Wireless mobile power supply with semiconductor chilling plate for heat dissipation

Abstract

The utility model discloses a wireless mobile power supply with a semiconductor chilling plate for heat dissipation, and relates to the technical field of wireless charging. The wireless mobile power supply comprises a wireless mobile power supply body which is internally provided with at least one battery unit and a TX wireless charging coil; the heat dissipation assembly is mounted in a manner of being matched with the wireless mobile power supply body and comprises a heat conduction aluminum sheet, a semiconductor refrigeration sheet, a heat dissipation sheet, a turbofan and an air inlet / outlet; the heat-conducting aluminum sheet is in direct contact with the TX wireless charging coil and is tightly attached to the TX wireless charging coil through strong-adhesion heat-conducting glue; the semiconductor chilling plate is provided with a cold end and a hot end, the cold end is connected with the TX wireless charging coil through a heat conduction aluminum sheet, and the hot end is connected with the cooling fin. The turbofan, the air inlet and the air outlet form an airflow exchange path, heat exchange is promoted, airflow generated by the turbofan enters from the air inlet, takes away heat through the cooling fins and then is exhausted from the air outlet, an effective convection heat dissipation mechanism is formed, and the performance of the whole heat dissipation system is remarkably improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wireless charging, in particular to a wireless mobile power supply with a semiconductor refrigeration plate for heat dissipation. Background Art

[0002] With the widespread adoption of wireless charging technology, wireless power banks have become widely popular due to their convenience. However, during high-power charging, the wireless charging coil generates a significant amount of heat. If this heat cannot be dissipated promptly, it can lead to reduced charging efficiency or even damage to the device. Existing wireless power banks typically use natural cooling or fan cooling, but these methods are ineffective in high-temperature environments. Some wireless power banks use thermally conductive aluminum sheets and thermally conductive silicone grease to transfer the heat generated by the TX coil to a larger outer casing, dispersing the heat across the large surface area for rapid dissipation. However, these methods also suffer from passive cooling and low heat dissipation efficiency.

[0003] To this end, we provide a wireless mobile power supply with semiconductor cooling fins for heat dissipation to solve the above problems. Utility Model Content

[0004] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0005] The utility model is a wireless mobile power supply with semiconductor cooling fins for heat dissipation, comprising:

[0006] The wireless mobile power supply body has at least one battery unit and a TX wireless charging coil built in;

[0007] A heat dissipation component is adapted to be installed with the wireless mobile power supply body, and includes a heat-conducting aluminum sheet, a semiconductor cooling sheet, a heat sink, a turbofan, and an air inlet and outlet;

[0008] The thermally conductive aluminum sheet is in direct contact with the TX wireless charging coil and is tightly adhered to it through a strong adhesive thermal adhesive; the semiconductor refrigeration sheet is provided with a cold end and a hot end, the cold end of which is connected to the TX wireless charging coil through the thermally conductive aluminum sheet, and the hot end is connected to the heat sink;

[0009] The turbofan and the air inlet and outlet form an air flow exchange and heat dissipation path to promote heat.

[0010] The present invention is further configured such that a temperature sensing module is further provided inside the wireless mobile power supply body, and the temperature sensing module is provided near the TX wireless charging coil.

[0011] The present invention is further configured such that the temperature sensing module includes a temperature sensor and a control unit;

[0012] The control unit adjusts the working state of the semiconductor refrigeration plate and the speed of the turbofan according to the data fed back by the temperature sensor.

[0013] The utility model is further configured such that the heat-conducting aluminum sheet is made of a material with high thermal conductivity and has a smooth and flat surface.

[0014] The utility model is further configured such that the heat sink is made of aluminum material, and is coated with thermal grease at the contact point with the hot end of the semiconductor refrigeration plate, and the heat sink is configured as a fin-shaped structure.

[0015] The present invention is further configured such that the air inlet and outlet are provided with dustproof nets, and the air inlet and outlet are opened on the side of the wireless mobile power supply body.

[0016] The present invention is further configured such that the wireless mobile power supply body is further provided with a USB interface or other forms of wired charging interface.

[0017] The utility model has the following beneficial effects:

[0018] 1. The utility model promotes heat exchange by forming an airflow exchange path between the turbofan and the air inlet and outlet. The airflow generated by the turbofan enters from the air inlet, passes through the heat sink to remove heat, and is discharged from the air outlet, forming an effective convection heat dissipation mechanism, significantly improving the performance of the overall heat dissipation system and ensuring the stability of the wireless mobile power supply during high-power charging.

[0019] 2. The utility model adopts a thermally conductive aluminum sheet made of a high thermal conductivity material, and tightly fits the TX wireless charging coil through a strong adhesion thermal conductive glue, ensuring efficient heat conduction, not only reducing the air gap, but also improving the heat transfer efficiency, thereby quickly transferring the heat generated by the TX wireless charging coil to the cold end of the semiconductor refrigeration sheet; the semiconductor refrigeration sheet has a cold end and a hot end, the cold end can quickly absorb the heat from the TX wireless charging coil, and the hot end transfers the heat to the heat sink, effectively realizing local cooling, avoiding the impact of high temperature on the TX wireless charging coil and its surrounding components, and extending the service life of the equipment; the heat sink is made of aluminum material and designed into a fin-shaped structure, which increases the surface area, thereby improving the heat dissipation efficiency, and then applying thermal conductive silicone grease at the contact with the hot end of the semiconductor refrigeration sheet further enhances the heat conduction effect, ensuring that heat can be efficiently transferred from the semiconductor refrigeration sheet to the heat sink.

[0020] 3. This utility model uses a temperature sensor module to monitor the temperature of the TX wireless charging coil in real time. When the temperature reaches a preset threshold, the control unit automatically activates the cooling system, adjusts the operating state of the semiconductor cooling plate and the speed of the turbofan, and implements intelligent temperature control. This intelligent temperature monitoring and adjustment mechanism ensures the safety and reliability of the charging process.

[0021] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 This is a schematic diagram of the position of the TX wireless charging coil in this utility model.

[0024] Figure 2 This is a schematic diagram of the heat dissipation assembly in the present invention.

[0025] Figure 3 This is a schematic diagram of the positions of the air inlets and outlets in the present utility model.

[0026] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0027] 100. Wireless mobile power supply body; 101. Battery unit; 102. TX wireless charging coil; 103. Temperature sensing module; 103a. Temperature sensor; 103b. Control unit; 200. Heat dissipation assembly; 201. Thermally conductive aluminum sheet; 202. Semiconductor cooling sheet; 202a. Cold end; 202b. Hot end; 203. Heat sink; 204. Turbofan; 205. Air inlet and outlet. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] Example

[0030] See also Figure 1-3 The utility model is a wireless mobile power supply with semiconductor cooling fins for heat dissipation, comprising:

[0031] The wireless mobile power supply body 100 has at least one battery unit 101 and a TX wireless charging coil 102 built in;

[0032] The heat dissipation assembly 200 is adapted to be installed with the wireless mobile power supply body 100, and includes a heat-conducting aluminum sheet 201, a semiconductor cooling sheet 202, a heat sink 203, a turbofan 204, and an air inlet and outlet 205;

[0033] The heat-conducting aluminum sheet 201 is in direct contact with the TX wireless charging coil 102 and is tightly adhered to the TX wireless charging coil 102 through a strong adhesive heat-conducting adhesive. The semiconductor cooling sheet 202 is provided with a cold end 202a and a hot end 202b. The cold end 202a is connected to the TX wireless charging coil 102 through the heat-conducting aluminum sheet 201, and the hot end 202b is connected to the heat sink 203.

[0034] The turbofan 204 and the air inlet and outlet 205 form an airflow exchange and heat dissipation path to promote heat.

[0035] Specifically, a temperature sensing module 103 is further provided inside the wireless mobile power supply body 100. The temperature sensing module 103 is provided near the TX wireless charging coil 102. The temperature sensing module 103 includes a temperature sensor 103a and a control unit 103b.

[0036] The control unit 103b adjusts the working state of the semiconductor refrigeration plate 202 and the speed of the turbofan 204 according to the data fed back by the temperature sensor 103a.

[0037] Furthermore, the heat-conducting aluminum sheet 201 is made of a material with high thermal conductivity and has a smooth and flat surface. The heat sink 203 is made of aluminum and is coated with thermal grease at the contact point with the hot end 202b of the semiconductor refrigeration sheet 202. The heat sink 203 is configured as a fin-shaped structure.

[0038] The air inlet and outlet 205 is provided with a dustproof net, and the air inlet and outlet 205 is opened on the side of the wireless mobile power supply body 100; the wireless mobile power supply body 100 is also provided with a USB interface or other forms of wired charging interface.

[0039] The purpose of this utility model is to provide a wireless mobile power supply with semiconductor refrigeration plate heat dissipation, which ensures the stability and safety of the wireless charging process through an efficient thermal management mechanism, and utilizes the cooling effect of the semiconductor refrigeration plate 202 to quickly absorb and transfer the heat generated by the TX wireless charging coil 102 to ensure low-temperature operation during the charging process; the temperature sensor module 103 realizes real-time monitoring of the temperature of the TX wireless charging coil 102 and automatically adjusts the working mode of the heat dissipation system to ensure the best heat dissipation effect; in addition to supporting wireless charging, it also provides USB and other wired charging interfaces, which increases the flexibility of use. The entire device is compact and portable, and has waterproof and dustproof functions, which is suitable for use in various environments. Specific descriptions of the heat dissipation process of the wireless mobile power supply are as follows:

[0040] 1. Charging starts: When a user places a device that supports wireless charging (such as a smartphone) on the wireless power bank, the TX wireless charging coil 102 starts transmitting power to the device;

[0041] 2. Temperature monitoring: The temperature sensor 103a in the temperature sensing module 103 monitors the temperature of the TX wireless charging coil 102 in real time, and the temperature data is transmitted to the control unit 103b via a signal line;

[0042] 3. Temperature determination: The control unit 103b receives and processes data from the temperature sensor 103a. If it detects that the temperature of the TX wireless charging coil 102 is lower than a preset safety threshold (e.g., 60°C), the cooling system remains in the off state. If it detects that the temperature reaches or exceeds the preset safety threshold, the control unit 103b activates the cooling system.

[0043] 4. Starting the semiconductor refrigeration chip 202: The control unit 103b sends a start signal to the semiconductor refrigeration chip 202, and the semiconductor refrigeration chip 202 starts working. The cold end 202a of the semiconductor refrigeration chip 202 quickly cools down and absorbs the heat generated by the TX wireless charging coil 102 through the heat-conducting aluminum sheet 201. At the same time, the hot end 202b of the semiconductor refrigeration chip 202 generates heat.

[0044] 5. Turbofan 204 starts: The control unit 103b sends a start signal to the turbofan 204, and the turbofan 204 starts to operate, generating airflow that enters from the air inlet, passes through the heat sink 203, removes heat from the hot end 202b, and is then discharged from the air outlet;

[0045] 6. Heat Conduction and Heat Dissipation: The thermally conductive aluminum sheet 201 efficiently transfers heat from the TX wireless charging coil 102 to the cold end 202a of the semiconductor refrigeration sheet 202. The fin-shaped structure of the heat sink 203 increases the surface area and improves heat dissipation efficiency. The thermal grease applied between the heat sink 203 and the hot end 202b of the semiconductor refrigeration sheet 202 further enhances the heat conduction effect. The airflow forms convection through the air inlet and outlet 205, effectively removing the heat from the heat sink 203 and ensuring that the temperature of the entire system is effectively controlled.

[0046] 7. Temperature Regulation: The control unit 103b adjusts the operating power of the semiconductor cooling plate 202 and the speed of the turbofan 204 based on real-time temperature feedback. If the temperature continues to rise, the control unit 103b increases the cooling power and fan speed. If the temperature drops to a safe range, the control unit 103b gradually reduces the cooling power and fan speed, or even shuts down the cooling system to save energy.

[0047] 8. Charging End: When the external device is fully charged or removed, the TX wireless charging coil 102 stops working and the temperature sensor module 103 continues to monitor the temperature until the temperature of the TX wireless charging coil 102 drops below the safe range. At this time, the control unit 103b will completely shut down the cooling system.

[0048] 9. Standby mode: When there is no need to charge, the wireless mobile power supply enters a low-power standby mode, and all heat dissipation components 200 are in an inactive state to extend battery life;

[0049] Through the detailed heat dissipation steps described above, the wireless mobile power supply can effectively manage the temperature of the TX wireless charging coil 102, ensuring that overheating during high-power charging will not affect charging efficiency or damage the device. Its intelligent temperature control mechanism not only improves the safety of wireless charging, but also enhances the user experience.

[0050] Example 2

[0051] The assembly steps of the wireless mobile power supply structure are as follows:

[0052] 1. Assemble the wireless mobile power supply 100: Install the battery unit 101 and the TX wireless charging coil 102 into the pre-prepared housing, and place the temperature sensor 103a near the TX wireless charging coil 102;

[0053] 2. Install the heat sink assembly 200: Use strong adhesive thermal adhesive to secure the thermally conductive aluminum sheet 201 to the TX wireless charging coil 102. Install the semiconductor cooling sheet 202, ensuring that its cold end 202a contacts the thermally conductive aluminum sheet 201 and its hot end 202b contacts the heat sink 203. Apply thermal grease to the contact surfaces. Secure the heat sink 203 and tightly attach it to the housing of the wireless mobile power supply 100. Install the turbofan 204, ensuring that it aligns with the air inlet and outlet 205.

[0054] 3. Configure the temperature sensing module 103: Connect the temperature sensor 103a to the control unit 103b, program the control unit 103b, set the temperature threshold and the corresponding control logic of the semiconductor cooling plate 202 and the turbofan 204;

[0055] 4. Testing and debugging: Perform functional tests on the entire device to ensure that functions such as wireless charging, cooling system, and temperature control are functioning properly. Based on the test results, adjust the parameters of each component until optimal performance is achieved.

[0056] 5. Packaging and Finished Product Inspection: After all internal components are installed, the wireless mobile power supply body 100 is packaged and the appearance and function of the product are finally inspected to ensure that it meets factory standards.

[0057] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0058] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments do not describe all details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A wireless mobile power supply with semiconductor cooling fins for heat dissipation, characterized in that: include: A wireless mobile power source body (100) is provided with at least one battery unit (101) and a TX wireless charging coil (102); A heat dissipation component (200) is adapted and installed with the wireless mobile power supply body (100), and comprises a heat-conducting aluminum sheet (201), a semiconductor cooling sheet (202), a heat sink (203), a turbofan (204), and an air inlet and outlet (205); The heat-conducting aluminum sheet (201) is in direct contact with the TX wireless charging coil (102) and is tightly adhered to the TX wireless charging coil (102) via a strong adhesive heat-conducting adhesive; the semiconductor refrigeration sheet (202) is provided with a cold end (202a) and a hot end (202b); the cold end (202a) is connected to the TX wireless charging coil (102) via the heat-conducting aluminum sheet (201), and the hot end (202b) is connected to the heat sink (203); The turbofan (204) and the air inlet and outlet (205) form an airflow exchange and heat dissipation path to promote heat.

2. The wireless mobile power supply with semiconductor refrigeration fins for heat dissipation according to claim 1, characterized in that: A temperature sensing module (103) is also provided inside the wireless mobile power source body (100), and the temperature sensing module (103) is provided near the TX wireless charging coil (102).

3. The wireless mobile power supply with semiconductor refrigeration fins for heat dissipation according to claim 2, characterized in that: The temperature sensing module (103) comprises a temperature sensor (103a) and a control unit (103b); The control unit (103b) adjusts the working state of the semiconductor refrigeration plate (202) and the speed of the turbofan (204) according to the data fed back by the temperature sensor (103a).

4. The wireless mobile power supply with semiconductor refrigeration fins for heat dissipation according to claim 1, characterized in that: The heat-conducting aluminum sheet (201) is made of a material with high thermal conductivity, and its surface is treated to be smooth and flat.

5. The wireless mobile power supply with semiconductor cooling fins for heat dissipation according to claim 1, characterized in that: The heat sink (203) is made of aluminum material, and is coated with thermal grease at the contact point with the hot end (202b) of the semiconductor refrigeration plate (202). The heat sink (203) is configured as a fin-shaped structure.

6. The wireless mobile power supply with semiconductor refrigeration fins for heat dissipation according to claim 1, characterized in that: The air inlet and outlet (205) is provided with a dustproof net, and the air inlet and outlet (205) is opened on the side of the wireless mobile power supply body (100).

7. The wireless mobile power supply with semiconductor cooling fins for heat dissipation according to claim 1, characterized in that: The wireless mobile power source body (100) is also provided with a USB interface or other forms of wired charging interface.

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