Water circulation temperature adjusting metal bath system

Abstract

The utility model discloses a water circulation temperature adjusting metal bath system, belongs to the technical field of metal baths, and aims to solve the problems that the temperature adjusting speed is low when an existing water cooling assembly is made of metal materials and the like. The utility model discloses a water-circulation temperature-regulating metal bath system, which comprises an adapter; one surface of the heating and cooling semiconductor module is attached to the wall surface of the adapter; the water circulation temperature adjusting system comprises a heat exchange block and a water supply pipe, a heat exchange cavity is formed in the heat exchange block, and the water supply pipe is used for conveying cooling water or heating water into the heat exchange cavity; the heat exchange block is attached to the other face of the heating and refrigerating semiconductor module, and heat exchange can be conducted between the heat exchange block and the heating and refrigerating semiconductor module. According to the water circulation temperature adjusting metal bath system disclosed by the utility model, the temperature of the adapter is ensured to be within a set range by utilizing the characteristic of high temperature control precision of the heating and refrigerating semiconductor module, the temperature adjusting requirement of a reagent bottle can be met in time, the temperature adjustment is rapid, and the temperature of the reagent bottle is more uniform and stable.

Description

Technical Field

[0001] The utility model relates to the technical field of metal baths, in particular to a water circulation temperature-regulating metal bath system. Background Art

[0002] In many scientific research and production fields, precise temperature control of reagents or samples is required. One existing method uses metal as a heat-conducting medium. The reagents or samples are placed in a metal frame and heat is exchanged with the metal, creating a metal bath similar to a traditional water bath.

[0003] After prolonged use, or when reagent or sample temperatures fluctuate significantly, the temperature of the metal material can rise or fall rapidly, resulting in reduced heat exchange efficiency. To address this issue, some existing metal baths are equipped with a water cooling assembly. This assembly is attached to the metal's outer shell and stabilizes the metal's temperature through heat exchange between water and the metal.

[0004] The existing structure has drawbacks: the water-cooling assembly is slow to adjust the temperature of metal materials, and the heat exchange efficiency is easily affected by the environment. In particular, when multiple metal frames are placed together, a single water-cooling assembly cannot exchange heat with all the metal materials in a timely manner, resulting in a poor user experience. Utility Model Content

[0005] The purpose of the utility model is to propose a water circulation temperature-regulating metal bath system, which solves the problem that the existing water cooling components are slow in regulating the temperature of metal materials, and the temperature control of the reagent bottle is more stable.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A water circulation temperature control metal bath system includes: an adapter for placing a reagent bottle; a heating and cooling semiconductor module, one side of which is attached to the wall of the adapter, and the heating and cooling semiconductor module can exchange heat with the reagent bottle through the adapter; and a water circulation temperature control system, including a heat exchange block and a water supply pipe, a heat exchange cavity is provided inside the heat exchange block, and the water supply pipe is used to transport cooling water or heating water to the heat exchange cavity; the heat exchange block is attached to the other side of the heating and cooling semiconductor module, and the heat exchange block can exchange heat with the heating and cooling semiconductor module.

[0008] In one of the preferred embodiments, the water circulation temperature control system also includes a water pump, the water supply pipe includes a water inlet pipe and a water outlet pipe, the water supply pipe is connected between the water pump and the water inlet of the heat exchange block, and the water outlet pipe is connected between the water pump and the water outlet of the heat exchange block. The water pump is used to deliver the cooling water or the heating water into the heat exchange cavity through the water inlet pipe.

[0009] In one preferred embodiment, the water circulation temperature control system further includes a fan assembly, and the fan assembly is used to cool the water in the water outlet pipe.

[0010] In one preferred embodiment, the water outlet pipe includes a front water outlet pipe and a rear water outlet pipe, the front water outlet pipe is connected between the fan assembly and the water outlet of the heat exchange block, and the rear water outlet pipe is connected between the fan assembly and the water pump.

[0011] In one preferred embodiment, the water circulation temperature-adjusting metal bath system further includes a temperature sensor, and the temperature sensor is used to detect the temperature of the adapter.

[0012] In one preferred embodiment, the water circulation temperature control metal bath system further includes a control system, which is respectively connected to the temperature sensor, the heating and cooling semiconductor module and the water circulation temperature control system.

[0013] In one of the preferred embodiments, the water circulation temperature control metal bath system includes at least two of the adapters and a group of the water circulation temperature control systems, the water circulation temperature control system includes the same number of heat exchange blocks as the adapters, and two adjacent heat exchange blocks are connected by an intermediate water pipe.

[0014] In one preferred embodiment, all of the adapters are attached to the same heating and cooling semiconductor module; or, each of the adapters is attached to a heating and cooling semiconductor module, and two adjacent heating and cooling semiconductor modules are electrically connected.

[0015] In one preferred embodiment, a limiting groove is provided on the adapter, and the reagent bottle is located in the limiting groove.

[0016] In one preferred embodiment, the adapter is made of aluminum material with a purity reaching a set value.

[0017] The water circulation temperature control metal bath system disclosed by the utility model comprises an adapter, a heating and cooling semiconductor module and a water circulation temperature control system which are arranged in sequence. One side of the heating and cooling semiconductor module can perform heat exchange with a reagent bottle through the adapter, and the other side of the heating and cooling semiconductor module can perform heat exchange with a heat exchange block of the water circulation temperature control system. The high temperature control precision of the heating and cooling semiconductor module is utilized to ensure that the temperature of the adapter is within a set range. Whether heating or cooling is required, the temperature control requirements of the reagent bottle can be met in a timely manner. The temperature is adjusted quickly, and the temperature of the reagent bottle is more uniform and stable, thereby improving the accuracy and reliability of experimental results and industrial production. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1This is a schematic structural diagram of a water circulation temperature-adjusting metal bath system provided by a specific embodiment of the present utility model;

[0019] Figure 2 yes Figure 1 A partial enlarged view of point A in the middle.

[0020] In the picture:

[0021] 1. Adapter; 2. Heating and cooling semiconductor module; 21. Wire; 31. Heat exchange block; 32. Water pump; 33. Water inlet pipe; 34. Fan assembly; 35. Front water outlet pipe; 36. Rear water outlet pipe; 37. Middle water pipe; 100. Reagent bottle. DETAILED DESCRIPTION

[0022] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar improvements without violating the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0025] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0026] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0027] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0028] This embodiment discloses a water circulation temperature regulating metal bath system for regulating the temperature of objects placed therein. Figure 1 and Figure 2 As shown, the water circulation temperature control metal bath system includes an adapter 1, a heating and cooling semiconductor module 2 and a water circulation temperature control system. The reagent bottle 100 is placed in the adapter 1 made of metal material. The water circulation temperature control system includes a heat exchange block 31 and a water supply pipe. A heat exchange cavity is opened inside the heat exchange block 31, and the water supply pipe is used to transport cooling water or heating water to the heat exchange cavity.

[0029] One side of the heating and cooling semiconductor module 2 adheres to the wall of the adapter 1, and the other side adheres to the heat exchange block 31. The heat exchange block 31 can exchange heat with the heating and cooling semiconductor module 2. The adapter 1, made of metal material, has excellent thermal conductivity and can quickly respond to temperature changes of the heating and cooling semiconductor module 2, enabling heat exchange between the heating and cooling semiconductor module 2 and the reagent bottle 100 through the adapter 1. It can be understood that by adjusting the current direction of the heating and cooling semiconductor module 2, the heating and cooling functions can be switched to meet different usage requirements.

[0030] By utilizing the high temperature control precision of the heating and cooling semiconductor module 2, the temperature of the adapter 1 is ensured to be within the set range. Whether heating or cooling is required, the temperature adjustment requirements of the reagent bottle 100 can be met in a timely manner. The temperature adjustment is rapid, and the temperature of the reagent bottle 100 is more uniform and stable, thereby improving the accuracy and reliability of experimental results and industrial production.

[0031] The heat exchange block 31 of the water circulation temperature control system is fitted with the heating and cooling semiconductor module 2. Cold water or hot water is supplied to the heat exchange block 31 through a water supply pipe. Water (cold water or hot water) is used to exchange heat with the heating and cooling semiconductor module 2 to ensure that the heat or cold transferred from the reagent bottle 100 to the heating and cooling semiconductor module 2 can be quickly transferred to the water circulation temperature control system, ensuring that the heating and cooling semiconductor module 2 can continuously transfer the heat or cold on the reagent bottle 100, so that the reagent bottle 100 can be maintained within the set temperature range for a long time, which is energy-saving and efficient.

[0032] The water circulation temperature-regulating metal bath system has a simple and compact structure, and the components are reliably connected, which facilitates daily maintenance and troubleshooting, and can achieve long-term and precise control of the temperature of the reagent bottle 100.

[0033] On the basis of the above structure, the water circulation temperature control system further includes a water pump 32. The water supply pipe includes a water inlet pipe 33 and a water outlet pipe. The water supply pipe is connected between the water pump 32 and the water inlet of the heat exchange block 31, and the water outlet pipe is connected between the water pump 32 and the water outlet of the heat exchange block 31.

[0034] The water pump 32 can deliver cooling water or heating water into the heat exchange cavity of the heat exchange block 31 through the water inlet pipe 33. As the cooling water or heating water flows from the water inlet of the heat exchange block 31 to the water outlet of the heat exchange block 31, it can exchange heat with the heating and cooling semiconductor module 2, removing heat or cold from the heating and cooling semiconductor module 2. This provides high heat exchange efficiency and ease of use. The water pump 32 can change its pumping speed based on the speed of temperature changes on the heating and cooling semiconductor module 2, thereby promptly transferring heat or cold from the heating and cooling semiconductor module 2, thereby enabling more precise temperature control of the reagent bottle 100.

[0035] When water pump 32 delivers cold water into the heat exchange cavity of heat exchange block 31, the cold water exchanges heat with the high-temperature heating and cooling semiconductor module 2, becoming medium-high-temperature water. This medium-high-temperature water then flows back to water pump 32 to prepare for the next heat exchange. To improve the heat exchange efficiency between the cold water and the high-temperature heating and cooling semiconductor module 2, the water circulation temperature control system also includes a fan assembly 34. Fan assembly 34 lowers the water temperature in the outlet pipe, minimizing the temperature of the water returning to water pump 32. This allows the next heat exchange to proceed directly without additional cooling measures, thus forming a closed loop.

[0036] The specific method for cooling the water in the outlet pipe of the water circulation temperature control system by the fan assembly 34 is not limited and can be determined according to actual use requirements. The fan can be used to blow air directly toward the outlet pipe to reduce the water temperature in the outlet pipe.

[0037] Another method is: the fan assembly 34 includes a housing and fan blades arranged in the housing. The water in the water outlet pipe enters the housing, and the fan blades blow air directly toward the medium- and high-temperature water, which has a better heat dissipation effect. Specifically, the water outlet pipe includes a front water outlet pipe 35 and a rear water outlet pipe 36. The front water outlet pipe 35 is connected between the fan assembly 34 and the water outlet of the heat exchange block 31, and the rear water outlet pipe 36 is connected between the fan assembly 34 and the water pump 32. The medium- and high-temperature water that has exchanged heat with the heating and cooling semiconductor module 2 enters the housing of the fan assembly 34 through the front water outlet pipe 35. After being cooled by the fan blades, the water temperature drops. The cooled water returns to the water pump 32 through the rear water outlet pipe 36, ready to enter the heat exchange block 31 for heat exchange again.

[0038] On the basis of the above structure, the water circulation temperature-controlled metal bath system further includes a temperature sensor. The temperature sensor is arranged on the adapter 1 so as to accurately detect the temperature of the adapter 1.

[0039] In this embodiment, the water circulation temperature control metal bath system further includes a control system, which is connected to the temperature sensor, the heating and cooling semiconductor module 2, and the water pump 32 and fan assembly 34 of the water circulation temperature control system.

[0040] The temperature sensor transmits the adapter 1's temperature measurement results to the control system, which then adjusts the operating states of the heating and cooling semiconductor module 2 and the water circulation temperature control system based on these values. Specifically, the control system determines whether to switch between the heating and cooling functions of the heating and cooling semiconductor module 2, whether to start and stop the water pump 32 and fan assembly 34, and the operating parameters of the water pump 32 and fan assembly 34 based on the temperature values ​​transmitted by the temperature sensor. This ensures that the temperature of the adapter 1 remains within a preset range, ensuring more accurate temperature control.

[0041] In this embodiment, the control system can be a centralized or distributed controller. For example, the controller can be a single single-chip microcomputer or a distributed array of multiple single-chip microcomputers. The single-chip microcomputer can run a control program to control the heating and cooling semiconductor module 2, water pump 32, and fan assembly 34 to achieve their functions. Specifically, the control system integrates temperature setting, display, monitoring, and automatic adjustment functions, providing excellent human-computer interaction.

[0042] Based on the above structure, the adapter 1 is provided with a limiting groove. The shape and size of the groove match the reagent bottle 100, and the reagent bottle 100 can be stably stuck in the limiting groove. The outer wall of the reagent bottle 100 is tightly attached to the inner wall of the groove. The full contact helps improve heat exchange efficiency and more accurately control the temperature of the reagent bottle 100.

[0043] The specific material of the metal adapter 1 is not limited, as long as it has good thermal conductivity and is easy to process. In this embodiment, the adapter 1 is made of aluminum with a purity that meets a set value. The purity setting is not specifically limited and can be adjusted according to operational requirements.

[0044] To improve operating efficiency, a water-circulating temperature-controlled metal bath system can include at least two adapters 1 and a set of water-circulating temperature-controlled systems. Each set of water-circulating temperature-controlled systems includes an equal number of heat exchange blocks 31 as the number of adapters 1, with one adapter 1 placed in each heat exchange block 31. Adjacent heat exchange blocks 31 are connected by intermediate water pipes 37. A single set of water-circulating pipes can deliver heat exchange water to all heat exchange blocks 31, simplifying the overall structure, reducing size, and making control more convenient.

[0045] The specific structure of the heating and cooling semiconductor module 2 that cooperates with multiple adapters 1 is not limited. In one structure, the area of ​​the heating and cooling semiconductor module 2 is increased, and all adapters 1 are attached to the same heating and cooling semiconductor module 2, so that the temperature control of the adapters 1 is more uniform.

[0046] In another configuration, each adapter 1 is attached to a heating and cooling semiconductor module 2, and adjacent heating and cooling semiconductor modules 2 are electrically connected via a wire 21. In other words, simply connecting existing heating and cooling semiconductor modules 2 in series can meet the heat exchange needs of multiple adapters 1, eliminating the need to modify the shape and size of the heating and cooling semiconductor modules 2, resulting in low cost.

[0047] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions are possible for those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. Water circulation temperature regulating metal bath system, characterized in that: include: An adapter (1) for placing a reagent bottle (100); a heating and cooling semiconductor module (2), one side of which is attached to the wall surface of the adapter (1), and the heating and cooling semiconductor module (2) can perform heat exchange with the reagent bottle (100) through the adapter (1); and A water circulation temperature control system comprises a heat exchange block (31) and a water supply pipe, wherein a heat exchange cavity is provided inside the heat exchange block (31), and the water supply pipe is used to transport cooling water or heating water into the heat exchange cavity; the heat exchange block (31) is attached to the other side of the heating and cooling semiconductor module (2), and the heat exchange block (31) can perform heat exchange with the heating and cooling semiconductor module (2).

2. The water circulation temperature regulating metal bath system according to claim 1, characterized in that: The water circulation temperature control system also includes a water pump (32), and the water supply pipe includes a water inlet pipe (33) and a water outlet pipe. The water supply pipe is connected between the water pump (32) and the water inlet of the heat exchange block (31), and the water outlet pipe is connected between the water pump (32) and the water outlet of the heat exchange block (31). The water pump (32) is used to send the cooling water or the heating water into the heat exchange cavity through the water inlet pipe (33).

3. The water circulation temperature regulating metal bath system according to claim 2, characterized in that: The water circulation temperature control system further comprises a fan assembly (34), and the fan assembly (34) is used to cool the water in the water outlet pipe.

4. The water circulation temperature regulating metal bath system according to claim 3, characterized in that: The water outlet pipe comprises a front water outlet pipe (35) and a rear water outlet pipe (36), wherein the front water outlet pipe (35) is connected between the fan assembly (34) and the water outlet of the heat exchange block (31), and the rear water outlet pipe (36) is connected between the fan assembly (34) and the water pump (32).

5. The water circulation temperature regulating metal bath system according to any one of claims 1 to 4, characterized in that: The water circulation temperature-adjusting metal bath system further comprises a temperature sensor, which is used to detect the temperature of the adapter (1).

6. The water circulation temperature regulating metal bath system according to claim 5, characterized in that: The water circulation temperature control metal bath system further comprises a control system, which is respectively connected to the temperature sensor, the heating and cooling semiconductor module (2) and the water circulation temperature control system.

7. The water circulation temperature regulating metal bath system according to any one of claims 1 to 4, characterized in that: The water circulation temperature control metal bath system comprises at least two adapters (1) and a group of water circulation temperature control systems, wherein the water circulation temperature control system comprises the same number of heat exchange blocks (31) as the number of the adapters (1), and two adjacent heat exchange blocks (31) are connected via an intermediate water pipe (37).

8. The water circulation temperature regulating metal bath system according to claim 7, characterized in that: All of the adapters (1) are attached to the same heating and cooling semiconductor module (2); or, Each of the adapters (1) is attached to a heating and cooling semiconductor module (2), and two adjacent heating and cooling semiconductor modules (2) are electrically connected.

9. The water circulation temperature regulating metal bath system according to any one of claims 1 to 4, characterized in that: A limiting groove is provided on the adapter (1), and the reagent bottle (100) is located in the limiting groove.

10. The water circulation temperature regulating metal bath system according to any one of claims 1 to 4, characterized in that: The adapter (1) is made of aluminum material with a purity reaching a set value.

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