Stamping mechanism of chip surface stamp
By designing a stamping mechanism for the chip surface, the problems of complex structure and inaccurate stamping movement of traditional devices were solved, efficient and synchronous stamp marking was achieved, equipment utilization was improved, and production costs were reduced.
Patent Information
- Application Number
- CN202422730900.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-11-11
AI Technical Summary
Traditional chip surface stamping devices have complex structures and large sizes, making them difficult to integrate with other production equipment. In addition, the stamping action is not precise enough, resulting in low equipment utilization and high production costs.
A stamping mechanism for chip surface stamping was designed, including an automatic tape discharging mechanism and an ink stamping mechanism. The stamp assembly was driven by a control cylinder for precise ink dipping and marking, and was combined with an automatic burning machine for synchronous operation.
It achieves the accuracy and efficiency of seal marking, simplifies the production process, improves equipment utilization and reduces production costs.
Smart Images
Figure CN223340324U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip surface stamps, in particular to a stamping mechanism for chip surface stamps. Background Art
[0002] Currently, automatic chip programming machines are fast and efficient for chip programming. Chip surface marking is a key technology. A mechanical ink stamping device can add a unique identifier to the chip. During the automated programming process, ink is printed on the chip surface to distinguish between previously programmed products and facilitate subsequent chip tracking and management.
[0003] Traditional chip surface stamping devices are complex and bulky, making them difficult to integrate effectively with other production equipment and occupying significant production space. Furthermore, these devices lack precision and efficiency in the inking and stamping process, leading to quality issues such as unclear markings. Because the stamping device is separate from the burning equipment, simultaneous operation is impossible, resulting in low equipment utilization and increased production costs and time. Utility Model Content
[0004] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a stamping mechanism for stamping the surface of a chip.
[0005] In order to achieve the above functions, the technical solution adopted by the utility model is as follows: a stamping mechanism for a chip surface stamp, comprising an automatic weaving and discharging mechanism and an ink stamping mechanism, wherein the ink stamping mechanism is installed on the automatic weaving and discharging mechanism; the ink stamping mechanism comprises a base, an adjustment slide, a control cylinder, a moving block, a fixed block and a stamp assembly, wherein the base is installed on one side of the automatic weaving and discharging mechanism, the adjustment slide is installed on the base, the control cylinder is fixedly installed on the outer side wall of the top of the adjustment slide, the moving block is fixedly installed under the control cylinder, the fixed block is slidably arranged in the moving block, and the stamp assembly is installed under the fixed block.
[0006] Preferably, a flip track is provided on the side wall of the fixed block, a 180° linear steering block is slidably provided on the flip track, and the seal assembly is installed under the bottom wall of the 180° linear steering block.
[0007] Preferably, the flip track includes a curved track and a straight track.
[0008] Preferably, an ink cartridge is installed on the top of the moving block, and the ink cartridge and the seal assembly are on the same vertical plane.
[0009] Preferably, the automatic braiding and discharging mechanism comprises a carrier tape, a heat sealing knife, an upper cover mold and a coiling tray, wherein the carrier tape, the heat sealing knife, the upper cover mold and the coiling tray are arranged in sequence from front to back, and a chip is provided on the carrier tape.
[0010] Preferably, the adjustment slide can be adjusted in three directions: X, Y and Z.
[0011] Preferably, the stamp component can be selected from AZ letters or 0-9 numbers.
[0012] Preferably, a seal buffer spring is further provided above the seal assembly.
[0013] The utility model adopts the above structure to achieve the following beneficial effects: the seal assembly is driven to move back and forth 180 degrees by controlling the cylinder to push the 180-degree linear steering block, and the ink is dipped when the machine is reset, and the seal position is marked; the mechanical structure is compact and reasonable, the built-in ink cartridge can be regularly added with ink, and it can be installed at the unwinding position of the automatic burning machine. After the chip is burned and passed, it is placed in the carrier tape and the seal is marked synchronously, which simplifies the production and processing process and improves equipment utilization. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall structure of a stamping mechanism for a chip surface stamp proposed by the present invention;
[0015] Figure 2 This is a schematic diagram of the structure of the ink stamp mechanism of the stamping mechanism for the chip surface proposed by the utility model Figure 1 ;
[0016] Figure 3 This is a side view of the ink stamp mechanism of the stamping mechanism for a chip surface stamp proposed by the present invention;
[0017] Figure 4 This is a front view of the ink stamp mechanism of the stamping mechanism for a chip surface stamp proposed by the present invention;
[0018] Figure 5 This is a schematic diagram of the structure of the ink stamp mechanism of the stamping mechanism for the chip surface proposed by the utility model Figure 2 ;
[0019] Figure 6 The utility model is a schematic structural diagram of a stamp assembly of a stamping mechanism for stamping a chip surface.
[0020] Among them, 1. Automatic tape discharging mechanism, 2. Ink stamp mechanism, 3. Base, 4. Adjustment slide, 5. Control cylinder, 6. Moving block, 7. Fixed block, 8. Stamp assembly, 9. Flip track, 10. Ink cartridge, 11. Carrier tape, 12. Heat sealing knife, 13. Upper cover mold, 14. Coil tray, 15. Chip, 16. 180° linear steering block, 17. Stamp buffer spring. DETAILED DESCRIPTION
[0021] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.
[0022] In the description of the present invention, it should be noted that the terms "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," and "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for the purpose of facilitating the description of the present invention and simplifying the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The present invention will be further described below in conjunction with the accompanying drawings.
[0023] like Figure 1-6 As shown, the utility model proposes a stamping mechanism for a chip surface stamp, comprising an automatic weaving and discharging mechanism 1 and an ink stamping mechanism 2, the ink stamping mechanism 2 being mounted on the automatic weaving and discharging mechanism 1; the ink stamping mechanism 2 comprising a base 3, an adjusting slide 4, a control cylinder 5, a moving block 6, a fixed block 7 and a stamp assembly 8, the base 3 being mounted on one side of the automatic weaving and discharging mechanism 1, the adjusting slide 4 being mounted on the base 3, the adjusting slide 4 being adjustable in three directions of X, Y and Z, the control cylinder 5 being fixedly mounted on the top outer wall of the adjusting slide 4, the moving block 6 being fixedly mounted under the control cylinder 5, the fixed block 7 being slidably arranged in the moving block 6, the stamp assembly 8 being mounted under the fixed block 7, and an ink cartridge 10 being mounted on the top of the moving block 6, the ink cartridge 10 and the stamp assembly 8 being on the same vertical plane.
[0024] like Figure 2 、 5 As shown, a flip track 9 is provided on the side wall of the fixed block 7, a 180° linear steering block 16 is slidably provided on the flip track 9, and the seal assembly 8 is installed under the bottom wall of the 180° linear steering block 16. The flip track 9 includes an arc track and a linear track.
[0025] like Figure 1 As shown, the automatic braiding and discharging mechanism 1 includes a carrier tape 11, a heat sealing knife 12, an upper cover mold 13 and a coil tray 14. The carrier tape 11, the heat sealing knife 12, the upper cover mold 13 and the coil tray 14 are arranged in sequence from front to back, and a chip 15 is provided on the carrier tape 11.
[0026] like Figure 6 As shown, the stamp assembly 8 can select AZ letters or 0-9 numbers, and a stamp buffer spring 17 is provided above the stamp assembly 8 to buffer the stamp assembly 8.
[0027] During specific use, when the automatic burning machine is in operation, the robot puts the good material with the pass burned into the automatic taping discharge mechanism 1, and the synchronous automatic equipment drives the solenoid valve to control the control cylinder 5 downward, driving the moving block 6, the fixed block 7 and the seal assembly 8 downward as a whole, and the seal assembly 8 stamps the chip 15 in the carrier 11. During the retraction of the control cylinder 5, the 180° linear steering block 16 is driven to move along the flip track 9 to achieve a 180° flip of the 180° linear steering block 16, thereby driving the seal assembly 8 to flip, and the seal assembly 8 dips the ink cartridge 10 for ink. This is repeated, and the chips 15 in the carrier 11 are marked one by one in a cycle. The ink stamp marking is more convenient and quick. The marked chip 15 moves forward with the carrier 11, and the synchronous upper cover mold 13 is packaged under the sealing of the heat sealing knife 12. The roll material tray is recycled, and the integrated printing mark of the IC material with the pass burned is completed.
[0028] The above description of the present invention and its embodiments is non-limiting. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by the above, and does not deviate from the purpose of the present invention, without inventive design, a structure and embodiment similar to the technical solution should fall within the scope of protection of the present invention.
Claims
1. A stamping mechanism for stamping a chip surface, comprising an automatic tape discharging mechanism (1) and an ink stamping mechanism (2), wherein the ink stamping mechanism (2) is mounted on the automatic tape discharging mechanism (1); characterized in that: The ink stamp mechanism (2) comprises a base (3), an adjusting slide (4), a control cylinder (5), a moving block (6), a fixed block (7) and a stamp assembly (8); the base (3) is mounted on one side of the automatic braiding and discharging mechanism (1); the adjusting slide (4) is mounted on the base (3); the control cylinder (5) is fixedly mounted on the top outer side wall of the adjusting slide (4); the moving block (6) is fixedly mounted under the control cylinder (5); the fixed block (7) is slidably arranged in the moving block (6); and the stamp assembly (8) is mounted under the fixed block (7).
2. The chip surface stamping mechanism according to claim 1, characterized in that: A flip track (9) is provided on the side wall of the fixed block (7), a 180° linear steering block (16) is slidably provided on the flip track (9), and the seal assembly (8) is installed under the bottom wall of the 180° linear steering block (16).
3. The chip surface stamping mechanism according to claim 2, characterized in that: The turning track (9) comprises an arc track and a straight track.
4. The chip surface stamping mechanism according to claim 3, characterized in that: An ink cartridge (10) is installed on the top of the moving block (6), and the ink cartridge (10) and the seal assembly (8) are on the same vertical plane.
5. The chip surface stamping mechanism according to claim 4, characterized in that: The automatic braiding and discharging mechanism (1) comprises a carrier tape (11), a heat-sealing knife (12), an upper cover mold (13) and a coiling tray (14); the carrier tape (11), the heat-sealing knife (12), the upper cover mold (13) and the coiling tray (14) are arranged in sequence from front to back; and a chip (15) is provided on the carrier tape (11).
6. The chip surface stamping mechanism according to claim 5, characterized in that: The adjustment slide (4) can be adjusted in three directions: X, Y and Z.
7. The chip surface stamping mechanism according to claim 6, characterized in that: The stamp component (8) can be selected from AZ letters or 0-9 numbers.
8. The chip surface stamping mechanism according to claim 7, characterized in that: A seal buffer spring (17) is also provided above the seal assembly (8).