Universal specification chip testing device

Abstract

The utility model relates to a general specification chip testing device, which comprises a testing plate, a testing area is arranged on the testing plate, an adjustable testing module is matched with the testing area, and the top of the adjustable testing module is provided with an empty slot for placing a chip to be tested; and a test circuit module is arranged on the test board outside the test area. According to the utility model, through the adjustment of the adjustable test module, the test device can be suitable for the test of different chips or chip modules to be tested, meets the test requirements of different shapes and different pin distances, and rapidly adapts to the iteration and diversity of the chips or chip modules to be tested; good electric contact between the test area and the to-be-tested chip or the chip module is ensured through the adjustable test module, and the test effect is ensured; the cost of developing the test seat is reduced, and a special mold is not needed.

Description

Technical Field

[0001] The utility model relates to the technical field of an electrical performance testing device, an electrical fault detection device and an electrical testing device characterized by performing tests not provided at other locations, and particularly relates to a chip testing device of universal specifications. Background Art

[0002] The test socket is a standard test device that tests the electrical performance and electrical connections of online components to detect manufacturing defects and component failures. It is mainly used to check the open and short circuit conditions of individual online components and various circuit networks. It has the characteristics of simple operation, fast speed, and accurate fault location.

[0003] A test socket typically includes a test board that provides structural support and test circuitry, contact terminals for signal transmission, and springs or pins to electrically connect the test circuitry to the chip. Prior art requires the development of specialized test fixtures to ensure reliable electrical contact between the chip or chip module under test and the test board. This involves mold-making for contact springs and spring holders, resulting in lengthy manufacturing cycles and high R&D costs, and is more suitable for mature modules.

[0004] With the development of the chip industry, the specifications of the chips or chip modules to be tested are diverse, and the updates are very fast in the R&D test stage. The test sockets with existing technology are obviously unable to meet the needs of rapid verification of R&D solutions. Utility Model Content

[0005] The utility model solves the problems existing in the prior art and provides a chip testing device of universal specifications.

[0006] The technical solution adopted by the present invention is a general-specification chip testing device, which includes a test board, a test area is provided on the test board, an adjustable test module is provided to match the test area, and an empty slot is provided on the top of the adjustable test module for placing the chip to be tested; a test circuit module is provided on the test board outside the test area.

[0007] Preferably, the adjustable test module includes a fixed base, a biaxial adjustment component and a detachable carrier plate arranged from bottom to top, and the empty slot is arranged in the middle of the detachable carrier plate; a number of elastic probe components are respectively provided in correspondence between the fixed base, the biaxial adjustment component and the detachable carrier plate.

[0008] Preferably, the dual-axis adjustment assembly includes two horizontal X-axis adjustment seats cooperatedly arranged on a fixed base, the fixed base is provided with two X-axis displacement adjustment mechanisms arranged along the horizontal X-axis, and any of the X-axis displacement adjustment mechanisms is cooperated with the corresponding horizontal X-axis adjustment seat;

[0009] Two horizontal Y-axis adjustment seats are provided on the top of any of the horizontal X-axis adjustment seats, and two Y-axis displacement adjustment mechanisms are provided on any of the horizontal X-axis adjustment seats along the horizontal Y-axis. Any of the Y-axis displacement adjustment mechanisms is cooperated with the corresponding horizontal Y-axis adjustment seat.

[0010] Preferably, the detachable carrier plate includes a positioning plate that cooperates with at least the horizontal Y-axis adjustment seat, and an empty slot is provided in the center of the positioning plate.

[0011] Preferably, the elastic probe assembly includes a plurality of first elastic probes disposed between a fixed base and a horizontal X-axis adjustment base, and a first through-hole group is respectively provided on the fixed base and the horizontal X-axis adjustment base for cooperating with the first elastic probes;

[0012] The elastic probe assembly further includes a plurality of second elastic probes disposed between the horizontal X-axis adjustment seat and the horizontal Y-axis adjustment seat, and a second through-hole group is respectively provided on the horizontal X-axis adjustment seat and the horizontal Y-axis adjustment seat for cooperating with the second elastic probes;

[0013] Electrical connectors are correspondingly provided between the first through hole group and the second through hole group of the horizontal X-axis adjustment seat.

[0014] Preferably, the second elastic probe passes through the horizontal Y-axis adjustment seat and is matched with the test through hole at the bottom of the empty slot.

[0015] Preferably, an adjustment mark is provided on the test board that cooperates with the adjustable test module.

[0016] Preferably, dustproof structures are respectively provided between the fixed base, the biaxial adjustment assembly and the detachable carrier plate.

[0017] Preferably, the test circuit module includes a test circuit, one end of which cooperates with the adjustable test module, and the other end of which includes a plurality of terminals.

[0018] Preferably, all the terminal rings are arranged at the edge of the test board, and a power-on indicator light is provided in conjunction with any of the terminals.

[0019] The utility model relates to a chip testing device of universal specifications, comprising a test board, wherein a test area is provided on the test board, an adjustable test module is provided in conjunction with the test area, an empty slot is provided on the top of the adjustable test module for placing the chip to be tested; a test circuit module is provided on the test board outside the test area.

[0020] The beneficial effects of the present invention are:

[0021] (1) Through the adjustment of the adjustable test module, it can be applied to the testing of different chips or chip modules to be tested, meet the testing requirements of different shapes and different pin spacings, and quickly adapt to the iteration and diversity of the chips or chip modules to be tested;

[0022] (2) Ensure good electrical contact between the test area and the chip or chip module to be tested through the adjustable test module to ensure the test effect;

[0023] (3) Reduce the cost of developing test sockets and eliminate the need for dedicated molds. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural diagram of the utility model;

[0025] Figure 2 This is a schematic diagram of the structure of the chip to be tested and the elastic probe assembly in the present invention;

[0026] Figure 3 This is a schematic diagram of the main structure of the adjustable test module in the initial state of the present invention;

[0027] Figure 4 This is a schematic diagram of the main structural view of the adjustable test module after adjustment in the present utility model;

[0028] Figure 5 This is a schematic diagram of the top view structure of the adjustable test module after adjustment in the utility model. DETAILED DESCRIPTION

[0029] The present invention will be further described in detail below with reference to the embodiments, but the protection scope of the present invention is not limited thereto.

[0030] The utility model relates to a chip testing device of universal specifications, which includes a test board 1, a test area 2 is provided on the test board 1, an adjustable test module 3 is provided to match the test area 2, and an empty slot 5 is provided on the top of the adjustable test module 3 for placing a chip to be tested 4; a test circuit module 6 is provided on the test board 1 outside the test area 2.

[0031] In the present invention, the test board 1 is used to demarcate the overall test operation area, wherein the test area 2 is used to configure the adjustable test module 3. The adjustable test module 3 mainly refers to the ability to adjust the size of the corresponding empty slot 5 based on the specifications of the chip to be tested 4, so as to realize the testing requirements of the chip to be tested 4 or chip modules with different shapes and different pin spacings.

[0032] In the present invention, a notch 7 needs to be provided on at least one side of the empty slot 5 to facilitate sample removal.

[0033] In the present invention, in order to implement the test, a test circuit module 6 is provided on the test board 1 , which is easily understood by those skilled in the art, and those skilled in the art can configure it themselves according to their needs.

[0034] The adjustable test module 3 includes a fixed base 31, a biaxial adjustment component and a detachable carrier plate arranged from bottom to top, and the empty slot 5 is arranged in the middle of the detachable carrier plate; a number of elastic probe components 11 are respectively provided between the fixed base 31, the biaxial adjustment component and the detachable carrier plate.

[0035] In the present invention, a fixed base 31 is fixedly set on the test board 1, and its function is to achieve a fixed electrical connection between the elastic probe assembly 11 and the test circuit module 6. At the same time, a biaxial adjustment assembly and a detachable carrier are set on the fixed base 31, and the biaxial adjustment assembly is used to adjust the overlapping position between it and the detachable carrier, and the applicable detachable carrier is selected based on the specifications of the empty slots 5 corresponding to the chips 4 to be tested of different specifications.

[0036] Obviously, the plurality of elastic probe assemblies 11 must be electrically connected between the fixed base 31 , the biaxial adjustment assembly and the detachable carrier, and finally connect the test circuit module 6 and the chip to be tested 4 .

[0037] In practical applications, there are various ways to implement the dual-axis adjustment assembly. An implementation method is given below.

[0038] In this embodiment, two horizontal X-axis adjustment seats 32 are set on the fixed base 31, and the two horizontal X-axis adjustment seats 32 can be displaced relative to or opposite to each other through two X-axis displacement adjustment mechanisms 33. Here, the two X-axis displacement adjustment mechanisms 33 can be a screw nut pair in the X-axis direction, and the rotation of the screw (fine adjustment) can be achieved by a manual knob, or a guide rail-slider group can be used for implementation; no matter which adjustment method is used, it is necessary to have a certain damping force or set a locking mechanism to prevent displacement during the test process. This is content that is easy to understand for those skilled in the art, and those skilled in the art can set it according to their needs.

[0039] Similarly, two horizontal Y-axis adjustment seats 34 are set on the top of each horizontal X-axis adjustment seat 32, and the adjustment logic is the same as described above (the setting of the Y-axis displacement adjustment mechanism 12 refers to the X-axis displacement adjustment mechanism 33).

[0040] In this embodiment, in fact, the final top is 4 horizontal Y-axis adjustment seats 34, which can be used to carry positioning plates 35 of different widths, and an empty slot 5 is set in the center of the positioning plate 35; the detachable carrier plate should at least be fixedly connected to the horizontal Y-axis adjustment seat 34 by means including but not limited to fixing bolts 8. To a certain extent, it can also be further fixed to the horizontal X-axis adjustment seat 32 by means including but not limited to fixing bolts 8. This is content that is easily understood by those skilled in the art.

[0041] The elastic probe assembly 11 includes a plurality of first elastic probes 36 disposed between a fixed base 31 and a horizontal X-axis adjustment base 32 , and a first through-hole group is respectively provided on the fixed base 31 and the horizontal X-axis adjustment base 32 for cooperating with the first elastic probes 36 ;

[0042] The elastic probe assembly 11 further includes a plurality of second elastic probes 37 disposed between the horizontal X-axis adjustment seat 32 and the horizontal Y-axis adjustment seat 34 , and a second through-hole group is respectively provided on the horizontal X-axis adjustment seat 32 and the horizontal Y-axis adjustment seat 34 to cooperate with the second elastic probes 37 ;

[0043] Electrical connectors 38 are correspondingly provided between the first through hole group and the second through hole group of the horizontal X-axis adjustment seat 32 .

[0044] In the present invention, considering that the positions of the horizontal X-axis adjustment base 32 and the horizontal Y-axis adjustment base 34 relative to the fixed base 31 are uncertain, if a single elastic probe is used, it is easy to cause damage or wear of the elastic probe, thereby affecting the test effect. Therefore, the elastic probes are divided into multiple groups to realize their electrical connection function. Specifically:

[0045] A first elastic probe 36 is disposed between the fixed base 31 and the horizontal X-axis adjustment base 32. Obviously, since the fixed base 31 is fixed, the bottom of the first elastic probe 36 must be fixedly electrically connected to the test circuit module 6, and the top of the first elastic probe 36 is fixed to the first through-hole group of the horizontal X-axis adjustment base 32;

[0046] The second elastic probe 37 is disposed between the horizontal X-axis adjustment base 32 and the horizontal Y-axis adjustment base 34. The bottom of the second elastic probe 37 is fixed to the second through-hole group of the horizontal X-axis adjustment base 32, and the top passes through the horizontal Y-axis adjustment base 34 and the test through-hole 39 provided at the bottom of the empty slot 5, and then contacts or is inserted into the test through-hole 39 provided at the bottom of the empty slot 5. Obviously, after the chip 4 to be tested is installed, its pins will be electrically connected to the second elastic probe 37 through the test through-hole 39;

[0047] The electrical connector 38 connects the ends of the first elastic probe 36 and the second elastic probe 37 at the first through hole group and the second through hole group of the horizontal X-axis adjustment seat 32 , thereby conducting electricity between the first elastic probe 36 and the second elastic probe 37 .

[0048] An adjustment mark 9 is provided on the test board 1 that cooperates with the adjustable test module 3 .

[0049] In the present invention, in order to ensure the displacement of the biaxial adjustment, an adjustment mark 9 can be set on the test plate 1, and the alignment can be achieved by visual inspection, or the position can be calibrated by methods including but not limited to laser leveling.

[0050] A dustproof structure 10 is provided between the fixed base 31 , the biaxial adjustment assembly and the detachable carrier plate.

[0051] In the present invention, the dustproof structure 10 ensures that each two components are relatively sealed to prevent dust or other conductive objects from entering and affecting the actual test results. In actual operation, in order to ensure convenience, a sealing cover or dustproof cover can be set on the outside after the complete biaxial adjustment and placement of the chip to be tested 4.

[0052] The test circuit module 6 includes a test circuit, one end of which cooperates with the adjustable test module 3 , and the other end of which includes a plurality of terminals 61 .

[0053] All the terminals 61 are arranged around the edge of the test board 1 , and a power-on indicator light (not shown in the figure) is provided in conjunction with any of the terminals 61 .

[0054] In the present invention, terminal 61 is used to realize the conduction of different test equipment, and a power-on indicator light is set to ensure the prompt of the conductive test path, thereby improving work efficiency; the indicator light here can be coordinated with the test circuit module 6 through power on, which is content that is easy to understand for technicians in this field.

[0055] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A general-purpose chip testing device, characterized by: The testing device includes a testing board, which is provided with a testing area, an adjustable testing module is provided to match the testing area, and an empty slot is provided on the top of the adjustable testing module for placing the chip to be tested; a testing circuit module is provided on the testing board outside the testing area.

2. The chip testing device of universal specifications according to claim 1, characterized in that: The adjustable test module includes a fixed base, a biaxial adjustment component and a detachable carrier plate arranged from bottom to top, and the empty slot is arranged in the middle of the detachable carrier plate; a number of elastic probe components are respectively provided between the fixed base, the biaxial adjustment component and the detachable carrier plate.

3. The chip testing device of universal specifications according to claim 2, characterized in that: The dual-axis adjustment assembly includes two horizontal X-axis adjustment seats arranged on a fixed base, and the fixed base is provided with two X-axis displacement adjustment mechanisms arranged along the horizontal X-axis, and any of the X-axis displacement adjustment mechanisms is arranged in conjunction with the corresponding horizontal X-axis adjustment seat; Two horizontal Y-axis adjustment seats are provided on the top of any of the horizontal X-axis adjustment seats, and two Y-axis displacement adjustment mechanisms are provided on any of the horizontal X-axis adjustment seats along the horizontal Y-axis. Any of the Y-axis displacement adjustment mechanisms is cooperated with the corresponding horizontal Y-axis adjustment seat.

4. The chip testing device of universal specifications according to claim 3, characterized in that: The detachable carrier plate includes a positioning plate that cooperates with at least the horizontal Y-axis adjustment seat, and an empty slot is provided in the center of the positioning plate.

5. The chip testing device of universal specifications according to claim 3, characterized in that: The elastic probe assembly includes a plurality of first elastic probes arranged between a fixed base and a horizontal X-axis adjustment base, and a first through-hole group is respectively provided on the fixed base and the horizontal X-axis adjustment base for cooperating with the first elastic probes; The elastic probe assembly further includes a plurality of second elastic probes disposed between the horizontal X-axis adjustment seat and the horizontal Y-axis adjustment seat, and a second through-hole group is respectively provided on the horizontal X-axis adjustment seat and the horizontal Y-axis adjustment seat for cooperating with the second elastic probes; Electrical connectors are correspondingly provided between the first through hole group and the second through hole group of the horizontal X-axis adjustment seat.

6. The chip testing device of universal specifications according to claim 5, characterized in that: The second elastic probe passes through the horizontal Y-axis adjustment seat and is matched with the test through hole at the bottom of the empty slot.

7. The chip testing device of universal specifications according to claim 3, characterized in that: An adjustment mark is provided on the test board that matches the adjustable test module.

8. The chip testing device of universal specifications according to claim 2, characterized in that: Dust-proof structures are respectively provided between the fixed base, the biaxial adjustment assembly and the detachable carrier plate.

9. The chip testing device of universal specifications according to claim 1, characterized in that: The test circuit module includes a test circuit, one end of which cooperates with the adjustable test module, and the other end includes a plurality of terminals.

10. The chip testing device of universal specifications according to claim 9, characterized in that: All the terminal rings are arranged at the edge of the test board, and a power-on indicator light is provided in conjunction with any of the terminals.

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