Radiation detector module, device and system

Abstract

The present disclosure provides radiation detector modules, devices, and systems. The radiation detector module includes a stacked multilayer structure including: a detector layer configured to detect radiation incident on the detector layer and to convert the radiation into an electrical signal; the detector layer is arranged on the first side, facing the radiation source, of the frame layer and fixed to the frame layer; and a signal processing layer disposed on a second side of the frame layer opposite to the first side and fixed to the frame layer, the signal processing layer configured to communicate with the detector layer to receive the electrical signal and process the electrical signal.

Description

Technical Field

[0001] The present disclosure relates to the field of detection, and more particularly, to a radiation detector module, a radiation detector device including the radiation detector module, and a radiation detector system including the radiation detector device. Background Art

[0002] Detection systems (e.g., imaging systems) can be used to image an examination subject and obtain corresponding test results. For example, CT (Computed Tomography) systems are widely used in various medical institutions to generate three-dimensional images of regions of interest, such as the lungs, to assist clinicians in making accurate medical diagnoses.

[0003] Some inspection systems use radiation from a radiation source to illuminate an object for examination. A detector on the opposite side of the radiation source detects the radiation, which is then used to analyze the data and obtain information about the object. For example, a CT system uses X-rays from an X-ray source to scan an object (e.g., a human body). The detector receives the X-rays that pass through the body and converts them into digital signals. These signals are then processed and analyzed by a computer to form an image, for example, of one or more parts of the body.

[0004] Radiation detector modules are a crucial component of CT imaging systems. They are expected to be smaller (e.g., in height and thickness) and less expensive. Furthermore, they play a crucial role in image quality and accuracy. To achieve this, radiation detector modules must be thermally stable, and their components must generally be accurately aligned internally. Other important requirements for CT detectors include ease of assembly and reliability. Utility Model Content

[0005] In order to at least solve one or more of the above technical problems and / or other possible technical problems, some embodiments of the present disclosure provide a radiation detector module, comprising a stacked multi-layer structure, the multi-layer structure including a detector layer, the detector layer being configured to detect radiation incident on the detector layer and convert the radiation into an electrical signal. The multi-layer structure also includes a frame layer, the detector layer being arranged on a first side of the frame layer facing the radiation source and fixed to the frame layer. The multi-layer structure further includes a signal processing layer, the signal processing layer being arranged on a second side of the frame layer opposite to the first side and fixed to the frame layer, the signal processing layer being configured to communicate with the detector layer to receive the electrical signal and process the electrical signal.

[0006] Optionally, the frame layer comprises a thermally conductive material.

[0007] Optionally, the detector layer is adhered to the frame layer via thermally conductive adhesive.

[0008] Optionally, the detector layer, the frame layer and the signal processing layer each have a flat plate configuration and are parallel to each other.

[0009] Optionally, at least a portion of the surface of the first side of the frame layer is covered with a radiation shielding layer.

[0010] Optionally, a heater is installed on the surface of the second side of the frame layer. In some embodiments, the surface of the second side of the frame layer includes a middle area and an edge area outside the middle area, and the heater is installed in the middle area.

[0011] Optionally, at least a portion of the surface of the heater is covered with a heat insulation layer, and the heat insulation layer is configured to block heat conduction between the frame layer and the heater.

[0012] Optionally, a first heat sink is installed on the surface of the second side of the frame layer. In some embodiments, the surface of the second side of the frame layer includes a middle area and an edge area outside the middle area, and the first heat sink is arranged on at least a portion of the edge area of ​​the surface of the second side.

[0013] Optionally, one or more connection structures are included between the signal processing layer and the frame layer. In some embodiments, the one or more connection structures include one or more pillars, gaskets or brackets provided on the frame layer.

[0014] Optionally, the detector layer comprises an array of detector units or an integral flat panel detector.

[0015] Optionally, the radiation detector module further includes a flexible circuit board connecting the detector layer and the signal processing layer to transmit signals, and the circuit board passes through or spans the frame layer.

[0016] Optionally, the signal processing layer includes a circuit board, and a second heat sink is mounted on the circuit board.

[0017] Optionally, the multi-layer structure of the radiation detector module further includes a housing layer, wherein the housing layer at least partially covers the signal processing layer and is connected to the frame layer.

[0018] Optionally, the signal processing layer includes a heat sink. The housing layer is provided with an opening for the heat sink to extend out of the housing layer.

[0019] Some embodiments of the present disclosure further provide a radiation detector device comprising one or more radiation detector modules as described above.

[0020] Optionally, the radiation detector device comprises at least two radiation detector modules, and the at least two radiation detector modules are arranged on the same track. Optionally, the track comprises a curved track.

[0021] Some embodiments of the present disclosure further provide a radiation system, including a radiation detector device as described in any of the above paragraphs, and a radiation source configured to emit the radiation toward the radiation detector device.

[0022] Some embodiments of the present disclosure also provide a radiation detector. The radiation detector includes a detector circuit board, which includes detector elements that convert received radiation into electrical signals. The radiation detector also includes a signal processing circuit board, which communicates with the detector circuit board and includes signal processing circuitry that processes the electrical signals received from the detector circuit board. The radiation detector also includes a frame, with the detector circuit board and the signal processing circuit board disposed on either side of the frame along the radiation direction.

[0023] Optionally, the frame is thermally conductive to the detector circuit board.

[0024] Optionally, the frame includes a middle area covered by at least one of the detector circuit board and the signal processing circuit board. In some embodiments, the frame further includes an edge area extending from the middle area, and the frame further includes a first heat sink mounted to the edge area.

[0025] Optionally, the radiation detector comprises a radiation shielding layer disposed between the detector circuit board and the frame.

[0026] Optionally, the radiation detector includes a heater disposed between the signal processing circuit board and the frame.

[0027] Optionally, the radiation detector includes a flexible circuit board connecting the detector circuit board and the signal processing circuit board to transmit signals, and the circuit board passes through or spans the frame.

[0028] Optionally, the radiation detector includes a second heat sink disposed on the signal processing circuit board and extending along the radiation direction of the rays.

[0029] Optionally, the radiation detector includes a shell covering the signal processing circuit board, and the shell includes an opening for the second heat sink to extend out of the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to further illustrate various embodiments of the present invention, the embodiments of the present invention will be specifically presented with reference to the accompanying drawings. It should be understood that these drawings may only depict typical embodiments of the present invention and therefore will not be considered as limiting the scope of protection claimed in the present invention.

[0031] In addition, the drawings show the main connection relationships or relative positional relationships of the various components, rather than all of these relationships, and the various components and connections in the drawings are not necessarily drawn to scale in reality.

[0032] Figure 1 An exemplary CT imaging system is shown.

[0033] Figure 2 Shows something like Figure 1 A block diagram of an exemplary imaging system of a CT imaging system.

[0034] Figure 3 An exploded view of a radiation detector module according to some embodiments of the present disclosure is shown.

[0035] Figure 4 An exploded view of a radiation detector module according to some other embodiments of the present disclosure is shown.

[0036] Figure 5 According to some embodiments of the present disclosure Figure 3 An assembly diagram of the radiation detector module without the housing.

[0037] Figure 6 According to some embodiments of the present disclosure Figure 3 An assembly diagram of the radiation detector module including the housing.

[0038] Figure 7 Shown are some other embodiments according to the present disclosure Figure 4 An assembly diagram of the radiation detector module without the housing.

[0039] Figure 8 Shown are some other embodiments according to the present disclosure Figure 4 An assembly diagram of the radiation detector module including the housing. DETAILED DESCRIPTION

[0040] The following detailed description refers to the accompanying drawings. The accompanying drawings illustrate, by way of example, specific embodiments in which the claimed subject matter may be practiced. It should be understood that the following specific embodiments are intended to provide specific descriptions of typical examples for illustrative purposes and should not be construed as limiting the present invention. Persons skilled in the art, provided they fully understand the spirit and purpose of the present invention, may make appropriate modifications and adjustments to the disclosed embodiments without departing from the spirit and scope of the claimed subject matter.

[0041] In the following detailed description, numerous specific details are set forth to provide a thorough understanding of each described embodiment. However, it will be apparent to one of ordinary skill in the art that the various described embodiments can be practiced without these specific details. In other instances, well-known structures are not described in detail to avoid unnecessarily obscuring aspects of the various embodiments. Unless otherwise defined, terms used herein shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains.

[0042] The terms "first," "second," and the like in the description and claims of the present disclosure do not imply any order, quantity, or importance, but are merely used to distinguish different components or features.

[0043] The embodiments of the present disclosure are exemplary implementations or examples. References in the specification to "an embodiment," "one embodiment," "some embodiments," "alternative embodiments," or "other embodiments" mean that the specific features and configurations described in conjunction with the embodiment are included in at least some embodiments of the present technology, but not necessarily all embodiments. Various appearances of "an embodiment," "one embodiment," or "some embodiments" do not necessarily refer to the same embodiment. Elements or aspects from one embodiment may be combined with elements or aspects of another embodiment.

[0044] In the description of this disclosure, the term "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0045] Unless otherwise defined, technical or scientific terms used in the claims and description shall have the ordinary meanings understood by persons of ordinary skill in the technical field to which the present invention belongs. Words such as "include" or "comprise" and similar expressions mean that the elements or objects preceding the word "include" or "comprise" include the elements or objects listed after the word "include" or "comprise" and their equivalents, and do not exclude other elements or objects.

[0046] It should be understood that the descriptions of positions and directions in this specification are made with reference to the specific embodiments shown in the drawings and are therefore relative. In other embodiments where the device or apparatus is positioned in an orientation opposite or different from that shown, these positional descriptions may vary accordingly.

[0047] The following will be combined Figures 1-8A radiation detector module, a radiation detector device including the radiation detector module, and a radiation detector system including the radiation detector device that can be used to practice the present invention are described in detail.

[0048] I. Imaging System Overview

[0049] While this disclosure primarily describes the technology in conjunction with CT imaging devices, it should be understood that the technology is also applicable to any other suitable type of imaging system, including but not limited to luggage x-ray machines, various medical imaging systems, and the like. In addition to CT, various medical imaging systems may include other medical imaging modalities, such as C-arm imaging systems, positron emission tomography (PET) systems, single photon emission computed tomography (SPECT) systems, interventional imaging systems (such as angiography and biopsy), X-ray radiography systems, X-ray fluoroscopy systems, and combinations thereof (e.g., multimodal imaging systems such as PET / CT or SPECT / CT imaging systems). Different types of imaging systems may be suitable for detecting corresponding targets. These targets may be any suitable type. As an example, a luggage x-ray machine may be suitable for detecting specific items in luggage. For medical imaging systems, detectable targets include interventional objects (such as needles, endoscopes, implants, catheters, guidewires, dilators, ablators, contrast agents, etc.), lesions (such as tumors, etc.), bones, organ tissue structures, vascular structures, and the like. On the other hand, for example, CT imaging systems can be used not only in the medical field but also in manufacturing, for example, for parts inspection.

[0050] Figure 1 An exemplary CT imaging system 100 is shown. Specifically, the CT imaging system (which may also be referred to as a CT apparatus) 100 is configured to image an examination object 112 (such as a patient, an inanimate object, one or more manufactured parts, industrial parts, a foreign object, etc.). Throughout this disclosure, the terms "examination object" and "patient" may be used interchangeably, and it should be understood that, at least in some embodiments, a patient is a type of examination object that can be imaged by the CT imaging system 100, and the examination object can include a patient. In some embodiments, the CT imaging system 100 includes a gantry 102, which may include at least one x-ray radiation source 104, which is configured to project an x-ray beam (or x-ray) 106 for imaging the examination object 112. Specifically, the x-ray radiation source 104 is configured to project the x-rays 106 toward a detector array 108 positioned on opposite sides of the gantry 102. Although Figure 1Only a single x-ray radiation source 104 is depicted, but in some embodiments, multiple x-ray radiation sources 104 may be employed to project multiple x-rays 106 toward multiple detectors to acquire projection data corresponding to the examination object 112 at different energy levels.

[0051] In some embodiments, the x-ray radiation source 104 projects a fan-shaped or cone-shaped x-ray beam 106 that is collimated to lie in the xy plane of a Cartesian coordinate system and is generally referred to as an "imaging plane" or "scanning plane." The x-ray beam 106 passes through an object 112. The x-ray beam 106, after being attenuated by the object 112, is incident on the detector array 108. The intensity of the attenuated radiation beam received at the detector array 108 depends on the attenuation of the x-rays 106 by the object 112. Each detector element of the detector array 108 generates a separate electrical signal that is a measure of the beam intensity at the detector location. Intensity measurements from all detectors are acquired individually to produce a transmission profile.

[0052] In third-generation CT imaging systems, the gantry 102 rotates the x-ray radiation source 104 and the detector array 108 around the examination object 112 within the imaging plane, causing the angle at which the x-ray beam 106 intersects the examination object 112 to continuously change. A full gantry rotation occurs when the gantry 102 completes a full 360-degree rotation. A set of x-ray attenuation measurements (e.g., projection data) from the detector array 108 at one gantry angle is referred to as a "view." Thus, a view is each incremental position of the gantry 102. A "scan" of the examination object 112 includes a set of views taken at different gantry angles or viewing angles during one rotation of the x-ray radiation source 104 and the detector array 108.

[0053] In an axial scan, the projection data is processed to construct an image corresponding to a two-dimensional slice taken through the examination object 112. One method for reconstructing an image from a set of projection data is known in the art as filtered back projection. This method converts attenuation measurements from the scan into an integer called a "CT number" or "Houinck unit" (HU), which is used to control the brightness of a corresponding pixel on, for example, a cathode ray tube display.

[0054] In some examples, the CT imaging system 100 may include a depth camera 114 positioned on or external to the gantry 102. Figure 1As shown, a depth camera 114 is mounted on a ceiling 116 positioned above an inspection object 112 and oriented to image the inspection object 112 when the inspection object 112 is at least partially outside the rack 102. The depth camera 114 may include one or more light sensors, including one or more visible light sensors and / or one or more infrared (IR) light sensors. In some embodiments, the one or more IR sensors may include one or more sensors in both the near IR range and the far IR range, thereby enabling thermal imaging. In some embodiments, the depth camera 114 may also include an IR light source. The light sensor may be any 3D depth sensor, such as a time-of-flight (ToF) sensor, a stereo sensor, or a structured light depth sensor, operable to generate a 3D depth image. In other embodiments, the light sensor may be a two-dimensional (2D) sensor operable to generate a 2D image. In some such embodiments, the 2D light sensor may be used to estimate 3D depth by inferring depth based on an understanding of light reflection phenomena. Regardless of whether the optical sensor is a 3D depth sensor or a 2D sensor, the depth camera 114 may be configured to output a signal encoding an image to a suitable interface, which may be configured to receive the signal encoding the image from the depth camera 114. In other examples, the depth camera 114 may also include other components, such as a microphone, to enable reception and analysis of directional and / or non-directional sounds from the observed inspection object and / or other sources.

[0055] In some embodiments, the CT imaging system 100 further includes an image processing unit 110 configured to reconstruct an image of the patient's target volume using a suitable reconstruction method, such as an iterative or analytical image reconstruction method. For example, the image processing unit 110 can reconstruct an image of the patient's target volume using an analytical image reconstruction method, such as filtered back projection (FBP). As another example, the image processing unit 110 can reconstruct an image of the patient's target volume using an iterative image reconstruction method, such as adaptive statistical iterative reconstruction (ASIR), conjugate gradient (CG), maximum likelihood expectation maximization (MLEM), model-based iterative reconstruction (MBIR), etc.

[0056] As used herein, the phrase "reconstructing an image" is not intended to exclude embodiments of the present disclosure in which data representing an image is generated rather than a visual image. Thus, as used herein, the term "image" broadly refers to both a visual image and data representing a visual image. However, many embodiments generate (or are configured to generate) at least one visual image.

[0057] The CT imaging system 100 also includes a table 115 on which the examination object 112 is positioned for imaging. The table 115 may be motorized so that the vertical position and / or lateral position of the table can be adjusted. Thus, the table 115 may include a motor and a motor controller, as will be described below with respect to Figure 2 The table motor controller moves the table 115 by adjusting the motor to appropriately position the examination object in the gantry 102 to acquire projection data corresponding to a target volume of the examination object. The table motor controller can adjust the height of the table 115 (e.g., the vertical position relative to the ground on which the table is located) and the lateral position of the table 115 (e.g., the horizontal position of the table along an axis parallel to the axis of rotation of the gantry 102).

[0058] Figure 2 Shows something like Figure 1 1. In some embodiments, the imaging system 200 includes a detector array 108 (see FIG. Figure 1 ). The detector array 108 also includes a plurality of detector elements 202 that together collect the x-ray beam 106 that passes through the examination object 112 (see Figure 1 ) to acquire corresponding projection data. Thus, in some embodiments, the detector array 108 is fabricated in a multi-slice configuration comprising multiple rows of cells or detector elements 202. In such a configuration, one or more additional rows of detector elements 202 are arranged in a parallel configuration for acquiring projection data. In some examples, the individual detectors or detector elements 202 of the detector array 108 may comprise photon counting detectors that register the interactions of individual photons into one or more energy bins. It should be understood that the techniques described herein may also be implemented using energy integrating detectors.

[0059] In some embodiments, the imaging system 200 is configured to traverse different angular positions around the examination object 112 to obtain desired projection measurement data. Thus, the gantry 102 and components mounted thereon can be configured to rotate about the rotation center 206 to obtain, for example, projection measurement data at different energy levels. Alternatively, in embodiments where the projection angle relative to the examination object 112 varies over time, the mounted components can be configured to move along a generally arc rather than along a circular segment.

[0060] In some embodiments, the imaging system 200 includes a control mechanism 208 to control the movement of components, such as the rotation of the gantry 102 and the operation of the x-ray radiation source 104. In some embodiments, the control mechanism 208 also includes an x-ray controller 210 configured to provide power and timing signals to the x-ray radiation source 104. Additionally, the control mechanism 208 includes a gantry motor controller 212 configured to control the rotational speed and / or position of the gantry 102 based on imaging requirements.

[0061] In some embodiments, the control mechanism 208 further includes a data acquisition system (DAS) 214 configured to sample analog data received from the detector elements 202 and convert the analog data into digital signals for subsequent processing. The data sampled and digitized by the DAS 214 is transmitted to a computer or computing device 216. In one example, the computing device 216 stores the data in a storage device 218. For example, the storage device 218 may include a hard drive, a floppy disk drive, a compact disc-read / write (CD-R / W) drive, a digital versatile disc (DVD) drive, a flash drive, and / or a solid-state storage drive.

[0062] Additionally, the computing device 216 provides commands and parameters to one or more of the DAS 214, the x-ray controller 210, and the gantry motor controller 212 to control system operations, such as data acquisition and / or processing. In some embodiments, the computing device 216 controls system operations based on operator input. The computing device 216 receives operator input, which may include, for example, commands and / or scan parameters, via an operator console 220 operatively coupled to the computing device 216. The operator console 220 may include a keyboard (not shown) or a touch screen to allow the operator to specify commands and / or scan parameters.

[0063] Although Figure 2 Only one operator console 220 is shown, but more than one operator console can be coupled to the imaging system 200, e.g., for inputting or outputting system parameters, requesting exams, and / or viewing images. Furthermore, in some embodiments, the imaging system 200 can be coupled to multiple displays, printers, workstations, and / or the like, located locally or remotely, e.g., within an institution or hospital or at an entirely different location, via one or more configurable wired and / or wireless networks (such as the Internet and / or a virtual private network).

[0064] In some embodiments, for example, the imaging system 200 includes or is coupled to a picture archiving and communication system (PACS) 224. In one exemplary embodiment, the PACS 224 is further coupled to remote systems (such as a radiology department information system, a hospital information system) and / or to an internal or external network (not shown) to allow operators at different locations to provide commands and parameters and / or gain access to image data.

[0065] The computing device 216 uses operator-supplied and / or system-defined commands and parameters to operate the table motor controller 226, which in turn controls the table motor to adjust the Figure 1 The table 115 is shown in FIG. Specifically, the table motor controller 226 moves the table 115 via the table motor so as to appropriately position the examination object 112 in the gantry 102 to acquire projection data corresponding to a target volume of the examination object 112. For example, the computing device 216 may send a command to the table motor controller 226, thereby instructing the table motor controller 226 to adjust the vertical position and / or lateral position of the table 115 via the motor.

[0066] As described above, the DAS 214 samples and digitizes the projection data acquired by the detector elements 202. Subsequently, the image reconstructor 230 uses the sampled and digitized x-ray data to perform high-speed reconstruction. Figure 2 The image reconstructor 230 is shown as a separate entity, but in some embodiments, the image reconstructor 230 may form part of the computing device 216. Alternatively, the image reconstructor 230 may not be present in the imaging system 200, and instead the computing device 216 may perform one or more functions of the image reconstructor 230. Furthermore, the image reconstructor 230 may be located locally or remotely and may be operatively connected to the imaging system 200 using a wired or wireless network. In particular, one exemplary embodiment may use computing resources in a "cloud" network cluster for the image reconstructor 230.

[0067] In some embodiments, the image reconstructor 230 stores the reconstructed image in the storage device 218. Alternatively, the image reconstructor 230 transmits the reconstructed image to the computing device 216 to generate usable examination object information (also referred to as examination object information) for diagnosis and evaluation. In some embodiments, the computing device 216 transmits the reconstructed image and / or examination object information to a display 232, which is communicatively coupled to the computing device 216 and / or the image reconstructor 230. In some embodiments, the display 232 allows an operator to evaluate the imaged anatomical structure. The display 232 can also allow the operator to select a volume of interest (VOI) and / or request examination object information, for example, via a graphical user interface (GUI), for subsequent scanning or processing.

[0068] As further described herein, the computing device 216 may include computer-readable instructions that are executable to send commands and / or control parameters to one or more of the DAS 214, the x-ray controller 210, the gantry motor controller 212, and the table motor controller 226 according to an examination imaging protocol, the examination imaging protocol including a clinical task / intent, which is also referred to herein as a clinical intent identifier (CID) for the examination. For example, the CID may inform the goal of the procedure based on a clinical indication (e.g., general scanning or lesion detection, anatomy of interest, quality parameters, or other goals), and may further define the desired position and orientation (e.g., posture) of the examination subject during the scan (e.g., supine and feet first). The operator of the system 200 can then position the examination subject on the table according to the examination subject position and orientation specified by the imaging protocol. In addition, the computing device 216 can set and / or adjust various scan parameters (e.g., dose, gantry rotation angle, kV, mA, attenuation filter) according to the imaging protocol. For example, the imaging protocol may be selected by an operator from a plurality of imaging protocols stored in a memory on the computing device 216 and / or a remote computing device, or the imaging protocol may be automatically selected by the computing device 216 based on received examination object information.

[0069] During the examination / scanning phase, it may be desirable to expose the subject to the lowest possible radiation dose while still maintaining the desired image quality. Furthermore, reproducible and consistent imaging quality may be desired between examinations and subjects, as well as between different imaging system operators. Consequently, the imaging system operator may perform manual adjustments to the table position and / or subject position, for example, to center the desired patient anatomy within the center of the gantry bore. However, such manual adjustments can be prone to error. Therefore, the CID associated with the selected imaging protocol may be mapped to various subject positioning parameters, including subject pose and orientation, table height, anatomical references for scanning, and start and / or end scan positions.

[0070] Thus, the depth camera 114 can be operatively and / or communicatively coupled to the computing device 216 to provide image data for determining the structure of the examination object, including posture and orientation. In addition, various techniques and processes further described herein for determining the structure of the patient based on the image data generated by the depth camera 114 can be stored as executable instructions in the non-transitory memory of the computing device 216.

[0071] In addition, in some examples, the computing device 216 may include a camera image data processor 215 that includes instructions for processing information received from the depth camera 114. The information received from the depth camera 114 (which may include depth information and / or visible light information) may be processed to determine various subject parameters, such as subject identity, subject build (e.g., height, weight, patient thickness), and the current subject position relative to the table and the depth camera 114. For example, prior to imaging, an image reconstructed from point cloud data generated by the camera image data processor 215 based on the images received from the depth camera 114 may be used to estimate the body contour or structure of the subject 112. The computing device 216 may use these subject parameters to, for example, perform patient-scanner contact prediction, scan range overlay, and scan keypoint calibration, as described in greater detail herein. Furthermore, the data from the depth camera 114 may be displayed via the display 232.

[0072] In some embodiments, information from the depth camera 114 can be used by the camera image data processor 215 to perform tracking of one or more inspection objects in the field of view of the depth camera 114. In some examples, image information (e.g., depth information) can be used to perform skeletal tracking, in which multiple joints of the inspection object are identified and analyzed to determine the movement, posture, position, etc. of the inspection object. The position of the joints during skeletal tracking can be used to determine the above-mentioned inspection object parameters. In other examples, the image information can be used directly to determine the above-mentioned inspection object parameters without skeletal tracking.

[0073] Based on these subject positioning parameters, the computing device 216 can output one or more alerts to the operator regarding the patient's posture / orientation and predicted results of the examination (e.g., scan), thereby reducing the likelihood that the subject will be exposed to a higher-than-desired radiation dose and improving the quality and reproducibility of images generated by the scan. As an example, the estimated anatomy can be used to determine whether the subject is in the imaging position prescribed by the radiologist, thereby reducing the incidence of repeating the scan due to improper positioning. In addition, the amount of time an imaging system operator spends positioning the subject can be reduced, thereby allowing more scans to be performed in a day and / or allowing for additional subject interactions.

[0074] Based on the depth of the camera (such as Figure 1 and Figure 2 For example, a controller (e.g., Figure 2 The computing device 216 of the depth camera 114 can extract patient structure and posture estimates based on the images received from the depth camera 114, thereby enabling different patient orientations to be distinguished from each other.

[0075] The CT imaging system 100 can perform an imaging examination based on a scan protocol. A scan protocol is a description of the imaging examination. The scan protocol may include a description of the body part involved, for example, using medical or layman's terms. The scan protocol may provide various parameters and related information for performing the scan and post-processing, such as power level, duration of radiation, movement speed, radiation energy, and time delay between image captures. It is contemplated that any configurable technical parameters that should be used by the imaging system 110 for the imaging examination may be defined in the scan protocol.

[0076] The CT imaging system 100 may have an automatic patient positioning function, that is, it may automatically position the patient to a scan start position in the opening of the gantry 102 based on an exam instruction or a scan protocol, and move the patient along the z-axis to a scan end position during scanning imaging. Existing automatic patient positioning functions can automatically determine the scanning range in the horizontal direction based on the anatomical structure to be imaged (e.g., from the exam instruction or scan protocol) and the patient structure from the depth camera 114. However, its automatic centering can only generally focus on the head or body and the average body contour center of all scout scans (hereinafter also referred to as reconnaissance scans). Therefore, the centering accuracy for specific anatomical structures and special patients is insufficient.

[0077] II. Detectors with Multi-layer Architecture

[0078] Figure 3 An exploded view of a radiation detector module 30 is shown, according to some embodiments of the present disclosure. Figure 4 FIG1 shows an exploded view of a radiation detector module 40 according to some other embodiments of the present disclosure. In some embodiments of the present disclosure, the radiation detector module 30 or the radiation detector module 40 may be, for example, a combination of the above Figure 2 The detector element 102 is described, but Figure 3 The radiation detector module 30 and Figure 4 The radiation detector module 40 integrates functions such as signal detection, analog-to-digital conversion, and signal processing. Figure 3 and Figure 4 In the figure, arrows are used to show radiation rays, such as X-rays, incident from below the radiation detector module 30 or the radiation detector module 40, so as to indicate the direction when describing. Figure 3 and Figure 4 The various layers included in the radiation detector module 30 or the radiation detector module 40 are shown in the embodiment. However, it should be understood that the radiation detector module 30 or the radiation detector module 40 may include the layer structure included in any of the embodiments described below, but does not necessarily include Figure 3 and Figure 4 All layers shown.

[0079] The radiation detector module 30 or 40 according to some embodiments of the present disclosure includes the following Figure 3 or Figure 4 The multilayer structure of the radiation detector module 30 includes a detector layer 302, a frame layer 304, and a signal processing layer 306. The detector layer 302 is disposed on the frame layer 304 toward the radiation source (e.g., 1 or 2). Figure 2 The first side of the radiation source 104) is as shown in FIG. Figure 3 As shown, the detector layer 302 can be disposed below the frame layer 304. The signal processing layer 306 is disposed on a second side of the frame layer 304 opposite to the first side, i.e., as shown in FIG. Figure 3 As shown, the signal processing layer 306 can be disposed above the frame layer 304. In other words, the detector layer 302 and the signal processing layer 306 are disposed on either side of the frame layer 304 along the radiation direction (direction indicated by the arrow). In some embodiments, the detector layer 302 and the signal processing layer 306 can be fixed to the frame layer 304. For example, the detector layer 302 and the signal processing layer 306 can be fixed to the frame layer 304 via one or more mechanical structures, including but not limited to screws.

[0080] Similarly, if combined Figure 4 As shown, the multi-layer structure of the radiation detector module 40 includes a detector layer 402, a frame layer 404 and a signal processing layer 406. The detector layer 402 is arranged on a first side of the frame layer 404 facing the radiation source, i.e., as shown in FIG. Figure 4As shown, the detector layer 402 can be disposed below the frame layer 404. The signal processing layer 406 is disposed on a second side of the frame layer 404 opposite to the first side, i.e., as shown in FIG. Figure 4 As shown, the signal processing layer 406 can be disposed above the frame layer 404. In other words, the detector layer 402 and the signal processing layer 406 are disposed on either side of the frame layer 404 along the radiation direction (direction indicated by the arrow). In some embodiments, the detector layer 402 and the signal processing layer 406 can be fixed to the frame layer 404. For example, the detector layer 402 and the signal processing layer 406 can be fixed to the frame layer 404 via one or more mechanical structures, including but not limited to screws.

[0081] The detector layers 302, 402 may be configured to detect radiation incident on the detector layers 302, 402, such as Figure 3 and Figure 4 The rays indicated by the arrows. The detector layers 302, 402 may be configured to further convert the detected rays into electrical signals. In some embodiments of the present disclosure, the detector layers 302, 402 may be implemented as circuit boards. The detector circuit board includes detector elements that convert received radiation into electrical signals. In some embodiments, the rays may include X-rays. In some embodiments, the detector elements of the detector circuit board may include elements that first convert X-rays into visible light (such as scintillators) and further convert light into electrical signals (such as photodiodes); in some embodiments, the detector elements of the detector circuit board may include photon counting detector elements or other types of elements that directly convert X-rays into electrical signals. The detector circuit board may also include an analog-to-digital conversion circuit to convert the analog signal into a digital signal.

[0082] exist Figure 3 In the illustrated embodiment, the detector layer 302 may include an array of a plurality of detector units 3022. As an example, Figure 3 The exploded view of FIG. 30 shows several detector units 3022, which can be reverse mounted to the bottom, i.e., the lower surface, of the frame layer 304. The detector layer 302 may include Figure 3 Other numbers of detector units 3022 are shown, which are different from the number shown. Figure 4 In the embodiment shown, the detector layer 302 is formed from a unitary flat panel detector circuit board.

[0083] The signal processing layer 306, 406 is configured to communicate with the detector layer 302, 402 to receive the electrical signals converted by the detector layer 302, 402 and process the electrical signals. In some embodiments of the present disclosure, the signal processing layer 306, 406 may be implemented as a circuit board. The signal processing circuit board may communicate with the detector circuit board and include signal processing circuitry for processing the electrical signals received from the detector circuit board.

[0084] The technical solution disclosed in the present invention arranges the functional modules in layers along the direction of the radiation and uses a frame layer to support the detector layer and the signal processing layer, so that the radiation detector module is more compact and easier to assemble.

[0085] In the technical solution disclosed in this disclosure, Figure 3 、 Figure 4 As shown, the detector layers 302, 402, frame layers 304, 404 and signal processing layers 306, 406 of the radiation detector modules 30, 40 respectively have a flat plate configuration and are parallel to each other. Figures 5 to 8 As shown, the radiation detector modules 30 and 40 are also in a flat-panel configuration. The flat-panel configuration means that the dimensions of the radiation detector modules 30 and 40 and their respective layer structures 302, 402, 304, 404, 306, 406 on the radiation receiving plane that receives radiation or faces the radiation source are much larger than or several times the dimensions of the radiation detector modules 30 and 40 parallel to the radiation propagation path. For example, Figure 3 、 Figure 4 As shown, the detector layers 302, 402, frame layers 304, 404, and signal processing layers 306, 406 are thin rectangular parallelepipeds, with their respective lengths and widths being much greater than their heights or thicknesses. The radiation detector modules 30, 40 and their respective layer structures 302, 402, 304, 404, 306, 406 have a planar configuration. This provides a larger area, allowing a single radiation detector module 30, 40 to carry more detector units 3022, 4022, thereby increasing the density of the radiation detector modules 30, 40 and correspondingly reducing the manufacturing cost of the radiation detector modules 30, 40. Furthermore, the detector layers 302, 402, frame layers 304, 404, and signal processing layers 306, 406 are parallel to each other, thereby reducing the heights and thicknesses of the radiation detector modules 30, 40.

[0086] In some embodiments of the present disclosure, the frame layer 304, 404 may also be configured for alignment of the detector layer 302, 402 and the signal processing layer 306, 406. For example Figure 3As shown, the frame layer 304 allows the detector layer 302 and the signal processing layer 306 on both sides thereof to be at least partially aligned, so as to facilitate signal transmission and help reduce the overall size of the radiation detector module 30. Figure 4 As shown, the frame layer 404 allows the detector layer 402 and the signal processing layer 406 on both sides thereof to be at least partially aligned, so as to facilitate signal transmission and help reduce the overall size of the radiation detector module 40 .

[0087] exist Figure 3 The illustrated embodiment further includes a flexible circuit board 3024. The flexible circuit board 3024 is configured to connect the detector units 3022 of the detector layer 302 with corresponding signal processing circuits in the signal processing layer 306 for signal transmission. Accordingly, the frame layer 304 may include a slot 3042 through which the flexible circuit board 3024 passes. This allows the flexible circuit board 3024 to pass through the slot 3042 of the frame layer 304 and connect to the processing circuit layer 306 above the frame layer 304.

[0088] exist Figure 4 In the embodiment shown, a flexible circuit board 4024 is similarly included. Figure 7 As shown in the assembly diagram of FIG, the flexible circuit board 4024 can be connected to the signal processing layer 406 across the frame 404 to transmit the signal to the signal processing layer 406. One or more flexible circuit boards 4024 can be included according to actual needs. Figure 4 As shown, the flexible circuit board 4024 can extend from one or more edges of the detector layer 402 (eg, a detector circuit board) and extend in the direction (upward) of the signal processing layer 406 .

[0089] The detector layers 302 and 402 are crucial components of the radiation detector module and imaging system, receiving and detecting incident radiation and converting it into electrical signals. The detectors in the detector layers 302 and 402 are highly temperature-sensitive during operation. This characteristic makes the thermal stability of the detector layers 302 and 402 crucial for the image quality and accuracy ultimately achieved by the imaging system. In some embodiments of the present disclosure, the frame layers 304 and 404 may also incorporate a temperature regulation function to further stabilize the operating temperature of the radiation detector modules 30 and 40. In some embodiments of the present disclosure, the frame layers 304 and 404 may also incorporate at least one of heating and cooling functions.

[0090] The frame layers 304, 404 may be provided with heaters. Figure 3 As shown, a heater 3044 is installed on the surface (upper surface) of the second side of the frame layer 304. For example, Figure 4As shown, a heater 4044 is mounted on the surface (upper surface) of the second side of the frame layer 404. In some embodiments, as shown in FIG. Figure 3 and Figure 4 As shown, the upper surface of the frame layer 304, 404 includes a middle area and an edge area outside the middle area, and the heater 3044, 4044 can be installed in the middle area.

[0091] In some embodiments of the present disclosure, the heaters 3044 and 4044 may be implemented as follows: Figure 3 and Figure 4 The thin surface heater shown achieves effective heating while fully utilizing the lateral (perpendicular to the direction indicated by the arrow) space of the radiation detector modules 30 and 40, further reducing the size of the radiation detector modules, particularly the dimension along the radiation direction (i.e., the height or thickness of the radiation detector modules 30 and 40). In some embodiments, a switching circuit coupled to the heaters 3044 and 4044 may be included to control the operating state of the heaters 3044 and 4044, thereby turning on the heaters 3044 and 4044 for heating when needed (e.g., when the operating environment temperature of the radiation detector modules 30 and 40 is below a preset value). In some embodiments of the present disclosure, at least a portion of the surface of the heaters 3044 and 4044 may be covered with a thermal insulation layer. The thermal insulation layer can block heat conduction between the frame layer and the heaters 3044 and 4044. The thermal insulation layer can be made of an insulating material, or it can be a gap between the frame layer and the heaters 3044 and 4044, with the air in the gap also serving to block heat conduction.

[0092] Alternatively or additionally, the frame layers 304, 404 may be provided with a heat sink. Figure 3 As shown, a heat sink 3046 is mounted on the surface (upper surface) of the second side of the frame layer 304. The heat sink 3046 is a component independent of the frame layer 304. For example, Figure 4 As shown, a heat sink 4046 is mounted or provided on the surface (upper surface) of the second side of the frame layer 404. In some embodiments, as shown in FIG. Figure 4 As shown, the frame layer 404 is an integrated structure manufactured by 3D printing or additive manufacturing technology, and the frame layer 404 is integrally provided with a plurality of sheet-shaped heat sinks 4046. In some embodiments, as shown in FIG. Figure 3 and Figure 4 As shown, the upper surface of the frame layer 304, 404 includes a middle area and an edge area outside the middle area, and the heat sink 3046, 4046 can be disposed on at least a portion of the edge area of ​​the upper surface of the frame layer 404. In some embodiments, as shown in FIG. Figure 3As shown, the heat sink 3046 can be arranged near one side edge of the upper surface of the frame layer 304. In other embodiments, as shown in FIG. Figure 4 As shown, heat sinks 4046 may be respectively provided near both side edges of the upper surface of the frame layer 404 .

[0093] In some embodiments of the present disclosure, the heat sinks 3046 and 4046 may be implemented as follows: Figure 3 and Figure 4 The heat sink 3046, 4046 may include multiple sheet-like or fin-like structures to increase the surface area, thereby increasing the heat dissipation rate. The sheet-like structure of the heat sink 3046, 4046 may extend at least partially along the edge and along the direction of the radiation (indicated by the arrow) to achieve good heat dissipation and fully utilize the space of the radiation detector module 30, 40.

[0094] In some embodiments, the frame 304, 404 can be made of a thermally conductive material to conduct heat. The thermally conductive material allows heat generated by the heater 3044, 4044 to be transferred away more quickly, for example, to the detectors of the detector layer 302, 402, which are thermally conductive to the frame. The thermally conductive material also allows heat transferred to the frame layer 304, 404 to be transferred more quickly. Therefore, the frame 304, 404 can be combined with the heater 3044, 4044 and / or the heat sink 3046, 4046 to further improve the thermal stability of the radiation detector module 30, 40, thereby enabling the imaging system to obtain higher quality and more accurate data. In some embodiments, the thermally conductive material of the frame 304, 404 can include a conductor with good thermal conductivity, including but not limited to aluminum, copper, etc.

[0095] In some embodiments, as Figure 4As shown, the detector layer 402 includes a lower surface (not shown) facing the radiation and an upper surface opposite the lower surface along the radiation direction. Detector elements 4022 are mounted on the lower surface of the detector layer 402. As described above, in some embodiments, these detector elements may include scintillators and photoelectric conversion diodes, photon counting detector elements, or other types of elements that directly convert X-rays into electrical signals. Signal processing elements 4026 are mounted on the upper surface of the detector layer 402. These signal processing elements 4026 may include analog-to-digital converter (ADC) chips that convert the analog signals generated by the detector elements into digital signals for subsequent signal processing and image reconstruction. Thermally conductive adhesive may be applied to at least a portion of the upper surface of the detection layer 402. The thermally conductive adhesive can better secure the detector layer 402 to the frame layer 404. Furthermore, the thermally conductive adhesive can further facilitate heat conduction between the detector layer 402 and the frame layer 404. In some embodiments, thermally conductive adhesive may not be applied to the upper surface of the detection layer 402, meaning that the detection layer 402 directly contacts and conducts heat to the frame layer 404.

[0096] In some embodiments of the present disclosure, the signal processing layer 306, 406 and the frame layer 304, 404 are connected in an isolated manner to avoid electrical short circuits or interference. Figure 3 、 Figure 4 In the illustrated embodiment, pillars 3048 and 4048 can be used to provide a certain spacing between the signal processing layers 306 and 406 and the frame layers 304 and 404, thereby achieving an isolated connection between the signal processing layer 406 and the frame layer 404. In other embodiments, an isolation design such as a gasket or a bracket can be used to achieve an isolated connection between the signal processing layer 406 and the frame layer 404.

[0097] Since the signal processing layer 306, 406 includes one or more components for signal processing, these components themselves also generate heat during operation. In order to avoid or at least reduce the heat generated by the signal processing layer 306, 406 from being directly transferred to the frame layer 304, 404, interfering with the temperature control of the frame layer 304, 404 (and thus potentially affecting the temperature of the detector layer 302, 402), in some embodiments of the present disclosure, the signal processing layer 306, 406 and the frame layer 304, 404 are spaced apart as described above. In addition, the signal processing layer 306, 406 may also include a heat sink 3062, 4062 to further avoid or reduce thermal interference between the signal processing layer 306, 406 and the frame layer 304, 404. The heat sink 3062, 4062 can be arranged at or near components that generate relatively high amounts of heat, so that the generated heat can be transferred away more quickly through the heat sink 3062, 4062, thereby reducing the temperature of the signal processing layer 306, 406. In some embodiments of the present disclosure, the heat sinks 3062 and 4062 may be configured to extend along the radiation direction (direction indicated by the arrow) to facilitate heat dissipation and fully utilize the longitudinal space, thereby facilitating reduction in the size of the radiation detector module.

[0098] In some embodiments, the heat sink 3062 or 4062 may also include one or more side-by-side sheet or fin structures to increase the heat dissipation area and accelerate heat dissipation. In some embodiments, a thermally conductive adhesive 3064 or 4064 may be included between the heat sink 3062 or 4062 and the circuit board 306 or 406. The thermally conductive adhesive 3064 or 4064 may be used to secure the heat sink 3062 or 4062 to the circuit board 306 or 406. The thermally conductive adhesive 3064 or 4064 may also accelerate the transfer of heat generated by the circuit board 306 or 406 to the heat sink 3062 or 4062.

[0099] In some embodiments of the present disclosure, a radiation shielding layer may be included between the detector layer 302, 402 and the frame layer 304, 404. For example, at least a portion of the lower surface of the frame layer 304, 404 is covered with the radiation shielding layer. The radiation shielding layer is configured to prevent radiation from propagating upward, that is, from propagating to the signal processing layer or the circuit board 306, 406. In some embodiments, the radiation shielding layer may be made of a high-density material such as tungsten, molybdenum, or lead. In some embodiments, the radiation shielding layer may be attached or coated to the lower surface of the frame layer 304, 404.

[0100] In some embodiments of the present disclosure, Figure 4As shown, the radiation detector module 40 may further include a collimator layer 401. The collimator layer 401 is disposed on one side of the lower surface of the detector layer 402. The collimator layer 401 may be fixed to the detector layer 402 and further fixed to the frame layer 404. The collimator layer 401 may be fitted to the lower surface of the detector layer 402. The collimator layer 401 may include a collimator for collimating or homogenizing radiation, and preventing or reducing radiation scattering. The collimator is made into an integrated structure using 3D printing or additive manufacturing technology to reduce manufacturing costs and improve performance. The collimator has a flat-plate configuration, which can reduce the height or thickness of the radiation detector module 40. In other embodiments, the collimator layer 401 may also be assembled to, for example, a surface according to design requirements. Figure 2 A rail or track is shown for mounting the detector array 108 .

[0101] like Figure 3 and Figure 4 As shown in the exploded view of FIG, in some embodiments of the present disclosure, the stacked multi-layer structure in the radiation detector modules 30 and 40 may further include a shell layer 308 and 408. Figure 5-Figure 8 , Figure 5 、 Figure 6 Shown separately Figure 3 Assembly diagrams of the radiation detector module 30 without and with the housing, Figure 7 、 Figure 8 Shown separately Figure 4 Assembly diagrams of the radiation detector module 40, shown without and with the housing, are shown. The housing layer 308, 408 at least partially covers the signal processing layer 306, 406 and is connected (e.g., fixed) to the frame layer 304, 404. The housing layer 308, 408 is made of a metal material, thereby improving the electromagnetic interference resistance or electromagnetic compatibility (EMC) performance of the radiation detector module 30, 40.

[0102] In some embodiments, as Figure 3 、 Figure 4 Combined with the corresponding Figure 6 and Figure 8 As shown, the housing layer 308, 408 is provided with openings 3082, 4082 for the heat sink 3062, 4062 on the signal processing circuit board 306, 406 to extend out of the housing layer 308, 408, so that the heat sink 3062, 4062 can dissipate heat better. In addition, the signal processing layer 306, 406 can include a heat conducting structure connected to the housing 308, 408 to more quickly conduct the heat generated by the signal processing layer 306, 406 to the housing 308, 408 and conduct it away from the housing 308, 408, so that the signal processing layer 306, 406 can cool down more quickly. Figure 6 and Figure 8As shown, the heat sinks 3046 and 4046 on the frame layers 304 and 404 can be arranged outside the shell layers 308 and 408 to better dissipate heat.

[0103] The radiation detector module disclosed herein features a layered structure designed along the radiation direction and a central frame that provides at least one or more of the following functions: support, alignment, and heat conduction. This makes the module more compact and compact, with precise internal component alignment, ease of assembly, and high reliability. Furthermore, the module incorporates a comprehensive temperature control design, ensuring more stable temperature control.

[0104] Some embodiments of the present disclosure may further include a radiation detector device. The radiation detector device includes one or more radiation detector modules 30 or (40) according to any embodiment of the present disclosure. In some embodiments, the radiation detector device includes at least two radiation detector modules 30 (or 40), and the at least two radiation detector modules 30 (or 40) may be arranged on the same track, for example Figure 2 The arcuate track on which the detector array 108 is mounted is shown.

[0105] Some embodiments of the present disclosure may further include a radiation system. The radiation system may include a radiation detector device according to any embodiment of the present disclosure. The radiation system may further include a radiation source configured to emit radiation rays toward the radiation detector device. The radiation source may be, for example, Figure 1 or Figure 2 Radiation source 104 is shown.

[0106] Without departing from the spirit and purpose of the present invention, those skilled in the art may make appropriate modifications and adjustments to the embodiments specifically described above. Therefore, it is intended that the subject matter claimed for protection is not limited to the specific examples disclosed, and that the subject matter claimed for protection also includes all implementations falling within the scope of the appended claims and their equivalents.

Claims

1. A radiation detector module comprising a stacked multilayer structure, the multilayer structure comprising: a detector layer configured to detect radiation incident on the detector layer and convert the radiation into an electrical signal; a frame layer, wherein the detector layer is disposed on a first side of the frame layer facing the radiation source and is fixed to the frame layer; A signal processing layer is provided on a second side of the frame layer opposite to the first side and fixed to the frame layer, the signal processing layer being configured to communicate with the detector layer to receive the electrical signal and process the electrical signal.

2. The radiation detector module of claim 1, wherein: The frame layer includes a thermally conductive material.

3. The radiation detector module according to any one of claims 1 to 2, wherein: The detector layer, the frame layer and the signal processing layer each have a flat plate configuration and are parallel to each other.

4. The radiation detector module according to any one of claims 1 to 2, wherein: At least a portion of a surface of the first side of the frame layer is covered with a radiation shielding layer.

5. The radiation detector module according to any one of claims 1 to 2, wherein: A heater is installed on the surface of the second side of the frame layer, The surface of the second side of the frame layer includes a middle area and an edge area outside the middle area, and the heater is installed in the middle area.

6. The radiation detector module of claim 5, wherein: At least a portion of the surface of the heater is covered with a heat insulation layer, which blocks heat conduction between the frame layer and the heater.

7. The radiation detector module according to any one of claims 1 to 2, wherein: A first heat sink is mounted on the surface of the second side of the frame layer, The surface of the second side of the frame layer includes a middle area and an edge area outside the middle area, and the first heat sink is disposed on at least a portion of the edge area of ​​the surface of the second side.

8. The radiation detector module according to any one of claims 1 to 2, wherein: One or more connection structures are provided between the signal processing layer and the frame layer. The one or more connection structures include one or more pillars, gaskets or brackets provided on the frame layer.

9. The radiation detector module according to any one of claims 1 to 2, wherein: It also includes a flexible circuit board connecting the detector layer and the signal processing layer to transmit signals, and the circuit board passes through or crosses the frame layer.

10. The radiation detector module according to any one of claims 1 to 2, wherein: The signal processing layer includes a circuit board, and a second heat sink is mounted on the circuit board.

11. The radiation detector module according to any one of claims 1 to 2, wherein: The multi-layer structure further comprises: A housing layer at least partially covers the signal processing layer and is connected to the frame layer.

12. The radiation detector module of claim 11, wherein: The signal processing layer includes a second heat sink, The shell layer is provided with an opening for the second heat sink to extend out of the shell layer.

13. A radiation detector device comprising one or more radiation detector modules, the radiation detector modules comprising: a detector layer configured to detect radiation incident on the detector layer and convert the radiation into an electrical signal; a frame layer, the detector layer being disposed on a first side of the frame layer and fixed to the frame layer; A signal processing layer is provided on a second side of the frame layer opposite to the first side and fixed to the frame layer, the signal processing layer being configured to communicate with the detector layer to receive the electrical signal and process the electrical signal.

14. The radiation detector device of claim 13, wherein: The radiation detector device includes at least two radiation detector modules, which are arranged on the same track.

15. A radiation system comprising: The radiation detector device according to any one of claims 13-14; as well as A radiation source is arranged to emit the radiation towards the radiation detector arrangement.

16. A radiation detector, characterized in that: include: a detector circuit board comprising detector elements for converting received radiation into electrical signals; a signal processing circuit board in communication with the detector circuit board and including signal processing circuitry for processing the electrical signal received from the detector circuit board; as well as The detector circuit board and the signal processing circuit board are respectively arranged on both sides of the frame along the radiation direction of the rays.

17. The radiation detector according to claim 16, wherein: The frame is thermally conductive to the detector circuit board.

18. The radiation detector according to claim 17, wherein: The frame includes a middle area covered by at least one of the detector circuit board and the signal processing circuit board, an edge area extending from the middle area, and a first heat sink mounted to the edge area.

19. The radiation detector according to claim 16, wherein: A radiation shield is included that is disposed between the detector circuit board and the frame.

20. The radiation detector according to claim 16, wherein: A heater is included and is disposed between the signal processing circuit board and the frame.

21. The radiation detector according to claim 16, wherein: A flexible circuit board is included for connecting the detector circuit board and the signal processing circuit board to transmit signals, and the circuit board passes through or spans over the frame.

22. The radiation detector of claim 16, wherein: It includes a second heat sink which is arranged on the signal processing circuit board and extends along the radiation direction of the rays.

23. The radiation detector according to claim 22, wherein: A shell covering the signal processing circuit board is included, wherein the shell includes an opening for the second heat sink to extend out of the shell.

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