Heat dissipation structure of display screen

Abstract

The utility model relates to a heat dissipation structure of a display screen. The heat dissipation structure of the display screen comprises a backlight iron stand, a supporting assembly, an FPC board and a heating module, wherein the supporting assembly is arranged on the backlight iron stand; the FPC board is arranged on the supporting assembly; the heating module is arranged on the FPC board. According to the scheme provided by the invention, the functional module on the PCB can be separated from the display screen.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a heat dissipation structure of a display screen. Background Art

[0002] Currently, functional modules on displays with PCBs generate significant heat over extended periods of time. Because the PCB is in close proximity to the display, this heat is transferred to the display, causing localized high temperatures and, over time, affecting the display's performance. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a heat dissipation structure for a display screen, which can isolate the functional modules on a PCB from the display screen.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] In a first aspect, the present application provides a heat dissipation structure for a display screen, comprising: a backlight iron frame; a support assembly, wherein the support assembly is arranged on the backlight iron frame; an FPC board, wherein the FPC board is arranged on the support assembly; and a heating module, wherein the heating module is arranged on the FPC board.

[0006] It also includes a PCB board, which is arranged on the backlight iron frame and is electrically connected to the FPC board.

[0007] The PCB board has an "L"-shaped cross-sectional structure.

[0008] The supporting assembly includes a heat insulation frame, a first fixed block and a second fixed block, the first fixed block and the second fixed block are respectively arranged on the backlight iron frame, one end of the heat insulation frame is connected to the first fixed block, and the other end of the heat insulation frame is connected to the second fixed block, and the FPC board is arranged on the heat insulation frame.

[0009] A heat dissipation channel is provided between the heat insulation frame and the backlight iron frame.

[0010] The length of the FPC board is smaller than the length of the thermal insulation frame.

[0011] The width of the heat dissipation channel ranges from 2 mm to 3 mm.

[0012] The first fixing block is provided with a first chamfered portion.

[0013] The second fixing block is provided with a second chamfered portion.

[0014] An installation area is provided on the FPC board, and the heating module is arranged in the installation area.

[0015] Compared with the prior art, the present invention has at least the following advantages:

[0016] This application integrates the heating module on the original PCB board into the FPC board, and then sets a supporting component to prop up the FPC board so that there is a certain distance between it and the back of the backlight iron frame, thereby avoiding local high temperature on the back of the backlight iron frame and maintaining normal display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for use in the embodiments.

[0018] Figure 1 This is a schematic structural diagram of a heat dissipation structure of a display screen in one embodiment of the present utility model;

[0019] Figure 2 It is a structural schematic diagram of another implementation manner of the heat dissipation structure of the display screen in one embodiment of the present utility model. DETAILED DESCRIPTION

[0020] The following describes embodiments of the present application in more detail with reference to the accompanying drawings. Although the accompanying drawings illustrate embodiments of the present application, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," and the like should be interpreted broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0023] Currently, functional modules on displays with PCBs generate significant heat over extended periods of operation. Because the PCB is in close proximity to the display, this heat is transferred to the display, causing localized high temperatures and, over time, affecting the display's performance.

[0024] In response to the above problems, an embodiment of the present application provides a heat dissipation structure for a display screen, which can isolate the functional modules on the PCB board from the display screen.

[0025] The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0026] See also Figure 1 A heat dissipation structure of a display screen includes: a backlight iron frame 100, a supporting component 200, an FPC board 300 and a heating module 400, wherein the supporting component 200 is arranged on the backlight iron frame 100; the FPC board 300 is arranged on the supporting component 200; and the heating module 400 is arranged on the FPC board 300.

[0027] It should be noted that this application integrates the heating module 400 on the original PCB board 500 onto the FPC board 300, and then sets a supporting component 200 to prop up the FPC board 300 so as to have a certain distance from the back of the backlight iron frame 100, thereby avoiding local high temperature on the back of the backlight iron frame 100 and maintaining a normal display effect.

[0028] See also Figure 1 In one embodiment, a heat dissipation structure of a display screen further includes a PCB board 500, which is disposed on the backlight iron frame 100 and electrically connected to the FPC board 300. Specifically, the PCB board 500 has an "L"-shaped cross-sectional structure.

[0029] It should be noted that the PCB board 500 is designed with an "L"-shaped cross-sectional structure, which can increase layout utilization.

[0030] See also Figure 1 and Figure 2 In one embodiment, the supporting assembly 200 includes a heat insulation frame 210, a first fixing block 220 and a second fixing block 230. The first fixing block 210 and the second fixing block 220 are respectively arranged on the backlight iron frame 100. One end of the heat insulation frame 210 is connected to the first fixing block 220, and the other end of the heat insulation frame 210 is connected to the second fixing block 230. The FPC board 300 is arranged on the heat insulation frame 210.

[0031] It should be noted that a heat dissipation channel 600 is provided between the heat insulation frame 210 and the backlight iron frame 100. The width of the heat dissipation channel 600 is in the range of 2mm to 3mm. The air flow in the heat dissipation channel 600 can remove some heat, thus assisting in heat dissipation.

[0032] See also Figure 1 In one embodiment, the length of the FPC board 300 is less than the length of the thermal insulation frame 210. It is understood that in order to ensure that the FPC board 300 is fully heat-dissipated, the length of the FPC board 300 is less than the length of the thermal insulation frame 210.

[0033] See also Figure 1 In one embodiment, the first fixing block 220 is provided with a first chamfered portion 221 . Specifically, the second fixing block 230 is provided with a second chamfered portion 231 .

[0034] It should be noted that the design of the first chamfered portion 221 and the second chamfered portion 231 can make the corners of the thermal insulation frame 210 smooth and rounded, thereby increasing the heat dissipation area.

[0035] In one embodiment, a mounting area is defined on the FPC board 300 , and the heating module 400 is disposed in the mounting area.

[0036] It can be understood that there are multiple installation areas, and the number of installation areas is the same as the number of heating modules 400.

[0037] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of each embodiment have their own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the description are not necessarily required for this application. In addition, it is understood that the steps in the method of the embodiment of the present application can be adjusted in sequence, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0038] The embodiments of the present application have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or improvements to the technology in the market, or to enable other persons skilled in the art to understand the embodiments disclosed herein.

Claims

1. A heat dissipation structure of a display screen, characterized in that: include: Backlit iron frame; A supporting assembly, the supporting assembly being arranged on the backlight iron frame; An FPC board, the FPC board being arranged on the supporting assembly; A heating module is arranged on the FPC board.

2. The heat dissipation structure of a display screen according to claim 1, characterized in that: It also includes a PCB board, which is arranged on the backlight iron frame and is electrically connected to the FPC board.

3. The heat dissipation structure of a display screen according to claim 2, characterized in that: The PCB board has an "L"-shaped cross-sectional structure.

4. The heat dissipation structure of a display screen according to claim 1, characterized in that: The supporting assembly includes a heat insulation frame, a first fixed block and a second fixed block, the first fixed block and the second fixed block are respectively arranged on the backlight iron frame, one end of the heat insulation frame is connected to the first fixed block, and the other end of the heat insulation frame is connected to the second fixed block, and the FPC board is arranged on the heat insulation frame.

5. The heat dissipation structure of a display screen according to claim 4, characterized in that: A heat dissipation channel is provided between the heat insulation frame and the backlight iron frame.

6. The heat dissipation structure of a display screen according to claim 4, characterized in that: The length of the FPC board is smaller than the length of the thermal insulation frame.

7. The heat dissipation structure of a display screen according to claim 5, characterized in that: The width of the heat dissipation channel ranges from 2 mm to 3 mm.

8. The heat dissipation structure of a display screen according to claim 7, characterized in that: The first fixing block is provided with a first chamfered portion.

9. The heat dissipation structure of a display screen according to claim 7, characterized in that: The second fixing block is provided with a second chamfered portion.

10. The heat dissipation structure of a display screen according to claim 1, characterized in that: An installation area is provided on the FPC board, and the heating module is arranged in the installation area.

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