Chip assembling mechanism

Abstract

A chip assembling mechanism comprises a chip feeding part, a chip carrying mechanism, a chip positioning mechanism, a chip pin bending mechanism, a chip posture adjusting mechanism, a chip assembling mechanism and a bottom plate, and the chip feeding part is arranged on the lower portion of the bottom plate. The chip carrying mechanism, the chip pin bending mechanism and the chip posture adjusting mechanism are sequentially arranged in the middle of the bottom plate from left to right, the chip positioning mechanisms are arranged on the chip carrying mechanism, the chip pin bending mechanism, the chip posture adjusting mechanism and the chip assembling mechanism respectively, and the chip assembling mechanism is arranged on the upper portion of the bottom plate. The chip positioning mechanism comprises a chip seat, an X-direction positioning clamping jaw air cylinder, an X-direction positioning push rod, a Y-direction positioning clamping jaw air cylinder and a Y-direction positioning push rod. Compared with the prior art, a traditional clamping jaw structure is replaced by the suction cup structure to assemble chips, a brand-new chip positioning mechanism is matched to improve the accuracy of the suction cup, and the failure rate is reduced.

Description

Technical Field

[0001] The utility model relates to the field of chip processing equipment, in particular to a chip assembly mechanism. Background Art

[0002] In some automotive sensors, sensor chips are key components, and these chips must be assembled into the corresponding high-temperature-resistant plastic sensor body. With increasingly fierce market competition, lower-cost chips are gradually replacing higher-cost chips. At the same time, due to the automotive industry's high requirements for product quality, chips that fail to be installed once are deemed unqualified and cannot be used again, and must be scrapped. Consequently, customer companies have increased their first-pass assembly quality requirement for chips from 98% to 99.5%. The new chips' smaller size makes assembly more challenging, and a 99.5% first-pass success rate requires higher precision than the previous 98%, necessitating upgrades to existing production equipment.

[0003] To address the above issues, we have made a series of improvements. Utility Model Content

[0004] The purpose of the present invention is to provide a chip assembly mechanism to overcome the above-mentioned shortcomings and deficiencies in the prior art.

[0005] A chip assembly mechanism, comprising: a chip feeding component, a chip transport mechanism, a chip positioning mechanism, a chip pin bending mechanism, a chip posture adjustment mechanism, a chip assembly mechanism, and a base plate, wherein the chip feeding component is disposed at the lower portion of the base plate, the chip transport mechanism, the chip pin bending mechanism, and the chip posture adjustment mechanism are disposed in sequence from left to right at the middle portion of the base plate, the chip positioning mechanism is disposed on the chip transport mechanism, the chip pin bending mechanism, the chip posture adjustment mechanism, and the chip assembly mechanism, respectively, and the chip assembly mechanism is disposed at the upper portion of the base plate;

[0006] Wherein, the chip positioning mechanism includes: a chip seat, an X-direction positioning clamping cylinder, an X-direction positioning push rod, a Y-direction positioning clamping cylinder and a Y-direction positioning push rod, the X-direction positioning clamping cylinder is connected to the side end of the chip seat, the X-direction positioning clamping cylinder is connected to the X-direction positioning push rod, the Y-direction positioning clamping cylinder is provided on the opposite side of the chip seat, and the Y-direction positioning clamping cylinder is connected to the Y-direction positioning push rod.

[0007] Furthermore, the chip feeding component includes: a chip feeder, a chip shearing mechanism and a chip slot, the chip shearing mechanism is arranged above the chip feeder, and the chip slot is arranged below the chip shearing mechanism.

[0008] Furthermore, the chip transport mechanism includes: a chip horizontal transport mechanism, a chip vertical transport mechanism and a chip transport suction cup mechanism. The chip horizontal transport mechanism is provided with a chip vertical transport mechanism. The number of the chip vertical transport mechanisms is 2. The chip transport suction cup mechanism is connected to the chip vertical transport mechanism.

[0009] Furthermore, the chip pin bending mechanism includes: a bending cylinder, a chip pin bending lower mold, a chip pin pressure head mechanism and a chip pin bending upper mold, the bending cylinder is connected to the chip pin bending lower mold, the chip pin pressure head mechanism is connected to the chip pin bending upper mold, and the chip pin bending lower mold is arranged below the chip pin bending upper mold.

[0010] Furthermore, the chip posture adjustment mechanism includes: a chip placement table, a chip flipping mechanism and a chip presence detection sensor. The chip placement table is provided with a vacuum adsorber, the chip flipping mechanism is provided at the side end of the chip placement table, and the chip presence detection sensor is provided in front of the chip placement table.

[0011] Furthermore, the chip assembly mechanism includes: a servo electric cylinder mechanism, a chip transport cylinder, a chip assembly suction cup mechanism and a chip precision positioning mechanism. The servo electric cylinder mechanism is connected to the chip transport cylinder. The chip transport cylinder is provided with a chip assembly suction cup mechanism. The chip precision positioning mechanism is provided on the chip assembly suction cup mechanism.

[0012] Beneficial effects of the utility model:

[0013] Compared with the traditional technology, the utility model uses a suction cup structure to replace the traditional clamping claw structure to assemble the chip, and is equipped with a new chip positioning mechanism to increase the accuracy of the suction cup and reduce the failure rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of the present utility model.

[0015] Figure 2 It is a schematic diagram of the explosion structure of the utility model.

[0016] Figure 3 It is a schematic diagram of the top structure of the utility model.

[0017] Figure 4 Schematic diagram of the chip positioning mechanism.

[0018] Figure 5 This is a structural diagram of another chip positioning mechanism.

[0019] Figure 6 This is a schematic diagram of the structure of the chip feeding component.

[0020] Figure 7It is a structural diagram of the chip transport mechanism.

[0021] Figure 8 This is a structural diagram of the chip pin bending mechanism.

[0022] Figure 9 This is a structural diagram of the chip posture adjustment mechanism.

[0023] Figure 10 Schematic diagram of the chip assembly mechanism.

[0024] Reference numerals:

[0025] The chip feeding component 100 , the chip feeder 110 , the chip shearing mechanism 120 and the chip slot 130 .

[0026] Chip transport mechanism 200 , chip horizontal transport mechanism 210 , chip vertical transport mechanism 220 , and chip transport suction cup mechanism 230 .

[0027] Chip positioning mechanism 300 , chip holder 310 , X-direction positioning clamping cylinder 320 , X-direction positioning push rod 330 , Y-direction positioning clamping cylinder 340 and Y-direction positioning push rod 350 .

[0028] Chip pin bending mechanism 400 , bending cylinder 410 , chip pin bending lower die 420 , chip pin pressing head mechanism 430 and chip pin bending upper die 440 .

[0029] Chip posture adjustment mechanism 500 , chip placement table 510 , chip flipping mechanism 520 and chip presence detection sensor 530 .

[0030] Chip assembly mechanism 600 , servo electric cylinder mechanism 610 , chip transport cylinder 620 , chip assembly suction cup mechanism 630 , chip precision positioning mechanism 640 and base plate 700 . DETAILED DESCRIPTION

[0031] The present invention will be further described below in conjunction with specific embodiments. It should be understood that the following embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0032] Example 1

[0033] Figure 1 It is a structural diagram of the present utility model. Figure 2 It is a schematic diagram of the explosion structure of the utility model. Figure 3 It is a schematic diagram of the top structure of the utility model. Figure 4 Schematic diagram of the chip positioning mechanism. Figure 5 This is a structural diagram of another chip positioning mechanism. Figure 6 This is a schematic diagram of the structure of the chip feeding component. Figure 7 It is a structural diagram of the chip transport mechanism. Figure 8 This is a structural diagram of the chip pin bending mechanism. Figure 9 This is a structural diagram of the chip posture adjustment mechanism. Figure 10 Schematic diagram of the chip assembly mechanism.

[0034] like Figure 1-3 As shown, a chip assembly mechanism includes: a chip feeding component 100, a chip conveying mechanism 200, a chip positioning mechanism 300, a chip pin bending mechanism 400, a chip posture adjustment mechanism 500, a chip assembly mechanism 600 and a base plate 700. The chip feeding component 100 is arranged at the lower part of the base plate 700, the chip conveying mechanism 200, the chip pin bending mechanism 400, and the chip posture adjustment mechanism 500 are arranged in the middle of the base plate 700 from left to right, the chip positioning mechanism 300 is respectively arranged on the chip conveying mechanism 200, the chip pin bending mechanism 400, the chip posture adjustment mechanism 500 and the chip assembly mechanism 600, and the chip assembly mechanism 600 is arranged on the upper part of the base plate 700.

[0035] like Figure 4 and Figure 5 As shown, the chip positioning mechanism 300 includes: a chip base 310, an X-direction positioning clamping cylinder 320, an X-direction positioning push rod 330, a Y-direction positioning clamping cylinder 340 and a Y-direction positioning push rod 350, the X-direction positioning clamping cylinder 320 is connected to the side end of the chip base 310, the X-direction positioning clamping cylinder 320 is connected to the X-direction positioning push rod 330, the Y-direction positioning clamping cylinder 340 is arranged on the opposite side of the chip base 310, and the Y-direction positioning clamping cylinder 340 is connected to the Y-direction positioning push rod 350.

[0036] like Figure 6 As shown, the chip feeding component 100 includes: a chip feeder 110 , a chip shearing mechanism 120 and a chip slot 130 . The chip shearing mechanism 120 is disposed above the chip feeder 110 , and the chip slot 130 is disposed below the chip shearing mechanism 120 .

[0037] like Figure 7 As shown, the chip transport mechanism 200 includes: a chip horizontal transport mechanism 210, a chip vertical transport mechanism 220 and a chip transport suction cup mechanism 230. The chip horizontal transport mechanism 210 is provided with a chip vertical transport mechanism 220. There are two chip vertical transport mechanisms 220. The chip transport suction cup mechanism 230 is connected to the chip vertical transport mechanism 220.

[0038] like Figure 8As shown, the chip pin bending mechanism 400 includes: a bending cylinder 410, a chip pin bending lower mold 420, a chip pin pressing head mechanism 430 and a chip pin bending upper mold 440. The bending cylinder 410 is connected to the chip pin bending lower mold 420, the chip pin pressing head mechanism 430 is connected to the chip pin bending upper mold 440, and the chip pin bending lower mold 420 is arranged below the chip pin bending upper mold 440.

[0039] like Figure 9 As shown, the chip posture adjustment mechanism 500 includes: a chip placement table 510, a chip flipping mechanism 520 and a chip existence detection sensor 530. A vacuum adsorbent is provided on the chip placement table 510, the chip flipping mechanism 520 is provided at the side end of the chip placement table 510, and the chip existence detection sensor 530 is provided in front of the chip placement table 510.

[0040] like Figure 10 As shown, the chip assembly mechanism 600 includes: a servo electric cylinder mechanism 610, a chip transport cylinder 620, a chip assembly suction cup mechanism 630 and a chip precision positioning mechanism 640. The servo electric cylinder mechanism 610 is connected to the chip transport cylinder 620, the chip transport cylinder 620 is provided with a chip assembly suction cup mechanism 630, and the chip precision positioning mechanism 640 is provided on the chip assembly suction cup mechanism 630.

[0041] The operating principle of the present invention is as follows: in the chip feeding component 100, the chip feeder 110 transfers the material to the chip shearing mechanism 120, the chip shearing mechanism 120 shears the chip, and the chip falls into the chip slot 130, and the chip slot transport mechanism withdraws the chip to the transport position.

[0042] In the chip transport mechanism 200 , the chip horizontal transport mechanism 210 , the chip vertical transport mechanism 220 , and the chip transport suction cup mechanism 230 , through cooperative movement of each mechanism, transport the chips step by step on the five stations.

[0043] In the chip pin bending mechanism 400, the chip pin bending lower mold 420, the chip pin pressing head mechanism 430 and the chip pin bending upper mold 440, with the cooperation of the chip positioning mechanism 300, the pin pressing head presses the pin before performing the bending step to ensure that the connection between the pin and the chip head is not subjected to stress, thereby avoiding damage.

[0044] In the chip posture adjustment mechanism 500 , the chip placement table 510 has a vacuum adsorption function to ensure that the chip does not fall, and the chip flipping mechanism 520 cooperates with the chip presence detection sensor 530 to adjust the chip to the correct installation angle.

[0045] In the chip assembly mechanism 600, the servo electric cylinder mechanism 610 is responsible for adjusting the Z-direction position of the chip, the chip transport cylinder 620 is responsible for the X-direction position of the chip, the chip assembly suction cup mechanism 630 is responsible for pushing the chip into the shell, and the chip precision positioning mechanism 640 positions the chip when picking up the chip and positions the shell when assembling the chip, thereby ensuring the success rate of chip assembly in one go.

[0046] The innovation of this utility model is:

[0047] Because chips are inherently fragile, conventional gripper handling methods risk damaging them. Therefore, the present invention utilizes suction cups as the primary handling tool. These suction cups are: chip handling suction cup mechanism 230 and chip assembly suction cup mechanism 630. However, the suction cups' inherent flexibility can lead to positional deviations during each handling process. This deviation can cause failures in various chip processing steps, such as bending and assembly. While the probability is low, approximately 2%, this probability does not achieve the desired results.

[0048] To further improve precision, we refined some process steps, incorporating fine-tuning capabilities into each moving part at each station. This enhanced chip positioning accuracy at each station and successfully increased the first-pass success rate of chip assembly. According to actual operational results, the chip assembly success rate is between 99.7% and 99.9%, meeting the 99.5% customer requirement. This was achieved by adding three chip positioning mechanisms 300: located on the chip transport mechanism 200, the chip pin bending mechanism 400, the chip posture adjustment mechanism 500, and the chip assembly mechanism 600. These positioning mechanisms have reduced the chip assembly failure rate from 2% to less than 0.5%.

[0049] The chip positioning mechanism 300 includes a chip holder 310, an X-direction positioning gripper cylinder 320, an X-direction positioning push rod 330, a Y-direction positioning gripper cylinder 340, and a Y-direction positioning push rod 350. The X-direction positioning gripper cylinder 320, the X-direction positioning push rod 330, the Y-direction positioning gripper cylinder 340, and the Y-direction positioning push rod 350 are all arranged near the chip holder 310. When the chip is placed on the chip holder 310 by the suction cup, the X-direction positioning gripper cylinder 320 closes and the Y-direction positioning push rod 350 is pushed out, positioning the chip head in a very small space. This corrects the position deviation caused by the suction cup handling, thereby successfully increasing the product's first-time success rate from 98% to over 99.5%, saving production costs for customers.

[0050] Compared with the traditional technology, the utility model uses a suction cup structure to replace the traditional clamping claw structure to assemble the chip, and is equipped with a new chip positioning mechanism to increase the accuracy of the suction cup and reduce the failure rate.

[0051] The above describes the specific implementation of the present invention, but the present invention is not limited thereto. As long as it does not deviate from the purpose of the present invention, the present invention can also have various changes.

Claims

1. A chip assembly mechanism, characterized in that: include: A chip feeding component (100), a chip conveying mechanism (200), a chip positioning mechanism (300), a chip pin bending mechanism (400), a chip posture adjustment mechanism (500), a chip assembly mechanism (600) and a base plate (700); the chip feeding component (100) is arranged at the lower part of the base plate (700); the chip conveying mechanism (200), the chip pin bending mechanism (400) and the chip posture adjustment mechanism (500) are arranged in sequence from left to right at the middle part of the base plate (700); the chip positioning mechanism (300) is respectively arranged on the chip conveying mechanism (200), the chip pin bending mechanism (400), the chip posture adjustment mechanism (500) and the chip assembly mechanism (600); and the chip assembly mechanism (600) is arranged at the upper part of the base plate (700); The chip positioning mechanism (300) comprises: a chip seat (310), an X-direction positioning clamping claw cylinder (320), an X-direction positioning push rod (330), a Y-direction positioning clamping claw cylinder (340) and a Y-direction positioning push rod (350); the X-direction positioning clamping claw cylinder (320) is connected to the side end of the chip seat (310); the X-direction positioning clamping claw cylinder (320) is connected to the X-direction positioning push rod (330); the Y-direction positioning clamping claw cylinder (340) is arranged on the opposite side of the chip seat (310); and the Y-direction positioning clamping claw cylinder (340) is connected to the Y-direction positioning push rod (350).

2. A chip assembly mechanism according to claim 1, characterized in that: The chip feeding component (100) comprises: a chip feeder (110), a chip shearing mechanism (120) and a chip slot (130); the chip shearing mechanism (120) is arranged above the chip feeder (110), and the chip slot (130) is arranged below the chip shearing mechanism (120).

3. The chip assembly mechanism according to claim 1, wherein: The chip transport mechanism (200) comprises: a chip transverse transport mechanism (210), a chip vertical transport mechanism (220) and a chip transport suction cup mechanism (230); the chip transverse transport mechanism (210) is provided with a chip vertical transport mechanism (220); the chip vertical transport mechanism (220) is provided in two pieces; and the chip transport suction cup mechanism (230) is connected to the chip vertical transport mechanism (220).

4. The chip assembly mechanism according to claim 1, wherein: The chip pin bending mechanism (400) comprises: a bending cylinder (410), a chip pin bending lower die (420), a chip pin pressing head mechanism (430) and a chip pin bending upper die (440); the bending cylinder (410) is connected to the chip pin bending lower die (420); the chip pin pressing head mechanism (430) is connected to the chip pin bending upper die (440); and the chip pin bending lower die (420) is arranged below the chip pin bending upper die (440).

5. The chip assembly mechanism according to claim 1, wherein: The chip posture adjustment mechanism (500) comprises: a chip placement platform (510), a chip flipping mechanism (520) and a chip presence detection sensor (530); a vacuum adsorber is provided on the chip placement platform (510); the chip flipping mechanism (520) is arranged at a side end of the chip placement platform (510); and the chip presence detection sensor (530) is arranged in front of the chip placement platform (510).

6. The chip assembly mechanism according to claim 1, wherein: The chip assembly mechanism (600) comprises: a servo electric cylinder mechanism (610), a chip transport cylinder (620), a chip assembly sucker mechanism (630) and a chip precision positioning mechanism (640); the servo electric cylinder mechanism (610) is connected to the chip transport cylinder (620); the chip assembly sucker mechanism (630) is provided on the chip transport cylinder (620); and the chip precision positioning mechanism (640) is provided on the chip assembly sucker mechanism (630).

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