Transfer device for circuit board processing

Abstract

The utility model discloses a transfer device for circuit board processing in the technical field of circuit board processing, which comprises a circuit board body, a placing mechanism arranged on the outer side of the circuit board body, a conveying mechanism arranged below the placing mechanism, a foam base plate arranged below the circuit board body, and a bearing tray mounted at the lower end of the foam base plate. The transfer device for circuit board processing is composed of a placing mechanism and a conveying mechanism, the placing mechanism adopts a bearing protection structure and a limiting protection structure and is used for protecting a circuit board body in the transfer process, the limiting protection structure can shield the two sides of the circuit board body, and the circuit board body can be conveyed to the conveying mechanism through the bearing protection structure. The effect of protecting the circuit board body can be achieved, and the situation that the circuit board body is collided or scattered in the transportation process is avoided; the conveying mechanism adopts a bearing structure and a displacement structure, a large number of circuit board bodies and placing mechanisms can be stacked, the conveying mechanism is also used for stacking unused placing mechanisms, and the transferring number of the circuit board bodies and the placing mechanisms is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a transfer device for circuit board processing. Background Art

[0002] Circuit board processing refers to the process of converting circuit design drawings into actual circuit boards, which involves multiple steps and technologies. First, the designer uses specialized software to draw the circuit diagram and generate the corresponding layout file. Next, a suitable substrate is selected, such as FR-4, CEM-1, etc., for cutting and forming. Then, the conductive pattern is transferred to the substrate by printing the circuit, usually using photolithography, etching and other technologies. In this step, the insulating layer and conductive layer of the circuit are precisely formed to ensure the effective transmission of current. After that, holes are drilled to install components. Finally, the circuit board will be tested and inspected to confirm its function and quality to ensure that it meets the design requirements. The entire process not only requires precise manufacturing technology, but also relies on advanced equipment and technology, and is widely used in the production of electronic products.

[0003] In combination with existing transfer devices for circuit board processing, it was found that existing devices were insufficiently adaptable to circuit boards of different sizes and types, and could not meet diverse production needs. During the transfer process, effective safety protection measures were lacking. In particular, some devices stacked the circuit boards together without protection. The bumps during transportation could cause constant friction between the circuit boards, and even damage the circuit boards.

[0004] Based on this, the present invention designs a transfer device for circuit board processing to solve the above problems. Utility Model Content

[0005] The purpose of the present utility model is to provide a transfer device for processing circuit boards to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a transfer device for processing circuit boards, comprising a circuit board body, a placing mechanism is provided on the outside of the circuit board body, a transport mechanism is provided below the placing mechanism, the placing mechanism comprises a carrying tray, a foam pad, a wall guard pad, a bearing frame, a rotating rod, a shield plate, a foam cushion, a mounting seat, a spring body and a buffer rubber pad, a foam pad is provided below the circuit board body, a carrying tray is installed at the lower end of the foam pad, a wall guard pad is fixedly installed on the inner wall of the carrying tray, a bearing frame is fixedly installed on the outer wall of the carrying tray, a rotating rod is installed at the upper end of the bearing frame, a shield plate is fixedly installed in the middle of the rotating rod, and the shield plate The lower end of the carrier is fixedly installed with a foam cushion, the upper end of the shield plate is fixedly installed with a mounting seat, the interior of the mounting seat is fixedly installed with a spring body, the upper end of the spring body is fixedly installed with a buffer rubber pad, the transportation mechanism includes a load-bearing pallet, a displacement roller, a limit rod, a limit slider, a groove, a limit baffle and a push rod, the lower end of the load-bearing pallet is provided with a load-bearing pallet, the lower end of the load-bearing pallet is installed with a displacement roller, the front and rear ends of the load-bearing pallet are fixedly installed with a limit rod, the front and rear ends of the load-bearing pallet are fixedly installed with a limit slider, the limit slider is slidably connected with the limit rod, the limit rod is provided with a groove, the right end of the load-bearing pallet is installed with a limit baffle, and the left end of the load-bearing pallet is fixedly installed with a push rod.

[0007] Optionally, four groups of the bearing frames are installed at the left and right ends of the carrying tray, two groups of the rotating rods, shielding plates and foam cushions are installed between the bearing frames, and a protruding rod is installed on the outer wall of the rotating rod.

[0008] Optionally, a protruding rod is installed on the inner wall of the bearing frame, the rotating rod and the bearing frame are connected by a protruding rod buckle, and two sets of the mounting seats, spring bodies and buffer pads are installed on the upper ends of the two shielding plates.

[0009] Optionally, the four displacement rollers are installed at the lower end of the carrying tray, the limit rod is located on the outside of the carrying tray, the multiple extraction slots are distributed on the limit rod from top to bottom, and the four limit rods are fixedly installed on the front and back sides of the carrying tray.

[0010] Optionally, two of the limit baffles are installed on the right end of the carrying tray, and multiple groups of the placement mechanisms are stacked on the inner side of the limit baffles.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. In the present invention, a placement mechanism is provided, which adopts a supporting and protective structure and a limiting protective structure. The supporting and protective structure can directly support and place the circuit board body to protect the circuit board body during transportation. The limiting protective structure can be flipped to block both sides of the circuit board body, which can achieve the effect of protecting the circuit board body and avoid the circuit board body from being bumped or scattered during transportation, thereby effectively improving the stability and reliability of conveying the circuit board body.

[0013] 2. In the present invention, a transport mechanism 3 is provided. The transport mechanism adopts a supporting structure and a displacement structure. The supporting structure supports multiple sets of circuit boards and placement mechanisms, which can achieve the effect of stacking a large number of circuit boards and placement mechanisms. It is also used to stack unused placement mechanisms, ensuring the number of circuit boards and placement mechanisms that can be transported. The displacement structure uses four displacement rollers and a push rod to perform the displacement function, which can realize the transport and transposition operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of the utility model in a three-dimensional front view;

[0015] Figure 2 This is a schematic structural diagram of the utility model when viewed from the front plane;

[0016] Figure 3 This is a schematic diagram of the structure of the utility model from a three-dimensional top view;

[0017] Figure 4 This is a schematic diagram of the structure of the utility model from a plan view;

[0018] Figure 5 This is a schematic diagram of the structure of the utility model in a three-dimensional cross-section Figure 1 ;

[0019] Figure 6 This is a schematic diagram of the structure of the utility model in a three-dimensional cross-section Figure 2 ;

[0020] Figure 7 This is a schematic diagram of the structure of the utility model in a three-dimensional cross-section Figure 3 ;

[0021] Figure 8 For this utility model Figure 6 A schematic diagram of the structure of the three-dimensional enlargement at point A;

[0022] Figure 9 For this utility model Figure 7 Schematic diagram of the three-dimensional enlarged structure at point B in the middle.

[0023] In the figure: 1. Circuit board body; 2. Placing mechanism; 201. Carrying tray; 202. Foam pad; 203. Wall guard pad; 204. Bearing frame; 205. Rotating rod; 206. Shield; 207. Foam cushion; 208. Mounting seat; 209. Spring body; 210. Buffering rubber pad; 3. Transport mechanism; 301. Carrying tray; 302. Displacement roller; 303. Limit rod; 304. Limit slider; 305. Slot; 306. Limit baffle; 307. Push rod. DETAILED DESCRIPTION

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0025] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] See also Figures 1 to 9In the embodiment of the present invention, a transfer device for processing a circuit board includes a circuit board body 1, a placing mechanism 2 is provided on the outside of the circuit board body 1, and a transport mechanism 3 is provided below the placing mechanism 2. The placing mechanism 2 includes a carrying tray 201, a foam pad 202, a wall protection pad 203, a bearing frame 204, a rotating rod 205, a shielding plate 206, a foam cushion 207, a mounting seat 208, a spring body 209 and a buffer rubber pad 210. A foam pad 202 is provided below the circuit board body 1, and a carrying tray 201 is installed at the lower end of the foam pad 202. The wall protection pad 203 is fixedly installed on the inner wall of the carrying tray 201, and the bearing frame 204 is fixedly installed on the outer wall of the carrying tray 201. The upper end of the bearing frame 204 is installed with a rotating rod 205. A shield plate 206 is fixedly installed on the middle part of the rod 205, a foam cushion 207 is fixedly installed on the lower end of the shield plate 206, a mounting seat 208 is fixedly installed on the upper end of the shield plate 206, a spring body 209 is fixedly installed inside the mounting seat 208, and a buffer rubber pad 210 is fixedly installed on the upper end of the spring body 209. Four sets of bearing frames 204 are installed on the left and right ends of the carrying tray 201, and two sets of rotating rods 205, shield plates 206 and foam cushions 207 are installed between the bearing frames 204. A convex rod is installed on the outer wall of the rotating rod 205, and a convex rod is installed on the inner wall of the bearing frame 204. The rotating rod 205 and the bearing frame 204 are connected by a convex rod buckle. Two sets of mounting seats 208, a spring body 209 and a buffer rubber pad 210 are installed on the upper ends of the two shield plates 206;

[0028] See also Figure 5 、 Figure 8 and Figure 9 Initially, the placement mechanism 2 adopts a supporting protection structure and a limiting protection structure. The supporting protection structure is a carrying tray 201, a foam pad 202 and a wall pad 203. The limiting protection structure is a bearing frame 204, a rotating rod 205, a shielding plate 206, a foam cushion 207, a mounting seat 208, a spring body 209 and a buffer rubber pad 210. When placing the circuit board body 1, first place the circuit board body 1 on the foam pad 202. When the circuit board body 1 is on the foam pad 202, it can protect the bottom of the circuit board body 1, and the wall pad 203 can protect the side wall of the circuit board body 1. Then, the limiting protection structure is activated and the circuit board body 1 is flipped and rotated. The rod 205 and the shielding plate 206 enable the shielding plate 206 to shield both sides of the circuit board body 1. At this time, the foam pad 207 shields the circuit board body 1, thereby protecting the circuit board body 1. In addition, the bearing frame 204 and the rotating rod 205 are connected by a protruding rod buckle, which is convenient for the user to flip and adjust, thereby improving the efficiency of disassembling and assembling the shielding plate 206 and the foam pad 207. At the same time, the mounting seat 208, the spring body 209 and the buffer pad 210 at the upper end of the shielding plate 206 can also provide an elastic buffering function. When multiple sets of placement mechanisms 2 are stacked, the spring body 209 and the buffer pad 210 can provide effective buffering and protection effects.

[0029] Among them, the placement mechanism 2 adopts a supporting protection structure and a limiting protection structure. The supporting protection structure can directly support and place the circuit board body 1 to protect the circuit board body 1 during transportation. The limiting protection structure can be flipped to block both sides of the circuit board body 1, which can achieve the effect of protecting the circuit board body 1 and prevent the circuit board body 1 from being bumped or scattered during transportation, effectively improving the stability and reliability of conveying the circuit board body 1;

[0030] The transport mechanism 3 includes a carrying tray 301, a displacement roller 302, a limiting rod 303, a limiting slider 304, a pulling groove 305, a limiting baffle 306 and a push rod 307. The lower end of the carrying tray 201 is provided with a carrying tray 301, and the lower end of the carrying tray 301 is installed with a displacement roller 302. The front and rear ends of the carrying tray 301 are fixedly installed with a limiting rod 303, and the front and rear ends of the carrying tray 201 are fixedly installed with a limiting slider 304. The limiting slider 304 is slidably connected to the limiting rod 303, and a pulling groove is provided on the limiting rod 303. Slot 305, a limit baffle 306 is installed on the right end of the carrying tray 301, a push rod 307 is fixedly installed on the left end of the carrying tray 301, four displacement rollers 302 are installed at the lower end of the carrying tray 301, a limit rod 303 is located on the outside of the carrying tray 201, multiple extraction slots 305 are distributed on the limit rod 303 from top to bottom, four limit rods 303 are fixedly installed on the front and back sides of the carrying tray 201, two limit baffles 306 are installed on the right end of the carrying tray 301, and multiple sets of placement mechanisms 2 are stacked on the inner side of the limit baffle 306;

[0031] See also Figure 3 、 Figure 5 and Figure 8 The transport mechanism 3 adopts a supporting structure and a displacement structure. The supporting structure is a bearing plate 301, a limiting rod 303, a limiting slider 304, a pulling groove 305 and a limiting baffle 306. The displacement structure is a displacement roller 302 and a push rod 307. Multiple sets of placement mechanisms 2 are stacked between the two limiting baffles 306. The placement mechanism 2 is used as a spare and can place the circuit board body 1. The limiting rod 303 is used to limit the position of the placement mechanism 2. After the circuit board body 1 is placed in the placement mechanism 2, the placement mechanism 2 can be stacked between the limiting rods 303 to achieve a limited stacking effect. The displacement roller 302 in the displacement structure can provide a displacement function, and the push rod 307 is convenient for users to push.

[0032] The transport mechanism 3 uses a supporting structure and a displacement structure. The supporting structure supports multiple sets of circuit boards 1 and placement mechanisms 2, enabling the stacking of a large number of circuit boards 1 and placement mechanisms 2. It is also used to stack unused placement mechanisms 2, ensuring the transport quantity of circuit boards 1 and placement mechanisms 2. The displacement structure uses four displacement rollers 302 and a push rod 307 to perform the displacement function, enabling transport and transposition operations.

[0033] The working principle of the present invention is as follows: first, the carrying tray 301 supports multiple circuit boards 1 and the placement mechanism 2, and the limiting rod 303 and the limiting slider 304 ensure that the placement mechanism 2 is in a stable position on the carrying tray 301. After the circuit board 1 is placed in the placement mechanism 2, when placing the circuit board 1, the circuit board 1 is first placed on the foam pad 202. When the circuit board 1 is on the foam pad 202, it can protect the bottom of the circuit board 1, and the wall pad 203 can protect the side wall of the circuit board 1. Then, the limiting protection structure is activated, and the rotating rod 205 and the shielding plate 206 are flipped. , so that the shielding plate 206 covers both sides of the circuit board body 1. At this time, the foam pad 207 covers the circuit board body 1, achieving the effect of protecting the circuit board body 1 and ensuring the safety of the circuit board body 1. Subsequently, through the action of the displacement roller 302, the entire carrying pallet 301 can be smoothly moved on the horizontal plane. The push rod 307 provides a user with an easy-to-control method. The user only needs to push the push rod 307 to achieve the displacement of the device. This device can not only effectively stack a large number of circuit boards 1 and placement mechanisms 2, but also reduce the complexity of manual operation during the transportation process, thereby improving the overall work efficiency.

[0034] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A transfer device for processing a circuit board, comprising a circuit board body (1), characterized in that: A placement mechanism (2) is provided on the outside of the circuit board body (1), and a transport mechanism (3) is provided below the placement mechanism (2). The placement mechanism (2) comprises a carrying tray (201), a foam pad (202), a wall pad (203), a bearing frame (204), a rotating rod (205), a shielding plate (206), a foam cushion (207), a mounting seat (208), a spring body (209) and a buffer rubber pad (210). A foam pad (202) is provided below the circuit board body (1). A carrying tray (201) is mounted on the lower end of the foam pad (202), a wall protection pad (203) is fixedly mounted on the inner wall of the carrying tray (201), a bearing frame (204) is fixedly mounted on the outer wall of the carrying tray (201), a rotating rod (205) is mounted on the upper end of the bearing frame (204), a shielding plate (206) is fixedly mounted on the middle part of the rotating rod (205), a foam cushion (207) is fixedly mounted on the lower end of the shielding plate (206), and a foam cushion (207) is fixedly mounted on the upper end of the shielding plate (206). A mounting seat (208) is provided, a spring body (209) is fixedly installed inside the mounting seat (208), a buffer rubber pad (210) is fixedly installed on the upper end of the spring body (209), the transport mechanism (3) comprises a bearing tray (301), a displacement roller (302), a limiting rod (303), a limiting slider (304), a groove (305), a limiting baffle (306) and a push rod (307), the lower end of the bearing tray (201) is provided with a bearing tray (301), the bearing tray (301) A displacement roller (302) is installed at the lower end of the support plate (301), a limiting rod (303) is fixedly installed at both the front and rear ends of the support plate (301), a limiting slider (304) is fixedly installed at both the front and rear ends of the support tray (201), the limiting slider (304) is slidably connected to the limiting rod (303), a pulling groove (305) is provided on the limiting rod (303), a limiting baffle (306) is installed at the right end of the support plate (301), and a push rod (307) is fixedly installed at the left end of the support plate (301).

2. A transfer device for circuit board processing according to claim 1, characterized in that: Four groups of bearing frames (204) are installed at the left and right ends of the carrying tray (201), two groups of rotating rods (205), shielding plates (206) and foam cushions (207) are installed between the bearing frames (204), and a protruding rod is installed on the outer wall of the rotating rod (205).

3. A transfer device for circuit board processing according to claim 1, characterized in that: A protruding rod is installed on the inner wall of the bearing frame (204), the rotating rod (205) and the bearing frame (204) are connected via a protruding rod buckle, and the upper ends of the two shielding plates (206) are each installed with two sets of the mounting seats (208), spring bodies (209) and buffer rubber pads (210).

4. A transfer device for circuit board processing according to claim 1, characterized in that: The four displacement rollers (302) are mounted on the lower end of the carrying tray (301), the limiting rod (303) is located outside the carrying tray (201), the plurality of extraction slots (305) are distributed on the limiting rod (303) from top to bottom, and the four limiting rods (303) are fixedly mounted on the front and rear sides of the carrying tray (201).

5. The transfer device for circuit board processing according to claim 1, characterized in that: The two limiting baffles (306) are installed at the right end of the supporting plate (301), and a plurality of the placing mechanisms (2) are stacked on the inner side of the limiting baffles (306).

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