Heat dissipation structure of Hall sensor in PCBA

Abstract

The utility model provides a heat radiation structure of a Hall sensor in a PCBA, comprising a PCB, a heat radiation support and a heat conduction copper sheet, the heat radiation support comprises a heat radiation plate, the heat radiation plate is connected with the PCB through a plurality of connecting columns, one side of the heat radiation plate close to the PCB is provided with a heat radiation cavity, one side of the PCB close to the heat radiation plate is provided with a Hall sensor, and the heat radiation cavity is provided with a heat conduction copper sheet. One end of the heat conduction copper sheet is attached to the surface of the Hall sensor through a heat conduction silica gel pad, and the other end of the heat conduction copper sheet is inserted into the heat dissipation cavity and is filled and fixed through pouring sealant. One end of the heat conduction copper sheet is attached to the surface of the Hall sensor through the heat conduction silica gel pad, the other end of the heat conduction copper sheet is inserted into the heat dissipation cavity, and the heat dissipation cavity is filled with the pouring sealant, so that heat generated by the Hall sensor can be conducted to the heat conduction copper sheet and then conducted to the heat dissipation plate through the heat conduction copper sheet and the pouring sealant. And heat is dissipated through the heat dissipation plate, so that effective heat dissipation of the Hall sensor is realized.

Description

Technical Field

[0001] The utility model relates to the field of PCB current detection, in particular to a heat dissipation structure of a Hall sensor in a PCBA. Background Art

[0002] With technological advancements, new energy vehicles, such as pure electric vehicles and hydrogen fuel cell vehicles, are rapidly gaining popularity. These vehicles primarily rely on electricity for power, and in this context, various onboard power supplies play a crucial role within these vehicles. For example, DC-DC converters, OBCs, motor controllers, and air compressor controllers require PCB current detection, necessitating the use of Hall effect sensors. Hall effect sensors generate significant heat during operation, which needs to be dissipated in a suitable manner.

[0003] When the current used by the Hall sensor is relatively redundant, the Hall sensor does not need to set up a separate heat dissipation structure, and the heat can be naturally radiated into the surrounding air to meet the heat dissipation needs. When the current approaches the limit current of the Hall sensor, the heat accumulation cannot be met by radiation heat dissipation. Utility Model Content

[0004] In order to solve the problem that the Hall sensor on the PCB in the prior art cannot meet the heat dissipation requirements, the utility model provides a heat dissipation structure of the Hall sensor in the PCBA.

[0005] The utility model provides a heat dissipation structure for a Hall sensor in a PCBA, comprising a PCB, a heat dissipation bracket, and a thermally conductive copper sheet. The heat dissipation bracket includes a heat dissipation plate, which is connected to the PCB via a plurality of connecting columns. A heat dissipation cavity is provided on a side of the heat dissipation plate close to the PCB. A Hall sensor is provided on a side of the PCB close to the heat dissipation plate. One end of the thermally conductive copper sheet is bonded to the surface of the Hall sensor via a thermally conductive silicone pad, and the other end of the thermally conductive copper sheet is inserted into the heat dissipation cavity and fixed by potting glue.

[0006] As a further improvement of the present invention, the thermally conductive copper sheet is an L-shaped structure.

[0007] As a further improvement of the present invention, a fixing column is provided on each side of the Hall sensor on the PCB board, and the fixing column is provided with a threaded hole. The end of the thermal conductive copper sheet that is in contact with the Hall sensor is provided with two fixing holes corresponding to the positions of the two fixing columns. The thermal conductive copper sheet is connected to the fixing column by a copper sheet fixing screw passing through the fixing hole.

[0008] As a further improvement of the present invention, the heat dissipation cavity and the heat dissipation plate are an integrally formed structure.

[0009] As a further improvement of the present invention, the connecting columns are multiple and are arranged on the periphery of the heat dissipation plate, and the multiple connecting columns and the heat dissipation plate are also an integrally formed structure.

[0010] As a further improvement of the present invention, the upper end of the connecting column is fixedly connected to the PCB board via a PCB fixing screw.

[0011] The beneficial effect of the utility model is as follows: the utility model is provided with a thermally conductive copper sheet having one end bonded to the surface of the Hall sensor through a thermally conductive silicone pad, and the other end of the thermally conductive copper sheet is inserted into the heat dissipation cavity, and the heat dissipation cavity is filled with potting glue, so that the heat generated by the Hall sensor can be conducted to the thermally conductive copper sheet, and then conducted to the heat dissipation plate through the thermally conductive copper sheet and the potting glue, and the heat is dissipated through the heat dissipation plate, thereby realizing effective heat dissipation of the Hall sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the heat dissipation structure of a Hall sensor in a PCBA of the present invention;

[0013] Figure 2 This is a schematic diagram of the decomposed structure of the heat dissipation structure of the Hall sensor in a PCBA of the present invention;

[0014] Figure 3 This is a cross-sectional view of a heat dissipation structure of a Hall sensor in a PCBA of the present invention.

[0015] Figure numerals: 1-PCB board; 2-Hall sensor; 3-thermal copper sheet; 4-thermal silicone pad; 5-heat sink; 6-heat sink cavity; 7-connecting column; 8-fixing column; 9-fixing hole; 10-copper sheet fixing screw; 11-PCB fixing screw. DETAILED DESCRIPTION

[0016] In the description of the present invention, it should be understood that if there are descriptions involving orientation, such as orientations or positional relationships indicated by up, down, front, back, left, and right, the orientation descriptions may be based on the orientations or positional relationships shown in the accompanying drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0017] In the description of this utility model, if there is a quantity, "several" means one or more, "more" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of the terms "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, or implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0018] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0019] like Figures 1 to 3 As shown, the utility model discloses a heat dissipation structure for a Hall sensor 2 in a PCBA, comprising a PCB 1, a heat dissipation bracket, and a thermally conductive copper sheet 3. The heat dissipation bracket includes a heat sink 5, which is connected to the PCB 1 via multiple connecting columns 7. The heat sink 5 has a heat dissipation cavity 6 on the side of the PCB 1 near the heat sink 5. The PCB 1 has a Hall sensor 2 on the side near the heat sink 5. In this embodiment, the Hall sensor plug-in is soldered to the PCB. One end of the thermally conductive copper sheet 3 is bonded to the surface of the Hall sensor 2 via a thermally conductive silicone pad 4. The other end of the thermally conductive copper sheet 3 is inserted into the heat dissipation cavity 6 and secured with potting compound. The thermally conductive silicone pad 4 can better transfer heat from the surface of the Hall sensor 2 to the thermally conductive copper sheet 3.

[0020] The heat dissipation bracket also includes heat dissipation fins connected to the heat dissipation plate 5 and a heat dissipation fan adapted to the heat dissipation fins. A water channel heat dissipation structure may also be provided on the heat dissipation plate (not shown in the figure).

[0021] The utility model is provided with a thermally conductive copper sheet 3, one end of which is bonded to the surface of the Hall sensor 2 through a thermally conductive silicone pad 4. The other end of the thermally conductive copper sheet 3 is inserted into a heat dissipation cavity 6, and the heat dissipation cavity 6 is filled with potting glue. In this way, the heat generated by the Hall sensor 2 can be transferred to the thermally conductive copper sheet 3, and then transferred to the heat dissipation plate 5 through the thermally conductive copper sheet 3 and the potting glue. The heat dissipation plate 5 then dissipates the heat through structures such as heat dissipation fins, fans or water channel heat dissipation, thereby achieving effective heat dissipation of the Hall sensor 2.

[0022] The heat dissipation area of ​​the heat dissipation plate 5 is larger, and when combined with the heat dissipation fins and the heat dissipation fan or with the water channel heat dissipation structure, it can achieve a better heat dissipation effect.

[0023] In the present invention, the thermally conductive copper sheet 3 is an L-shaped structure, which facilitates the arrangement of the thermally conductive copper sheet 3. The horizontal end is in contact with the Hall sensor 2, and the vertical end is inserted into the heat dissipation cavity 6. Of course, the shape of the thermally conductive copper sheet 3 can also be adjusted accordingly according to the specific structural layout.

[0024] In the present invention, a fixing post 8 is provided on each side of the Hall sensor 2 on the PCB 1. Each fixing post 8 has a threaded hole. The end of the thermally conductive copper sheet 3 that contacts the Hall sensor 2 has two fixing holes 9 corresponding to the positions of the two fixing posts 8. The thermally conductive copper sheet 3 is connected to the fixing posts 8 via copper sheet fixing screws 10 that pass through the fixing holes 9. The thermally conductive copper sheet 3 can be pressed against the thermal conductive silicone pad 4 on the Hall sensor 2 and fixed to the PCB 1 via the copper sheet fixing screws 10, ensuring sufficient contact between the heat dissipating copper sheet 3 and the Hall sensor 2 via the thermal conductive silicone pad 4.

[0025] In the present invention, the heat dissipation cavity 6 and the heat dissipation plate 5 are an integrally formed structure, which is made of metal material, so as to ensure sufficient heat conduction to achieve a better heat dissipation effect.

[0026] In the present invention, there are multiple connecting columns 7 and they are arranged on the periphery of the heat dissipation plate 5. The multiple connecting columns 7 and the heat dissipation plate 5 are also an integrally formed structure. The connecting columns 7 are also made of metal material, which not only can achieve the connection function, but also can further enhance the heat dissipation effect.

[0027] In the present invention, the upper end of the connecting column 7 is fixedly connected to the PCB board 1 through a PCB fixing screw 11, which facilitates assembly.

[0028] The utility model has a simple structure and can dissipate the heat generated by the Hall sensor 2 through the heat dissipation plate 5, thereby achieving a better heat dissipation effect and ensuring the stable operation of the Hall sensor 2.

[0029] The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A heat dissipation structure for a Hall sensor in a PCBA, characterized by: The device comprises a PCB, a heat dissipation bracket and a thermally conductive copper sheet. The heat dissipation bracket comprises a heat dissipation plate, which is connected to the PCB via a plurality of connecting columns. A heat dissipation cavity is provided on the side of the heat dissipation plate close to the PCB. A Hall sensor is provided on the side of the PCB close to the heat dissipation plate. One end of the thermally conductive copper sheet is bonded to the surface of the Hall sensor via a thermally conductive silicone pad, and the other end of the thermally conductive copper sheet is inserted into the heat dissipation cavity and fixed by potting glue.

2. The heat dissipation structure of the Hall sensor in the PCBA according to claim 1, characterized in that: The heat-conducting copper sheet is an L-shaped structure.

3. The heat dissipation structure of the Hall sensor in the PCBA according to claim 1, characterized in that: A fixing column is provided on each side of the Hall sensor on the PCB board, and each fixing column is provided with a threaded hole. The end of the thermal conductive copper sheet that is in contact with the Hall sensor is provided with two fixing holes corresponding to the positions of the two fixing columns. The thermal conductive copper sheet is connected to the fixing columns by copper sheet fixing screws passing through the fixing holes.

4. The heat dissipation structure of the Hall sensor in the PCBA according to claim 1, characterized in that: The heat dissipation cavity and the heat dissipation plate are an integrally formed structure.

5. The heat dissipation structure of the Hall sensor in the PCBA according to claim 4, characterized in that: There are multiple connecting columns and they are arranged on the periphery of the heat dissipation plate. The multiple connecting columns and the heat dissipation plate are also an integrally formed structure.

6. The heat dissipation structure of the Hall sensor in the PCBA according to claim 5, characterized in that: The upper end of the connecting column is fixedly connected to the PCB board via a PCB fixing screw.

Images