High-heat-conduction heat-dissipation aluminum profile

Abstract

The utility model relates to the technical field of aluminum profiles, in particular to a high heat conduction and heat dissipation aluminum profile which comprises an aluminum profile body, a plurality of fixing through holes are formed in the surface of the aluminum profile body, a heat conduction and heat dissipation mechanism is arranged on the inner side of the aluminum profile body, and a heat dissipation strengthening mechanism is fixedly connected to the bottom of the heat conduction and heat dissipation mechanism. The heat conduction and heat dissipation mechanism comprises a first mounting frame, movable positioning insertion rods are symmetrically arranged at the positions, corresponding to the fixing through holes, in the first mounting frame, and through the arrangement of the heat conduction and heat dissipation mechanism, in the actual use process, overall heat absorption can be improved, heat can be conducted and diffused outwards, and the heat conduction and heat dissipation efficiency is improved. And meanwhile, when the heat conduction and heat dissipation mechanisms are connected and matched with the fixing through holes, the aluminum profile body and the heat conduction and heat dissipation mechanisms can be rapidly assembled, and operation is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of aluminum profiles, in particular to a high thermal conductivity and heat dissipation aluminum profile. Background Art

[0002] Aluminum profiles generally refer to profiles made of aluminum alloy. Due to their excellent corrosion resistance, non-ferromagnetic properties, machinability and recyclability, aluminum profiles have a wider range of applications.

[0003] When existing aluminum profiles are used, their overall structure is relatively simple, and their thermal conductivity and heat dissipation effects are poor. As a result, when the aluminum profiles are used as the shells of some equipment, they cannot discharge heat to the outside in time for heat dissipation. For this reason, we propose a high thermal conductivity and heat dissipation aluminum profile. Utility Model Content

[0004] In view of the above problems, the present invention provides a high thermal conductivity and heat dissipation aluminum profile, which can solve the problems existing in the above background technology.

[0005] The technical solution of the utility model is:

[0006] A high thermal conductivity and heat dissipation aluminum profile, including an aluminum profile body, a plurality of fixed through holes are opened on the surface of the aluminum profile body, a heat conduction and heat dissipation mechanism is provided on the inner side of the aluminum profile body, and the bottom of the heat conduction and heat dissipation mechanism is fixedly connected to the enhanced heat dissipation mechanism, and the heat conduction and heat dissipation mechanism includes a first mounting frame, and movable positioning rods are symmetrically provided at the positions corresponding to the fixed through holes inside the first mounting frame, one end of the movable positioning rod is fixedly connected to a force-bearing mounting plate, and a force spring is fixedly connected between the force-bearing mounting plates, and a pressure inclined surface is opened on the end of the movable positioning rod away from the force-bearing mounting plate.

[0007] In a further technical solution, a fixed guide rod is fixedly connected to the interior of the first mounting frame, and one end of the fixed guide rod passes through the interior of the force-bearing mounting plate and extends to the outside.

[0008] In a further technical solution, the outer side of the end surface of the movable positioning rod and the inner side of the fixed through hole are slidably fitted with each other.

[0009] In a further technical solution, a plurality of heat-conducting and heat-dissipating plates are provided on the inner side of the first mounting frame.

[0010] In a further technical solution, the enhanced heat dissipation mechanism includes a second mounting frame, and a plurality of enhanced heat dissipation support plates are equidistantly provided on the inner side of the second mounting frame.

[0011] The beneficial effects of the utility model are:

[0012] 1. The heat conduction and heat dissipation mechanism can improve the overall heat absorption during actual use, conduct the heat, and diffuse it to the outside, thereby effectively improving the overall heat dissipation effect. At the same time, when the heat conduction and heat dissipation mechanism is connected with the fixed through hole, the aluminum profile body and the heat conduction and heat dissipation mechanism can be quickly assembled, and the operation is convenient;

[0013] 2. The enhanced heat dissipation mechanism can further absorb the heat during use, and at the same time improve the overall strength of use. When subjected to external forces, it is not easy to deform, so that the whole can be used stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a high thermal conductivity and heat dissipation aluminum profile according to an embodiment of the present utility model;

[0015] Figure 2 This is a schematic diagram of the main structure of an aluminum profile with high thermal conductivity and heat dissipation according to an embodiment of the present utility model;

[0016] Figure 3 This is a schematic diagram of the heat conduction and heat dissipation structure of a high heat conduction and heat dissipation aluminum profile according to an embodiment of the present utility model;

[0017] Figure 4 This is a schematic structural diagram of an enhanced heat dissipation mechanism of a high thermal conductivity and heat dissipation aluminum profile according to an embodiment of the present utility model.

[0018] Description of reference numerals:

[0019] 1. Aluminum profile body; 2. Fixed through hole; 3. Heat conduction and heat dissipation mechanism; 4. Enhanced heat dissipation mechanism; 5. First mounting frame; 6. Movable positioning rod; 7. Force-bearing mounting plate; 8. Force-bearing spring; 9. Fixed guide rod; 10. Pressure-bearing inclined surface; 11. Heat conduction and heat dissipation plate; 12. Second mounting frame; 13. Enhanced heat dissipation support plate. DETAILED DESCRIPTION

[0020] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0021] Example:

[0022] like Figures 1-4As shown, a high thermal conductivity and heat dissipation aluminum profile includes an aluminum profile body 1, a plurality of fixed through holes 2 are opened on the surface of the aluminum profile body 1, a heat conduction and heat dissipation mechanism 3 is provided on the inner side of the aluminum profile body 1, and the bottom of the heat conduction and heat dissipation mechanism 3 is fixedly connected with a reinforced heat dissipation mechanism 4, the heat conduction and heat dissipation mechanism 3 includes a first mounting frame 5, and the interior of the first mounting frame 5 is symmetrically provided with movable positioning rods 6 corresponding to the positions of the fixed through holes 2, one end of the movable positioning rod 6 is fixedly connected with a force-bearing mounting plate 7, and a force-bearing spring 8 is fixedly connected between the force-bearing mounting plates 7, and a pressure inclined surface 10 is opened on the end of the movable positioning rod 6 away from the force-bearing mounting plate 7.

[0023] The working principle of the above technical solution is as follows:

[0024] During use, when the aluminum profile body 1 is subjected to heat, the heat conduction and heat dissipation mechanism 3 can absorb the heat received by the aluminum profile body 1 and diffuse it to the outside. At the same time, the overall surface area of ​​the heat conduction and heat dissipation mechanism 3 is large, and the effect of diffusing heat is high, thereby improving the heat dissipation effect, facilitating the strengthening of the heat dissipation mechanism 4 to absorb and transfer heat, and at the same time, it can also enhance the overall strength of use, and is easy to operate, so that the force spring 8 can push the force mounting plate 7 and the movable positioning rod 6, so that the movable positioning rod 6 can be stuck in the inner side of the fixed through hole 2, thereby quickly installing the first mounting frame 5, the movable positioning rod 6, the force mounting plate 7 and the force spring 8, and the operation is easy.

[0025] In another embodiment, Figure 3 As shown, a fixed guide rod 9 is fixedly connected to the interior of the first mounting frame 5 , and one end of the fixed guide rod 9 passes through the interior of the force-bearing mounting plate 7 and extends to the outside.

[0026] The guide rod 9 is convenient for fixing and can guide the force-bearing mounting plate 7 to prevent the force-bearing mounting plate 7 and the movable positioning rod 6 from being skewed when moving.

[0027] In another embodiment, Figure 1 and Figure 3 As shown, the outer side of the end surface of the movable positioning rod 6 and the inner side of the fixing through hole 2 are slidably fitted with each other.

[0028] The end of the movable positioning rod 6 can be stably inserted into the inner side of the fixing through hole 2 to avoid shaking.

[0029] In another embodiment, Figure 3 As shown, a plurality of heat-conducting and heat-dissipating plates 11 are provided on the inner side of the first mounting frame 5 .

[0030] The heat dissipation plate 11 can improve the overall heat dissipation effect and is easy to operate.

[0031] In another embodiment, Figure 4 As shown, the enhanced heat dissipation mechanism 4 includes a second mounting frame 12 , and a plurality of enhanced heat dissipation support plates 13 are equidistantly provided on the inner side of the second mounting frame 12 .

[0032] The second mounting frame 12 and the reinforced heat dissipation support plate 13 can not only improve the overall heat conduction effect, but also improve the overall use strength and facilitate operation.

[0033] The working principle of the present invention is as follows: during use, the first mounting frame 5, the movable positioning rod 6, the force-bearing mounting plate 7, the force-bearing spring 8, the fixed guide rod 9 and the heat-conducting heat dissipation plate 11 are inserted into the inner side of the aluminum profile body 1, and the second mounting frame 12 and the reinforced heat dissipation support plate 13 are moved at the same time. At this time, the edge of the aluminum profile body 1 can squeeze the pressure-bearing inclined surface 10, so that the movable positioning rod 6 can move toward the inner side of the first mounting frame 5, compressing the force-bearing spring 8, and the force-bearing mounting plate 7 can stably move on the outer side of the surface of the fixed guide rod 9. When the first mounting frame 5 and the second When the second mounting frame 12 is fully inserted into the inner side of the aluminum profile body 1, the force spring 8 can push the force mounting plate 7 and the movable positioning rod 6, so that the end of the movable positioning rod 6 can be stably inserted into the inner side of the fixed through hole 2, thereby quickly installing and fixing. When the aluminum profile body 1 absorbs a large amount of heat, the second mounting frame 12, the reinforced heat dissipation support plate 13 and the heat conductive heat dissipation plate 11 can all quickly absorb and diffuse the heat. At the same time, the second mounting frame 12 and the reinforced heat dissipation support plate 13 can also improve the overall strength of use, so that the whole can be used stably and is easy to operate.

[0034] The above embodiments merely represent specific implementation methods of the present invention. Although the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention.

Claims

1. A high thermal conductivity and heat dissipation aluminum profile, comprising an aluminum profile body (1), characterized in that: The surface of the aluminum profile body (1) is provided with a plurality of fixed through holes (2), the inner side of the aluminum profile body (1) is provided with a heat conduction and heat dissipation mechanism (3), the bottom of the heat conduction and heat dissipation mechanism (3) is fixedly connected with a heat dissipation reinforcement mechanism (4), the heat conduction and heat dissipation mechanism (3) comprises a first mounting frame (5), the interior of the first mounting frame (5) is symmetrically provided with a movable positioning rod (6) at a position corresponding to the fixed through hole (2), one end of the movable positioning rod (6) is fixedly connected with a force-bearing mounting plate (7), a force-bearing spring (8) is fixedly connected between the force-bearing mounting plates (7), and a pressure-bearing inclined surface (10) is provided at one end of the movable positioning rod (6) away from the force-bearing mounting plate (7).

2. The high thermal conductivity and heat dissipation aluminum profile according to claim 1, characterized in that: A fixed guide rod (9) is fixedly connected to the interior of the first mounting frame (5), and one end of the fixed guide rod (9) passes through the interior of the force-bearing mounting plate (7) and extends to the outside.

3. The high thermal conductivity and heat dissipation aluminum profile according to claim 1, characterized in that: The outer side of the end surface of the movable positioning rod (6) and the inner side of the fixed through hole (2) are slidably fitted with each other.

4. The high thermal conductivity and heat dissipation aluminum profile according to claim 1, characterized in that: A plurality of heat-conducting and heat-dissipating plates (11) are provided on the inner side of the first mounting frame (5).

5. The high thermal conductivity and heat dissipation aluminum profile according to claim 1, characterized in that: The enhanced heat dissipation mechanism (4) comprises a second mounting frame (12), and a plurality of enhanced heat dissipation support plates (13) are equidistantly provided on the inner side of the second mounting frame (12).

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