Heat-conducting film structure

Abstract

The utility model discloses a heat-conducting film structure, which comprises a first radiating fin and a second radiating fin, and the first radiating fin and the second radiating fin are connected through a connecting layer. A plurality of strip-shaped grooves are formed in the back-to-back faces of the first cooling fin and the second cooling fin, adhesive faces are arranged in the strip-shaped grooves, non-stick paper adheres to the interiors of the strip-shaped grooves through the adhesive faces, a plurality of adsorption assemblies are arranged on the back-to-back faces of the first cooling fin and the second cooling fin, and the connecting layer is made of glue. And the glue is coated on the first radiating fin and the second radiating fin in a rolling manner. The adhesive surface is in contact with the heat dissipation surface by pressing the heat conduction adhesive sheet, the heat conduction adhesive sheet can be adhered to the heat dissipation surface through the adhesive surface, meanwhile, the negative pressure suction groove is extruded to exhaust air and can be adsorbed to the heat dissipation surface, and the non-stick paper is sunken and hidden at the moment and is not easy to touch, so that the edge warping condition of the non-stick paper is not easy to occur when the heat conduction adhesive sheet is carried; therefore, the glue surface is not polluted, and the condition of waste of the heat-conducting glue sheet is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal conductive films, in particular to a thermal conductive film structure. Background Art

[0002] Thermal conductive silicone sheet is a thermal conductive medium material synthesized through a special process with silicone as the base material and various auxiliary materials such as metal oxides. In the industry, it is also called thermal conductive silicone pad, thermal conductive silicone sheet, soft thermal conductive pad, thermal conductive silicone gasket, etc.

[0003] The existing thermal conductive film still has some shortcomings during use. When the existing high-efficiency thermal conductive film is carried or placed, the plastic film on its surface will be torn off and the adhesive surface will be covered with dust, causing the adhesiveness to gradually lose, thereby making the thermal conductive film unusable, resulting in the thermal conductive film being unusable and wasted; for this reason, the present application proposes a thermal conductive film structure. Utility Model Content

[0004] The purpose of the utility model is to solve the above technical problems and to propose a thermal conductive film structure.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A thermally conductive adhesive sheet structure comprises a first heat sink and a second heat sink, wherein the first heat sink and the second heat sink are connected via a connecting layer;

[0007] The first heat sink and the second heat sink are both provided with a plurality of strip grooves on the opposite side thereof, the strip grooves are provided with a glue surface, and non-stick paper is adhered to the strip grooves through the glue surface, and the first heat sink and the second heat sink are both provided with a plurality of groups of adsorption components on the opposite side thereof.

[0008] Preferably, the connection layer is glue, and the glue is rolled on the first heat sink and the second heat sink.

[0009] Preferably, the strip-shaped grooves are distributed in a linear array on the first heat sink and the second heat sink.

[0010] Preferably, each group of the adsorption components is located between two strip-shaped grooves, and each group of the adsorption components includes a plurality of negative pressure adsorption grooves, and the plurality of negative pressure adsorption grooves are distributed in a linear array.

[0011] Preferably, the thickness of the non-stick paper is smaller than the thickness of the strip groove.

[0012] Preferably, a connecting mechanism is further included, wherein the connecting mechanism includes a plurality of first ridges and second ridges respectively fixed on the first heat sink and the second heat sink, wherein the first ridges and the second ridges are staggered and interlocked and connected by a connecting glue.

[0013] Preferably, the first convex strips and the second convex strips have the same thickness and length.

[0014] Preferably, the plurality of first convex strips and the plurality of second convex strips are distributed in a linear array, a first groove body is formed between two adjacent first convex strips, and a second groove body is formed between two adjacent second convex strips.

[0015] Preferably, the first groove body, the second groove body, the first convex strip and the second convex strip have the same size.

[0016] Preferably, blocking strips for blocking the first and second convex strips are fixed to the end surfaces of the first and second heat sinks, and the thickness of the blocking strips is the same as the total thickness of the first and second heat sinks.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The utility model presses the thermal conductive film to make the adhesive surface contact with the heat dissipation surface, so that the adhesive surface can adhere to the heat dissipation surface. At the same time, the negative pressure suction groove is squeezed to discharge the air and can be adsorbed on the heat dissipation surface. Since the non-stick paper is recessed and hidden at this time, it is not easy to be touched, so that the non-stick paper is not easy to curl up when carried, and the adhesive surface will not be contaminated, and there will be no waste of thermal conductive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic structural diagram of a thermally conductive film structure proposed in Example 1 of the present utility model;

[0020] Figure 2 This is a schematic structural diagram of a thermally conductive film structure proposed in Example 2 of the present utility model;

[0021] Figure 3 This is a schematic structural diagram of point A in a thermally conductive film structure proposed in Example 2 of the present utility model;

[0022] Figure 4 This is a structural schematic diagram of a thermally conductive film structure proposed in Example 3 of the present utility model.

[0023] In the figure: 1 first heat sink, 2 non-stick paper, 3 adsorption component, 4 strip groove, 5 adhesive surface, 6 second heat sink, 7 first convex strip, 8 second convex strip, 9 blocking strip, 10 connection layer. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0025] Example 1

[0026] Reference Figure 1 A thermal conductive film structure includes a first heat sink 1 and a second heat sink 6. The first heat sink 1 and the second heat sink 6 are connected by a connecting layer 10. The connecting layer 10 is glue. The glue is rolled on the first heat sink 1 and the second heat sink 6 to ensure the stability of the connection between the two. In addition, the first heat sink 1 and the second heat sink 6 can also be formed as one piece.

[0027] The first heat sink 1 and the second heat sink 6 are each provided with a plurality of strip grooves 4 on the opposite sides thereof, and the strip grooves 4 are distributed in a linear array on the first heat sink 1 and the second heat sink 6; a glue surface 5 is provided in the strip groove 4, and a non-stick paper 2 is adhered in the strip groove 4 through the glue surface 5, and the thickness of the non-stick paper 2 is less than the thickness of the strip groove 4; in this way, when the thermal conductive film is carried, the non-stick paper 2 is recessed and hidden, and is not easily touched, so that the non-stick paper 2 is not likely to curl up when carried, and the glue surface 5 will not be contaminated, and there will be no waste of thermal conductive film.

[0028] A plurality of adsorption components 3 are provided on the opposite sides of the first heat sink 1 and the second heat sink 6. Each group of adsorption components 3 is located between two strip grooves 4. Each group of adsorption components 3 includes a plurality of negative pressure adsorption grooves, and the plurality of negative pressure adsorption grooves are distributed in a linear array. When the heat dissipation surface is a smooth surface, the thermal conductive film is pressed to make the adhesive surface 5 contact with the heat dissipation surface. The adhesive surface 5 can adhere to the heat dissipation surface, and at the same time, the negative pressure adsorption groove is squeezed to discharge the air, so that it can be adsorbed on the heat dissipation surface.

[0029] In addition, both sides of the thermal conductive film can be used as adhesive surfaces without affecting heat conduction and heat dissipation.

[0030] Example 2

[0031] Reference Figure 2-3 The present embodiment differs from the first embodiment in that the present embodiment further includes a connecting mechanism, which includes a plurality of first ridges 7 and second ridges 8 respectively fixed to the first heat sink 1 and the second heat sink 6. The first ridges 7 and the second ridges 8 are staggered and connected by a connecting glue. The first ridges 7 and the second ridges 8 have the same thickness and length. The plurality of first ridges 7 and the plurality of second ridges 8 are distributed in a linear array. A first groove is formed between two adjacent first ridges 7, and a second groove is formed between two adjacent second ridges 8. The first groove, the second groove, the first ridges 7, and the second ridges 8 have the same size.

[0032] In this way, the contact area between the first heat sink 1 and the second heat sink 6 can be increased, and the heat conduction area is increased compared to embodiment 1, thereby achieving more effective heat conduction.

[0033] Example 3

[0034] Reference Figure 4 The difference between this embodiment and embodiments 1 and 2 is that, in this embodiment, a stopper 9 is fixed to the end surfaces of the first heat sink 1 and the second heat sink 6 to block the first ridge 7 and the second ridge 8. The thickness of the stopper 9 is the same as the total thickness of the first heat sink 1 and the second heat sink 6.

[0035] By providing the blocking bars 9 , both ends of the non-stick paper 2 can be further blocked, thereby further preventing the non-stick paper 2 from warping.

[0036] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A thermally conductive film structure, characterized in that: include: A first heat sink (1) and a second heat sink (6), wherein the first heat sink (1) and the second heat sink (6) are connected via a connecting layer (10); A plurality of strip grooves (4) are provided on the opposite sides of the first heat sink (1) and the second heat sink (6), a rubber surface (5) is provided in the strip groove (4), and non-stick paper (2) is adhered in the strip groove (4) through the rubber surface (5), and a plurality of adsorption components (3) are provided on the opposite sides of the first heat sink (1) and the second heat sink (6).

2. A thermally conductive film structure according to claim 1, characterized in that: The connection layer (10) is glue, and the glue is rolled onto the first heat sink (1) and the second heat sink (6).

3. The thermal conductive film structure according to claim 1, characterized in that: The strip-shaped grooves (4) are distributed in a linear array on the first heat sink (1) and the second heat sink (6).

4. The thermal conductive film structure according to claim 1, characterized in that: Each group of the adsorption components (3) is located between two strip-shaped grooves (4), and each group of the adsorption components (3) includes a plurality of negative pressure adsorption grooves, and the plurality of negative pressure adsorption grooves are distributed in a linear array.

5. The thermal conductive film structure according to claim 1, characterized in that: The thickness of the non-stick paper (2) is smaller than the thickness of the strip groove (4).

6. The thermally conductive film structure according to claim 1, characterized in that: It also includes a connecting mechanism, which includes a plurality of first ridges (7) and second ridges (8) respectively fixed on the first heat sink (1) and the second heat sink (6), wherein the first ridges (7) and the second ridges (8) are staggered and interlocked and connected by a connecting glue.

7. The thermally conductive film structure according to claim 6, characterized in that: The first convex strip (7) and the second convex strip (8) have the same thickness and length.

8. The thermally conductive film structure according to claim 7, characterized in that: The plurality of first convex strips (7) and the plurality of second convex strips (8) are distributed in a linear array, a first groove body is formed between two adjacent first convex strips (7), and a second groove body is formed between two adjacent second convex strips (8).

9. The thermally conductive film structure according to claim 8, characterized in that: The first trough body, the second trough body, the first convex strip (7), and the second convex strip (8) have the same size.

10. The thermally conductive film structure according to claim 1, characterized in that: The end surfaces of the first heat sink (1) and the second heat sink (6) are fixed with blocking strips (9) for blocking the first convex strips (7) and the second convex strips (8); the thickness of the blocking strips (9) is the same as the total thickness of the first heat sink (1) and the second heat sink (6).

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