on the flatness of the top surface of the square silicon ingot A. When the remaining number of machining operations reaches zero, the detection device controls the corresponding grinding spindle of the grinding device to stop operation and longitudinally move away from the square silicon ingot A via the grinding tool advance and retract mechanism, thereby completing the grinding of a pair of side surfaces.

[0085] Please combine Figures 2 to 6 The square silicon rod A is transported to the loading area through the loading conveyor 12. The first clamp 141 and the second clamp 142 of the first manipulator 14 clamp the square silicon rod A and move up and down along the first gantry 13 to pick it up from the loading area. Then, the first manipulator 14 clamps the square silicon rod A and moves longitudinally along the first gantry 13 to transport it to the proximal end of the grinding area.

[0086] When the grinding device 2 is used to perform the grinding operation on a pair of side surfaces of the square silicon rod A located at the grinding station, the grinding carrier 21 drives the square silicon rod A to move laterally from the proximal end to the distal end along the first section 111 of the grinding guide 11. During this process, the first grinding spindle 22 and the second grinding spindle 23 of the grinding device 2 enter the grinding position under the drive of the grinding tool advance and retreat mechanism. The rough grinding wheel rotates at high speed around the transmission shaft and extends. The grinding carrier 21 drives the square silicon rod A to move from the proximal end to the distal end of the first section 111. The distal end of the side surface of the square silicon rod A contacts the rough grinding wheel for rough grinding. As the square silicon rod A moves from the proximal end to the distal end of the first section 111 until it completely passes through the rough grinding wheel, the two rough grinding wheels of the side grinding device complete the rough grinding of the two side surfaces of the square silicon rod A. At this time, the coarse grinding wheel retracts along the drive shaft to its initial position, allowing the fine grinding wheel to extend / protrude relative to the coarse grinding wheel and to be in a position where it does not interfere with the fine grinding wheel. Driven by the grinding surface carrier 21, the square silicon rod A moves from the distal end toward the proximal end of the first section 111131. During this movement, the proximal end of the side surface of the square silicon rod A first contacts the fine grinding wheel. When the square silicon rod A moves from the distal end to the proximal end of the first section 111 and completely passes through the fine grinding wheel, the two fine grinding wheels of the side grinding device complete the fine grinding of the two side surfaces of the square silicon rod A. In this way, the grinding operation of a pair of side surfaces of the square silicon rod A is completed.

[0087] As mentioned above, after the grinding operation is completed on one pair of side surfaces of the square silicon rod A, the grinding operation needs to be performed on the other pair of side surfaces. In order to switch the one pair of side surfaces of the square silicon rod A to the other pair of side surfaces to continue the grinding operation on the other pair of side surfaces, in one embodiment, Figure 2 As shown, a turning mechanism 24 is provided on the second side of the machine base 1 , and the turning mechanism 24 corresponds to the first section 111 of the grinding guide rail 11 .

[0088] See also Figure 7 , which is a schematic diagram of the structure of the flip mechanism in one embodiment of the present application. Figure 7 As shown, the flipping mechanism 24 includes a flip frame 241, which is disposed on the second side of the base 1 and includes a frame body 2411 and a fork arm structure 2412. The fork arm structure 2412 is disposed on the frame body 2411 via a flip shaft 2413 for forking and flipping the square silicon ingots A. In some examples, the frame body 2411 provides stable support for the square silicon ingots A. The material of the frame body 2411 includes, but is not limited to, high-strength materials such as stainless steel, cast iron, and carbon structural steel.

[0089] Furthermore, the fork arm structure 2412 includes a longitudinal fork arm 24121 and a vertical fork arm 24122. Figure 7In the example shown, the longitudinal fork arm 24121 extends along the longitudinal direction of the machine base 1, and the vertical fork arm 24122 extends along the vertical direction of the machine base 1, and an "L"-shaped support space that can accommodate the square silicon rod A is formed between the longitudinal fork arm 24121 and the vertical fork arm 24122. In some examples, support members are also provided on the longitudinal fork arm 24121 and the vertical fork arm 24122, and the support members are used to enable the fork arm structure 2412 to stably support the square silicon rod A during the flipping process, and prevent the square silicon rod A from detaching from the fork arm structure 2412 during the flipping process. The material of the support member includes but is not limited to materials with a high friction coefficient such as rubber and polyurethane. In some examples, the connection method of the longitudinal fork arm 24121 and the vertical fork arm 24122 includes but is not limited to welding, mortise and tenon connection or one-piece molding.

[0090] In one embodiment, the flipping mechanism 24 includes a flipping drive mechanism 242, which is disposed between the frame body 2411 and the flipping shaft 2413 and is used to drive the flipping shaft 2413 to flip 90 degrees, thereby driving the square silicon rod A carried by the fork arm structure 2412 to flip. Figure 8 Combined with Figure 7 ,in, Figure 8 The diagram shows the state of the flip mechanism after turning over in one embodiment of the present application. Figure 7 and Figure 8 As shown, after the flip mechanism 24 flips 90 degrees counterclockwise around the flip axis 2413, the longitudinal fork arm 24121 is Figure 7 The vertical direction in the Figure 8 The vertical fork arm 24122 extends along the vertical direction of the machine base 1. Figure 7 The vertical direction in is flipped to Figure 8 The first manipulator 14 extends along the longitudinal direction of the machine base 1. It should be understood that the first manipulator can only grip the square silicon ingot A in the longitudinal direction. After grinding one pair of side surfaces of the square silicon ingot A, the first manipulator 14 grips the pair of side surfaces along the longitudinal direction after grinding. If the other pair of side surfaces of the square silicon ingot A are to be ground, the other pair of side surfaces need to be flipped from the vertical direction to the longitudinal direction, and then re-gripped by the first manipulator 14 and fed into the first section 111 for grinding.

[0091] In one embodiment, the flip drive mechanism 242 can be configured as a cylinder with a telescopic rod, which drives the telescopic rod to perform telescopic movement, thereby driving the longitudinal fork arm 24121 and the vertical fork arm 24122 to perform a 90° flip around the flip axis 2413. For example, when the cylinder drives the telescopic rod to perform a contraction movement, the contracted telescopic rod pulls the fork arm structure 2412, thereby driving the longitudinal fork arm 24121 and the vertical fork arm 24122 to perform a 90° flip counterclockwise around the flip axis 2413, presenting the following: Figure 8 When the cylinder drives the telescopic rod to extend, the extended telescopic rod pushes the fork arm structure 2412, thereby driving the longitudinal fork arm 24121 and the vertical fork arm 24122 to flip 90 ° clockwise with the flip axis 2413 as the axis, so as to once again present the Figure 7 The status shown.

[0092] In one embodiment, a buffer member may be provided at the contact point between the frame body 2411 and the fork arm structure 2412 to absorb the impact of the fork arm structure 2412 on the frame body 2411 after the fork arm structure 2412 completes its flipping motion, thereby preventing mechanical damage to the flip frame 2411 and ensuring the service life of the grinding device. In some examples, the material of the buffer member includes, but is not limited to, elastic materials such as rubber, silicone, and polyurethane.

[0093] In one embodiment, the flipping mechanism 24 includes a longitudinal guide rail and a forward / backward drive mechanism. The longitudinal guide rail is disposed longitudinally on the second side of the machine base 1 and is used to support a flipping frame 241. The forward / backward drive mechanism is used to drive the flipping frame 241 forward and backward relative to the grinding guide rail 11 along the longitudinal guide rail. Specifically, the longitudinal guide rail can be disposed longitudinally on the second side of the machine base 1. Accordingly, a slider that mates with the longitudinal guide rail can be disposed at the bottom of the frame body 2411 of the flipping mechanism 24. The forward / backward drive mechanism can include a longitudinal rack, a drive gear, and a gear drive motor. The longitudinal rack can be disposed parallel to the longitudinal guide rail, the drive gear meshing with the longitudinal rack, and the gear drive motor is associated with the drive gear and can be disposed on the frame body 2411 of the flipping mechanism 24. The gear drive motor rotates the connected drive gear, which, through the meshing of the drive gear with the longitudinal rack, drives the flipping mechanism 24 to move longitudinally on the longitudinal guide rail 441.

[0094] In other embodiments, the advance and retreat drive mechanism may include: a movable screw and a drive motor, wherein the movable screw is arranged in the longitudinal direction and is associated with the frame body 2411 of the flipping mechanism 24, and the drive motor is used to drive the movable screw to rotate so that the associated flipping mechanism 24 moves in the longitudinal direction on the longitudinal guide rail. Of course, the advance and retreat drive mechanism can still be modified in other ways. For example, in some other embodiments, the advance and retreat drive mechanism includes a chain conveyor mechanism or a conveyor belt mechanism.

[0095] When the grinding operation is completed on one pair of side surfaces of the square silicon rod A and the grinding operation is required on the other pair of side surfaces, the first clamp 141 and the second clamp 142 of the first manipulator 14 clamp the square silicon rod A and move up and down along the first gantry 13 to clamp it from the first section 111. Then, the first manipulator 14 clamps the square silicon rod A and moves longitudinally along the first gantry 13 to transport it to the fork arm structure 2412 of the flipping mechanism 24 to present the square silicon rod A as shown in FIG. Figure 7 At this point, the pair of side surfaces along the longitudinal direction of the fork arm structure 2412 have been ground, while the other pair of side surfaces to be ground are located in the vertical direction. Next, the flipping mechanism 24, under the action of the driving mechanism 242, drives the longitudinal fork arm 24121 and the vertical fork arm 24122 to flip 90 degrees counterclockwise around the flip axis 2413, so as to present the following state: Figure 8 The state shown. At this time, the other pair of side surfaces to be ground are flipped from the vertical direction to the longitudinal direction, and the first manipulator 14 clamps the other pair of side surfaces to be ground in the longitudinal direction of the square silicon rod A, and places them on the grinding carrier 21 at the proximal end of the first section 111. The other pair of side surfaces repeats the grinding process of the pair of side surfaces that have completed the grinding operation. In short, driven by the grinding carrier 21, it moves from the proximal end to the distal end of the first section 111 to complete a rough grinding, and then moves from the distal end to the proximal end of the first section 111 to complete a fine grinding. In this way, the grinding operation of the four side surfaces of the square silicon rod A has been completed, forming a square silicon rod B. Thereafter, the first grinding spindle 22 and the second grinding spindle return to the grinding position, and the square silicon rod B moves again from the proximal end to the distal end of the first section 111, waiting to be transferred from the grinding area to the angle grinding area, and then the angle grinding device 3 of the present application performs the angle grinding operation on the square silicon rod B.

[0096] In order to transfer the square silicon rod B from the surface grinding area to the angle grinding area, in one embodiment, as shown in FIG. Figure 1As shown, a second gantry 15 is provided on the machine base 1. The second gantry 15 is laterally arranged between the first section 111 and the second section 112 of the grinding guide rail 11, and longitudinally arranged on the second section 112 of the grinding guide rail 11. Furthermore, a second manipulator 16 is provided on the second gantry 15. The second manipulator 16 can move laterally, longitudinally, and up and down on the second gantry 15 to transfer the square silicon rod B from the surface grinding carrier 21 to the angle grinding carrier 31, or from the angle grinding carrier 31 to the unloading conveying device. The specific structure and function of the angle grinding carrier 31 and the unloading conveying device can be found in the description of the subsequent embodiments and will not be repeated here.

[0097] It should be understood that the second manipulator 16 can perform lifting and lowering movements on the second gantry 15 to clamp or release the square silicon rod B from various positions, and can perform horizontal movements on the second gantry 15 to transfer the square silicon rod B from the surface grinding position to the angle grinding position, and can perform longitudinal movements on the second gantry 15 to transfer the square silicon rod B from the angle grinding position to the unloading position.

[0098] Since the four sides of the square silicon rod B have reached a very high degree of flatness after the rough grinding and fine grinding in the previous grinding process, the side of the square silicon rod B can be extracted by vacuum or negative pressure adsorption during the subsequent chamfering or rounding operation. Figure 9 , which is a schematic diagram of the structure of the second manipulator in one embodiment of the present application, as shown in FIG. Figure 9 As shown, the second robot 16 includes a suction cup assembly 161 , and the suction cup assembly 161 is used to suck the square silicon rod B from the top surface. Furthermore, the second robot 16 may also include a transport base 162 and a transport drive mechanism 163 .

[0099] In one embodiment, a suction cup assembly 161 is fixed to the end of the robotic arm 522 and is used to absorb the top surface of the workpiece. In one implementation, the suction cup assembly 161 includes an air source and a suction cup body. The air source is connected to the suction cup body via an air pipe, and is used to control the suction cup body to generate a predetermined pressure to absorb or release the other silicon rod B. In actual applications, the air source can be, for example, a vacuum pump.

[0100] In one embodiment, the workpiece carrier 162 is used to achieve lateral movement of the second manipulator 16 on the second gantry 15. To this end, a transverse guide rail extending laterally is provided on the second gantry 15. To match this, a transverse translation slider is provided on the second manipulator 16. The transverse translation slider is provided on the workpiece carrier 162 and corresponds to the transverse guide rail. In some embodiments, the workpiece drive mechanism 163 may include: a workpiece translation rack, a workpiece translation gear, and a workpiece translation drive motor. The workpiece translation rack is laterally arranged on the second gantry 15. The workpiece translation gear is provided on the workpiece carrier 162 and meshes with the workpiece translation rack. The workpiece translation drive motor 524 is used to drive the workpiece translation gear to rotate so that the associated workpiece carrier 162 moves along the workpiece translation rack, thereby achieving lateral movement of the second manipulator 16. For example, the workpiece translation drive motor drives the workpiece translation gear to rotate forward, driving the second manipulator 16 to move laterally to the left along the workpiece translation rack; the workpiece translation drive motor drives the workpiece translation gear to rotate reversely, driving the second manipulator 16 to move laterally to the right along the workpiece translation rack.

[0101] In one embodiment, to enable longitudinal movement of the second manipulator 16 along the second gantry 15, a longitudinal guide rail may be provided on the second gantry 15. Accordingly, a longitudinal translation slider may be provided on the second manipulator 16. The specific implementation of longitudinal movement can be found in the previous description and will not be repeated here.

[0102] In one embodiment, to enable the second manipulator 16 to move up and down along the second gantry 15, a lifting guide rail may be provided on the second gantry 15. Accordingly, a lifting and translation slider may be provided on the second manipulator 16. The specific implementation of its vertical movement can be found in the previous description and will not be repeated here.

[0103] As mentioned above, after the surface grinding device 2 completes the surface grinding operation on the four sides of the square silicon rod A to form the square silicon rod B, the second manipulator 16 moves laterally along the second gantry 15 to transfer the square silicon rod B from the surface grinding area to the angle grinding area, and then the angle grinding device 3 performs the angle grinding operation.

[0104] The angle grinding device 3 provided in this application is correspondingly arranged in the second section 112, and is used to grind the edges of the opposite sides of the silicon rod B. Figure 1In the illustrated embodiment, the angle grinding device 3 of the present application includes an angle grinding carrier 31, a first angle grinding spindle 32, and a second angle grinding spindle 33. The angle grinding carrier 31 is mounted on the grinding guide 11 and can move laterally along the grinding guide 11 to laterally support the square silicon ingot B to be ground. The first angle grinding spindle 32 and the second angle grinding spindle 33 are respectively mounted on opposite sides of the grinding guide 11 to perform angle grinding operations on opposite edges of the square silicon ingot B.

[0105] In one embodiment, see Figure 10 , which shows a schematic diagram of the structure of an angle grinding carrier according to one embodiment of the present application. As shown, the angle grinding carrier 31 includes a pair of opposing bearing seats, each of which is provided with a rocking mechanism 311 for laterally supporting the square silicon rod B and driving the square silicon rod B in directional and rocking motion. For ease of description, the opposing pair of bearing seats will be referred to as the first bearing seat 312 and the second bearing seat 313, respectively. The first bearing seat 312 and the second bearing seat 313 will not be further described in subsequent embodiments.

[0106] In one embodiment, if Figure 3 and Figure 10 As shown, the first support seat 312 and the second support seat 313 are laterally movable and disposed in the second section 112 of the grinding guide rail 11, and are used to support the square silicon rod B during the grinding operation under the operation of the first and second grinding spindles 32 and 33. In certain embodiments, the first and second support seats 312 and 313 further include a slider and a grinding drive assembly. The slider is disposed at the bottom of the first and second support seats 312 and 313 and is adapted to the grinding guide rail 11. The grinding drive assembly is used to drive the first and second support seats 312 and 313 to move laterally along the second section 112.

[0107] In certain implementations, the angle grinding drive assembly may further include a screw 314 and an angle grinding drive motor 315, wherein the screw 314 is connected to the first support seat 312 and the second support seat 313 along the transverse direction, and the angle grinding drive motor 315 (the angle grinding drive motor 315 may be, for example, a servo motor) is connected to the screw 314. In this way, the screw 314 is driven to rotate by the angle grinding drive motor 315, thereby enabling the first support seat 312 and the second support seat 313 to move transversely along the second section 112. The implementation of the angle grinding drive assembly is not limited to this, and other components that can drive the first support seat 312 and the second support seat 313 to move transversely along the second section 112 are still applicable. For example, the angle grinding drive assembly may include a rack, a drive gear meshing with the rack, and a drive motor that drives the drive gear to rotate.

[0108] See also Figures 11 to 15 ,in, Figure 11 This is a schematic diagram of an angle grinding device performing an angle grinding operation in one embodiment of the present application. Figures 12 to 15 Displayed as Figure 11 The schematic diagram of the embodiment shown is that the swing mechanism drives the square silicon rod to perform reversing motion, as shown in FIG. Figure 11 As shown, the lateral support described in the aforementioned embodiment refers to the swing mechanism 311 supporting two adjacent side walls of the square silicon rod B so that the two opposite edges of the square silicon rod B extend along the longitudinal direction, and the square silicon rod B is ground under the operation of the first grinding spindle 32 and the second grinding spindle 33.

[0109] Specifically, in an embodiment in which the swing mechanism 311 supports the square silicon rod B laterally and drives the square silicon rod B to perform a reversing motion, for example, Figure 12 As shown, the pair of edges a and b of the square silicon rod B along the longitudinal direction have been ground. Next, the pair of edges c and d along the vertical direction of the square silicon rod B need to be ground. At this time, the edges c and d need to be converted from the vertical direction to the longitudinal direction so that the edges c and d can be ground under the operation of the first grinding spindle 32 and the second grinding spindle 33 set along the longitudinal direction. Specifically, the swing mechanism 311 moves along Figure 12 Rotate clockwise in the direction of the dotted arrow to Figure 13 At the position shown, the square silicon rod B is Figure 13 In the state shown, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Then, the swing mechanism 311 moves along Figure 13 Rotate counterclockwise to the direction of the dotted arrow Figure 14 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311, forming a Figure 14 Finally, the swing mechanism 311 drives the square silicon rod B along Figure 14 Rotate clockwise in the direction of the dotted arrow to Figure 15 The position shown, such as Figure 15 As shown, the edges c and d of the square silicon rod B have been Figure 12 The vertical direction shown is converted into the longitudinal direction, after which the angle grinding operation can continue under the operation of the first angle grinding spindle 32 and the second angle grinding spindle 33 .

[0110] It should be noted that when the swing mechanism 311 supports the square silicon rod B laterally and drives the square silicon rod B to perform reversing movement, the rotation of the swing mechanism 311 is flexible. Figures 12 to 15 For illustrative purposes only Figure 11The reversing movement of the swing mechanism 311 in the illustrated embodiment should not be construed as limiting the present application. For example, in this embodiment, the swing mechanism 311 may also rotate in a counterclockwise-clockwise-counterclockwise direction and sequence when reversing, which may be determined based on actual production requirements.

[0111] In one embodiment, if Figure 11 As shown, the rocking mechanism 311 includes a driving source 3111 and a rocking member 3112, wherein the rocking member 3112 is connected to the output shaft of the driving source 3111. In one example, the rocking member 3112 can be configured as a plate-like structure, which is connected to the output shaft of the driving source 3111 via a bearing, so that it can drive the square silicon rod B to rock under the drive of the driving source 3111. The driving source 3111 includes, but is not limited to, a motor and a cylinder.

[0112] In one embodiment, the reversing angle of the swing mechanism 311 is ±90°. In the example where the reversing angle of the swing mechanism 311 is -90°, it means that the swing mechanism 311 rotates 90° counterclockwise with the axis direction of its symmetry axis as the starting point, and presents the following Figure 11 The swing mechanism 311 in the embodiment is Figure 13 Rotate to Figure 14 In the example where the reversing angle of the rocking mechanism 311 is 90°, it means that the rocking mechanism 311 rotates 90° clockwise starting from the axis direction where the symmetry axis is located.

[0113] Of course, the reversing angle of the rocking mechanism 311 can also be ±45°. For example, in the example where the reversing angle of the rocking mechanism 311 is -45°, it means that the rocking mechanism 311 rotates 45° counterclockwise with the axis direction of its symmetry axis as the starting point. In the example where the reversing angle of the rocking mechanism 311 is 45°, it means that the rocking mechanism 311 rotates 45° clockwise with the axis direction of its symmetry axis as the starting point, as shown in FIG. Figure 11 The swing mechanism 311 in the embodiment is Figure 12 Rotate to Figure 13 The commutation state shown, or as shown from Figure 14 Rotate to Figure 15 Furthermore, the reversing angle of the rocking mechanism 311 can be set to -90°, -85°, -80°, -75°, -70°, -65°, -60°, -55°, -50°, -45°, -40°, -35°, -30°, -25°, -20°, -15°, -10°, -5°, 0°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, or 90°, etc.

[0114] In the embodiment where the swing mechanism 311 supports the square silicon rod B laterally and drives the square silicon rod B to swing, please refer to Figure 16 , displayed as Figure 11 A schematic diagram of a swing mechanism driving a square silicon rod to swing in the illustrated embodiment. As shown, when the swing mechanism 311 performs an angle grinding operation on a pair of edges a and b of the square silicon rod B, the swing mechanism 311 can swing left and right at a preset swing angle in the direction of the arrow shown in the figure. In one example, the preset swing angle of the swing mechanism 311 is ±5°. In the example where the preset swing angle of the swing mechanism 311 is -5°, this means that the swing mechanism 311 rotates 5° counterclockwise about the axis of the square silicon rod. In the example where the preset swing angle of the swing mechanism 311 is 5°, this means that the swing mechanism 311 rotates 5° clockwise about the axis of the square silicon rod. Furthermore, the preset swing angle of the swing mechanism 311 can be set to -5°, -4°, -3°, -2°, -1°, 0°, 1°, 2°, 3°, 4°, or 5°, etc.

[0115] In one embodiment, the angle grinding operation includes chamfering the edges of the square silicon rod B. During the chamfering operation, the sidewalls of the square silicon rod B are placed on the first support seat 312 and the second support seat 313 at a 45° angle relative to the vertical, and the swing mechanism 311 is in a static state. The static state can be understood as the preset swing angle of the swing mechanism 311 being set to 0°. Taking the chamfering operation of edges a and b as an example, Figure 11 The swing mechanism 311 shown is Figure 12 In the state shown, the edges a and b are chamfered. Further, as shown in FIG. Figure 12 As shown, the angle α of the side wall of the square silicon rod B relative to the vertical is 45°. The rocking mechanisms 311 on the first supporting seat 312 and the second supporting seat 313 are mirror-symmetrical and can drive the square silicon rod B to move horizontally. At this time, the edges a and b of the square silicon rod B can be chamfered under the operation of the first grinding spindle 32 and the second grinding spindle 33 arranged in the longitudinal direction.

[0116] In another embodiment, the angle grinding operation includes performing a rounding operation on the edges of the square silicon rod B. During the rounding operation, the side walls of the square silicon rod B are placed on the first support seat 312 and the second support seat 313 at a 45-degree angle relative to the vertical. The swing mechanism 311 performs a swing motion with the axis of the square silicon rod B as the rotation axis. Still taking the rounding operation on edges a and b as an example, Figure 11 The swing mechanism 311 shown is Figure 16 In the state shown, the edges a and b are rounded. Further, as shown in FIG. Figure 16As shown, the angle α of the side wall of the square silicon rod B relative to the vertical is 45°. At this time, the edges a and b of the square silicon rod B perform a swinging motion with the axis of the square silicon rod B as the axis of rotation, for example, a rotation motion with a period of 5° counterclockwise rotation and then 5° clockwise rotation. While rotating, the edges a and b of the square silicon rod B can move laterally under the support of the first supporting seat 312 and the second supporting seat 313, and perform a rounding operation under the operation of the first grinding spindle 32 and the second grinding spindle 33.

[0117] In one embodiment, a support assembly for adjusting the axis of the sideways placed square silicon rod is provided on the swing mechanism 311. It should be understood that when the cross section of the square silicon rod is not a square with the same aspect ratio, for example, in some embodiments, the square silicon rod is a half rod with a rectangular cross section formed by cutting in half (i.e., the first specification silicon rod), or a square silicon rod with slightly different length and width dimensions of the cross section formed by cutting or grinding due to special requirements (i.e., the second specification silicon rod), for example, the cross section of the square silicon rod is a rectangle with a width of 182 mm and a length of 210 mm. Therefore, when chamfering or rounding grinding is performed on such silicon rods, a pair of edges on the left and right sides of the sideways placed silicon rod need to be adjusted to the same height. For this reason, in one embodiment, the support assembly is provided on the swing member 3112, such as Figure 10 As shown, the support assembly includes a first support assembly 3113 and a second support assembly 3114, which are used to support two adjacent side surfaces of the end of the square silicon rod B. Figure 15 As shown, the supporting surfaces β of the first supporting assembly 3113 and the second supporting assembly 3114 are 90°.

[0118] In one embodiment, if Figure 10 and Figure 11 As shown, the first support assembly 3113 or the second support assembly 3114 includes at least one pair of support cams and a compensation motor, the compensation motor is used to drive each support cam to rotate, and the output shaft of the compensation motor and the axis of the support cam are eccentrically arranged to compensate for the error between the axis of the square silicon rod B and the axis of the rocking mechanism 311. Figure 15 In the example shown, the first support assembly 3113 and the second support assembly 3114 each include a pair of support cams. For ease of description, the pair of support cams included in the first support assembly 3113 are respectively referred to as the first support cam 31131 and the second support cam 31132, and the pair of support cams included in the second support assembly 3114 are respectively referred to as the third support cam 31141 and the fourth support cam 31142.

[0119] It should be understood that when grinding the second-specification silicon rod, the first support assembly 3113 and the second support assembly 3114 need to rotate their respective support cams by different angles so that the pair of edges of the second-specification silicon rod are located at the same height, thereby enabling the grinding operation to be performed under the operation of the first grinding spindle 32 and the second grinding spindle 33. In this embodiment, the first support cam 31131, the second support cam 31132, the third support cam 31141, and the fourth support cam 31142 are all equipped with compensation motors. That is, each support cam can be independently controlled and can be independently rotated to any angle to adjust the height of the edge to be ground along the longitudinal direction of the square silicon rod, thereby compensating for the error between the axis of the square silicon rod and the axis of the swing mechanism 311. Specifically, each supporting cam and its respective driving source can be connected to at least one gear, and the torque and speed required by each supporting cam can be adjusted by adjusting the gear ratio, but this is not limited to the above, as long as the rotation of each supporting cam can be achieved and the error between the axis of the square silicon rod and the axis of the swing mechanism 311 can be compensated. In one embodiment, please refer to Figure 17 and Figure 18 , respectively, are schematic diagrams showing the supporting cam compensating the axis center error of the silicon rod of the first specification in one embodiment of the present application. Figure 17 As shown, before the angle grinding operation is performed, the first supporting cam 31131, the second supporting cam 31132, the third supporting cam 31141, and the fourth supporting cam 31142 of the swing mechanism 311 support the first specification silicon rod B1, and the axis O1 of the swing mechanism 311 is located at Figure 17 As mentioned above, before the grinding operation, it is necessary to compensate for the error between the axis of the first specification silicon rod B1 and the axis of the swing mechanism 311. It should be understood that Figure 17 In the example shown, the axis O2 of the silicon rod B1 of the first specification does not coincide with the axis O1 of the rocking mechanism 311. Therefore, before performing the angle grinding operation, the axis of the eccentric shaft of each supporting cam needs to be adjusted so that the axis O2 of the silicon rod B1 of the first specification coincides with the axis O1 of the rocking mechanism 311. Specifically, Figure 18 As shown, the first supporting cam 31131, the second supporting cam 31132, the third supporting cam 31141, and the fourth supporting cam 31142 are driven by their respective driving sources along the Figure 17 The axes of the respective eccentric axes are adjusted in the direction indicated by the arrows so that the axis O2 of the silicon rod B1 of the first specification coincides with the axis O1 of the swing mechanism 311, and the axis O2 coincides with the axis O1 of the swing mechanism 311. Figure 18 The status shown.

[0120] Thereafter, the first specification silicon rod B1 moves laterally under the support of the first supporting seat 312 and the second supporting seat 313, and performs chamfering operation under the operation of the first grinding spindle 32 and the second grinding spindle 33, or rotates around the axis O1 of the swing mechanism 311 to perform the preset swing angle to perform swinging motion to perform rounding operation.

[0121] In another embodiment, see Figure 19 and Figure 20 , respectively, are schematic diagrams showing the supporting cam compensating the axis center error of the second specification silicon rod in one embodiment of the present application. Figure 19 As shown, before the angle grinding operation is performed, the first supporting cam 31131, the second supporting cam 31132, the third supporting cam 31141, and the fourth supporting cam 31142 of the swing mechanism 311 support the second specification silicon rod B2, and the axis O1 of the swing mechanism 311 is located at Figure 19 It should be understood that in Figure 19 In the example shown, the axis O3 of the second-specification silicon rod B2 does not coincide with the axis O1 of the rocking mechanism 311. Therefore, before performing the angle grinding operation, the axis of the eccentric shaft of each supporting cam needs to be adjusted so that the axis O3 of the second-specification silicon rod B2 coincides with the axis O1 of the rocking mechanism 311. Specifically, Figure 20 As shown, the first supporting cam 31131, the second supporting cam 31132, the third supporting cam 31141, and the fourth supporting cam 31142 are driven by their respective driving sources along the Figure 19 The axes of the respective eccentric shafts are adjusted in the direction indicated by the arrows so that the axis O3 of the second specification silicon rod B2 coincides with the axis O1 of the swing mechanism 311, and the axis O3 and the swing mechanism 311 are aligned. Figure 20 The status shown.

[0122] Thereafter, the second specification silicon rod B2 moves laterally under the support of the first supporting seat 312 and the second supporting seat 313, and performs chamfering operation under the operation of the first grinding spindle 32 and the second grinding spindle 33, or rotates around the axis O1 of the swing mechanism 311 to perform the preset swing angle to perform swing motion to perform rounding operation.

[0123] In another embodiment of the angle grinding device provided in this application, please refer to Figures 21 to 25 ,in, Figure 21 This is a schematic diagram showing an angle grinding device performing an angle grinding operation in another embodiment of the present application. Figures 22 to 25 Displayed as Figure 21 Schematic diagram of the swing mechanism driving the square silicon rod to perform reversing motion in the embodiment shown.

[0124] Specifically, in an embodiment in which the swing mechanism 311 supports the square silicon rod B laterally and drives the square silicon rod B to perform a reversing motion, for example, Figure 22 As shown, the pair of edges a and b of the square silicon rod B along the longitudinal direction have been ground. Next, the pair of edges c and d along the vertical direction of the square silicon rod B need to be ground. At this time, the edges c and d need to be switched to the position to be ground so that the edges c and d can be ground under the operation of the first grinding spindle 32 and the second grinding spindle 33 set along the longitudinal direction. Specifically, the swing mechanism 311 moves along Figure 22 Rotate counterclockwise to the direction of the dotted arrow Figure 23 At the position shown, the square silicon rod B is Figure 23 In the state shown, at this time, the two support components on the swing component 311 are along Figure 23 The solid line moves in the direction of the arrow, so that the square silicon rod B is supported only by the two support plates. Then, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Figure 23 Rotate clockwise in the direction of the dotted arrow Figure 24 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311. Then, the two support assemblies on the swing assembly 311 move along the Figure 24 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is clamped by the two supporting components and the two supporting plates at the same time. Figure 24 Rotate counterclockwise in the direction of the dotted arrow Figure 25 The position shown, such as Figure 25 As shown, the edges c and d of the square silicon rod B have been switched to the position to be ground. Afterwards, the grinding process can continue under the operation of the first grinding spindle 32 and the second grinding spindle 33. In this embodiment, the specific structure and function of the two support assemblies and two support plates on the swing mechanism 311 will be described in detail later and will not be repeated here.

[0125] It should be noted that when the swing mechanism 311 supports the square silicon rod B laterally and drives the square silicon rod B to perform reversing movement, the rotation of the swing mechanism 311 is flexible. Figures 22 to 25 For illustrative purposes only Figure 21 The reversing movement of the swing mechanism 311 in the illustrated embodiment should not be construed as limiting the present application. For example, in this embodiment, the swing mechanism 311 may also rotate in a clockwise-counterclockwise-clockwise direction and sequence when reversing, which may be determined based on actual production requirements.

[0126] In one embodiment, if Figure 21As shown, the rocking mechanism 311 includes a driving source 3111 and a rocking member 3112, wherein the rocking member 3112 is connected to the output shaft of the driving source 3111. In one example, the rocking member 3112 can be configured as a plate-like structure, which is connected to the output shaft of the driving source 3111 via a bearing, so that it can drive the square silicon rod B to rock under the drive of the driving source 3111. The driving source 3111 includes, but is not limited to, a motor and a cylinder.

[0127] In one embodiment, the reversing angle of the rocking mechanism 311 is ±90°. In the example where the reversing angle of the rocking mechanism 311 is -90°, it means that the rocking mechanism 311 rotates 90° counterclockwise with the axis direction of its symmetry axis as the starting point. In the example where the reversing angle of the rocking mechanism 311 is 90°, it means that the rocking mechanism 311 rotates 90° clockwise with the axis direction of its symmetry axis as the starting point. Figure 21 The swing mechanism 311 in the embodiment is Figure 23 Rotate to Figure 24 The switching state at the time.

[0128] Of course, the reversing angle of the rocking mechanism 311 can also be ±45°. For example, in the example where the reversing angle of the rocking mechanism 311 is -45°, it means that the rocking mechanism 311 rotates 45° counterclockwise with the axis direction of its symmetry axis as the starting point, and presents Figure 21 The swing mechanism 311 in the embodiment is Figure 22 Rotate to Figure 23 The switching state at the time, or as Figure 24 Rotate to Figure 25 In the example where the reversing angle of the rocking mechanism 311 is 45°, it means that the rocking mechanism 311 rotates 45° clockwise with the axis direction of its symmetry axis as the starting point. Furthermore, the reversing angle of the rocking mechanism 311 can be set to -90°, -85°, -80°, -75°, -70°, -65°, -60°, -55°, -50°, -45°, -40°, -35°, -30°, -25°, -20°, -15°, -10°, -5°, 0°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70°, 75°, 80°, 85°, or 90°, etc.

[0129] In the embodiment where the swing mechanism 311 supports the square silicon rod B laterally and drives the square silicon rod B to swing, please refer to Figure 26 , displayed as Figure 21A schematic diagram of a swing mechanism driving a square silicon rod to swing in the illustrated embodiment. As shown, when the swing mechanism 311 performs an angle grinding operation on a pair of edges a and b of the square silicon rod B, the swing mechanism 311 can swing left and right at a preset swing angle in the direction of the arrow shown in the figure. In one example, the preset swing angle of the swing mechanism 311 is ±5°. In the example where the preset swing angle of the swing mechanism 311 is -5°, this means that the swing mechanism 311 rotates 5° counterclockwise about the axis of the square silicon rod. In the example where the preset swing angle of the swing mechanism 311 is 5°, this means that the swing mechanism 311 rotates 5° clockwise about the axis of the square silicon rod. Furthermore, the preset swing angle of the swing mechanism 311 can be set to -5°, -4°, -3°, -2°, -1°, 0°, 1°, 2°, 3°, 4°, or 5°, etc.

[0130] In one embodiment, the angle grinding operation includes chamfering the edges of the square silicon rod B. During the chamfering operation, the sidewalls of the square silicon rod B are placed on the first support seat 312 and the second support seat 313 at a 45° angle relative to the vertical, and the swing mechanism 311 is in a static state. The static state can be understood as the preset swing angle of the swing mechanism 311 being set to 0°. Taking the chamfering operation of edges a and b as an example, Figure 21 The swing mechanism 311 shown is Figure 22 In the state shown, the edges a and b are chamfered. Further, as shown in FIG. Figure 22 As shown, the angle α of the side wall of the square silicon rod B relative to the vertical is 45°. The rocking mechanisms 311 on the first supporting seat 312 and the second supporting seat 313 are mirror-symmetrical and can drive the square silicon rod B to move horizontally. At this time, the edges a and b of the square silicon rod B can be chamfered under the operation of the first grinding spindle 32 and the second grinding spindle 33 arranged in the longitudinal direction.

[0131] In another embodiment, the angle grinding operation includes performing a rounding operation on the edges of the square silicon rod B. During the rounding operation, the side walls of the square silicon rod B are placed on the first support seat 312 and the second support seat 313 at a 45-degree angle relative to the vertical. The swing mechanism 311 performs a swing motion with the axis of the square silicon rod B as the rotation axis. Still taking the rounding operation on edges a and b as an example, Figure 21 The swing mechanism 311 shown is Figure 26 In the state shown, the edges a and b are rounded. Further, as shown in FIG. Figure 26As shown, the angle α of the side wall of the square silicon rod B relative to the vertical is 45°. At this time, the edges a and b of the square silicon rod B perform a swinging motion with the axis of the square silicon rod B as the axis of rotation, for example, a rotation motion with a period of 5° counterclockwise rotation and then 5° clockwise rotation. While rotating, the edges a and b of the square silicon rod B can move laterally under the support of the first supporting seat 312 and the second supporting seat 313, and perform a rounding operation under the operation of the first grinding spindle 32 and the second grinding spindle 33.

[0132] In one embodiment, the swing mechanism 311 is provided with a support assembly for adjusting the axis of the sideways placed square silicon rod. As mentioned above, when it is necessary to grind the angles of the square rod with a square cross section and the half rod with a rectangular cross section formed by cutting in half, most manufacturers use different equipment to process the square rod and the half rod respectively, which will increase production costs. Therefore, in one embodiment, the support assembly is provided on the swing member 3112, see Figure 27 , displayed as Figure 21 The three-dimensional structural diagram of the swing mechanism in the embodiment shown is shown in FIG. Figure 27 As shown, the support assembly includes a first support assembly 3113 and a second support assembly 3114, which are used to support two adjacent side surfaces of the end of the square silicon rod B. Figure 25 As shown, the supporting surfaces β of the first supporting assembly 3113 and the second supporting assembly 3114 are 90°.

[0133] In one embodiment, the first support assembly 3113 or the second support assembly 3114 includes a support plate for supporting the side of the square silicon rod, a linear displacement assembly connected to the support plate, and a servo motor for driving the linear displacement assembly to perform telescopic movement. The servo motor drives the linear displacement assembly to perform telescopic movement to adjust the axis of the square silicon rod supported by the support plate and the axis of the swing mechanism 311 to be on the same axis line. For ease of description, as Figure 27 As shown, the pallet, linear displacement component, and servo motor included in the first support assembly 3113 are respectively referred to as the first pallet 31133, the first linear displacement component 31134, and the first servo motor 31135, and the pallet, linear displacement component, and servo motor included in the second support assembly 3114 are respectively referred to as the second pallet 31143, the second linear displacement component 31144, and the second servo motor 31145.

[0134] In one embodiment, a first clamping space for accommodating square silicon rods is defined between the first support plate 31133 and the first linear displacement assembly 31134. A second clamping space for accommodating square silicon rods is defined between the second support plate 31143 and the second linear displacement assembly 31144. The first and second clamping spaces spatially overlap. The "overlapping space" can be understood as meaning that the projections of the two regions or spaces on any plane have an overlapping portion. That is, the first and second clamping spaces together form a space for accommodating square silicon rods.

[0135] The following describes the specific structure of the support assembly by taking the first support plate 31133, the first linear displacement assembly 31134, and the first servo motor 31135 included in the first support assembly 3113 as an example. In one example, the first support plate 31133 and the first linear displacement assembly 31134 can be connected by a screw, and the first servo motor 31135 is associated with the screw to drive the screw to rotate so that the first linear displacement assembly 31134 moves toward the direction close to the square silicon rod. In another example, the first support plate 31133 and the first linear displacement assembly 31134 can be connected by a bidirectional screw, and the first servo motor 31135 is associated with the bidirectional screw to drive the bidirectional screw to rotate so that the first support plate 31133 and the first linear displacement assembly 31134 move toward or away from each other, thereby achieving the clamping or release of the square silicon rod. Of course, in certain other embodiments, the support assembly can also be configured to include structures such as a telescopic rod and a drive cylinder, as long as it can clamp or release the square silicon rod, and this application does not limit this.

[0136] Specifically, when the first support plate 31133 and the first linear displacement assembly 31134 of the first support assembly 3113, and the second support plate 31143 and the second linear displacement assembly 31144 of the second support assembly 3114 are fixed together, the square silicon rod can be stably supported in the carrying space. At this time, it can be chamfered, rounded, or other actions that require rotation. When the first linear displacement assembly 31134 and the second linear displacement assembly 31144 are driven away from the square silicon rod by their respective servo motors and the square silicon rod is supported only by the first support plate 31133 and the second support plate 31143, the second manipulator 16 can extend into the carrying space and absorb the top surface of the square silicon rod B, lifting it from the swing mechanism 311 to perform the reversing movement described in the aforementioned embodiment.

[0137] In one embodiment, if Figure 27As shown, in order to further achieve stable support for the square silicon rod, the rocking mechanism 311 also includes a backrest 3115 for abutting against the end face of the square silicon rod. In this embodiment, the screw rod or the bidirectional screw rod included in the first support assembly 3113 and the second support assembly 3114 can pass through the backrest 3115. Figure 27 As shown, at least one spring pin 3116 can be provided on the backrest 3115. The spring pin 3116 can be in close contact with the square silicon rod, thereby preventing the square silicon rod from loosening or slipping during reversing or swinging. At the same time, it can also absorb the impact force and vibration of the square silicon rod, thereby playing a shock-absorbing role.

[0138] In one embodiment, the first linear displacement assembly 31134 and the second linear displacement assembly 31144 are driven by respective servo motors to move different distances to accommodate square silicon rods of different specifications. For example, when grinding a silicon rod of the second specification, the first support assembly 3113 and the second support assembly 3114 can respectively fix the long and short edges of the silicon rod of the second specification. Specifically, the movement distances of the first linear displacement assembly 31134 and the second linear displacement assembly 31144 are determined based on the specifications of the square silicon rods being processed, and this application does not impose any restrictions on this.

[0139] As mentioned above, the telescopic movement of the first linear displacement component 31134 and the second linear displacement component 31144 can also adjust the axis of the square silicon rod and the axis of the rocking mechanism 311 to be on the same axis line. It should be understood that due to changes in the specifications of the square silicon rod supported by the support plate or changes in the orientation of the rocking mechanism 311 during operation, the axis of the square silicon rod and the axis of the rocking mechanism 311 may not be on the same axis line. At this time, the first linear displacement component 31134 and the second linear displacement component 31144 can be telescopically moved to different distances relative to the first support plate 31133 and the second support plate 31143 respectively. Combined with the rotational movement of the rocking mechanism 311, compensation for the axis errors of square silicon rods of different specifications can be achieved. For details, please refer to the description in the aforementioned embodiment, which will not be repeated here.

[0140] In one embodiment, the width of the support plate is less than the width of any side of the square silicon rod. It should be understood that if any side of the square silicon rod supported by the first support plate 31133 or the second support plate 31143 is flush with or protrudes from any side, it will interfere with the first grinding spindle 32 or the second grinding spindle 33 during chamfering or rounding operations, thereby causing mechanical damage to the swing mechanism 311 or the grinding spindle. For example, in the example of grinding the second specification silicon rod, the width of the first support plate 31133 or the second support plate 31143 is less than the length of the short edge of the second specification silicon rod. In some examples, an elastic member such as rubber or silicone may be further provided on the inside of the first support plate 31133 or the second support plate 31143 to provide a buffering effect for the square silicon rod.

[0141] In one embodiment, a coarse grinding wheel is provided at the first end of the first grinding spindle 32 or the second grinding spindle 33, and a fine grinding wheel is provided at the second end away from the first end; the first grinding spindle 32 or the second grinding spindle 33 rotates 180 degrees to switch between the coarse grinding wheel and the fine grinding wheel to perform the angle grinding operation on the square silicon rod. Figure 28 , which is a schematic diagram showing the structure of the first grinding spindle in one embodiment of the present application. Figure 28 As shown, a coarse grinding wheel 321 is provided at the first end of the first grinding spindle 32, and a fine grinding wheel 322 is provided at the second end away from the first end. The first grinding spindle 32 is rotated 180° to switch the coarse grinding wheel 321 or the fine grinding wheel 322 to perform the angle grinding operation on the square silicon rod.

[0142] To enable switching between the coarse grinding wheel 321 and the fine grinding wheel 322, in one embodiment, the first angle grinding spindle 32 may further include a rotating support and a rotational drive source. The rotating support is fixedly connected to the first angle grinding spindle 32, and the rotational drive source is associated with the rotating support, thereby driving the first angle grinding spindle 32 to rotate 180° along the axis L1 to achieve switching between the coarse grinding wheel 321 and the fine grinding wheel 322. In some embodiments, the rotational drive source may be, for example, a rotary motor.

[0143] In one embodiment, the first angle grinding spindle 32 and the second angle grinding spindle 33 can move relative to or away from each other in the longitudinal direction so that the respective coarse grinding wheel or fine grinding wheel reaches the grinding position or exits from the grinding position. The specific implementation process can be found in the description of the aforementioned embodiment and will not be repeated here.

[0144] As previously described, the surface grinding device 2 performs surface grinding on all four sides of the square silicon rod A to form a square silicon rod B. The second robot 16 transfers the square silicon rod B from the surface grinding area to the angle grinding carrier 31 in the angle grinding area, and then the support assembly on the swing mechanism 311 performs angle grinding on the four edges of the square silicon rod B.

[0145] exist Figures 11 to 20 In the embodiment of the chamfering operation shown, when using Figure 11 When the swing mechanism 311 shown in the figure performs chamfering operation on the four edges a, b, c, and d of the square silicon rod B, first, the edges a and b of the square silicon rod B are chamfered. At this time, the square silicon rod B appears as follows: Figure 12 In the state shown, it moves laterally from the proximal end to the distal end along the second section 112 of the grinding guide 11 driven by the grinding carrier 31. The fine grinding wheels of the first grinding spindle 32 and the second grinding spindle 33 rotate 180° under the drive of the rotary drive source and move longitudinally to reach the grinding position, so that the edges a and b move once from the proximal end to the distal end along the second section 112, and the chamfering operation is completed. Then, the edges c and d of the other silicon rod B need to be chamfered. Specifically, the swing mechanism 311 moves along Figure 12 Rotate clockwise in the direction of the dotted arrow to Figure 13 At the position shown, the square silicon rod B is Figure 13 In the state shown, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Then, the swing mechanism 311 moves along Figure 13 Rotate counterclockwise to the direction of the dotted arrow Figure 14 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311, forming a Figure 14 Finally, the swing mechanism 311 drives the square silicon rod B along Figure 14 Rotate clockwise in the direction of the dotted arrow to Figure 15 The position shown, such as Figure 15 As shown, the edges c and d of the square silicon rod B have been Figure 12 The vertical direction shown is switched to the longitudinal direction, after which the fine grinding wheels of the first and second grinding spindles 32 and 33 are brought back to the grinding position. The edges c and d of the square silicon rod B are moved once from the distal end to the proximal end along the second section 112, completing the chamfering operation. In this manner, the chamfering operation of the four edges a, b, c, and d of the square silicon rod B is completed.

[0146] exist Figures 11 to 20 In the embodiment of the spherical operation shown in FIG. Figure 11 When the swing mechanism 311 shown in the figure performs the rounding operation on the four edges a, b, c, and d of the square silicon rod B, first, the edges a and b of the square silicon rod B are rounded. At this time, the square silicon rod B appears as follows: Figure 12In the state shown, it moves laterally from the proximal end to the distal end along the second section 112 of the grinding guide rail 11 driven by the angle grinding carrier 31. At the same time, the swing mechanism 311 performs a swinging motion with the axis of the square silicon rod B as the axis of rotation. The coarse grinding wheels of the first angle grinding spindle 32 and the second angle grinding spindle 33 rotate 180° under the drive of the rotary drive source, and move longitudinally to reach the grinding position. Then, the edges a and b of the square silicon rod B move from the proximal end to the distal end along the second section 112. Subsequently, the fine grinding wheels of the first angle grinding spindle 32 and the second angle grinding spindle 33 rotate 180° under the drive of the rotary drive source, and move longitudinally to reach the grinding position. The edges a and b of the square silicon rod B move once more from the distal end to the proximal end along the second section 112 to complete the rounding operation. Then, it is necessary to perform rounding operation on the edges c and d of the square silicon rod B. Specifically, the swing mechanism 311 rotates along Figure 12 Rotate clockwise in the direction of the dotted arrow to Figure 13 At the position shown, the square silicon rod B is Figure 13 In the state shown, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Then, the swing mechanism 311 moves along Figure 13 Rotate counterclockwise to the direction of the dotted arrow Figure 14 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311, forming a Figure 14 Finally, the swing mechanism 311 drives the square silicon rod B along Figure 14 Rotate clockwise in the direction of the dotted arrow to Figure 15 The position shown, such as Figure 15 As shown, the edges c and d of the square silicon rod B have been Figure 12 The vertical direction shown is converted to the longitudinal direction. Thereafter, the coarse grinding wheels of the first and second grinding spindles 32 and 33 are rotated 180° again to the grinding position. The edges c and d of the square silicon rod B move from the proximal end to the distal end along the second section 112. Simultaneously, the rocking mechanism 311 performs a rocking motion with the axis of the square silicon rod B as its axis. Finally, the fine grinding wheels of the first and second grinding spindles 32 and 33 are rotated 180° again to the grinding position. The edges c and d of the square silicon rod B move from the distal end to the proximal end along the second section 112. Simultaneously, the rocking mechanism 311 performs a rocking motion with the axis of the square silicon rod B as its axis, completing the rounding of the edges c and d. In this manner, the rounding of the four edges a, b, c, and d of the square silicon rod B is completed.

[0147] exist Figures 21 to 27 In another embodiment of the chamfering operation shown, when using Figure 21When the swing mechanism 311 shown in the figure performs chamfering operation on the four edges a, b, c, and d of the square silicon rod B, first, the edges a and b of the square silicon rod B are chamfered. At this time, the square silicon rod B appears as follows: Figure 22 In the state shown, it moves laterally from the proximal end to the distal end along the second section 112 of the grinding guide 11 driven by the grinding carrier 31. The fine grinding wheels of the first grinding spindle 32 and the second grinding spindle 33 rotate 180° under the drive of the rotary drive source and move longitudinally to reach the grinding position, so that the edges a and b move once from the proximal end to the distal end along the second section 112, and the chamfering operation is completed. Then, the edges c and d of the other silicon rod B need to be chamfered. Specifically, the swing mechanism 311 moves along Figure 22 Rotate counterclockwise to the direction of the dotted arrow Figure 23 At the position shown, the square silicon rod B is Figure 23 In the state shown, at this time, the first support assembly 3113 and the second support assembly 3114 on the swing assembly 311 are along Figure 23 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is supported only by the first support plate 31133 and the second support plate 31143. Then, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Figure 23 Rotate clockwise in the direction of the dotted arrow Figure 24 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311. Then, the two support assemblies on the swing assembly 311 move along the Figure 24 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is clamped by the first support assembly 3113 and the second support assembly 3114, as well as the first support plate 31133 and the second support plate 31143. Finally, the swing mechanism 311 drives the square silicon rod B to move along Figure 24 Rotate counterclockwise in the direction of the dotted arrow Figure 25 The position shown, such as Figure 25 As shown, edges c and d of the square silicon rod B have been switched to the grinding position. Afterwards, the fine grinding wheels of the first and second grinding spindles 32 and 33 can be moved back to the grinding position. Edges c and d of the square silicon rod B are moved once along the second section 112 from the distal end to the proximal end, completing the chamfering operation. In this way, the chamfering operation of the four edges a, b, c, and d of the square silicon rod B is complete.

[0148] exist Figures 21 to 27 In another embodiment of the spherical operation shown, when using Figure 21 When the swing mechanism 311 shown in the figure performs the rounding operation on the four edges a, b, c, and d of the square silicon rod B, first, the edges a and b of the square silicon rod B are rounded. At this time, the square silicon rod B appears as follows: Figure 22In the state shown, it moves laterally from the proximal end to the distal end along the second section 112 of the grinding guide 11 driven by the grinding carrier 31. At the same time, the swing mechanism 311 performs a swing motion with the axis of the square silicon rod B as the axis of rotation. The fine grinding wheels of the first grinding spindle 32 and the second grinding spindle 33 rotate 180° under the drive of the rotary drive source and move longitudinally to reach the grinding position, so that the edges a and b move once from the proximal end to the distal end along the second section 112 to complete the rounding operation. Then, the edges c and d of the square silicon rod B need to be rounded. Specifically, the swing mechanism 311 moves along Figure 22 Rotate counterclockwise to the direction of the dotted arrow Figure 23 At the position shown, the square silicon rod B is Figure 23 In the state shown, at this time, the first support assembly 3113 and the second support assembly 3114 on the swing assembly 311 are along Figure 23 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is supported only by the first support plate 31133 and the second support plate 31143. Then, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Figure 23 Rotate clockwise in the direction of the dotted arrow Figure 24 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311. Then, the two support assemblies on the swing assembly 311 move along the Figure 24 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is clamped by the first support assembly 3113 and the second support assembly 3114, as well as the first support plate 31133 and the second support plate 31143. Finally, the swing mechanism 311 drives the square silicon rod B to move along Figure 24 Rotate counterclockwise in the direction of the dotted arrow Figure 25 The position shown, such as Figure 25 As shown, edges c and d of the square silicon ingot B have been switched to the position to be ground. After this, the fine grinding wheels of the first and second grinding spindles 32 and 33 are moved back to the grinding position. Edges c and d of the square silicon ingot B are moved once along the second section 112 from the distal end to the proximal end. Simultaneously, the rocking mechanism 311 performs a rocking motion about the axis of the square silicon ingot B. This completes the rounding operation. In this manner, the rounding of the four edges a, b, c, and d of the square silicon ingot B is complete.

[0149] After the square silicon rod has been ground by the surface grinding device 2 in the surface grinding area and the angle grinding device 3 in the angle grinding area, it needs to be transferred by the second manipulator 16 to the unloading conveying device described in the above embodiment for unloading.

[0150] In one embodiment, if Figure 1 and 2As shown, the unloading and conveying device 17 is arranged on the machine base 1 and is parallel to the second section 112 of the grinding guide rail 11 and located at the far end of the machine base 1, and is used for unloading and conveying the square silicon rods B that have completed the grinding operation.

[0151] In one embodiment, the unloading conveying device 17 and the loading conveying device 12 have the same configuration. Please refer to the description in the above embodiment for details, which will not be repeated here.

[0152] The following combination Figures 1 to 28 The grinding process of the silicon rod grinding equipment of the present applicant is described in detail.

[0153] First, the square silicon rod A is ground. The square silicon rod A is transported to the loading area via the loading conveyor 12. The first clamp 141 and the second clamp 142 of the first manipulator 14 grip the square silicon rod A and lift it along the first gantry 13 to lift it from the loading area. Subsequently, the first manipulator 14 grips the square silicon rod A and moves longitudinally along the first gantry 13 to transport it to the proximal end of the grinding area. The grinding carrier 21 drives the square silicon rod A to move laterally along the first section 111 of the grinding guide 11, from the proximal end toward the distal end. During this process, the first grinding spindle 22 and the second grinding spindle 23 of the surface grinding device 2 enter the grinding position under the drive of the grinding tool advance and retreat mechanism. The rough grinding wheel rotates at high speed around the transmission shaft and extends. The surface grinding carrier 21 drives the square silicon rod A to move along the proximal end toward the distal end of the first section 111. The distal end of the side surface of the square silicon rod A contacts the rough grinding wheel for rough grinding. As the square silicon rod A moves from the proximal end to the distal end of the first section 111 and completely passes through the rough grinding wheel, the two rough grinding wheels of the side grinding device complete the rough grinding of the two side surfaces of the square silicon rod A. At this time, the coarse grinding wheel retracts along the drive shaft to its initial position, allowing the fine grinding wheel to extend / protrude relative to the coarse grinding wheel and to be in a position where it does not interfere with the fine grinding wheel. Driven by the grinding surface carrier 21, the square silicon rod A moves from the distal end toward the proximal end of the first section 111131. During this movement, the proximal end of the side surface of the square silicon rod A first contacts the fine grinding wheel. When the square silicon rod A moves from the distal end to the proximal end of the first section 111 and completely passes through the fine grinding wheel, the two fine grinding wheels of the side grinding device complete the fine grinding of the two side surfaces of the square silicon rod A. In this way, the grinding operation of a pair of side surfaces of the square silicon rod A is completed.

[0154] When the grinding operation is completed on one pair of side surfaces of the square silicon rod A and the grinding operation is required on the other pair of side surfaces, the first clamp 141 and the second clamp 142 of the first manipulator 14 clamp the square silicon rod A and move up and down along the first gantry 13 to clamp it from the first section 111. Then, the first manipulator 14 clamps the square silicon rod A and moves longitudinally along the first gantry 13 to transport it to the fork arm structure 2412 of the flipping mechanism 24 to present the square silicon rod A as shown in FIG. Figure 7At this point, the pair of side surfaces along the longitudinal direction of the fork arm structure 2412 have been ground, while the other pair of side surfaces to be ground are located in the vertical direction. Next, the flipping mechanism 24, under the action of the driving mechanism 242, drives the longitudinal fork arm 24121 and the vertical fork arm 24122 to flip 90 degrees counterclockwise around the flip axis 2413, so as to present the following state: Figure 8 At this time, the other pair of side surfaces to be ground are flipped from the vertical direction to the longitudinal direction. The first manipulator 14 clamps the other pair of side surfaces to be ground in the longitudinal direction of the square silicon ingot A and places them on the grinding carrier 21 at the proximal end of the first section 111. The other pair of side surfaces repeat the grinding process of the pair of side surfaces that have completed the grinding operation. In short, driven by the grinding carrier 21, they move from the proximal end to the distal end of the first section 111 to complete a rough grinding, and then move from the distal end to the proximal end of the first section 111 to complete a fine grinding. In this way, the grinding operation of the four side surfaces of the square silicon ingot A is completed, forming a square silicon ingot B.

[0155] Afterwards, the first surface grinding spindle 22 and the second surface grinding spindle return to the grinding position, and the square silicon rod B is moved again from the proximal end to the distal end of the first section 111, and is transferred from the surface grinding area to the angle grinding carrier 31 in the angle grinding area by the second robot 16. The adjacent two side surfaces of its end are supported by the respective support cams of the first support assembly 3113 and the second support assembly 3114 to perform angle grinding operations on its four edges a, b, c, and d.

[0156] In one embodiment, when using Figure 11 When the swing mechanism 311 shown in the figure performs chamfering operation on the four edges a, b, c, and d of the square silicon rod B, first, the edges a and b of the square silicon rod B are chamfered. At this time, the square silicon rod B appears as follows: Figure 12 In the state shown, it moves laterally from the proximal end to the distal end along the second section 112 of the grinding guide 11 driven by the grinding carrier 31. The fine grinding wheels of the first grinding spindle 32 and the second grinding spindle 33 rotate 180° under the drive of the rotary drive source and move longitudinally to reach the grinding position, so that the edges a and b move once from the proximal end to the distal end along the second section 112, and the chamfering operation is completed. Then, the edges c and d of the other silicon rod B need to be chamfered. Specifically, the swing mechanism 311 moves along Figure 12 Rotate clockwise in the direction of the dotted arrow to Figure 13 At the position shown, the square silicon rod B is Figure 13 In the state shown, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Then, the swing mechanism 311 moves along Figure 13 Rotate counterclockwise to the direction of the dotted arrow Figure 14At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311, forming a Figure 14 Finally, the swing mechanism 311 drives the square silicon rod B along Figure 14 Rotate clockwise in the direction of the dotted arrow to Figure 15 The position shown, such as Figure 15 As shown, the edges c and d of the square silicon rod B have been Figure 12 The vertical direction shown is switched to the longitudinal direction, after which the fine grinding wheels of the first and second grinding spindles 32 and 33 are brought back to the grinding position. The edges c and d of the square silicon rod B are moved once from the distal end to the proximal end along the second section 112, completing the chamfering operation. In this manner, the chamfering operation of the four edges a, b, c, and d of the square silicon rod B is completed.

[0157] When using Figure 11 When the swing mechanism 311 shown in the figure performs the rounding operation on the four edges a, b, c, and d of the square silicon rod B, first, the edges a and b of the square silicon rod B are rounded. At this time, the square silicon rod B appears as follows: Figure 12 In the state shown, it moves laterally from the proximal end to the distal end along the second section 112 of the grinding guide rail 11 driven by the angle grinding carrier 31. At the same time, the swing mechanism 311 performs a swinging motion with the axis of the square silicon rod B as the axis of rotation. The coarse grinding wheels of the first angle grinding spindle 32 and the second angle grinding spindle 33 rotate 180° under the drive of the rotary drive source, and move longitudinally to reach the grinding position. Then, the edges a and b of the square silicon rod B move from the proximal end to the distal end along the second section 112. Subsequently, the fine grinding wheels of the first angle grinding spindle 32 and the second angle grinding spindle 33 rotate 180° under the drive of the rotary drive source, and move longitudinally to reach the grinding position. The edges a and b of the square silicon rod B move once more from the distal end to the proximal end along the second section 112 to complete the rounding operation. Then, it is necessary to perform rounding operation on the edges c and d of the square silicon rod B. Specifically, the swing mechanism 311 rotates along Figure 12 Rotate clockwise in the direction of the dotted arrow to Figure 13 At the position shown, the square silicon rod B is Figure 13 In the state shown, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Then, the swing mechanism 311 moves along Figure 13 Rotate counterclockwise to the direction of the dotted arrow Figure 14 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311, forming a Figure 14 Finally, the swing mechanism 311 drives the square silicon rod B along Figure 14 Rotate clockwise in the direction of the dotted arrow to Figure 15 The position shown, such as Figure 15 As shown, the edges c and d of the square silicon rod B have been Figure 12 The vertical direction shown is converted to the longitudinal direction. Thereafter, the coarse grinding wheels of the first and second grinding spindles 32 and 33 are rotated 180° again to the grinding position. The edges c and d of the square silicon rod B move from the proximal end to the distal end along the second section 112. Simultaneously, the rocking mechanism 311 performs a rocking motion with the axis of the square silicon rod B as its axis. Finally, the fine grinding wheels of the first and second grinding spindles 32 and 33 are rotated 180° again to the grinding position. The edges c and d of the square silicon rod B move from the distal end to the proximal end along the second section 112. Simultaneously, the rocking mechanism 311 performs a rocking motion with the axis of the square silicon rod B as its axis, completing the rounding of the edges c and d. In this manner, the rounding of the four edges a, b, c, and d of the square silicon rod B is completed.

[0158] In another embodiment, when using Figure 21 When the swing mechanism 311 shown in the figure performs chamfering operation on the four edges a, b, c, and d of the square silicon rod B, first, the edges a and b of the square silicon rod B are chamfered. At this time, the square silicon rod B appears as follows: Figure 22 In the state shown, it moves laterally from the proximal end to the distal end along the second section 112 of the grinding guide 11 driven by the grinding carrier 31. The fine grinding wheels of the first grinding spindle 32 and the second grinding spindle 33 rotate 180° under the drive of the rotary drive source and move longitudinally to reach the grinding position, so that the edges a and b move once from the proximal end to the distal end along the second section 112, and the chamfering operation is completed. Then, the edges c and d of the other silicon rod B need to be chamfered. Specifically, the swing mechanism 311 moves along Figure 22 Rotate counterclockwise to the direction of the dotted arrow Figure 23 At the position shown, the square silicon rod B is Figure 23 In the state shown, at this time, the first support assembly 3113 and the second support assembly 3114 on the swing assembly 311 are along Figure 23 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is supported only by the first support plate 31133 and the second support plate 31143. Then, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Figure 23 Rotate clockwise in the direction of the dotted arrow Figure 24 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311. Then, the two support assemblies on the swing assembly 311 move along the Figure 24 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is clamped by the first support assembly 3113 and the second support assembly 3114, as well as the first support plate 31133 and the second support plate 31143. Finally, the swing mechanism 311 drives the square silicon rod B to move along Figure 24 Rotate counterclockwise in the direction of the dotted arrow Figure 25 The position shown, such as Figure 25 As shown, edges c and d of the square silicon rod B have been switched to the grinding position. Afterwards, the fine grinding wheels of the first and second grinding spindles 32 and 33 can be moved back to the grinding position. Edges c and d of the square silicon rod B are moved once along the second section 112 from the distal end to the proximal end, completing the chamfering operation. In this way, the chamfering operation of the four edges a, b, c, and d of the square silicon rod B is complete.

[0159] When using Figure 21 When the swing mechanism 311 shown in the figure performs the rounding operation on the four edges a, b, c, and d of the square silicon rod B, first, the edges a and b of the square silicon rod B are rounded. At this time, the square silicon rod B appears as follows: Figure 22 In the state shown, it moves laterally from the proximal end to the distal end along the second section 112 of the grinding guide 11 driven by the grinding carrier 31. At the same time, the swing mechanism 311 performs a swing motion with the axis of the square silicon rod B as the axis of rotation. The fine grinding wheels of the first grinding spindle 32 and the second grinding spindle 33 rotate 180° under the drive of the rotary drive source and move longitudinally to reach the grinding position, so that the edges a and b move once from the proximal end to the distal end along the second section 112 to complete the rounding operation. Then, the edges c and d of the square silicon rod B need to be rounded. Specifically, the swing mechanism 311 moves along Figure 22 Rotate counterclockwise to the direction of the dotted arrow Figure 23 At the position shown, the square silicon rod B is Figure 23 In the state shown, at this time, the first support assembly 3113 and the second support assembly 3114 on the swing assembly 311 are along Figure 23 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is supported only by the first support plate 31133 and the second support plate 31143. Then, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and lifts it from the swing mechanism 311. Figure 23 Rotate clockwise in the direction of the dotted arrow Figure 24 At this time, the suction cup assembly 161 of the second manipulator 16 absorbs the top surface of the square silicon rod B and re-places it on the swing mechanism 311. Then, the two support assemblies on the swing assembly 311 move along the Figure 24 The square silicon rod B is moved in the direction of the arrow shown by the solid line, so that the square silicon rod B is clamped by the first support assembly 3113 and the second support assembly 3114, as well as the first support plate 31133 and the second support plate 31143. Finally, the swing mechanism 311 drives the square silicon rod B to move along Figure 24 Rotate counterclockwise in the direction of the dotted arrow Figure 25 The position shown, such as Figure 25As shown, edges c and d of the square silicon ingot B have been switched to the position to be ground. After this, the fine grinding wheels of the first and second grinding spindles 32 and 33 are moved back to the grinding position. Edges c and d of the square silicon ingot B are moved once along the second section 112 from the distal end to the proximal end. Simultaneously, the rocking mechanism 311 performs a rocking motion about the axis of the square silicon ingot B. This completes the rounding operation. In this manner, the rounding of the four edges a, b, c, and d of the square silicon ingot B is complete.

[0160] Finally, the square silicon rod B that has completed the surface grinding and angle grinding operations is transferred by the second manipulator 16 to the unloading conveying device 17 for unloading.

[0161] In summary, in order to overcome the technical problem in the above-mentioned related technologies that the angle grinding device cannot be applied to the processing of silicon rods of different specifications, resulting in increased production costs, the present application provides a square silicon rod grinding equipment and an angle grinding device thereof, which configures the angle grinding device to include a first and a second angle grinding spindles arranged on opposite sides of a grinding guide rail, and an angle grinding carrier arranged on the grinding guide rail and capable of moving laterally along the grinding guide rail, and a swinging mechanism is provided on the angle grinding carrier to support and drive the square silicon rod to perform reversing movement and swinging movement, thereby realizing the grinding processing of the four sides of the square silicon rod in the form of fixed angle grinding spindles and swinging silicon rods; by arranging a support component that can adjust the axis of the square silicon rod on the swinging mechanism, the positioning deviation of the square silicon rod can be eliminated, thereby ensuring the processing quality; further, the provision of the support component enables the angle grinding device to be applicable to the processing of silicon rods of different specifications, enhances the versatility of the angle grinding device, and reduces the production cost.

[0162] The grinding equipment provided in some embodiments of the present application integrates the surface grinding and angle grinding operations of the square silicon rods on the same track by arranging a first section for performing surface grinding operations on the square silicon rods and a second section for performing angle grinding operations on the square silicon rods on the grinding guide rails of the machine base, thereby reducing the transportation time of the square silicon rods between the first section and the second section, and avoiding the repositioning of the square silicon rods after each transportation, thereby ensuring processing efficiency. Specifically, by arranging a surface grinding device including a surface grinding carrier, a first surface grinding spindle, and a second surface grinding spindle on the first section, the surface grinding operation of the square silicon rods on the first section is realized. By arranging an angle grinding device including a grinding carrier, a first angle grinding spindle, and a second angle grinding spindle on the second section, the angle grinding operation of the square silicon rods on the first section is realized.

[0163] The above embodiments are merely illustrative of the invention and the beneficial effects achieved by this application and are not intended to limit this application. Anyone familiar with the art may modify or alter the above embodiments without departing from the principles and scope of this application. Therefore, all equivalent modifications or alterations accomplished by a person of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. An angle grinding device for a grinding device, the grinding device comprising a machine base and a grinding guide rail disposed on the machine base and extending laterally, characterized in that: The angle grinding device comprises: An angle grinding carrier is disposed on the grinding guide rail and can move laterally along the grinding guide rail, and is used to laterally support a square silicon rod to be ground. The angle grinding carrier includes a pair of oppositely arranged bearing seats, each of which is provided with a swing mechanism for laterally supporting the square silicon rod and driving the square silicon rod to perform reversing and swinging movements; the swing mechanism is provided with a support assembly for adjusting the axis of the laterally placed square silicon rod; The first and second grinding spindles are respectively arranged on opposite sides of the grinding guide rail for performing grinding operations on the edges of the square silicon rod on opposite sides.

2. The angle grinding device according to claim 1, characterized in that: The rocking mechanism includes a driving source and a rocking member connected to an output shaft of the driving source. The reversing angle of the rocking mechanism is ±90°; and the preset rocking angle of the rocking mechanism is ±5°.

3. The angle grinding device according to claim 1, characterized in that: The grinding operation includes chamfering the edges of the square silicon rod. During the chamfering operation, the side walls of the square silicon rod are placed on a pair of oppositely arranged supporting seats at a 45° angle relative to the vertical, and the rocking mechanism is in a stationary state.

4. The angle grinding device according to claim 1, characterized in that: The angle grinding operation performs a rounding operation on the edges of the square silicon rod; during the rounding operation, the side walls of the square silicon rod are placed on a pair of oppositely arranged supporting seats at a 45° angle relative to the vertical, and the swing mechanism performs a swinging motion with the axis of the square silicon rod as the rotation axis.

5. The angle grinding device according to claim 2, characterized in that: The support assembly is arranged on the rocking member, and includes a first support assembly and a second support assembly for supporting two adjacent side surfaces of the end of the square silicon rod, and the support surfaces of the first support assembly and the second support assembly are at 90 degrees.

6. The angle grinding device according to claim 5, characterized in that: The first support assembly or the second support assembly includes: at least one pair of support cams, and a compensation motor for driving each of the support cams to rotate, wherein the output shaft of the compensation motor and the axis of the support cam are eccentrically arranged to compensate for the error between the axis of the square silicon rod and the axis of the rocking mechanism.

7. The angle grinding device according to claim 5, characterized in that: The first support assembly or the second support assembly includes: a support plate for supporting the side of the square silicon rod, a linear displacement assembly connected to the support plate, and a servo motor for driving the linear displacement assembly to perform telescopic movement. The servo motor drives the linear displacement assembly to perform telescopic movement to adjust the axis of the square silicon rod supported by the support plate and the axis of the swing mechanism to be on the same axis line.

8. The angle grinding device according to claim 7, characterized in that: The width of the supporting plate is smaller than the width of any side surface of the square silicon rod.

9. The angle grinding device according to claim 1, characterized in that: The first end of the first or second grinding spindle is provided with a coarse grinding wheel, and the second end away from the first end is provided with a fine grinding wheel; the first or second grinding spindle rotates 180 degrees to switch the coarse grinding wheel or the fine grinding wheel to perform the angle grinding operation on the square silicon rod.

10. A grinding device for square silicon rods, characterized in that: include: A machine base is provided with a grinding guide rail extending in a transverse direction, wherein the grinding guide rail includes a first section for transversely placing a square silicon rod for a surface grinding operation and a second section for transversely placing the square silicon rod for an angle grinding operation; a surface grinding device, disposed in the first section and configured to perform surface grinding on the square silicon rod, comprising a surface grinding carrier for clamping both ends of the square silicon rod and capable of moving laterally along the grinding guide rail, and first and second surface grinding spindles, respectively disposed on opposite sides of the grinding guide rail and configured to perform surface grinding on opposite side surfaces of the square silicon rod; and The angle grinding device according to any one of claims 1 to 9 is correspondingly arranged in the second section for performing an angle grinding operation on the edges on opposite sides of the square silicon rod.

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