Photoelectronic device performance testing device

Abstract

The utility model discloses a photoelectronic device performance testing device, relates to the photoelectronic device technology field, and comprises a machine body and a clamping tool, the machine body is internally provided with the clamping tool, the clamping tool comprises a mounting plate, a spacing boss, a component body, an elastic clamping piece, a notch and a seesaw, the spacing boss is fixed in the middle of the mounting plate, and the seesaw is fixed in the middle of the mounting plate. And a component body is attached to the front end of the limiting boss. According to the optoelectronic device performance testing device provided by the invention, an original cover-closing type up-and-down pressing full-wrapping fixing mode is replaced by a spring clamping piece fixing mode, the structure is simple, opening and closing are convenient, when the device is used, the main body part of the component body is tightly attached to the limiting boss, the pin part protrudes out of the edge of the front end of the mounting plate, and the performance of the component body is greatly improved. Openings of the elastic clamping pieces are unfolded and clamped on the component bodies on the two sides of the mounting plate by using the warping plates, clamping is stable, the upper and lower groups of component bodies can be contained at the same time for synchronous aging test, and the applicability is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of optoelectronic devices, in particular to a device for testing the performance of optoelectronic devices. Background Art

[0002] Optoelectronic devices use semiconductor technology to integrate light and electrons, realizing the conversion and control of light and electricity. The core of optoelectronic devices is the photoelectric effect, which uses photoelectric induction to make electrons flow, completing energy conversion and signal transmission. After production, optoelectronic devices need to be tested for various aspects of their performance before they can be sold and used. One of the tests is the testing of their high-temperature resistance. Since optoelectronic devices are usually installed in circuits, they will generate a certain amount of heat during operation, so optoelectronic devices are required to have a certain degree of high-temperature resistance.

[0003] However, during the actual testing process, a general testing device requires the optoelectronic devices to be tested to be fixed in the testing device in sequence, which makes the overall operation steps more cumbersome and increases the workload of the operator. In addition, the closed-cover upper and lower pressing clamp fixing method adopted in the existing technology causes the optoelectronic device to be completely wrapped by the clamp, making it impossible to reasonably control the aging power of the optoelectronic device by monitoring the shell temperature of the optoelectronic device during the test process.

[0004] Therefore, in view of this, the shortcomings of the existing structure are studied and improved, and an optoelectronic device performance testing device is proposed. Utility Model Content

[0005] The purpose of the present invention is to provide an optoelectronic device performance testing device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: an optoelectronic device performance testing device, comprising a body and a clamping fixture, the body having a built-in clamping fixture, the clamping fixture comprising a mounting plate, a limiting boss, a component body, an elastic clip, a recess and a rocker, the limiting boss being fixed in the middle of the mounting plate, and the component body being placed in contact with the front end of the limiting boss, the rear end of the mounting plate being provided with an elastic clip, and recesses being provided at both ends of the elastic clip, and a rocker being inserted into the recess.

[0007] Furthermore, the pin portion of the component body protrudes from the front end edge of the mounting plate, and the main body portion of the component body fits with the limiting boss.

[0008] Furthermore, the elastic clip is made of elastic metal material, and the notches at both ends of the elastic clip are controlled to open and close under the action of the seesaw.

[0009] Furthermore, an aging test board is connected to the outside of the body, and the aging test board is connected in parallel with the components through wires.

[0010] Furthermore, the machine body is provided with an aging chamber, and a heat radiation reflecting plate is provided on the inner wall of the aging chamber.

[0011] Furthermore, a hinge is fixed on the top of the opening of the aging chamber, and a transparent flip plate is rotated on the top of the hinge.

[0012] Furthermore, heating wires are provided at both upper and lower ends of the aging chamber, and layer plates are fixed to the inner walls on both sides of the aging chamber.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. When the utility model is in use, the present application replaces the original cover-type upper and lower tight-pressing full-wrapped fixing method with a spring clip fixing method. The structure is simple and easy to open and close. When in use, the main part of the component body is pressed against the limiting boss and the pin part is protruded from the front edge of the mounting plate. The rocker is used to make the elastic clip opening unfold and clamped on the component body on both sides of the mounting plate. The clamping is firm and can accommodate two groups of upper and lower component bodies at the same time for synchronous aging testing, which is more applicable.

[0015] 2. When using the utility model, the two ends of the mounting plate are inserted into the layer plates on the inner walls of both sides of the aging chamber and the seesaw is removed. The machine body is connected to the mains and power is supplied to the disc-shaped heating wires located at the upper and lower ends of the aging chamber. The heating wires convert electric heat into thermal energy to test the performance of the component bodies in a high-temperature environment. The aging test can be performed simultaneously on the upper and lower groups of component bodies of the mounting plate, and each component body is heated evenly, and the test results are accurate and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the device of the utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the body of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the clamping fixture of the utility model.

[0019] In the figure: 1. Body; 2. Aging test board; 3. Aging chamber; 4. Hinge; 5. Transparent flip panel; 6. Heating wire; 7. Shelf; 8. Clamping fixture; 801. Mounting plate; 802. Limiting boss; 803. Component body; 804. Elastic clip; 805. Notch; 806. Rocker. DETAILED DESCRIPTION

[0020] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0021] like Figures 1 to 3 As shown, the optoelectronic device performance test device includes a body 1 and a clamping fixture 8. The body 1 has a built-in clamping fixture 8, and the clamping fixture 8 includes a mounting plate 801, a limiting boss 802, a component body 803, an elastic clip 804, a recess 805 and a rocker 806. The limiting boss 802 is fixed in the middle of the mounting plate 801, and the component body 803 is placed on the front end of the limiting boss 802. The elastic clip 804 is provided at the rear end of the mounting plate 801, and recesses 805 are provided at both ends of the elastic clip 804, and the rocker 806 is inserted into the inside of the recess 805. The pin part of the component body 803 protrudes from the front edge of the mounting plate 801, and the main part of the component body 803 is fixed to the mounting plate 801. The limiting bosses 802 are fitted together, and the elastic clips 804 are made of elastic metal material. The notches 805 at both ends of the elastic clips 804 are controlled to open and close under the action of the rocker 806. The present application replaces the original cover-type upper and lower tight-pressing full-wrapped fixing method with the fixing method of the spring clips. The structure is simple and easy to open and close. When in use, the main part of the component body 803 is placed close to the limiting boss 802 and the pin part protrudes from the front edge of the mounting plate 801. The rocker 806 is used to open the elastic clips 804 and clamp them on the component bodies 803 on both sides of the mounting plate 801. The clamping is firm and can accommodate two groups of component bodies 803 at the same time for synchronous aging testing, which has stronger applicability.

[0022] like Figures 1 to 2 As shown, the body 1 is externally connected to an aging test board 2, and the aging test board 2 is connected in parallel with each component body 803 through a wire. The body 1 has a built-in aging chamber 3, and the inner wall of the aging chamber 3 is provided with a heat radiation reflector. A hinge 4 is fixed to the top of the opening of the aging chamber 3, and a transparent flip plate 5 is rotated on the top of the hinge 4. Electric heating wires 6 are provided at the upper and lower ends of the aging chamber 3, and layer plates 7 are fixed to the inner walls of both sides of the aging chamber 3. The two ends of the mounting plate 801 are inserted into the layer plates 7 on the inner walls of both sides of the aging chamber 3 and the rocker plate 806 is removed. The body 1 is connected to the mains and power is supplied to the disc-shaped heating wires 6 located at the upper and lower ends of the aging chamber 3. The heating wires 6 convert electric heat into thermal energy to test the performance of the component body 803 in a high temperature environment. The aging test can be performed simultaneously on the upper and lower groups of component bodies 803 on the mounting plate 801, and each component body 803 is heated evenly, and the test results are accurate and reliable.

[0023] Working principle: When using the optoelectronic device performance test device, the present application replaces the original cover-type upper and lower tight-pressing full-wrapped fixing method with a spring clip fixing method. The structure is simple and easy to open and close. When in use, the main part of the component body 803 is pressed against the limiting boss 802 and the pin part protrudes from the front edge of the mounting plate 801. The rocker 806 is used to open the elastic clip 804 and clamp it on the component body 803 on both sides of the mounting plate 801. The clamping is firm and can accommodate two groups of upper and lower components at the same time. The component body 803 is subjected to aging test simultaneously, which has stronger applicability. The two ends of the mounting plate 801 are inserted into the layer plates 7 on the inner walls of both sides of the aging chamber 3 and the rocker 806 is removed. The body 1 is connected to the mains power and supplies power to the disc-shaped heating wires 6 located at the upper and lower ends of the aging chamber 3. The heating wires 6 convert electric heat into thermal energy to test the performance of the component body 803 in a high-temperature environment. The aging test can be performed simultaneously on the two groups of component bodies 803 on the upper and lower sides of the mounting plate 801, and each component body 803 is heated evenly, and the test results are accurate and reliable.

[0024] The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for specific applications.

Claims

1. An optoelectronic device performance testing device, comprising a body (1) and a clamping fixture (8), characterized in that: The body (1) is provided with a clamping fixture (8), the clamping fixture (8) comprising a mounting plate (801), a limiting boss (802), a component body (803), an elastic clip (804), a recess (805) and a seesaw (806); the limiting boss (802) is fixed in the middle of the mounting plate (801), and the component body (803) is placed in contact with the front end of the limiting boss (802); the rear end of the mounting plate (801) is provided with an elastic clip (804), and both ends of the elastic clip (804) are provided with recesses (805), and the seesaw (806) is inserted into the recess (805).

2. The optoelectronic device performance testing device according to claim 1, characterized in that: The pin portion of the component body (803) protrudes from the front edge of the mounting plate (801), and the main body portion of the component body (803) fits in contact with the limiting boss (802).

3. The optoelectronic device performance testing device according to claim 1, characterized in that: The elastic clip (804) is made of elastic metal material, and the notches (805) at both ends of the elastic clip (804) are controlled to open and close under the action of the seesaw (806).

4. The optoelectronic device performance testing device according to claim 1, characterized in that: The machine body (1) is externally connected to an aging test board (2), and the aging test board (2) is connected in parallel with each component body (803) via a wire.

5. The optoelectronic device performance testing device according to claim 1, characterized in that: The machine body (1) is provided with an aging chamber (3) therein, and a heat radiation reflection plate is provided on the inner wall of the aging chamber (3).

6. The optoelectronic device performance testing device according to claim 5, characterized in that: A hinge (4) is fixed on the top of the opening of the aging chamber (3), and a transparent flap (5) is rotatably provided on the top of the hinge (4).

7. The optoelectronic device performance testing device according to claim 5, characterized in that: Electric heating wires (6) are provided at both upper and lower ends of the aging chamber (3), and layer plates (7) are fixed to the inner walls of both sides of the aging chamber (3).

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