Packaging assembly and tray assembly with same

Abstract

The packaging assembly comprises a packaging piece and a supporting layer which are arranged in a stacked mode, the supporting layer is used for supporting the packaging piece, the packaging piece comprises a first packaging layer and a second packaging layer, the first packaging layer and the supporting layer are arranged in a stacked mode, the first packaging layer is provided with a placing area and an idle area, and the supporting layer is used for supporting the supporting layer. The placing area is used for placing a to-be-packaged object, and the second packaging layer is arranged on the side, away from the supporting layer, of the first packaging layer in a stacked mode and is provided with a first adhesive area and a second adhesive area; wherein the projection of the first adhesive area on the first packaging layer is located in the placing area, and the projection of the second adhesive area on the first packaging layer is located in the free area. The packaging assembly can be used for packaging and positioning the objects to be packaged with different sizes, so that the packaging and transporting cost is reduced, and meanwhile, the objects to be packaged with electronic components adhered to the peripheries can be packaged and positioned.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to a packaging component and a tray component having the same. Background Art

[0002] To ensure that chip products do not shift during transportation and thus avoid damage and failure, existing technologies use hollow boards that match the size of the chip products to place the chip products, and also place anti-slip pads between the periphery of the chip products and the inner wall of the hollow board to position the chip products.

[0003] However, the hollow board of the above solution can only be used to transport chip products of a specific size, and the transportation cost is relatively high. At the same time, the above solution cannot be used to position products with electronic components bonded around them. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a packaging assembly that can package and position objects of different sizes, thereby reducing packaging and transportation costs. At the same time, it can also package and position objects to be packaged that have electronic components bonded to their periphery.

[0005] The present invention also aims to provide a tray assembly having the above packaging assembly.

[0006] According to an embodiment of the first aspect of the present invention, a package assembly includes a package and a support layer that are stacked, wherein the support layer is used to support the package, and the package includes:

[0007] a first encapsulation layer, the first encapsulation layer and the supporting layer being stacked, the first encapsulation layer having a placement area and a spare area, the placement area being used for placing an object to be encapsulated;

[0008] a second encapsulation layer, the second encapsulation layer being stacked on a side of the first encapsulation away from the support layer and having a first adhesive area and a second adhesive area;

[0009] The projection of the first adhesive area on the first packaging layer is located in the placement area, and the projection of the second adhesive area on the first packaging layer is located in the idle area.

[0010] According to some embodiments of the present invention, the second encapsulation layer is an adhesive layer;

[0011] The package further includes a third packaging layer bonded to the second packaging layer such that the second packaging layer forms the first adhesive area and the second adhesive area.

[0012] According to some embodiments of the present invention, the third encapsulation layer is annular, the inner periphery of the third encapsulation layer surrounds the first adhesive area with the second encapsulation layer, and the outer periphery of the third encapsulation layer and the outer periphery of the second encapsulation layer form the second annular adhesive area.

[0013] According to some embodiments of the present invention, a region of the idle area corresponding to the second adhesive area is provided with convex patterns.

[0014] According to some embodiments of the present invention, one side of the first encapsulation layer is fixedly connected to a corresponding side of the second encapsulation layer.

[0015] According to some embodiments of the present invention, a buffer layer is further included, and the buffer layer is stacked between the supporting layer and the first encapsulation layer.

[0016] According to some embodiments of the present invention, the material of the first encapsulation layer is a transparent material;

[0017] The buffer layer is a porous structure, and a marking piece is inserted on a side facing the first packaging layer. The marking piece is used to mark a placement area for the object to be packaged.

[0018] According to some embodiments of the present invention, a relief groove is provided on a side of the buffer layer away from the first encapsulation layer, and the relief groove is used to avoid the object to be encapsulated.

[0019] This application provides a packaging assembly comprising a packaging component and a support layer. The packaging component comprises a first packaging layer and a second packaging layer. The first packaging layer and the support layer are stacked. The first packaging layer has a placement area and a spare area. The placement area is used to place the object to be packaged. The second packaging layer is stacked on the side of the first packaging component away from the support layer and has a first adhesive area and a second adhesive area. The projection of the first adhesive area on the first packaging layer is located within the placement area, and the projection of the second adhesive area on the first packaging layer is located within the spare area. The support layer can support the packaging component to prevent the lower packaging component from failing under pressure when multiple packaging components need to be stacked and shipped and have weak pressure-bearing capacity. The first and second packaging layers are arranged to encapsulate the object to be packaged between the first and second packaging layers. By forming a first adhesive area on the second packaging layer for bonding to the object to be packaged and a second adhesive area for bonding to the spare area of ​​the first packaging layer, the object to be packaged can be positioned and fixed within the first and second packaging layers. The packaging assembly is adhered to the surface of the object to be packaged to position it, so that the object to be packaged with electronic components adhered around it can also be packaged by the packaging assembly, and objects to be packaged of different sizes can also be packaged by the packaging assembly, which increases the application range and reduces transportation costs.

[0020] The tray assembly according to the second embodiment of the present invention includes the packaging assembly in the above embodiment.

[0021] The pallet assembly according to the embodiment of the present invention adopts the packaging assembly in the above embodiment, so that the pallet assembly can further package objects of different sizes and different requirements, thereby expanding the scope of application and reducing transportation costs.

[0022] According to some embodiments of the present invention, the device further includes a chassis having a receiving groove, wherein the packaging component is disposed in the receiving groove;

[0023] The chassis is provided with a positioning column, and the packaging component is provided with a positioning hole matched with the positioning column, and the positioning hole avoids the placement area.

[0024] According to some embodiments of the present invention, one of the side of the chassis provided with the accommodating groove and the side away from the accommodating groove is provided with a first positioning groove, and the other side is provided with a first positioning protrusion matching the first positioning groove.

[0025] According to some embodiments of the present invention, an upper cover is further included, wherein one of the sides of the upper cover and the bottom plate where the accommodating groove is provided has a second positioning groove, and the other side has a second positioning protrusion that matches the second positioning groove.

[0026] According to some embodiments of the present invention, one of the other side of the upper cover and the side of the bottom plate facing away from the accommodating groove is provided with a third positioning groove, and the other is provided with a third positioning protrusion matching the third positioning groove.

[0027] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a structural diagram of a packaging assembly according to an embodiment of the present application;

[0029] Figure 2 is a cross-sectional view of a packaging assembly according to an embodiment of the present application;

[0030] Figure 3 is a plan view of the bonding of the second packaging layer and the third packaging layer of a packaging assembly according to an embodiment of the present application;

[0031] Figure 4 is a schematic diagram of one side of a buffer layer of a packaging component according to an embodiment of the present application;

[0032] Figure 5is a schematic diagram of the other side of a buffer layer of a packaging component according to an embodiment of the present application;

[0033] Figure 6 is a structural schematic diagram of an embodiment of a tray assembly according to an embodiment of the present application;

[0034] Figure 7 is a cross-sectional view of a chassis of a tray assembly according to an embodiment of the present application;

[0035] Figure 8 is a structural schematic diagram of another embodiment of a tray assembly according to an embodiment of the present application;

[0036] Figure 9 is a cross-sectional view of an upper cover of a tray assembly according to an embodiment of the present application;

[0037] Figure 10 is a schematic diagram of stacking another embodiment of a tray assembly according to an embodiment of the present application;

[0038] Figure 11 It is a stacked cross-sectional view of another embodiment of a tray assembly according to an embodiment of the present application.

[0039] Reference numerals:

[0040] Package component 100,

[0041] Package 10, positioning hole 10a, first packaging layer 11, placement area 11a, idle area 11b, convex pattern 111, second packaging layer 12, first adhesive area 12a, second adhesive area 12b, opening and closing tear handle 121, third packaging layer 13,

[0042] Support layer 20,

[0043] Buffer layer 30, marking member 31, avoidance groove 32,

[0044] Tray assembly 1000,

[0045] Chassis 200, accommodating groove 200a, positioning column 201, first positioning groove 202, first positioning protrusion 203, second positioning groove 204, third positioning protrusion 205,

[0046] Upper cover 300 , second positioning protrusion 301 , third positioning groove 302 . DETAILED DESCRIPTION

[0047] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0048] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will appreciate the applicability of other processes and / or the use of other materials.

[0049] Packaging technology involves packaging integrated circuits with insulating plastic or ceramic materials. Packaging is essential and crucial for chips. Chips must be isolated from the outside world to prevent airborne impurities from corroding their circuitry and degrading their electrical performance. Furthermore, packaged chips are easier to install and transport. The quality of packaging technology directly impacts the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) it connects to. Semiconductor chips undergo testing to screen out defects before being released as products. Every chip must pass this "packaging" process to qualify as a qualified semiconductor product.

[0050] The existing packaging methods include: processing a PP hollow board that matches the chip size for placing the chip, and setting an anti-slip gasket around the chip and between the hollow board to position the chip. This solution can only be applied to the transportation of chip products of a specific size, and the transportation cost is relatively high. At the same time, for products with electronic components bonded to the periphery, or special-shaped products and products whose surfaces cannot withstand pressure, the above solution cannot be used for positioning; or, by covering the chip surface with an anti-slip film to position it, but the anti-slip effect of the anti-slip film is poor. At the same time, the surface of the anti-slip film needs to be coated with electrostatic liquid to reduce the friction voltage to prevent electrostatic breakdown caused by excessive friction voltage. The electrostatic liquid is easy to precipitate and transfer to the product surface, which cannot meet the needs of products with high cleanliness requirements, and at the same time affects the subsequent peeling, Bongding and other processes.

[0051] Based on this, the present invention proposes a packaging component that can package and position objects to be packaged of different sizes, reducing packaging and transportation costs. At the same time, it can also package and position objects to be packaged with electronic components bonded around them.

[0052] Figure 1-Figure 5 FIG. 1 is a schematic structural diagram of a packaging component 100 according to an embodiment of the present invention. Figure 1 and Figure 2 The packaging component 100 includes a stacked package 10 and a support layer 20, the support layer 20 is used to support the package 10, the package 10 includes a first packaging layer 11 and a second packaging layer 12, the first packaging layer 11 and the support layer 20 are stacked, the first packaging layer 11 has a placement area 11a and an idle area 11b, the placement area 11a is used to place the object to be packaged, the second packaging layer 12 is stacked on the side of the first package away from the support layer 20, and has a first adhesive area 12a and a second adhesive area 12b; wherein, the projection of the first adhesive area 12a on the first packaging layer 11 is located in the placement area 11a, and the projection of the second adhesive area 12b on the first packaging layer 11 is located in the idle area 11b.

[0053] Specifically, refer to Figure 1 and Figure 2 The packaging assembly 100 in the embodiment of the present invention includes a packaging element 10 and a support layer 20. The packaging element 10 is used to position and package the object to be packaged. The support layer 20 is used to support the packaging element 10 to prevent the lower packaging element 10 from failing under pressure when multiple packaging elements 100 need to be stacked and shipped and have weak pressure-bearing capacity. The support layer 20 can be made of PET sheet, and the thickness of the PET sheet can be 0.8mm-1.6mm. The support layer 20 can be processed using a vacuum forming process.

[0054] Reference Figure 1 and Figure 2 The package 10 includes a first package layer 11 and a second package layer 12. The first package layer 11 is stacked with a support layer 20. For example, the first package layer 11 and the support layer 20 can be stacked along the thickness direction of the support layer 20. The first package layer 11 has a placement area 11a and a spare area 11b. The distribution of the placement area 11a and the spare area 11b is not limited. For example, the placement area 11a and the spare area 11b can be distributed such that the spare area 11b surrounds the placement area 11a, the spare area 11b and the placement area 11a are staggered, or the spare area 11b and the placement area 11a each occupy half. The number of spare areas 11b and the placement area 11a can be one or more than two; the number of placement areas 11a can be one or more than two.

[0055] The placement area 11a is used to place the object to be packaged, wherein the size of the placement area 11a can be larger than the size of the object to be packaged, or the size of the placement area 11a can be the same as the size of the object to be packaged, so that the object to be packaged can be placed in the placement area 11a.

[0056] Reference Figure 1 and Figure 2 The second encapsulation layer 12 is stacked on the side of the first encapsulation layer away from the support layer 20. That is, the second encapsulation layer 12, the first encapsulation layer 11, and the support layer 20 are stacked in sequence along the thickness direction of the support layer 20. The size and shape of the second encapsulation layer 12 and the first encapsulation layer 11 can be the same or different. For example, the size of the second encapsulation layer 12 can be greater than, equal to, or smaller than the size of the first encapsulation layer 11. The size of the first encapsulation layer 11 can be greater than, equal to, or smaller than the size of the support layer 20.

[0057] Reference Figure 1 The second encapsulation layer 12 has a first adhesive area 12a and a second adhesive area 12b. The first adhesive area 12a and the second adhesive area 12b are adhesive and can be used to bond with other structures. The projection of the first adhesive area 12a on the first encapsulation layer 11 is located in the placement area 11a, so as to bond with the object to be encapsulated placed in the placement area 11a. The projection of the second adhesive area 12b on the first encapsulation layer 11 is located in the idle area 11b, so as to bond with the first encapsulation layer 11. In this way, the second encapsulation layer 12 can be bonded to the object to be encapsulated and the first encapsulation layer 11 respectively. The second encapsulation layer 12 is bonded to the first encapsulation layer 11 so that the second encapsulation layer 12 is fixed relative to the first encapsulation layer 11, and the second encapsulation layer 12 is bonded to the object to be encapsulated so that the object to be encapsulated is fixed relative to the second encapsulation layer 12. In this way, the first encapsulation layer 11, the object to be encapsulated, and the second encapsulation layer 12 are fixed to each other, thereby achieving the positioning of the object to be encapsulated in the package 10. Since the positioning of the object to be encapsulated is achieved by bonding to its surface, even if electrical components are bonded to the periphery of the object to be encapsulated, its positioning will not be affected. At the same time, as long as the size of the object to be encapsulated is smaller than the size of the first encapsulation layer 11 and the second encapsulation layer 12, and the second adhesive area 12b can be avoided, it can be encapsulated by the packaging component 100. That is, the packaging component 100 can encapsulate and position objects to be encapsulated of different sizes, reducing the packaging and transportation costs. At the same time, it can also encapsulate and position objects to be encapsulated with electronic components bonded to the periphery.

[0058] Therefore, refer to Figure 1 and Figure 2According to the packaging component 100 of the present invention, by providing a support layer 20, the packaging part 10 can be supported, so as to avoid the lower packaging part 10 from failing under pressure when the packaging component 100 needs to be stacked and shipped in multiple pieces and has a weak pressure-bearing capacity. By providing a first packaging layer 11 and a second packaging layer 12, the object to be packaged is encapsulated between the first packaging layer 11 and the second packaging layer 12. By forming a first adhesive area 12a for bonding to the object to be packaged and a second adhesive area 12b for bonding to the idle area 11b of the first packaging layer 11 in the second packaging layer 12, the object to be packaged can be positioned and fixed in the first packaging layer 11 and the second packaging layer 12. By bonding on the surface of the object to be packaged to position it, the object to be packaged with electronic components bonded around it can also be packaged by the packaging component 100, and objects to be packaged of different sizes can also be packaged by the packaging component 100, which increases the scope of application and reduces transportation costs.

[0059] In some embodiments of the present invention, reference Figure 3 The second encapsulation layer 12 is an adhesive layer. The package 10 further includes a third encapsulation layer 13. The third encapsulation layer 13 is bonded to the second encapsulation layer 12 so that the second encapsulation layer 12 forms a first adhesive area 12a and a second adhesive area 12b.

[0060] By configuring the second encapsulation layer 12 as an adhesive layer, access is facilitated. By adhering the third encapsulation layer 13 to the second encapsulation layer 12, the second encapsulation layer 12 is divided into a first adhesive region 12a and a second adhesive region 12b. The projection of at least a portion of the third encapsulation layer 13 onto the first encapsulation layer 11 is located within the placement region 11a, thereby ensuring that the projection of the first adhesive region 12a onto the first encapsulation layer 11 is also located within the placement region 11a, thus preventing the first adhesive region 12a from adhering to the periphery of the object to be encapsulated.

[0061] Specifically, the second encapsulation layer 12 can be an adhesive film, for example, a PET film or a silicone film. The projection of the third encapsulation layer 13 on the first encapsulation layer 11 can fall completely or partially within the first encapsulation layer 11. Preferably, the projection of the third encapsulation layer 13 on the first encapsulation layer 11 falls completely within the first encapsulation layer 11. The third encapsulation layer 13 can have a regular shape, for example, a ring shape; the third encapsulation layer 13 can also have an irregular shape, for example, a grid shape, or the outer periphery of the third encapsulation layer 13 can have a tooth shape, for example, sharp teeth or flat teeth.

[0062] In some embodiments, the third encapsulation layer 13 may be a PET film layer and may have a thickness of 0.03 mm to 0.08 mm.

[0063] In some embodiments, the second encapsulation layer 12 may have a thickness of 0.03 mm to 0.08 mm and a viscosity of 10 g to 20 g.

[0064] In some embodiments of the present invention, reference Figure 3 The third encapsulation layer 13 is annular, and the inner periphery of the third encapsulation layer 13 surrounds the first adhesive area 12a of the second encapsulation layer 12, and an annular second adhesive area 12b is formed between the outer periphery of the third encapsulation layer 13 and the outer periphery of the second encapsulation layer 12.

[0065] By providing the third encapsulation layer 13 with a ring-shaped shape, an annular adhesive avoidance zone is formed. The inner periphery of the third encapsulation layer 13 encloses a first adhesive zone 12a on the second encapsulation layer 12, and an annular second adhesive zone 12b is formed between the outer periphery of the third encapsulation layer 13 and the outer periphery of the second encapsulation layer 12. Thus, the third encapsulation layer 13 separates the first adhesive zone 12a from the second adhesive zone 12b, and the second adhesive zone 12b is bonded to the first encapsulation layer 11 to form a closed space, preventing foreign matter from entering and affecting the object to be encapsulated. The annular third encapsulation layer 13 is bonded between the first encapsulation layer 11 and the second encapsulation layer 12. After the first and second encapsulation layers 11 and 12 are bonded, a hollow structure is formed in the placement zone 11a, facilitating the placement of the object to be encapsulated and the bonding of the second encapsulation layer 12 to the object to be encapsulated.

[0066] Specifically, the third encapsulation layer 13 can be a regular ring shape. For example, the third encapsulation layer 13 can be a circular ring or a square ring; the third encapsulation layer 13 can also be an irregular ring shape. For example, the inner circumference of the third encapsulation layer 13 is circular and the outer circumference is rectangular; or, the inner circumference of the third encapsulation layer 13 is rectangular and the outer circumference is circular; or, the inner circumference of the third encapsulation layer 13 is circular or rectangular and the outer circumference is tooth-shaped, for example, it can be pointed teeth or flat teeth.

[0067] In some embodiments, the width of the second adhesive area 12b may be 5 mm to 10 mm.

[0068] In some embodiments of the present invention, reference Figure 3 The area of ​​the idle area 11b corresponding to the second adhesive area 12b is provided with a convex pattern 111.

[0069] By setting the convex groove 111 in the area corresponding to the idle area 11b and the second adhesive area 12b, the second adhesive area 12b can be bonded to the idle area 11b without being overly sticky, so that the second encapsulation layer 12 can be separated from the first encapsulation layer 11 when the object to be encapsulated needs to be taken out.

[0070] Specifically, there may be one or more convex patterns 111. Preferably, there are more than two convex patterns 111. The two or more convex patterns 111 may be arranged at intervals along the direction from the inner circumference of the third encapsulation layer 13 to the outer circumference of the third encapsulation layer 13; the two or more convex patterns 111 may also be arranged at intervals along a direction forming a certain angle with the direction from the inner circumference of the third encapsulation layer 13 to the outer circumference of the third encapsulation layer 13; the two or more convex patterns 111 may also be arranged along the extension direction of the blank area (refer to Figure 3 more than two ridges 111 may also be arranged in a grid shape, the shape of the grid is not limited, for example, the shape of the grid may be a diamond, a rectangle, or the like.

[0071] In some embodiments, in order to allow the second adhesive area 12b to adhere to the idle area 11b without being overly sticky, so that when the object to be encapsulated needs to be taken out, it is convenient to separate the second encapsulation layer 12 from the first encapsulation layer 11, the area corresponding to the idle area 11b and the second adhesive area 12b can be coated with silicone oil, etc.

[0072] In some embodiments, the second encapsulation layer 12 is provided with an opening and closing tearing finger 121 to facilitate separation of the second encapsulation layer 12 from the first encapsulation layer 11. Specifically, the opening and closing tearing finger 121 is provided on the side of the second encapsulation layer 12 facing the first encapsulation layer 11 and partially extends out of the first encapsulation layer 11. Furthermore, the opening and closing tearing finger 121 is bonded to the convex pattern 111 area. Exemplarily, one or more opening and closing tearing fingers 121 can be provided. Preferably, two opening and closing tearing fingers 121 are provided, and the two opening and closing tearing fingers 121 are spaced apart and provided on one side of the second encapsulation layer 12.

[0073] In some embodiments of the present invention, reference Figure 1 , one side of the first encapsulation layer 11 is fixedly connected to the corresponding side of the second encapsulation layer 12 .

[0074] By fixedly connecting one side of the first encapsulation layer 11 with the corresponding side of the second encapsulation layer 12 , the first encapsulation layer 11 , the second encapsulation layer 12 and the third encapsulation layer 13 are formed into a whole, which facilitates encapsulation and improves encapsulation efficiency.

[0075] In some embodiments, the first encapsulation layer 11 and the second encapsulation layer 12 can be fixedly connected by bonding. Specifically, the adhesive can be applied to a position near the edge of the second encapsulation layer 12. They can also be fixedly connected by other means as long as the first encapsulation layer 11 and the second encapsulation layer 12 can be fixed.

[0076] In some embodiments, the side where the first encapsulation layer 11 and the second encapsulation layer 12 are fixedly connected is opposite to the side where the opening and closing tear handle 121 is provided, so that the first encapsulation layer 11 and the second encapsulation layer 12 can be separated by pulling the opening and closing tear handle 121 .

[0077] In some embodiments of the present invention, reference Figure 2 、 Figure 4 and Figure 5 The packaging component 100 further includes a buffer layer 30 , which is stacked between the support layer 20 and the first packaging layer 11 .

[0078] The buffer layer 30 is provided between the support layer 20 and the first encapsulation layer 11 to provide buffer protection for the object to be encapsulated, so that the object to be encapsulated is not easily damaged or failed due to pressure, thereby improving the encapsulation protection effect.

[0079] Specifically, the projection of the buffer layer 30 on the support layer 20 can be located inside the support layer 20 or overlap with the support layer 20. The buffer layer 30 can be made of a material having a buffering effect. For example, the buffer layer 30 can be an EVA material or an EPE material with a porous and dense structure to improve the buffering effect.

[0080] In some embodiments of the present invention, reference Figure 1 and Figure 4 The first encapsulation layer 11 is made of a transparent material; the buffer layer 30 is a porous structure, and a marking member 31 is inserted on the side facing the first encapsulation layer 11, and the marking member 31 is used to mark the placement area 11a of the object to be encapsulated.

[0081] By setting the material of the first encapsulation layer 11 to a transparent material, the structure of the buffer layer 30 can be seen through the first encapsulation layer 11. Setting the buffer layer 30 to a porous structure can not only improve the buffering effect, but also facilitate the insertion of components. A marking member 31 is inserted on the side of the buffer layer 30 facing the first encapsulation layer 11 to mark the placement area 11a of the object to be encapsulated, so as to facilitate the placement of the object to be encapsulated in the placement area 11a to improve the encapsulation efficiency. At the same time, marking the placement area 11a of the object to be encapsulated can make it possible for the first adhesive area 12a of the second encapsulation layer 12 to adhere to the middle area of ​​the object to be encapsulated when the object to be encapsulated is adhered to the first adhesive area 12a of the second encapsulation layer 12, avoiding adhesion to the surrounding area and damaging the object to be encapsulated. The insertion method is adopted so that the marking member 31 can be seen through the first encapsulation layer 11, but the marking member 31 will not protrude from the surface of the buffer layer 30, so that the buffer layer 30 can be attached to the first encapsulation layer 11.

[0082] Specifically, the first encapsulation layer 11 can be made of a release PET material, etc., so that the marking member 31 provided on the buffer layer 30 can be visible through the first encapsulation layer 11. The thickness of the first encapsulation layer 11 can be 0.03 mm to 0.08 mm. The release force of the first encapsulation layer 11 can be 5 g to 10 g.

[0083] There can be one or more marking members 31. When there is one marking member 31, it can mark the center point of the object to be packaged. When there are two or more marking members 31, for example, two marking members 31, the two marking members 31 can mark the two ends of the diagonal line of the object to be packaged. Preferably, there are four marking members 31, each used to mark the four corners of the object to be packaged.

[0084] The projection shape of the marking element 31 on the first packaging layer 11 can be dot-shaped, line-shaped, L-shaped, etc. Preferably, the projection shape of the marking element 31 on the first packaging layer 11 is L-shaped.

[0085] In some embodiments of the present invention, reference Figure 5 A relief groove 32 is provided on a side of the buffer layer 30 away from the first encapsulation layer 11 , and the relief groove 32 is used to avoid the object to be encapsulated.

[0086] By providing an avoidance groove 32 on the side of the buffer layer 30 away from the first packaging layer 11, when multiple packaging components 100 are stacked, the objects to be packaged in the lower layer are prevented from being damaged and failing due to the pressure of the objects to be packaged in the upper layer, which is beneficial for improving the protection of the objects to be packaged while stacking multiple packaging components 100.

[0087] It is understood that to effectively avoid the object to be encapsulated, the size of the avoidance groove 32 should be set as large as possible, thereby reducing the placement accuracy requirement for the object to be encapsulated. However, to improve the cushioning effect of the buffer layer 30, the size of the avoidance groove 32 should be reduced. Taking all factors into consideration, the projection of the avoidance groove 32 on the first encapsulation layer 11 can overlap with the placement area 11a; or the projection of the avoidance groove 32 on the first encapsulation layer 11 can be located within the placement area 11a. Preferably, the projection of the avoidance groove 32 on the first encapsulation layer 11 and the placement area 11a form a ring.

[0088] In some embodiments, the depth of the avoidance groove 32 may be 1 / 5-1 / 2 of the thickness of the buffer layer 30 . For example, the depth of the avoidance groove 32 may be 1 / 5, 1 / 4, 2 / 5, 1 / 3, 1 / 2, etc. of the thickness of the buffer layer 30 .

[0089] According to the tray assembly 1000 of the second embodiment of the present invention, Figure 6 and Figure 11 , including the packaging component 100 in the above embodiment.

[0090] According to the tray assembly 1000 of the embodiment of the present invention, by adopting the packaging assembly 100 in the above embodiment, the tray assembly 1000 can further package objects to be packaged of different sizes and with different requirements, thereby expanding the scope of application and reducing transportation costs.

[0091] In some embodiments of the present invention, reference Figure 1 and Figure 6 The tray assembly 1000 further includes a chassis 200 having a receiving groove 200a, in which the packaging assembly 100 is disposed; the chassis 200 is provided with a positioning column 201, and the packaging assembly 100 is provided with a positioning hole 10a that matches the positioning column 201, and the positioning hole 10a avoids the placement area 11a.

[0092] The accommodating groove 200a is provided to accommodate the packaging component 100, thereby protecting the packaging component 100. The positioning posts 201 and the positioning holes 10a are provided, and the positioning holes 10a and the positioning posts 201 cooperate to position the packaging component 100 within the accommodating groove 200a. During transportation, the packaging component 100 can be fixed relative to the chassis 200, preventing the packaged object from being vibrated and failing.

[0093] Specifically, the shape of the accommodating groove 200a can be the same as that of the package component 100. The size of the accommodating groove 200a can be the same as that of the package component 100, or the size of the accommodating groove 200a can be slightly larger than that of the package component 100, so that the package component 100 can be placed in the accommodating groove 200a.

[0094] The positioning post 201 can be a cylindrical or square column, and accordingly, the positioning hole 10a can be a circular or square hole. There can be one or more positioning posts 201. Preferably, there can be two or more positioning posts 201. Furthermore, there can be four positioning posts 201, each located at the four corners of the chassis 200. Accordingly, the positioning holes 10a are arranged to match the positioning posts 201.

[0095] In some embodiments of the present invention, reference Figure 7 and Figure 8 The chassis 200 is provided with a first positioning groove 202 on one side of the accommodating groove 200a and a first positioning protrusion 203 matching the first positioning groove 202 on the other side.

[0096] By respectively arranging the first positioning groove 202 and the first positioning protrusion 203 on opposite sides of the chassis 200, the two stacked chassis 200 can be positioned, thereby improving the stacking stability.

[0097] Specifically, the first positioning groove 202 and the first positioning protrusion 203 avoid the accommodating groove 200a and can be provided on the circumferential edge of the chassis 200. The first positioning groove 202 can be provided on the side of the chassis 200 provided with the accommodating groove 200a, in which case the first positioning protrusion 203 is provided on the side of the chassis 200 facing away from the accommodating groove 200a. The first positioning groove 202 can also be provided on the side of the chassis 200 facing away from the accommodating groove 200a, in which case the first positioning protrusion 203 is provided on the side of the chassis 200 provided with the accommodating groove 200a. The first positioning groove 202 and the first positioning protrusion 203 are mutually matched structures so that they can contact each other and increase the contact area.

[0098] The shapes of the first positioning groove 202 and the first positioning protrusion 203 are not limited. For example, the first positioning groove 202 and the first positioning protrusion 203 can both be rectangular, trapezoidal, triangular, semicircular, 1 / 3 circular, elliptical with a notch, etc.

[0099] The number of first positioning grooves 202 and first positioning protrusions 203 can be one or more. Preferably, the number of first positioning grooves 202 and first positioning protrusions 203 is two or more, and the two or more first positioning grooves 202 and first positioning protrusions 203 can be spaced apart on the same side of the chassis 200, or on two adjacent sides, or on two opposing sides. Furthermore, each side of the chassis 200 can be provided with multiple first positioning grooves 202 and first positioning protrusions 203, and the multiple first positioning grooves 202 and first positioning protrusions 203 can be evenly distributed.

[0100] In some embodiments of the present invention, reference Figure 8 and Figure 9 The tray assembly 1000 further includes an upper cover 300 , one of the sides of the upper cover 300 and the bottom plate 200 having the accommodating groove 200a, a second positioning groove 204 and the other having a second positioning protrusion 301 matching the second positioning groove 204 .

[0101] By respectively providing a second positioning groove 204 and a second positioning protrusion 301 on one side of the upper cover 300 and the side of the chassis 200 where the accommodating groove 200a is provided, the upper cover 300 and the chassis 200 are positioned and assembled, thereby improving the safety and stability of transportation of the packaging component 100 provided in the chassis 200.

[0102] Specifically, the second positioning groove 204 and the second positioning protrusion 301 avoid the accommodating groove 200a and can be respectively provided on the circumferential edges of the chassis 200 and the upper cover 300. The second positioning groove 204 can be provided on one side of the upper cover 300, in which case the second positioning protrusion 301 is provided on the side of the chassis 200 provided with the accommodating groove 200a. The second positioning groove 204 can also be provided on the side of the chassis 200 provided with the accommodating groove 200a, in which case the second positioning protrusion 301 is provided on the side of the chassis 200 provided with the upper cover 300. The second positioning groove 204 and the second positioning protrusion 301 are mutually matched structures so that they can contact each other, increasing the contact area.

[0103] The shapes of the second positioning groove 204 and the second positioning protrusion 301 are not limited. For example, the second positioning groove 204 and the second positioning protrusion 301 can both be rectangular, trapezoidal, triangular, semicircular, 1 / 3 circular, elliptical with a notch, etc.

[0104] The number of second positioning grooves 204 and second positioning protrusions 301 can be one or more. Preferably, the number of second positioning grooves 204 and second positioning protrusions 301 is two or more, and the two or more second positioning grooves 204 and second positioning protrusions 301 can be spaced apart on the same side of the chassis 200 and the upper cover 300, or on two adjacent sides, or on two opposing sides. Furthermore, each side of the chassis 200 and the upper cover 300 can be provided with multiple second positioning grooves 204 and second positioning protrusions 301, and the multiple second positioning grooves 204 and second positioning protrusions 301 can be evenly distributed.

[0105] In some embodiments, the depth of the second positioning groove 204 is greater than the depth of the first positioning groove 202. Specifically, the difference between the depth h2 of the second positioning groove 204 and the depth h1 of the first positioning groove 202 is greater than or equal to 3 mm.

[0106] In some embodiments of the present invention, reference Figure 8 and Figure 9 One of the other side of the upper cover 300 and the side of the chassis 200 away from the accommodating groove 200a is provided with a third positioning groove 302, and the other is provided with a third positioning protrusion 205 that matches the third positioning groove 302.

[0107] By respectively providing a third positioning groove 302 and a third positioning protrusion 205 on the other side of the upper cover 300 and the side of the bottom plate 200 away from the accommodating groove 200a, the two adjacent stacked tray assemblies 1000 can be positioned. Figure 10 , which improves the stacking stability of the tray assembly 1000.

[0108] Specifically, the third positioning groove 302 can be provided on the other side of the upper cover 300. In this case, the third positioning protrusion 205 is provided on the side of the chassis 200 away from the accommodating groove 200a. The third positioning groove 302 can also be provided on the side of the chassis 200 away from the accommodating groove 200a. In this case, the third positioning protrusion 205 is provided on the other side of the upper cover 300. The third positioning groove 302 and the third positioning protrusion 205 are mutually matched structures so that they can contact each other and increase the contact area.

[0109] The shapes of the third positioning groove 302 and the third positioning protrusion 205 are not limited. For example, the third positioning groove 302 and the third positioning protrusion 205 can be rectangular, trapezoidal, triangular, semicircular, 1 / 3 circular, elliptical with a notch, etc.

[0110] The number of the third positioning groove 302 and the third positioning protrusion 205 can be one or more. Preferably, the number of the third positioning groove 302 and the third positioning protrusion 205 is two or more, and the two or more third positioning grooves 302 and the third positioning protrusion 205 can be spaced apart on the same side of the bottom plate 200 or the upper cover 300, or on two adjacent sides, or on two opposite sides.

[0111] In some embodiments, reference Figure 11 The depth of the third positioning groove 302 is h3, where h3 is ≥ 6 mm. The length of the third positioning protrusion 205 is the same as the depth of the third positioning groove 302.

[0112] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0113] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0114] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0115] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0116] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A packaging component, characterized in that: The package comprises a stacked package and a support layer, wherein the support layer is used to support the package, and the package comprises: a first encapsulation layer, the first encapsulation layer and the supporting layer being stacked, the first encapsulation layer having a placement area and a spare area, the placement area being used for placing an object to be encapsulated; a second encapsulation layer, the second encapsulation layer being stacked on a side of the first encapsulation away from the support layer and having a first adhesive area and a second adhesive area; The projection of the first adhesive area on the first packaging layer is located in the placement area, and the projection of the second adhesive area on the first packaging layer is located in the idle area.

2. The packaging assembly according to claim 1, wherein: The second encapsulation layer is an adhesive layer; The package further includes a third packaging layer bonded to the second packaging layer such that the second packaging layer forms the first adhesive area and the second adhesive area.

3. The packaging assembly according to claim 2, wherein: The third packaging layer is annular, the inner periphery of the third packaging layer surrounds the first adhesive area with the second packaging layer, and the outer periphery of the third packaging layer and the outer periphery of the second packaging layer form the second annular adhesive area.

4. The packaging assembly according to claim 3, wherein: The idle area and the area corresponding to the second adhesive area are provided with convex patterns.

5. The packaging assembly according to claim 1, wherein: One side of the first encapsulation layer is fixedly connected to a corresponding side of the second encapsulation layer.

6. The packaging assembly according to claim 1, wherein: It also includes a buffer layer, which is stacked between the support layer and the first encapsulation layer.

7. The packaging assembly according to claim 6, wherein: The material of the first encapsulation layer is a transparent material; The buffer layer is a porous structure, and a marking piece is inserted on a side facing the first packaging layer, and the marking piece is used to mark the placement area of ​​the object to be packaged.

8. The packaging assembly according to claim 6, wherein: A relief groove is provided on a side of the buffer layer away from the first encapsulation layer, and the relief groove is used to avoid the object to be encapsulated.

9. A tray assembly, characterized in that: The packaging assembly comprises the packaging assembly according to any one of claims 1 to 8.

10. The tray assembly according to claim 9, wherein: It also includes a chassis, the chassis has a receiving groove, and the packaging component is arranged in the receiving groove; The chassis is provided with a positioning column, and the packaging component is provided with a positioning hole matched with the positioning column, and the positioning hole avoids the placement area.

11. The tray assembly according to claim 10, wherein: The chassis is provided with a first positioning groove on one of the side of the accommodating groove and the side away from the accommodating groove, and the other side is provided with a first positioning protrusion matched with the first positioning groove.

12. The tray assembly according to claim 10, wherein: It also includes an upper cover, one of the sides of the upper cover and the bottom plate where the accommodating groove is provided has a second positioning groove, and the other side has a second positioning protrusion matched with the second positioning groove.

13. The tray assembly according to claim 12, wherein: One of the other side of the upper cover and the side of the bottom plate away from the accommodating groove is provided with a third positioning groove, and the other is provided with a third positioning protrusion matched with the third positioning groove.

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