Electronic device
By setting up motors and metal heat sinks in electronic devices to shield antenna signals, the problem of antenna interference in wireless communication equipment is solved, communication stability and isolation are improved, and the communication quality of the equipment is enhanced.
Patent Information
- Application Number
- CN202422682465.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-04
- Publication Date
- 2025-09-12
- Estimated Expiration
- 2034-11-04
AI Technical Summary
In modern communication devices, with the increasing integration of wireless communication technologies, interference between wireless signals is becoming increasingly serious, especially when Wi-Fi and Bluetooth antennas are working. In addition, the miniaturization of devices makes it difficult to ensure spatial competition and isolation between antennas.
In an electronic device, a motor and a metal heat sink are arranged between a first antenna and a second antenna. The motor is used to shield signals, and the metal heat sink absorbs and dissipates heat, thereby reducing interference between antennas and improving isolation and communication stability.
It effectively reduces signal interference between antennas, improves communication stability and isolation, and enhances the communication quality of the equipment.
Smart Images

Figure CN223334019U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an electronic device. Background Art
[0002] In the modern communications field, with the advancement of technology, users' demand for high-speed, stable wireless connections is growing. To meet this demand, electronic devices are integrating an increasing number of wireless communication technologies, such as Wi-Fi and Bluetooth. As the number of wireless communication technologies integrated into devices increases, the potential for interference between different wireless signals becomes more severe. For example, when Wi-Fi and Bluetooth antennas operate in the same or adjacent frequency bands, mutual interference can significantly degrade communication quality. Furthermore, the increasing miniaturization of many electronic devices further exacerbates competition for space between antennas, making it even more difficult to ensure isolation.
[0003] The contents of the background technology section are merely the technologies known to the inventors and do not necessarily represent the existing technologies in this field. Utility Model Content
[0004] In view of one or more deficiencies in the prior art, the present invention provides an electronic device, comprising:
[0005] Motherboard;
[0006] A first communication chip is provided on the mainboard;
[0007] A second communication chip is provided on the mainboard;
[0008] a first antenna, disposed on the mainboard and coupled to the first communication chip;
[0009] a second antenna, disposed on the mainboard and coupled to the second communication chip; and
[0010] The motor is arranged between the first antenna and the second antenna.
[0011] According to one aspect of the present invention, the first antenna is arranged at the left edge of the mainboard, and the second antenna is arranged at the right edge of the mainboard.
[0012] According to one aspect of the present invention, the electronic device further includes a metal heat sink, which is disposed on the mainboard, and at least a portion of the metal heat sink is located between the first antenna and the second antenna.
[0013] According to one aspect of the present invention, the metal heat sink comprises:
[0014] a first heat dissipation portion, substantially parallel to the mainboard; and
[0015] One or more connecting parts, each of which is connected to the first heat dissipation part and the mainboard.
[0016] According to one aspect of the present invention, at least one of the connecting portions is located between the first antenna and the second antenna.
[0017] According to one aspect of the present invention, a portion of the first heat dissipation portion is located between the first antenna and the second antenna.
[0018] According to one aspect of the present invention, the metal heat sink further includes one or more second heat dissipation parts, the second heat dissipation parts are connected to the first heat dissipation parts, and a preset angle is formed between the second heat dissipation parts and the first heat dissipation parts.
[0019] According to one aspect of the present invention, at least one second heat dissipation portion is located between the first antenna and the second antenna.
[0020] According to one aspect of the present invention, the electronic device further includes a housing, and the mainboard and the motor are both arranged in the housing.
[0021] According to one aspect of the present invention, the electronic device is a camera.
[0022] Compared with the prior art, an embodiment of the present invention provides an electronic device, in which a motor is arranged between a first antenna and a second antenna, so that the motor shields at least part of the signals transmitted by the first antenna and the second antenna, thereby reducing signal interference between the first antenna and the second antenna and improving antenna isolation and communication stability. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0024] Figure 1 A schematic diagram showing a partial structure of an electronic device according to an embodiment of the present utility model;
[0025] Figure 2 An exploded view of a partial structure of an electronic device according to an embodiment of the present invention is shown.
[0026] In the figure: 100, electronic device; 110, main board; 120, first communication chip; 130, second communication chip; 140, first antenna; 150, second antenna; 160, motor; 170, chip; 180, housing; 190, metal heat sink; 191, first heat dissipation part; 192, connecting part; 193, second heat dissipation part. DETAILED DESCRIPTION
[0027] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.
[0028] In the description of the present invention, it should be understood that terms such as "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," and "counterclockwise" are used to indicate positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed to indicate or imply relative importance or to implicitly specify the number of the technical features referred to. Therefore, features designated "first" or "second" may explicitly or implicitly include one or more of the aforementioned features. In the description of the present invention, "plurality" means two or more, unless otherwise clearly defined.
[0029] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, removable, or integral connections; mechanical, electrical, or intercommunication connections; direct or indirect connections through an intermediary; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.
[0030] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact via another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or diagonally above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly above or diagonally above the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0031] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.
[0032] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.
[0033] Figure 1 FIG. 1 is a schematic diagram showing a partial structure of an electronic device 100 according to an embodiment of the present invention. Figure 2 An exploded view showing a partial structure of an electronic device 100 according to an embodiment of the present invention is shown below. Figure 1 and Figure 2 Provide a detailed description.
[0034] like Figure 1 and Figure 2As shown, electronic device 100 may be a camera and includes a mainboard 110, a first communication chip 120, a second communication chip 130, a first antenna 140, a second antenna 150, and a motor 160. The first communication chip 120 and the second communication chip 130 may also be two functional modules integrated on the same chip 170, which is connected to the upper side of the mainboard 110. In some embodiments, the first communication chip 120 and the second communication chip 130 may be independent chips, each of which is connected to the upper side of the mainboard 110. The first antenna 140 and the second antenna 150 are each connected to the upper side of the mainboard 110. The first antenna 140 is coupled to the first communication chip 120. The first communication chip 120 can transmit or receive wireless signals via the first antenna 140. For example, the first communication chip 120 may be a WiFi chip, which can receive or transmit 2.4 GHz WiFi signals or 5 GHz WiFi signals via the first antenna 140. The second antenna 150 is coupled to the second communication chip 130. The second communication chip 130 can transmit or receive wireless signals through the second antenna 150. For example, the second communication chip 130 can be a WiFi / BT chip. The second communication chip 130 can receive or transmit 2.4GHz Wi-Fi signals through the second antenna 150, or can receive or transmit 2.4GHz Bluetooth signals through the second antenna 150. The motor 160 is arranged between the first antenna 140 and the second antenna 150. The motor 160 can shield at least part of the signals transmitted by the first antenna 140 and the second antenna 150, thereby reducing interference between the first antenna 140 and the second antenna 150, thereby improving the stability of communication. Optionally, the electronic device 100 can also be an electric toothbrush, an electric shaver, a smart speaker, a mobile phone, a tablet computer, etc., but the present invention is not limited to this.
[0035] According to one embodiment of the present invention, Figure 1 As shown, the first antenna 140 and the second antenna 150 can be respectively arranged on both sides of the mainboard 110 to maximize the distance between the first antenna 140 and the second antenna 150, thereby reducing the interference between the first antenna 140 and the second antenna 150. Figure 1 In the illustrated embodiment, the first antenna 140 is disposed at the left edge of the mainboard 110, and the second antenna 150 is disposed at the right edge of the mainboard 110. Optionally, the first antenna 140 and / or the second antenna 150 are metal sheets, and the first antenna 140 and the second antenna 150 can be connected to the mainboard 110 by welding.
[0036] According to one embodiment of the present invention, Figure 1 As shown, the electronic device 100 further includes a housing 180 ( Figure 1 Only a portion of the housing 180 is shown. The motherboard 110 and the motor 160 are both disposed within the housing 180 and are fixedly connected to the housing 180 by screws or other fasteners. Optionally, the output shaft of the motor 160 extends outside the housing 180 and is connected to another portion of the electronic device 100 (e.g., the base), so that the motor 160 can drive the housing 180 to rotate about its output shaft.
[0037] According to one embodiment of the present invention, Figure 1 and Figure 2 As shown, the electronic device 100 may further include a metal heat sink 190, which is disposed on the upper side of the mainboard 110. The metal heat sink 190 can absorb the heat generated by the mainboard 110 and other electronic components, and dissipate the heat to the surrounding environment through its large surface area, thereby preventing the mainboard 110 and other electronic components from overheating and preventing the mainboard 110 and other electronic components from being degraded or damaged due to overheating. Figure 1 and Figure 2 As shown, at least a portion of the metal heat sink 190 is located between the first antenna 140 and the second antenna 150 to shield at least part of the signals transmitted by the first antenna 140 and the second antenna 150, thereby reducing interference between the first antenna 140 and the second antenna 150 and improving communication stability.
[0038] According to one embodiment of the present invention, Figure 1 and Figure 2 As shown, the metal heat sink 190 may include a first heat dissipation portion 191 and one or more connecting portions 192. The first heat dissipation portion 191 is generally parallel to the mainboard 110. The connecting portions 192 are integrally formed at the edge of the first heat dissipation portion 191 and connected to the sub-mainboard 110 via fasteners such as screws. Optionally, a portion of the first heat dissipation portion 191 extends between the first antenna 140 and the second antenna 150. Optionally, at least one connecting portion 192 is located between the first antenna 140 and the second antenna 150.
[0039] According to one embodiment of the present invention, Figure 1 and Figure 2As shown, the metal heat sink 190 may further include one or more second heat sinks 193, which are integrally formed on the edge of the first heat sink 191. The second heat sink 193 and the first heat sink 191 form a preset angle, for example, the second heat sink 193 and the first heat sink 191 are perpendicular to each other. By providing the second heat sink 193, the heat dissipation area of the metal heat sink 190 can be increased, and the heat dissipation efficiency of the metal heat sink 190 can be improved, which is conducive to preventing the motherboard 110 and other electronic components from overheating, thereby avoiding the motherboard 110 and other electronic components from being degraded or damaged due to overheating. Optionally, at least one second heat sink 193 is located between the first antenna 140 and the second antenna 150 to further improve the signal shielding effect of the metal heat sink 190, thereby reducing the interference between the first antenna 140 and the second antenna 150, and thus improving the stability of communication.
[0040] According to one embodiment of the present invention, Figure 1 and Figure 2 As shown, a portion of the metal heat sink 190 extends below the motor 160. A thermal pad is disposed between the motor 160 and the metal heat sink 190. The thermal pad can direct heat generated by the motor 160 to the metal heat sink 190, thereby improving the heat dissipation efficiency of the motor 160. Alternatively, the thermal pad can be made of thermally conductive silicone, thermally conductive silicone grease, or a thermally conductive phase change material.
[0041] Compared with the prior art, an embodiment of the present invention provides an electronic device 100, which disposes a motor 160 and a metal heat sink 190 between a first antenna 140 and a second antenna 150, so that the motor 160 and the metal heat sink 190 shield at least part of the signals transmitted by the first antenna 140 and the second antenna 150, thereby reducing signal interference between the first antenna 140 and the second antenna 150 and improving antenna isolation and communication stability.
[0042] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. An electronic device, characterized in that: include: Motherboard; A first communication chip is provided on the mainboard; A second communication chip is provided on the mainboard; a first antenna, disposed on the mainboard and coupled to the first communication chip; a second antenna, disposed on the mainboard and coupled to the second communication chip; and The motor is arranged between the first antenna and the second antenna.
2. The electronic device according to claim 1, wherein The first antenna is arranged at a left edge of the mainboard, and the second antenna is arranged at a right edge of the mainboard.
3. The electronic device according to claim 1, wherein The electronic device further includes a metal heat sink, which is disposed on the mainboard, and at least a portion of the metal heat sink is located between the first antenna and the second antenna.
4. The electronic device according to claim 3, wherein: The metal heat sink comprises: a first heat dissipation portion, substantially parallel to the mainboard; and One or more connecting parts, each of which is connected to the first heat dissipation part and the mainboard.
5. The electronic device according to claim 4, characterized in that At least one of the connecting portions is located between the first antenna and the second antenna.
6. The electronic device according to claim 4, characterized in that A portion of the first heat dissipation portion is located between the first antenna and the second antenna.
7. The electronic device according to claim 4, wherein: The metal heat sink further includes one or more second heat dissipation parts, which are connected to the first heat dissipation parts, and a preset angle is formed between the second heat dissipation parts and the first heat dissipation parts.
8. The electronic device according to claim 7, wherein: At least one second heat dissipation portion is located between the first antenna and the second antenna.
9. The electronic device according to any one of claims 1 to 8, characterized in that: The electronic device further includes a housing, and the mainboard and the motor are both arranged in the housing.
10. The electronic device according to claim 9, characterized in that The electronic device is a camera.