Stretchable composite heat-conducting adhesive film

By designing a stretchable composite thermally conductive adhesive film, the problem of poor adhesion caused by cutting and thermal deformation of the thermally conductive adhesive film is solved, and the adaptive thermal conductivity effect is improved when the temperature changes.

CN223329231UActive Publication Date: 2025-09-12SUZHOU VERYBOND MATERIALS CO LTD
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Patent Information

Application Number
CN202422723837.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-08
Publication Date
2025-09-12
Estimated Expiration
2034-11-08

AI Technical Summary

Technical Problem

Existing thermally conductive adhesive films need to be cut according to the specifications of electronic components during use, and are prone to poor adhesion due to thermal deformation, thereby affecting the thermal conductivity.

Method used

A stretchable composite thermally conductive adhesive film is designed. The structure, from top to bottom, includes a protective outer layer, a composite thermally conductive layer, a base material layer, an adhesive layer and a release layer. The composite thermally conductive layer contains a silicone layer and a graphene thermally conductive layer. The base material layer has a multi-segment structure, including a substrate layer and a stretching layer, which can adapt to deformation caused by temperature changes.

Benefits of technology

The adaptability of the thermally conductive adhesive film is improved to ensure that electronic components can still be effectively attached when the temperature changes, thereby improving the thermal conductivity.

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Abstract

The utility model discloses a stretchable composite heat-conducting adhesive film which is sequentially provided with a protective outer layer, a composite heat-conducting layer, a substrate material layer, an adhesive layer and a release layer from top to bottom, the lower portion of the protective outer layer is attached to the surface of the composite heat-conducting layer, and the composite heat-conducting layer comprises a first silica gel layer, a graphene heat-conducting layer and a second silica gel layer. A gap cavity is formed between the first silica gel layer and the second silica gel layer, the graphene heat conduction layer is located in the gap cavity, the bottom of the composite heat conduction layer is connected with the substrate material layer, the bottom of the substrate material layer is attached to the adhesive layer, and the substrate material layer is of a multi-section structure and is composed of a plurality of sets of substrate layers and stretching layers. And the base material layers and the stretching layers are alternately distributed. The self-adaptive heat-conducting adhesive film can be self-adaptive to the problem of deformation of the adhesive film caused by temperature change of a use environment, so that the heat-conducting effect of the heat-conducting adhesive film on an electronic component is ensured, and the heat-conducting effect of the heat-conducting adhesive film can be effectively improved as the graphene heat-conducting layer is arranged in the heat-conducting layer in the heat-conducting adhesive film.
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Description

Technical Field

[0001] The utility model relates to the technical field of thermally conductive adhesive films, in particular to a stretchable composite thermally conductive adhesive film. Background Art

[0002] Thermally conductive film is a thin film material with excellent thermal conductivity. It is commonly used in electronic products, optical devices, automotive parts and other fields to conduct heat and help dissipate heat. Thermally conductive film is usually composed of thermal conductive materials and adhesives. Thermally conductive film is widely used in electronic products, such as surface mount cooling, CPU cooling, LED light cooling, etc., which can effectively improve the heat dissipation effect of the device and protect the device from overheating damage. With the rapid development of electronic technology, the integration density of electronic components and devices is increasing, and the size is constantly shrinking, which puts higher and higher requirements on the heat dissipation system. Thermal interface materials are an important means to solve the heat dissipation problem of electronic devices. Common thermal interface materials include thermal paste, thermal gaskets, thermal adhesives, thermal conductive films and phase change materials. Thermally conductive film has self-adhesiveness, flexibility, conformability and high compression ratio. It can fill uneven surfaces and can tightly and firmly adhere to heat source devices and heat sinks, effectively solving problems such as heat conduction, insulation and buffering, and is the best thermal interface material between heat sinks and chips.

[0003] However, existing thermally conductive adhesive films present the following challenges during use: Prior to use, thermally conductive adhesive films often need to be cut to the appropriate specifications of the electronic components being used to ensure they meet the required specifications. However, in actual use, thermally conductive adhesive films can sometimes deform due to heat, which can lead to poor adhesion to electronic components and compromised thermal conductivity. Therefore, a corresponding technical solution is needed to address these issues. Utility Model Content

[0004] The purpose of the present utility model is to provide a stretchable composite thermally conductive adhesive film, which solves the technical problem that the thermally conductive adhesive film often needs to be cut to corresponding specifications according to the specifications of the electronic components used before use to ensure that the cut thermally conductive adhesive film can meet the needs. However, during actual use, the thermally conductive adhesive film may sometimes be deformed when heated, which can easily lead to a poor adhesion effect of the thermally conductive adhesive film to the electronic components, thereby affecting the thermal conductivity effect.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a stretchable composite thermally conductive adhesive film, which is provided with a protective outer layer, a composite thermally conductive layer, a base material layer, an adhesive layer and a release layer in sequence from top to bottom, the lower part of the protective outer layer is attached to the surface of the composite thermally conductive layer, the composite thermally conductive layer includes a silicone layer 1, a graphene thermally conductive layer and a silicone layer 2, a gap cavity is formed between the silicone layer 1 and the silicone layer 2, the graphene thermally conductive layer is located in the gap cavity, the bottom of the composite thermally conductive layer is connected to the base material layer, the bottom of the base material layer is attached to the adhesive layer, the base material layer is a multi-segment structure and is composed of several groups of base material layers and stretching layers, the base layer and the stretching layer are distributed alternately, and the release layer is attached to the bottom of the adhesive layer.

[0006] As a preferred embodiment of the present invention, the protective outer layer and the release layer are both made of polyethylene material, and the thickness of the protective outer layer is the same as that of the release layer, and both are 0.3 mm to 0.6 mm.

[0007] As a preferred embodiment of the present invention, the interior of the silicone layer 1 is processed to form several groups of stretching grooves, and the two adjacent groups of stretching grooves are distributed in a V shape. The silicone layer 2 has the same structure as the silicone layer 1 and has a thickness of 0.6mm-0.9mm. The silicone layer 2 and the silicone layer 1 are both made of silicone rubber material.

[0008] As a preferred embodiment of the present invention, the graphene heat-conducting layer is composed of several groups of graphene particles, and the several groups of graphene particles are evenly distributed in the gap cavity, and the diameter of the graphene particles is 0.01 mm-0.03 mm.

[0009] As a preferred embodiment of the present invention, the substrate layer has a curved surface structure with a raised middle portion and is made of a polyimide film material. The thickness of the substrate layer is 1.2 mm to 1.5 mm.

[0010] As a preferred embodiment of the present invention, the surface of the stretching layer is formed into a laminated structure and is distributed on both sides of the substrate layer. The thickness of the stretching layer is the same as that of the substrate layer.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0012] 1. This solution improves the existing thermally conductive adhesive film structure and designs a stretchable composite thermally conductive adhesive film. The composite thermally conductive adhesive film can adapt to the deformation problem caused by changes in the operating environment temperature, thereby ensuring the thermal conductivity of the thermally conductive adhesive film for electronic components. In addition, a graphene thermal conductive layer is provided within the thermal conductive layer inside the thermally conductive adhesive film, which can effectively improve the thermal conductivity of the thermally conductive adhesive film.

[0013] 2. The stretchable composite thermally conductive adhesive film designed in this solution can adapt to the deformation problem caused by temperature changes and can improve the thermal conductivity of the thermally conductive adhesive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is the overall structural diagram of the utility model;

[0015] Figure 2 This is a cross-sectional view of the silica gel layer of the present invention;

[0016] Figure 3 This is a structural diagram of the base material layer described in the present utility model.

[0017] In the figure: 1. Protective outer layer; 2. Composite thermal conductive layer; 3. Base material layer; 4. Adhesive layer; 5. Release layer; 6. Silicone layer 1; 7. Graphene thermal conductive layer; 8. Silicone layer 2; 9. Gap cavity; 10. Base material layer; 11. Stretching layer; 12. Stretching groove; 13. Graphene particles. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figure 1-3 The utility model provides a technical solution: a stretchable composite thermal conductive adhesive film, which is sequentially provided with a protective outer layer 1, a composite thermal conductive layer 2, a base material layer 3, an adhesive layer 4 and a release layer 5 from top to bottom. The lower part of the protective outer layer 1 is attached to the surface of the composite thermal conductive layer 2. The composite thermal conductive layer 2 includes a silicone layer 1 6, a graphene thermal conductive layer 7 and a silicone layer 2 8. A gap cavity 9 is formed between the silicone layer 1 6 and the silicone layer 2 8. The graphene thermal conductive layer 7 is located in the gap cavity 9. The bottom of the composite thermal conductive layer 2 is connected to the base material layer 3. The bottom of the base material layer 3 is attached to the adhesive layer 4. The base material layer 3 is a multi-segment structure and is composed of several groups of base material layers 10 and stretching layers 11. The base material layers 10 and the stretching layers 11 are distributed alternately. The release layer 5 is attached to the bottom of the adhesive layer 4.

[0020] Further improvement, such as Figure 1 As shown, the protective outer layer 1 and the release layer 5 are both made of polyethylene material, and the thickness of the protective outer layer 1 is the same as that of the release layer 5 and is 0.3 mm to 0.6 mm.

[0021] Further improvement, such as Figure 1 and 2As shown, the interior of the silicone layer 6 is processed and formed with several groups of stretching grooves 12, and two adjacent groups of stretching grooves 12 are distributed in a V shape. The silicone layer 2 8 has the same structure as the silicone layer 1 6 and has a thickness of 0.6mm-0.9mm. The silicone layer 2 8 and the silicone layer 1 6 are both made of silicone rubber material, which facilitates the deformation and stretching adjustment of the composite thermal conductive layer 2.

[0022] Further improvement, such as Figure 1 As shown, the graphene thermal conductive layer 7 is composed of several groups of graphene particles 13, which are evenly distributed in the gap cavity 9. The diameter of the graphene particles 13 is 0.01mm-0.03mm. The graphene material can effectively improve the thermal conductivity of the thermal conductive adhesive film.

[0023] Further improvement, such as Figure 1 As shown, the substrate layer 10 has a curved surface structure with a raised middle portion and is made of a polyimide film material. The thickness of the substrate layer 10 is 1.2 mm to 1.5 mm, which facilitates deformation adjustment and stretching of the substrate layer 10 .

[0024] Specifically, the surface of the stretching layer 11 is processed into a laminated structure and distributed on both sides of the substrate layer 10. The thickness of the stretching layer 11 is the same as that of the substrate layer 10. The laminated structure of the stretching layer 11 can improve the deformation adaptability of the base material layer 3.

[0025] During use: When it is necessary to attach a thermally conductive adhesive film to electronic components, the staff can remove the protective outer layer 1 and the release layer 5. During actual use, if the thermally conductive adhesive film is affected by temperature and deforms, the self-deformation and stretching ability of the composite thermally conductive layer 2 and the base material layer 3 can ensure the thermal conductivity of the thermally conductive adhesive film on the surface of the electronic components. In addition, the graphene material can effectively improve the thermal conductivity of the thermally conductive adhesive film.

[0026] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "two ends", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one such feature.

[0028] In the present invention, unless otherwise clearly stipulated and limited, the terms "install", "set", "connect", "fix", "screw" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0029] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A stretchable composite thermally conductive adhesive film, characterized in that: From top to bottom, a protective outer layer (1), a composite heat-conducting layer (2), a base material layer (3), an adhesive layer (4) and a release layer (5) are sequentially arranged. The lower portion of the protective outer layer (1) is attached to the surface of the composite heat-conducting layer (2). The composite heat-conducting layer (2) includes a silicone layer (1) (6), a graphene heat-conducting layer (7) and a silicone layer (2) (8). A gap cavity (9) is formed between the silicone layer (1) (6) and the silicone layer (2) (8). The graphene heat-conducting layer (7) is located in the gap cavity (9). The bottom of the composite heat-conducting layer (2) is connected to the base material layer (3). The bottom of the base material layer (3) is attached to the adhesive layer (4). The base material layer (3) is a multi-segment structure and is composed of several groups of base material layers (10) and stretching layers (11). The base material layers (10) and stretching layers (11) are alternately distributed. The release layer (5) is attached to the bottom of the adhesive layer (4).

2. The stretchable composite thermally conductive adhesive film according to claim 1, characterized in that: The protective outer layer (1) and the release layer (5) are both made of polyethylene material. The thickness of the protective outer layer (1) is the same as that of the release layer (5), and both are 0.3 mm to 0.6 mm.

3. The stretchable composite thermally conductive adhesive film according to claim 1, characterized in that: The interior of the silicone layer 1 (6) is processed to form a plurality of groups of stretching grooves (12), and two adjacent groups of stretching grooves (12) are distributed in a V shape. The silicone layer 2 (8) has the same structure as the silicone layer 1 (6) and has a thickness of 0.6mm-0.9mm. The silicone layer 2 (8) and the silicone layer 1 (6) are both made of silicone rubber material.

4. The stretchable thermally conductive composite adhesive film according to claim 1, wherein: The graphene heat-conducting layer (7) is composed of several groups of graphene particles (13), and the several groups of graphene particles (13) are evenly distributed in the gap cavity (9), and the diameter of the graphene particles (13) is 0.01 mm-0.03 mm.

5. The stretchable thermally conductive composite adhesive film according to claim 1, characterized in that: The substrate layer (10) has a curved surface structure with a raised middle portion and is made of a polyimide film material. The thickness of the substrate layer (10) is 1.2 mm to 1.5 mm.

6. The stretchable thermally conductive composite adhesive film according to claim 5, characterized in that: described The surface of the stretching layer (11) is processed and formed into a laminated structure and is distributed on both sides of the base material layer (10). The thickness of the stretching layer (11) is the same as the thickness of the substrate layer (10).