Semiconductor lighting module mounting structure

Abstract

The utility model discloses a semiconductor lighting module mounting structure, which relates to the technical field of lighting modules and is characterized in that two ends of a shell are fixedly connected with fixing plates respectively, a sliding groove is formed in the bottom of the shell, a plurality of sliding holes are axially formed in the bottom of the shell, the sliding holes are communicated with the sliding groove, and an aluminum substrate is arranged at the bottom end of the shell and connected with the shell in an abutting mode. The top end of the aluminum substrate is axially and fixedly connected with a plurality of sliding seats, the sliding seats are clamped and connected in the sliding grooves and are in sliding connection with the inner walls of the sliding grooves, the circuit board is arranged at the top end of the aluminum substrate and is in sliding connection with the aluminum substrate, and the top end of the circuit board is fixedly connected with a semiconductor; a worker controls the aluminum substrate to rotate, the aluminum substrate drives the sliding seat to rotate along the sliding groove, when the sliding groove is aligned with the sliding hole, the worker controls the aluminum substrate to vertically move downwards, so that the aluminum substrate is taken down from the shell, and the worker only needs to rotate the aluminum substrate to achieve the effect of disassembling and assembling the circuit board from the shell.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting modules, in particular to a semiconductor lighting module installation structure. Background Art

[0002] A lighting module is a device that integrates a light source and control circuit to provide a lighting solution. It can be a simple LED lighting module or a complex intelligent lighting module that can achieve automated and intelligent lighting control through sensors, controllers and communication protocols.

[0003] In the existing technology, the lighting module is mainly composed of a circuit board, a semiconductor, a shell and a heat sink. The semiconductor is fixed to the circuit board by welding, the heat sink is fixed to the circuit board for heat dissipation, and the circuit board is fixed in the shell by multiple screws to achieve the installation of the lighting module.

[0004] However, when the semiconductor is damaged, the circuit board needs to be removed from the housing, and the staff needs to remove multiple screws. This operation is time-consuming and labor-intensive, affecting the use effect of the semiconductor lighting module. Utility Model Content

[0005] The purpose of the present utility model is to provide a semiconductor lighting module installation structure to solve the technical problem in the prior art that when the semiconductor is damaged, the circuit board needs to be removed from the housing and the staff needs to remove multiple screws, which is a time-consuming and labor-intensive operation and affects the use effect of the semiconductor lighting module.

[0006] The technical problem to be solved by the present invention can be achieved through the following technical solutions:

[0007] A semiconductor lighting module mounting structure, comprising:

[0008] A housing, wherein both ends of the housing are fixedly connected to fixed plates, a slide groove is provided at the bottom of the housing, and a plurality of slide holes are axially provided at the bottom of the housing, wherein the slide holes are connected to the slide groove;

[0009] An aluminum base plate, the aluminum base plate is arranged at the bottom end of the housing and is abutted against the housing, and a plurality of slides are axially fixedly connected to the top end of the aluminum base plate, the slides are clamped and connected in the slide groove and are slidably connected to the inner wall of the slide groove;

[0010] The circuit board is arranged on the top of the aluminum substrate and is slidably connected to the aluminum substrate. The top of the circuit board is fixedly connected with a semiconductor.

[0011] As a further solution of the present invention: a rotating plate is fixedly connected to both ends of the circuit board, the rotating plate is rotatably connected to the inner wall of the shell, and a limiting groove is opened on the top of the aluminum substrate in a direction parallel to the axis of the circuit board.

[0012] As a further solution of the present invention: the inner wall of the limit groove is clamped and connected with a limit seat, the side end of the limit seat is abutted and connected with the inner wall of the limit groove and is slidably connected with the inner wall of the limit groove, and the top end of the limit seat is fixedly connected to the circuit board.

[0013] As a further solution of the present invention: a plurality of heat sinks are fixedly connected to the bottom of the aluminum substrate, locking assemblies are fixedly connected on both sides of the bottom of the aluminum substrate, and locking plates are fixedly connected on both sides of the inner wall of the shell.

[0014] As a further solution of the present invention: the locking assembly includes: a locking column and a spring, the upper and lower ends of the spring are fixedly connected to the aluminum base plate and the locking column respectively, limiting holes are respectively penetrated on both sides of the aluminum base plate, the locking plate is provided with a locking hole, the locking column is slidably connected to the inner wall of the limiting hole, the locking column is slidably connected to the locking hole and is abutted against the inner wall of the locking hole.

[0015] As a further solution of the present invention: a connecting plate is provided at the bottom end of the locking column, and both ends of the connecting plate are fixedly connected to the locking column respectively.

[0016] Beneficial effects of the utility model:

[0017] 1. When the semiconductor is damaged and needs to be replaced, the staff controls the aluminum substrate to rotate, and the aluminum substrate drives the slide to rotate along the slide groove. When the slide groove is aligned with the slide hole, the staff controls the aluminum substrate to move vertically downward, thereby removing the aluminum substrate from the shell. The staff only needs to rotate the aluminum substrate to achieve the effect of disassembling and assembling the circuit board from the shell, avoiding the time-consuming and laborious operation of fixing the aluminum substrate to the shell with screws in the existing technology. Then the staff can remove the circuit board from the aluminum substrate.

[0018] 2. The two sides of the shell are installed through fixed fixing plates, thereby achieving the effect of fixing the aluminum substrate and the circuit board. Among them, the card connection between the slide groove and the slide seat provides support and fixation for the aluminum substrate, and the slide hole facilitates the slide seat to enter or exit the slide groove. It should be noted that when the circuit board and semiconductor are installed inside the shell, the aluminum substrate and the bottom end of the shell are abutted against each other, thereby ensuring that the inside of the shell is in a sealed environment, preventing dust from entering the shell and interfering with the normal operation of the circuit board and semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2This is a front view of the overall structure of the utility model;

[0022] Figure 3 This is the AA cross-sectional view of the overall structure of the utility model;

[0023] Figure 4 BB is a cross-sectional view of the overall structure of the utility model;

[0024] Figure 5 This is a schematic diagram of the locking assembly structure of the utility model;

[0025] Figure 6 This is a schematic diagram of the rotating plate structure of the present utility model;

[0026] Figure 7 This is a schematic diagram of the shell structure of the utility model;

[0027] Figure 8 This is a schematic diagram of the limit groove structure of the utility model.

[0028] In the figure: 1. Housing; 2. Fixing plate; 3. Aluminum base plate; 4. Heat sink; 5. Connecting plate; 6. Locking column; 7. Spring; 8. Slide groove; 9. Slide seat; 10. Limit seat; 11. Circuit board; 12. Semiconductor; 13. Rotating plate; 14. Slide hole; 15. Locking plate; 16. Locking hole; 17. Limit hole; 18. Limit groove. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] like Figures 1-8 As shown, a semiconductor lighting module installation structure includes: a housing 1, an aluminum substrate 3 and a circuit board 11,

[0031] The two ends of the shell 1 are fixedly connected to the fixing plate 2, the bottom of the shell 1 is provided with a slide groove 8, and the bottom of the shell 1 is axially provided with a plurality of slide holes 14, the slide holes 14 are connected with the slide groove 8, the aluminum substrate 3 is arranged at the bottom of the shell 1 and is connected to the shell 1, the top of the aluminum substrate 3 is axially fixedly connected with a plurality of slide seats 9, the slide seat 9 is connected in the slide groove 8 and is slidably connected to the inner wall of the slide groove 8, the circuit board 11 is arranged at the top of the aluminum substrate 3 and is slidably connected to the aluminum substrate 3, the top of the circuit board 11 is fixedly connected with a semiconductor 12, and when the semiconductor 12 is damaged, it needs to be repaired. During replacement, the staff controls the aluminum substrate 3 to rotate, and the aluminum substrate 3 drives the slide 9 to rotate along the slide groove 8. When the slide groove 8 is aligned with the slide hole 14, the staff controls the aluminum substrate 3 to move vertically downward, thereby removing the aluminum substrate 3 from the housing 1. The staff only needs to rotate the aluminum substrate 3 to achieve the effect of disassembling and assembling the circuit board 11 from the housing 1, avoiding the time-consuming and laborious operation of fixing the aluminum substrate 3 to the housing 1 by screws in the prior art. Then the staff can remove the circuit board 11 from the aluminum substrate 3.

[0032] The two sides of the shell 1 are installed by fixed fixing plates 2, thereby achieving the effect of fixing the aluminum substrate 3 and the circuit board 11. Among them, the clamping connection between the slide groove 8 and the slide seat 9 provides support and fixation for the aluminum substrate 3, and the slide hole 14 facilitates the slide seat 9 to enter or exit the slide groove 8. It should be noted that when the circuit board 11 and the semiconductor 12 are installed inside the shell 1, the aluminum substrate 3 and the bottom end of the shell 1 are abutted, thereby ensuring that the inside of the shell 1 is in a sealed environment, preventing dust from entering the shell 1 and interfering with the normal operation of the circuit board 11 and the semiconductor 12.

[0033] In some specific embodiments, both ends of the circuit board 11 are fixedly connected with a rotating plate 13, and the rotating plate 13 is rotatably connected to the inner wall of the shell 1. A limiting groove 18 is provided on the top of the aluminum substrate 3 in a direction parallel to the axis of the circuit board 11. The inner wall of the limiting groove 18 is clamped and connected with the limiting seat 10. The side end of the limiting seat 10 is abutted and connected with the inner wall of the limiting groove 18 and is slidably connected with the inner wall of the limiting groove 18. The top of the limiting seat 10 is fixedly connected to the circuit board 11. When the aluminum substrate 3 is removed from the shell 1, the staff controls the circuit board 11 to slide along the aluminum substrate 3, and the circuit board 11 slides along the inner wall of the limiting groove 18 with the limiting seat 10, thereby realizing that the circuit board 11 is easy to remove from the aluminum substrate 3. 3, when the circuit board 11 is installed in the shell 1, the aluminum base plate 3 is installed at the bottom of the shell 1. At this time, the rotating plate 13 and the inner wall of the shell 1 are in abutment with each other, and the shell 1 and the inner wall of the rotating plate 13 are in abutment with each other to provide a limit for the circuit board 11, thereby preventing the circuit board 11 from deflecting on the aluminum base plate 3. The limit seat 10 and the inner wall of the limit groove 18 are connected by a clamping arrangement to provide a limit support for the circuit board 11. When the aluminum base plate 3 rotates, the aluminum base plate 3 drives the circuit board 11 to rotate through the limit seat 10 and the inner wall of the limit groove 18, thereby the circuit board 11 drives the rotating plate 13 to rotate, and the rotating plate 13 will not contact the locking plate 15 when rotating.

[0034] In some specific embodiments, a plurality of heat sinks 4 are fixedly connected to the bottom of the aluminum substrate 3, locking assemblies are fixedly connected on both sides of the bottom of the aluminum substrate 3, and locking plates 15 are fixedly connected on both sides of the inner wall of the outer shell 1. When the circuit board 11 and the semiconductor 12 are in operation, heat is generated, and the heat is transferred and dissipated through the aluminum substrate 3. The heat can be further dissipated through the heat sink 4. The heat sink 4 improves the heat dissipation effect of the aluminum substrate 3. The aluminum substrate 3 can be limited by the locking assembly to prevent the aluminum substrate 3 from rotating when installed at the bottom of the outer shell 1.

[0035] When the locking pin 6 is in the state of being inserted into the locking hole 16, the locking pin 6 is in the state of being pressed against the locking hole 16, and the locking pin 6 is in the state of being pressed against the locking hole 16.

[0036] In some specific implementation schemes, a connecting plate 5 is provided at the bottom end of the locking column 6, and both ends of the connecting plate 5 are fixedly connected to the locking column 6. The staff can control the connecting plate 5 to control the two sets of locking components to lock or unlock the aluminum substrate 3, which provides convenience for the use of the locking components and at the same time avoids the phenomenon of self-rotation of the locking column 6.

[0037] The above describes several embodiments of the present invention in detail, but the present invention is not limited to these embodiments and should not be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A semiconductor lighting module installation structure, characterized in that: include: A housing (1), wherein both ends of the housing (1) are fixedly connected to fixed plates (2), a slide groove (8) is provided at the bottom of the housing (1), and a plurality of slide holes (14) are axially provided at the bottom of the housing (1), and the slide holes (14) are communicated with the slide groove (8); An aluminum substrate (3), the aluminum substrate (3) being arranged at the bottom end of the housing (1) and being abutted against the housing (1), a plurality of slides (9) being axially fixedly connected to the top end of the aluminum substrate (3), the slides (9) being clamped and connected in the slide groove (8) and being slidably connected to the inner wall of the slide groove (8); A circuit board (11) is provided on the top of the aluminum substrate (3) and is slidably connected to the aluminum substrate (3); a semiconductor (12) is fixedly connected to the top of the circuit board (11).

2. A semiconductor lighting module mounting structure according to claim 1, characterized in that: Rotating plates (13) are fixedly connected to both ends of the circuit board (11), and the rotating plates (13) are rotatably connected to the inner wall of the housing (1). A limiting groove (18) is provided on the top of the aluminum substrate (3) in a direction parallel to the axis of the circuit board (11).

3. The semiconductor lighting module mounting structure according to claim 2, characterized in that: The inner wall of the limiting groove (18) is clamped and connected to the limiting seat (10), the side end of the limiting seat (10) is abutted and connected to the inner wall of the limiting groove (18) and is slidably connected to the inner wall of the limiting groove (18), and the top end of the limiting seat (10) is fixedly connected to the circuit board (11).

4. The semiconductor lighting module mounting structure according to claim 1, characterized in that: The bottom end of the aluminum substrate (3) is fixedly connected to a plurality of heat sinks (4), the two sides of the bottom of the aluminum substrate (3) are respectively fixedly connected to locking assemblies, and the two sides of the inner wall of the housing (1) are respectively fixedly connected to locking plates (15).

5. The semiconductor lighting module mounting structure according to claim 4, characterized in that: The locking assembly comprises: a locking column (6) and a spring (7); the upper and lower ends of the spring (7) are fixedly connected to the aluminum substrate (3) and the locking column (6), respectively; limiting holes (17) are respectively provided on both sides of the aluminum substrate (3); the locking plate (15) is provided with a locking hole (16); the locking column (6) is slidably connected to the inner wall of the limiting hole (17); the locking column (6) is slidably connected to the locking hole (16) and is abutted against the inner wall of the locking hole (16).

6. The semiconductor lighting module mounting structure according to claim 5, characterized in that: A connecting plate (5) is provided at the bottom end of the locking column (6), and both ends of the connecting plate (5) are fixedly connected to the locking column (6) respectively.

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