MEMS separation auxiliary device

Abstract

The utility model discloses an MEMS separation auxiliary device which comprises a first pressing plate and a second pressing plate which can be operated to abut against each other or be far away from each other, the opposite faces of the first pressing plate and the second pressing plate are respectively provided with a buffer layer, and the opposite faces of the buffer layers are respectively provided with a bonding layer. Wherein when the first pressing plate and the second pressing plate are pressed against each other, the buffer layer can generate elastic deformation so as to provide uniform pressure for the MEMS clamped between the bonding layers. The MEMS separation auxiliary device provided by the utility model can assist in completing accurate separation of the MEMS substrate and the surface layer. The buffer layer can apply uniform pressure to the MEMS between the bonding layers through elastic deformation, so as to ensure that the two surfaces of the MEMS are in full contact with the bonding layers; the adhesive layer may separate the MEMS substrate from the facing layer. The MEMS separation auxiliary device provided by the utility model can ensure the bonding uniformity between the MEMS and the bonding layer so as to ensure the integrity of the layer structure after separation.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor detection, in particular to a MEMS separation auxiliary device. Background Art

[0002] MEMS is the abbreviation of Micro Electro Mechanical Systems. It has a tiny three-dimensional structure and is mainly composed of three parts: sensors, actuators and micro energy. It can process various input and output signals.

[0003] MEMS devices usually have a substrate and a surface structure arranged on the substrate. Depending on the application, the surface structure may be a gyroscope, accelerometer, etc. During the application of MEMS devices, the substrate and the surface structure on the substrate are separated to facilitate observation of whether the internal comb structure is abnormal. In the prior art, the MEMS separation operation is to first stick the two sides of the MEMS with tape, and then tear the tape by hand to separate the substrate and the surface layer. When the above method is used for separation, uneven contact of the bonding surface may cause separation failure, and uneven pressing and tearing force may also cause the separated surface structure to be severely fragmented.

[0004] Therefore, in order to solve the above technical problems, it is necessary to provide a MEMS separation auxiliary device. Utility Model Content

[0005] The purpose of the utility model is to provide a MEMS separation auxiliary device, which can solve the above-mentioned problems that uneven contact of the bonding surface may lead to separation failure, and uneven pressing and tearing force may also cause serious fragmentation of the separated surface layer structure.

[0006] In order to achieve the above-mentioned purpose, the technical solution provided by a specific embodiment of the present invention is as follows:

[0007] A MEMS separation assisting device includes a first pressing plate and a second pressing plate that can be operated to press against or move away from each other, wherein opposing surfaces of the first pressing plate and the second pressing plate are both provided with a buffer layer, and opposing surfaces of the buffer layers are both provided with an adhesive layer;

[0008] When the first pressing plate and the second pressing plate are pressed against each other, the buffer layer may generate elastic deformation to provide uniform pressure to the MEMS clamped between the adhesive layers.

[0009] In one or more embodiments of the present invention, a rotating shaft is installed between the first pressing plate and the second pressing plate, and the first pressing plate can pivot relative to the second pressing plate around the rotating shaft so that the first pressing plate and the second pressing plate are pressed against or away from each other.

[0010] In one or more embodiments of the present invention, the adhesive layer is located on a side of the buffer layer away from the rotation shaft.

[0011] In one or more embodiments of the present invention, the second pressure plate includes a pressure plate portion and side walls arranged on two opposite sides of the pressure plate portion, the rotating shaft is installed between the two side walls, and the pressure plate portion and the two side walls enclose a receiving space for receiving the first pressure plate.

[0012] In one or more embodiments of the present invention, a protrusion is provided at one end of the first pressure plate away from the rotating shaft, and a pressure can be applied to the side of the protrusion away from the second pressure plate so that the first pressure plate and the second pressure plate are pressed against each other; and a pulling force can be applied to the side of the protrusion close to the second pressure plate so that the first pressure plate and the second pressure plate are moved away from each other.

[0013] In one or more embodiments of the present invention, when the first pressing plate is pressed against the second pressing plate, the protrusion is located outside the accommodating space.

[0014] In one or more embodiments of the present invention, the area of ​​the buffer layer is larger than the area of ​​the adhesive layer, and the area of ​​the adhesive layer is larger than the area of ​​the MEMS.

[0015] In one or more embodiments of the present invention, when the first pressing plate and the second pressing plate are pressed against each other, the opposing surfaces of the two adhesive layers respectively located on the two buffer layers completely overlap.

[0016] In one or more embodiments of the present invention, the buffer layer is a rubber pad.

[0017] In one or more embodiments of the present invention, the adhesive layer is a copper tape.

[0018] Compared with the existing technology, the MEMS separation auxiliary device of the present invention can assist in the precise separation of the MEMS substrate and the surface layer. Its operation process is: first, the MEMS device is placed on the adhesive layer, and then the first pressure plate and the second pressure plate are pressed against each other to make the buffer layer elastically deform, and the buffer layer applies uniform pressure to the MEMS clamped in the adhesive layer to ensure that both sides of the MEMS are in full contact with the adhesive layer. Finally, the first pressure plate and the second pressure plate are separated, and the characteristics of the adhesive layer are used to separate the substrate and the surface layer of the MEMS. The MEMS separation auxiliary device of the present invention can ensure the uniformity of the bonding between the MEMS and the adhesive layer to ensure the integrity of the layer structure after separation, greatly reducing the difficulty and risk of separation, and improving the quality and efficiency of MEMS separation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 Schematic diagram of the structure in which the first pressing plate and the second pressing plate are away from each other in the MEMS separation auxiliary device in one embodiment of the present utility model;

[0021] Figure 2 Schematic diagram of the structure in which the first pressing plate and the second pressing plate are pressed against each other in the MEMS separation auxiliary device in one embodiment of the present invention.

[0022] Description of main reference numerals:

[0023] 1. First pressing plate; 11. Protruding portion; 2. Second pressing plate; 21. Pressing plate portion; 22. Side wall; 3. Buffer layer; 4. Adhesive layer. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will be combined with the drawings of the embodiments of the present invention to clearly and completely describe the technical solutions of the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0025] Reference Figure 1 and Figure 2 The MEMS separation auxiliary device in one embodiment of the present invention includes a first pressure plate 1 and a second pressure plate 2 that can be operated to press against or move away from each other. The opposing surfaces of the first pressure plate 1 and the second pressure plate 2 are provided with a buffer layer 3, and the opposing surfaces of the buffer layer 3 are installed with an adhesive layer 4. When the first pressure plate 1 and the second pressure plate 2 are pressed against each other, the buffer layer 3 can produce elastic deformation to provide uniform pressure to the MEMS clamped between the adhesive layer 4. In this embodiment, the buffer layer 3 is a rubber pad and the adhesive layer 4 is a copper tape. In other embodiments, the buffer layer 3 can also be other materials that can produce elastic deformation, and the adhesive layer 4 can also be other materials with adhesive properties.

[0026] When the MEMS substrate and surface layer need to be separated, the MEMS is first placed on the adhesive layer 4 of the second pressure plate 2, and the first pressure plate 1 and the second pressure plate 2 are pressed against each other. At this time, the buffer layer 3 can produce elastic deformation, providing uniform pressure to the MEMS clamped between the two adhesive layers 4, thereby ensuring that both sides of the MEMS are in full contact with the adhesive layers 4. After completing the above steps, the first pressure plate 1 and the second pressure plate 2 are moved away from each other. In this process, the performance of the adhesive layer 4 can be used to complete the separation of the MEMS substrate and the surface layer.

[0027] Understandably, if a portion of the MEMS surface structure is not in contact with the adhesive layer, that area may be damaged during the subsequent separation step. However, in the MEMS separation assisting device of this embodiment, since the adhesive layer 4 can fully contact both surfaces of the MEMS under the action of the buffer layer 3, it can ensure the integrity of the MEMS surface layer after separation, reducing the difficulty and risk of MEMS separation and improving the quality and efficiency of MEMS separation.

[0028] Reference Figure 1 A rotating shaft is installed between the first pressing plate 1 and the second pressing plate 2. The first pressing plate 1 can pivot relative to the second pressing plate 2 around the rotating shaft to make the first pressing plate 1 and the second pressing plate 2 move closer to each other or farther away from each other. Therefore, by rotating the first pressing plate 1, the first pressing plate 1 and the second pressing plate 2 can be made to move closer to each other or farther away from each other.

[0029] Reference Figure 1 The second pressure plate 2 includes a pressure plate portion 21 and sidewalls 22 disposed on opposite sides of the pressure plate portion 21. The rotating shaft is installed between the sidewalls 22. The pressure plate portion 21 and the sidewalls 22 enclose a space for accommodating the first pressure plate 1. When the first pressure plate 1 and the second pressure plate 2 are pressed against each other, the opposing surfaces of the two adhesive layers 4 located on the two buffer layers 3 completely overlap. This arrangement allows the adhesive layer 4 on the first pressure plate 1 to precisely abut against the adhesive layer 4 on the second pressure plate 2, thereby ensuring the accuracy of the adhesive layer 4 when bonding the MEMS and avoiding pressure leaks, misalignment, and other issues.

[0030] Reference Figure 1A protrusion 11 is provided at one end of the first pressure plate 1 away from the rotating shaft. A pressure can be applied to the side of the protrusion 11 away from the second pressure plate 2 so that the first pressure plate 1 and the second pressure plate 2 are pressed against each other; a pulling force can be applied to the side of the protrusion 11 close to the second pressure plate 2 so that the first pressure plate 1 and the second pressure plate 2 are moved away from each other. The adhesive layer 4 is located on the side of the buffer layer 3 away from the rotating shaft. When the first pressure plate 1 is pressed against the second pressure plate 2, the protrusion 11 is located outside the accommodating space. In this embodiment, the protrusion 11 is a plate body with an arc-shaped edge. The protrusion 11 provides an operating space for relevant personnel to drive the first pressure plate 1 and the second pressure plate 2 to press together and move away, which is convenient for providing uniform pressure and pulling force to the MEMS clamped between the two adhesive layers 4, thereby improving the convenience of separating the base and surface layer of the MEMS.

[0031] Reference Figure 1 To ensure the effectiveness of bonding layer 4 in bonding the MEMS, the area of ​​buffer layer 3 is larger than that of bonding layer 4, which in turn is larger than that of the MEMS. As can be appreciated, the area of ​​bonding layer 4 ensures complete coverage and adhesion to both sides of the MEMS, while the area of ​​buffer layer 3 ensures uniform pressure on the MEMS, thereby ensuring the integrity of the subsequent layers after MEMS separation.

[0032] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0033] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A MEMS separation assist device, characterized in that: It comprises a first pressing plate (1) and a second pressing plate (2) which can be operated to press against or move away from each other, wherein the opposing surfaces of the first pressing plate (1) and the second pressing plate (2) are both provided with a buffer layer (3), and the opposing surfaces of the buffer layer (3) are both provided with an adhesive layer (4); When the first pressing plate (1) and the second pressing plate (2) are pressed against each other, the buffer layer (3) can produce elastic deformation to provide uniform pressure to the MEMS clamped between the adhesive layers (4).

2. The MEMS separation assisting device according to claim 1, wherein: A rotating shaft is installed between the first pressing plate (1) and the second pressing plate (2), and the first pressing plate (1) can pivot relative to the second pressing plate (2) around the rotating shaft so that the first pressing plate (1) and the second pressing plate (2) are pressed against or away from each other.

3. The MEMS separation assisting device according to claim 2, wherein: The adhesive layer (4) is located on a side of the buffer layer (3) away from the rotating shaft.

4. The MEMS separation assisting device according to claim 2, wherein: The second pressing plate (2) comprises a pressing plate portion (21) and side walls (22) arranged on two opposite sides of the pressing plate portion (21); the rotating shaft is installed between the two side walls (22); the pressing plate portion (21) and the two side walls (22) enclose a receiving space for receiving the first pressing plate (1).

5. The MEMS separation assisting device according to claim 4, wherein: A protrusion (11) is provided at one end of the first pressure plate (1) away from the rotating shaft, and a pressure can be applied to the side of the protrusion (11) away from the second pressure plate (2) so that the first pressure plate (1) and the second pressure plate (2) are pressed against each other; and a pulling force can be applied to the side of the protrusion (11) close to the second pressure plate (2) so that the first pressure plate (1) and the second pressure plate (2) are moved away from each other.

6. The MEMS separation assisting device according to claim 5, wherein: When the first pressing plate (1) is pressed against the second pressing plate (2), the protruding portion (11) is located outside the accommodating space.

7. The MEMS separation assisting device according to claim 1, wherein: The area of ​​the buffer layer (3) is larger than the area of ​​the adhesive layer (4), and the area of ​​the adhesive layer (4) is larger than the area of ​​the MEMS.

8. The MEMS separation assisting device according to claim 1, wherein: When the first pressing plate (1) and the second pressing plate (2) are pressed against each other, the opposite surfaces of the two adhesive layers (4) respectively located on the two buffer layers (3) completely overlap.

9. The MEMS separation assisting device according to claim 1, wherein: The buffer layer (3) is a rubber pad.

10. The MEMS separation assisting device according to claim 1, wherein: The bonding layer (4) is a copper tape.

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