Grinding wheel

Abstract

The utility model discloses a grinding wheel which comprises an annular base body, a first grinding material layer and a second grinding material layer, the annular base body is made of aluminum, a mounting hole used for mounting the annular base body on grinding equipment is formed in the center of the end face of the annular base body, and the grinding equipment can drive the annular base body to rotate. The first grinding material layer is arranged at the outer ring position of the end face of the annular base body, the second grinding material layer is arranged in the middle of the end face of the annular base body, and the hardness of the first grinding material layer is larger than that of the second grinding material layer. According to the grinding wheel, the first grinding material layer and the second grinding material layer are adopted for splicing, materials are ground through the first grinding material layer, then ground through the second grinding material layer and finally ground through the first grinding material layer, the problem that different positions are ground unevenly in the material machining process can be solved through alternate grinding, and the grinding efficiency is improved. Vibration of the materials and burrs at the discharging opening are reduced, and the product quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding wheel equipment, in particular to a grinding wheel. Background Art

[0002] Grinding wheels, also known as bonded abrasives, are made by bonding ordinary abrasives into a specific shape (mostly circular with a central through-hole) with a certain strength. Grinding wheels are the most widely used and most widely used abrasive tool. Rotating at high speed, they can perform rough, semi-finish, and fine grinding on the outer and inner circumferences, flat surfaces, and various profiles of metal or non-metal workpieces, as well as grooving and parting. However, existing grinding wheels suffer from uneven grinding of different parts of the material, resulting in a short service life and high operating costs. Utility Model Content

[0003] The purpose of this utility model is to provide a grinding wheel to solve the above-mentioned problems.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0005] A grinding wheel comprising:

[0006] annular base;

[0007] Abrasive layer 1 and abrasive layer 2, the abrasive layer 1 is arranged at the outer ring position of the end surface of the annular base, and the abrasive layer 2 is arranged at the middle position of the end surface of the annular base, and the hardness of the abrasive layer 1 is greater than the hardness of the abrasive layer 2.

[0008] Preferably, a chip removal groove 1 is provided between the abrasive layer 1 and the abrasive layer 2.

[0009] Preferably, a plurality of chip removal grooves 2 are spaced apart on the abrasive layer 1, and the plurality of chip removal grooves 2 are arranged in a ring.

[0010] Preferably, a plurality of the second chip removal grooves are connected to the first chip removal groove.

[0011] Preferably, the second chip removal groove is linear or curved.

[0012] Preferably, the diameter of the second abrasive layer is between 1 / 3 and 1 / 2 of the outer diameter of the annular substrate.

[0013] Preferably, the abrasive layer 1 is CBN abrasive.

[0014] Preferably, the second abrasive layer is green silicon carbide abrasive.

[0015] Preferably, the abrasive layer 1 and the abrasive layer 2 are both fixedly connected to the annular base by an adhesive.

[0016] Preferably, the abrasive layer 1 and the abrasive layer 2 are both ring-shaped.

[0017] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0018] In the utility model, a grinding wheel is formed by splicing two abrasives, abrasive layer 1 and abrasive layer 2. When the material is ground by the grinding wheel, the end of the material is first ground by the abrasive layer 1, then moves to the abrasive layer 2, and then is ground by the abrasive layer 2. Finally, it can pass through the abrasive layer 1 and be ground by the abrasive layer 1 again. Alternating grinding can solve the problem of uneven grinding at different positions during the material processing process, reduce the vibration of the material and burrs at the discharge port, and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural diagram of the utility model;

[0020] Figure 2 This is a schematic diagram of the use state of the utility model.

[0021] Markings in the figure: 1, annular base; 2, abrasive layer 1; 3, abrasive layer 2; 4, chip groove 1; 5, chip groove 2; 6, material. DETAILED DESCRIPTION

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0023] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0024] Reference Figure 1 , a grinding wheel, comprising an annular base 1, an abrasive layer 1 2 and an abrasive layer 2 3; wherein:

[0025] The ring base 1 is made of aluminum, and a mounting hole is provided at the center of its end surface for mounting the ring base 1 on a grinding device. The grinding device can drive the ring base 1 to rotate.

[0026] Abrasive layer 1 2 is made of CBN abrasive and is provided at the outer ring position of the end face of the annular base 1; abrasive layer 2 3 is made of green silicon carbide abrasive and is provided at the middle position of the end face of the annular base 1; abrasive layer 1 2 and abrasive layer 2 3 are both annular in shape, abrasive layer 1 2 and abrasive layer 2 3 are adjacent to each other, and the diameter of abrasive layer 2 3 is between 1 / 3 and 1 / 2 of the outer diameter of the annular base 1;

[0027] The abrasive layer 1 2 and the abrasive layer 2 3 are both fixedly connected to the annular base 1 by an adhesive, and the adhesive can be one of an epoxy resin adhesive, a polyurethane resin adhesive, an epoxy resin adhesive or a phenolic resin adhesive. The abrasive layer 1 2 and the abrasive layer 2 3 are both fixed to the end surface of the annular base 1 by sintering with the adhesive;

[0028] The hardness of the CBN abrasive is greater than that of the green silicon carbide abrasive. Therefore, the hardness of the abrasive layer 1 2 is greater than that of the abrasive layer 2 3. When the grinding wheel is rotating to grind the material 6, the cutting force of the abrasive layer 1 2 during the grinding process is greater than the cutting force of the abrasive layer 2 3.

[0029] In the above embodiment, if Figure 2 As shown, a grinding wheel is formed by splicing two abrasives, the abrasive layer 1 2 and the abrasive layer 2 3. When the material 6 is ground by the grinding wheel, the end of the material 6 first passes through the abrasive layer 1 2 and can be initially ground by the abrasive layer 1 2. Then, the material 6 that continues to advance can pass through the abrasive layer 2 3 and be secondarily ground by the abrasive layer 2 3. Finally, the material 6 passes through the abrasive layer 1 2 again to achieve the third grinding. Alternating grinding can solve the problem of uneven grinding at different positions of the material 6 during processing. The grinding of the material 6 is relatively uniform, which can reduce the vibration of the material 6 and the burrs at the discharge port, further ensuring the product quality.

[0030] In addition, the abrasive layer 2 of the outer ring of the grinding wheel uses harder abrasives to ensure strong and effective cutting force and further improve the life of the grinding wheel. The linear speed of the abrasive layer 23 of the inner ring of the grinding wheel is lower than the linear speed of the abrasive layer 2 of the outer ring, and the hardness of the abrasive layer 23 is slightly lower than the hardness of the abrasive layer 2, so that the wear of the inner and outer rings is kept relatively consistent, so that the wear of the grinding wheel can be made consistent as a whole, avoiding the situation where the grinding wheel is scrapped due to uneven wear on the surface, improving the service life, saving the cost of the grinding wheel, and ultimately reducing the cost of product consumables.

[0031] In one possible implementation, Figure 1 As shown, a plurality of chip removal grooves 2 5 are provided on the abrasive layer 1 2 at intervals. The chip removal grooves 2 5 are linear or curved ( Figure 1 or Figure 2 The chip groove 25 is only a straight line type (a plurality of chip grooves 25 are arranged in a ring shape, and the number of chip grooves 25 can be two, four, six, eight or ten, etc. The number of chip grooves 25 can also be an odd number ( Figure 1 or Figure 2 The number of chip flutes 2-5 is only 8).

[0032] In the above-mentioned embodiment, when the abrasive layer 2 grinds the material 6, the plurality of chip removal grooves 5 reserved on the abrasive layer 2 can significantly improve its chip removal capacity, reduce and minimize the abrasive layer 2's adsorption force on waste chips, thereby improving the grinding efficiency of the abrasive layer 2, reducing the frequency of dressing, and improving the machine utilization rate.

[0033] In one possible implementation, Figure 1 As shown, a chip groove 1 4 is provided between the abrasive layer 1 2 and the abrasive layer 2 3 , and a plurality of chip grooves 2 5 are connected to the chip groove 1 4 ;

[0034] In the above embodiment, the reserved chip removal groove 2 5 can significantly improve the chip removal capacity of the abrasive layer 2 3, reduce and minimize the adsorption force of the abrasive layer 2 3 on waste chips, improve grinding efficiency, reduce dressing frequency, and improve machine utilization rate.

Claims

1. A grinding wheel, characterized in that: include: annular base (1); Abrasive layer 1 (2) and abrasive layer 2 (3), wherein the abrasive layer 1 (2) is arranged at the outer ring position of the end face of the annular base (1), and the abrasive layer 2 (3) is arranged at the middle position of the end face of the annular base (1), and the hardness of the abrasive layer 1 (2) is greater than the hardness of the abrasive layer 2 (3).

2. The grinding wheel according to claim 1, wherein: A chip removal groove (4) is provided between the abrasive layer (2) and the abrasive layer (3).

3. The grinding wheel according to claim 2, characterized in that: The abrasive layer one (2) A plurality of chip removal grooves 2 (5) are arranged at intervals on the upper portion, and the plurality of chip removal grooves 2 (5) are arranged in a ring.

4. The grinding wheel according to claim 3, characterized in that A plurality of the second chip removal grooves (5) are connected to the first chip removal groove (4).

5. The grinding wheel according to claim 4, characterized in that: The second chip removal groove (5) is linear or curved.

6. The grinding wheel according to claim 3, characterized in that: The diameter of the second abrasive layer (3) is between 1 / 3 and 1 / 2 of the outer diameter of the annular base (1).

7. The grinding wheel according to claim 5, characterized in that The abrasive layer 1 (2) is CBN abrasive.

8. The grinding wheel according to claim 5, characterized in that The abrasive layer 2 (3) is green silicon carbide abrasive.

9. The grinding wheel according to claim 5, characterized in that: The abrasive layer 1 (2) and the abrasive layer 2 (3) are both fixedly connected to the annular base (1) by an adhesive.

10. The grinding wheel according to claim 5, characterized in that The abrasive layer 1 (2) and the abrasive layer 2 (3) are both ring-shaped.

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