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71 results about "Test coupon" patented technology

A coupon or test coupon is a printed circuit board (PCB) used to test the quality of a printed wiring board (PWB) fabrication process. Test coupons are fabricated on the same panel as the PWBs, typically at the edges.

Method of analyzing spot welded structures

Method of analyzing spot welded sheet metal structures subjected to forces that promote one or more basic failure modes of either shear tension, in-plane rotation, coach peel, normal tension, or any combination of such basic modes, the method comprising: (i) providing spot welded sheet metal test coupons for analysis of the selected failure mode for the structure to be analyzed and subjecting such test coupons to progressively increasing forces that eventually achieve failure in the selected failure mode to thereby generate measured load and displacement test data; (ii) analyzing the data from the basic modes to derive and extract spot weld strength and stiffness information and then surface fitting such extracted data to create a database; (iii) establishing a computer math model for simulating the spot weld failure modes of the structure and populating the database thereinto to enable simulated physical tests of the structure; (iv) creating a cumulative-damage failure criterion for the spot welded structure that ratios (a) the resultant strength information from the populated math model for selected combinations of load and selected combinations of time and structure thickness, and (b) the measured strength information derived for such combinations of load derived from the test data; and (v) solving the criterion to determine whether it indicates failure for the combination of resultant strength and other values selected.
Owner:FORD GLOBAL TECH LLC

Under-deposit corrosion experiment bracket and method for experimenting by using same

ActiveCN102680382ASolve the problem of poor reliability of research resultsReliable experimental methodWeather/light/corrosion resistanceElectricityTest coupon
The invention relates to an under-deposit corrosion experiment bracket and a method for experimenting by using the same, relating to the technical field of corrosion testing. The under-deposit corrosion experiment bracket comprises a bracket panel and a bracket base, wherein outer edges of the bracket panel and the bracket base are provided with fixing holes which are opposite in position, the bracket panel and the bracket base are connected and fixed through fixing members arranged in the fixing holes, the bracket panel is provided with a working electrode hole the diameter of which is equal to that of a working electrode, a panel groove is arranged around the working electrode hole and is internally provided with an O-shaped panel ring, a base groove is arranged in the bracket base, an O-shaped base ring is arranged in the base groove, three electric contacts are arranged on positions on the bracket base, which are positioned in the circumference of the inner diameter of the O-shaped base ring; lower ends of the electric contacts are inserted to the tops of electric contact supports; and a lead groove is arranged in the bracket base, and electric leads are arranged on the electric contact supports. The method can be used for carrying out electrochemical corrosion testing, corrosion weight loss measurement and surface appearance observation on the same corrosion test coupon, and is suitable for simulation study on electrochemical corrosion and under-deposit corrosion.
Owner:CHINA PETROLEUM & CHEM CORP +1

Printed circuit board test coupon for electrical testing during thermal exposure and method of using the same

A printed circuit board (PCB) test coupon for thermal exposure and electrical testing includes a double sided or multi-layer substrate with a plurality of vias formed within the substrate of the test coupon (blind, buried, stacked vias) or extending through the entire substrate (through hole/via) from a first surface on the first side of the plated hole/via to a second surface on the second side of the plated hole/via. Each of a first plurality of trace patterns interconnect a subset of the plurality of plated holes/vias on the first side of the plated holes/vias, and each of a second plurality of trace patterns interconnect a different subset of the plurality of plated holes/vias on the second side of the plated holes/vias. The first and second pluralities of trace patterns have different patterns and connect to connection points in a connector pattern defined in the substrate. One of the second plurality of trace patterns is configured to measure temperature and two of the second plurality of trace patterns are configured to measure calibration/drift by resistance measurements. The test coupon provides test nets that include a single plated hole/via, and optionally includes daisy chain test nets. A resistance measurement of each plated hole/via (or daisy chain) is provided by connecting 2 wires of a 4-wire kelvin bridge measurement system to the first and second sides of the plated hole/via (or daisy chain) using connection points for one of the first plurality of trace patterns and one of the second plurality of trace patterns that connect to each side of the said plated hole/via (or daisy chain).
Owner:RELIABILITY ASSESSMENT SOLUTIONS INC

Printed circuit board test coupon for electrical testing during thermal exposure and method of using the same

A printed circuit board (PCB) test coupon for thermal exposure and electrical testing includes a double sided or multi-layer substrate with a plurality of vias formed within the substrate of the test coupon (blind, buried, stacked vias) or extending through the entire substrate (through hole / via) from a first surface on the first side of the plated hole / via to a second surface on the second side of the plated hole / via. Each of a first plurality of trace patterns interconnect a subset of the plurality of plated holes / vias on the first side of the plated holes / vias, and each of a second plurality of trace patterns interconnect a different subset of the plurality of plated holes / vias on the second side of the plated holes / vias. The first and second pluralities of trace patterns have different patterns and connect to connection points in a connector pattern defined in the substrate. One of the second plurality of trace patterns is configured to measure temperature and two of the second plurality of trace patterns are configured to measure calibration / drift by resistance measurements. The test coupon provides test nets that include a single plated hole / via, and optionally includes daisy chain test nets. A resistance measurement of each plated hole / via (or daisy chain) is provided by connecting 2 wires of a 4-wire kelvin bridge measurement system to the first and second sides of the plated hole / via (or daisy chain) using connection points for one of the first plurality of trace patterns and one of the second plurality of trace patterns that connect to each side of the said plated hole / via (or daisy chain).
Owner:RELIABILITY ASSESSMENT SOLUTIONS INC
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