PCB ink cross-grid test PAD device
By designing a PCB ink grid test PAD device and using a pressing component to automatically fix the grid board and PCB, the problems of cumbersome fixing operations and sample damage in the existing technology are solved, and the convenience and efficiency of the test are improved.
Patent Information
- Application Number
- CN202422210595.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-09-09
AI Technical Summary
During the existing PCB ink grid test, the fixing operation of the grid board and the PCB is cumbersome, which can easily damage qualified samples and is not conducive to efficient testing.
A PCB ink grid test PAD device was designed, which automatically fixed the grid plate and the PCB using a pressing component. The automatic fixing function without manual pressing was achieved through connecting plates, hinged rods, moving blocks and resistance structures.
It simplifies the operating process of PCB ink testing, improves the convenience of testing, avoids damage to qualified samples, and improves testing efficiency.
Smart Images
Figure CN223346706U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB ink hundred-grid testing, in particular to a PCB ink hundred-grid testing PAD device. Background Art
[0002] PCB, also known as circuit board, refers to a printed circuit board with point-to-point connections and printed components formed according to a predetermined design on a general substrate. It is the support body of electronic components and the carrier for the electrical connection of electronic components. In order to protect the circuit and improve the performance and reliability of the circuit board, ink processing is required during the PCB processing process. Wet film ink is widely used in PCB production. The ink types include inner wet film for inner layer circuit production and ink printed on the surface of the circuit board for soldering protection.
[0003] However, ink adhesion is the most important part of ink process control. There are many factors that affect ink adhesion, such as poor coating, insufficient baking, poor exposure, and excessive development. Such defects directly result in irreparable scrap. Therefore, a hundred-grid test is added to the inner layer of the PCB board circuit and the solder mask wet film process. The hundred-grid test is used to detect the adhesion of PCBD ink. The hundred-grid test adopts two groups of methods. Method 1: A hundred-grid knife scrapes out a hundred grids on the sample, and then uses tape to stick it. The adhesion is judged by the mark left by the tape. This method is easy to damage qualified samples. Method 2 usually uses a hundred-grid board with a grid and tape for testing. The hundred-grid board and the sample are stacked, and the tape adheres to the ink of the sample through the grid. Although this method is not easy to damage qualified samples in the test, during the test process, the staff needs to press and fix the hundred-grid board and the sample together before the adhesion test can be performed, which makes it inconvenient to perform hundred-grid testing on PCB. Utility Model Content
[0004] In view of the shortcomings of the existing technology, the utility model provides a PCB ink hundred-grid test PAD device, which has the advantages of easy pressing and fixing, and solves the problem of inconvenient pressing and fixing.
[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a PCB ink grid PAD test device, comprising a grid plate, a plurality of grids are provided on the top of the grid plate, test coupon strips are fixed around the lower end of the grid plate, a stopper is fixed to the right side wall of the grid plate, support blocks are fixed to the front and rear ends of the grid plate, and a pressing assembly for pressing the PCB is provided on opposite sides of two groups of support blocks;
[0006] The compression assembly includes a connecting plate fixed to the opposite side of the front and rear groups of support blocks, a compression plate is provided at the top of the two connecting plates, a soft pad is fixed to the top of the compression plate, a protrusion is fixed to the lower end of the compression plate, and the left and right sides of the lower end of the connecting plate are hingedly connected to two hinged rods, and the compression assembly also includes a resistance structure arranged at the other end of the two groups of hinged rods to provide resistance to them.
[0007] Furthermore, the top ends of the two connecting plates are each provided with a sliding hole for allowing the hinged rod to pass through the inside thereof, and the hinged rod is slidably connected to the inside of the sliding hole.
[0008] Furthermore, the resistance structure includes a moving block hingedly connected to the other end of the two groups of hinged rods, support blocks are fixed to the left and right ends of the moving block, and sliding rods are fixed to the opposite ends of the front and rear groups of moving blocks, the outer surface of the sliding rod is slidably connected to a cross bar, and the outer surface of the sliding rod is sleeved with a resistance spring.
[0009] Furthermore, two sliding grooves are provided on the left and right walls of the connecting plate inner cavity for the support block to slide on the inner walls thereof, and the support block is slidably connected to the inside of the sliding grooves.
[0010] Furthermore, an extension groove for allowing the sliding rod to move in or out of the interior is provided at opposite ends of the front and rear groups of cross bars, and the sliding rod is slidably connected to the interior of the extension groove.
[0011] Furthermore, the opposite ends of the front and rear groups of cross bars are respectively fixed to the front and rear walls of the inner cavities of the two connecting plates.
[0012] Compared with the existing technology, the technical solution of this application has the following beneficial effects:
[0013] The PCB ink grid test PAD device is equipped with a pressing component, which can stack and fix the grid board and the PCB together. As a result, the PCB and the grid board can be pressed together without the need for staff to press the grid board and the PCB together. This can effectively reduce the complexity of PCB ink testing and improve the convenience of testing. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the structure of the utility model;
[0015] Figure 2 This is a bottom-up structural diagram of the grid board and test coupon strips of the present invention;
[0016] Figure 3 This is a structural diagram of the support block and connecting plate of the utility model;
[0017] Figure 4 This is a structural diagram of the hinged rod and the shifting block of the utility model.
[0018] In the figure: 1 hundred grid plate, 2 grid, 3 test coupon bar, 4 stop block, 5 support block, 51 connecting plate, 52 pressing plate, 53 cushion, 54 protrusion, 55 hinge rod, 56 sliding hole, 57 moving block, 58 supporting block, 59 sliding rod, 510 cross bar, 511 resistance spring. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0020] See also Figures 1 to 2 In this embodiment, a PCB ink grid test PAD device includes a grid board 1, a plurality of grids 2 are opened on the top of the grid board 1, and test coupon strips 3, also known as test impedance strips, are fixed around the lower end of the grid board 1. A stop block 4 is fixed on the right wall of the grid board 1, and support blocks 5 are fixed on the front and rear ends of the grid board 1. A pressing component for pressing the PCB is provided on the opposite side of the two groups of support blocks 5.
[0021] In addition, test coupon strips 3 are installed around the grid board 1, so that the four test coupon strips 3 can monitor the impedance value process on the printed circuit board (PCB). The thicker the ink thickness, the smaller the impedance value. Conversely, the thinner the ink thickness, the larger the impedance value. Therefore, the test coupon strips 3 can monitor the ink on the printed circuit board PCB, and an impedance tester is provided at the other end of the test coupon strips 3. The test coupon strips 3 are in contact with the test end of the impedance tester to measure the impedance data, so as to monitor the ink thickness.
[0022] See also Figure 1 、 Figure 3 and Figure 4 The pressing assembly in this embodiment includes a connecting plate 51 fixed to the opposite side of the front and rear groups of support blocks 5, and a pressing plate 52 is provided at the top of the two connecting plates 51. A soft pad 53 is fixed to the top of the pressing plate 52. The soft pad 53 is a silicone pad to prevent the pressing plate 52 from causing wear on the PCB. A protrusion 54 is fixed to the lower end of the pressing plate 52. The protrusion 54 makes it easy for the staff to pull the pressing plate 52 to move. The left and right sides of the lower end of the connecting plate 51 are hingedly connected to two hinged rods 55. The pressing assembly also includes a resistance structure provided at the other end of the two groups of hinged rods 55 to provide resistance to it.
[0023] Among them, the top ends of the two connecting plates 51 are each provided with a sliding hole 56 for the hinged rod 55 to pass through, and the hinged rod 55 is slidably connected to the inside of the sliding hole 56, so that the two groups of hinged rods 55 can extend into the interior of the two connecting plates 51 through the two sliding holes 56, so that the two groups of hinged rods 55 can be connected to the resistance structure, so that the resistance structure can exert resistance on the pressing plate 52 through the two groups of hinged rods 55, so that the pressing plate 52 can tightly press the PCB to the lower end of the grid board 1.
[0024] See also Figures 3 to 4 The resistance structure in this embodiment includes a moving block 57 hingedly connected to the other end of the two groups of hinged rods 55, and support blocks 58 are fixed to the left and right ends of the moving block 57. The opposite ends of the front and rear groups of moving blocks 57 are fixed with sliding rods 59, and the outer surface of the sliding rod 59 is slidably connected to the cross bar 510, and the outer surface of the sliding rod 59 is sleeved with a resistance spring 511.
[0025] Secondly, the left and right walls of the inner cavity of the connecting plate 51 are provided with two sliding grooves for the support blocks 58 to slide on the inner walls. The support blocks 58 are slidably connected to the inside of the sliding grooves, so that the moving block 57 can be firmly moved in the connecting plate 51 through the corresponding two support blocks 58. In addition, the two support blocks 58 on the same side support the moving block 57 while limiting the moving range of the moving block 57 to prevent the sliding rod 59 from completely falling off from the cross bar 510.
[0026] In addition, the opposite ends of the front and rear sets of cross bars 510 are provided with extension grooves for the slide bar 59 to move in or out of the interior thereof. The slide bar 59 is slidably connected to the interior of the extension groove, so that the slide bar 59 can move into the extension groove so that the slide bar 59 can move into the cross bar 510, thereby adjusting the distance between the cross bar 510 and the shift block 57 so that the cross bar 510 and the shift block 57 can squeeze the resistance spring 511.
[0027] Furthermore, the opposite ends of the front and rear sets of cross bars 510 are fixed to the front and rear walls of the inner cavities of the two connecting plates 51 respectively.
[0028] It should be noted that the impedance tester and the electronic components appearing in this article are commonly known to the public in the prior art, and their working methods and circuit connections are commonly known to the public in the prior art, so their working principles will not be described in detail in this article.
[0029] The working principle of the above embodiment is:
[0030] When in use, pull the protrusion 54 downward to make the protrusion 54 pull the pressing plate 52 downward, so that the pressing plate 52 moves downward and the two sets of hinged rods 55 can be squeezed, that is, the two sets of hinged rods 55 push the front and rear sets of shifting blocks 57 to move oppositely, so that the shifting blocks 57 can push the sliding rod 59 to gradually move into the cross bar 510, so that the shifting blocks 57 and the cross bar 510 can squeeze the resistance spring 511, so that the PCB can be moved to the lower end of the grid board 1, and release the protrusion 54, so that the two sets of resistance springs 511 push the front and rear sets of shifting blocks 57 to move relative to each other, so that the two sets of shifting blocks 57 can push the pressing plate 52 downward through the two sets of hinged rods 55, so that the pressing plate 52 can fix the PCB to the lower side of the grid board 1, thereby eliminating the need for staff to press and fix the grid board 1 and PCB, and the PCB and grid board 1 can be pressed together, which can effectively reduce the tediousness of PCB ink testing.
[0031] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.
[0032] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A PCB ink grid test PAD device, comprising a grid board (1), characterized in that: The top of the grid board (1) is provided with a plurality of grids (2), the lower end of the grid board (1) is fixed with test coupon strips (3) on all sides, the right side wall of the grid board (1) is fixed with a stopper (4), the front and rear ends of the grid board (1) are fixed with support blocks (5), and the opposite sides of the two groups of support blocks (5) are provided with a pressing assembly for pressing the PCB; The compression assembly includes a connecting plate (51) fixed to the opposite side of the front and rear groups of support blocks (5), the top ends of the two connecting plates (51) are provided with a compression plate (52), the top ends of the compression plates (52) are fixed with a soft pad (53), the lower ends of the compression plates (52) are fixed with a protrusion (54), the left and right sides of the lower end of the connecting plate (51) are hingedly connected to two hinged rods (55), and the compression assembly also includes a resistance structure provided at the other ends of the two groups of hinged rods (55) for providing resistance thereto.
2. A PCB ink grid test PAD device according to claim 1, characterized in that: The top ends of the two connecting plates (51) are each provided with a sliding hole (56) for the hinge rod (55) to pass through, and the hinge rod (55) is slidably connected to the inside of the sliding hole (56).
3. The PCB ink grid test PAD device according to claim 1, characterized in that: The resistance structure includes a moving block (57) hingedly connected to the other end of the two groups of hinged rods (55), and a support block (58) is fixed to the left and right ends of the moving block (57). The opposite ends of the front and rear groups of the moving blocks (57) are fixed with a sliding rod (59), and the outer surface of the sliding rod (59) is slidably connected to a cross bar (510), and the outer surface of the sliding rod (59) is sleeved with a resistance spring (511).
4. A PCB ink grid test PAD device according to claim 3, characterized in that: The left and right walls of the inner cavity of the connecting plate (51) are both provided with two sliding grooves for the support block (58) to slide on the inner wall thereof, and the support block (58) is slidably connected to the inside of the sliding grooves.
5. The PCB ink grid test PAD device according to claim 3, characterized in that: An extension groove for allowing the slide bar (59) to move in or out of the interior thereof is provided at opposite ends of the front and rear groups of the cross bars (510), and the slide bar (59) is slidably connected to the interior of the extension groove.
6. The PCB ink grid test PAD device according to claim 3, characterized in that: The opposite ends of the front and rear groups of cross bars (510) are respectively fixed to the front and rear walls of the inner cavity of the two connecting plates (51).