Guide structure of Beidou positioning chip
By adjusting the design of components and heat dissipation components, the problems of poor signal reception and heat accumulation of the Beidou positioning chip in a fixed position were solved, flexible signal reception and effective heat dissipation were achieved, and the stability and service life of the chip were improved.
Patent Information
- Application Number
- CN202422716523.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-11-08
AI Technical Summary
The Beidou positioning chip lacks flexibility due to its fixed position and cannot achieve optimal satellite signal reception in certain environments. It also accumulates heat under high load or long-term operation, resulting in performance degradation or damage.
A guiding structure including an adjustment component and a heat dissipation component is designed to adjust the chip angle through a motor and gears, and combine a thermal pad and a heat sink to manage heat to ensure optimal signal reception and heat dissipation.
The Beidou positioning chip has achieved flexible signal reception and effective heat dissipation in different environments, improving the stability and life of the chip.
Smart Images

Figure CN223347056U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a guiding structure, in particular to a guiding structure of a Beidou positioning chip. Background Art
[0002] The Beidou positioning chip is an integrated circuit designed specifically for the Beidou satellite navigation system. It receives Beidou satellite signals and calculates position information. The Beidou satellite navigation system is China's independently developed global satellite navigation system, similar to the US GPS, Russia's GLONASS, and the EU's Galileo system. With technological advancements, Beidou positioning chips will continue to develop towards higher integration, lower power consumption, higher accuracy, and greater security.
[0003] Although the existing Beidou positioning chips have made significant technological progress, they still have some shortcomings in actual use, as follows:
[0004] Fixed location leads to lack of flexibility: Beidou positioning chips are usually installed on devices. However, due to the fixed installation location, the direction of the receiving antenna cannot be flexibly adjusted in some cases. For example, between high-rise buildings in cities or in densely forested areas, the fixed installation location may not provide optimal satellite signal reception.
[0005] Heat accumulation: Under high load or long-term operation, fixed Beidou positioning chips may generate a lot of heat. If not dissipated in time, it may cause chip performance degradation or even damage. This problem is particularly prominent in enclosed spaces with poor heat dissipation conditions.
[0006] Therefore, a guidance structure for a Beidou positioning chip is particularly needed to solve the above problems. Utility Model Content
[0007] In order to overcome the shortcomings of existing Beidou positioning chips, such as insufficient flexibility due to fixed position and heat accumulation, the utility model provides a guiding structure of a Beidou positioning chip.
[0008] The utility model is achieved through the following technical approaches: a guiding structure of a Beidou positioning chip, comprising a base, a support rod, a connecting rod, a connecting seat, a bottom shell, a top shell, a connection port and a Beidou positioning chip body. The base is located at the lowest layer and serves as a support for the entire structure. The support rod is fixedly connected to the center position of the top of the base. The top of the support rod is rotatably connected to the connecting rod, and the upper end of the connecting rod is rotatably connected to the connecting seat through a universal ball. The top of the connecting seat is fixedly connected to the bottom shell, the top edge position of the bottom shell is installed with a top shell, the rear side of the top of the bottom shell near the edge is fixedly connected with a connection port, the Beidou positioning chip body is installed at the center position of the top, and the connection port is electrically connected to the Beidou positioning chip body. It also includes an adjustment component and a heat dissipation component. An adjustment component is provided between the support rod, the connecting rod and the connecting seat, and a heat dissipation component is provided between the Beidou positioning chip body and the connecting seat.
[0009] Furthermore, the adjustment component includes a motor, a gear and an electric push rod. The motor is installed on the left side of the upper end of the support rod. A gear is fixedly connected to the output shaft of the motor. Another gear is fixedly connected to the outside of the lower end of the connecting rod, and the two gears are engaged with each other. The electric push rod is installed on the left side of the middle end of the connecting rod, and the telescopic rod of the electric push rod is fixedly connected to the bottom of the connecting seat.
[0010] Furthermore, the heat dissipation component includes a thermal pad and a radiator. The connecting seat is provided with multiple ventilation holes in a circular array. The bottom of the Beidou positioning chip body is fixedly connected to the thermal pad. The radiator is installed inside the connecting seat, and the bottom surface of the thermal pad is in contact with the top surface of the radiator.
[0011] Furthermore, it also includes a metal shielding layer, and the metal shielding layer is fixedly connected to the center position of the top of the bottom shell.
[0012] Furthermore, a low-pass filter is included, and the low-pass filter is installed on the left side of the top of the bottom shell near the edge.
[0013] Furthermore, a band-pass filter is included, and the band-pass filter is installed on the right side of the top of the bottom shell near the edge.
[0014] Furthermore, a controller is included. The controller is installed on the front side of the top of the bottom shell near the edge. The controller is electrically connected to the motor, the electric push rod, the low-pass filter and the band-pass filter.
[0015] From the above description of the structure of the present invention, it can be seen that the design starting point, concept and advantages of the present invention are:
[0016] The utility model realizes the precise adjustment of the pitch and azimuth angles of the Beidou positioning chip body by setting an adjustment component, so that the chip body is always in the best position to receive satellite signals, ensuring that the Beidou positioning chip body can accurately receive satellite signals. The utility model then effectively manages the heat generated by the Beidou positioning chip body during operation by setting a heat dissipation component, ensuring that it operates within a safe temperature range, thereby improving the stability and life of the Beidou positioning chip body.
[0017] The utility model optimizes the signal receiving quality, removes unnecessary interference signals and improves the accuracy and reliability of signal processing by arranging a metal shielding layer, a low-pass filter and a band-pass filter. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.
[0019] Figure 2 It is a partial cross-sectional view of the connecting seat, bottom shell and top shell of the utility model.
[0020] Figure 3 This is a top plan schematic diagram of the Beidou positioning chip body, metal shielding layer, low-pass filter and other components of the utility model.
[0021] Figure 4 It is a three-dimensional structural diagram of the motor, gears, electric push rod and other components of the utility model.
[0022] In the accompanying drawings: 1. base, 2. support rod, 201. connecting rod, 3. connecting seat, 301. vent, 4. bottom shell, 5. top shell, 6. connection port, 7. Beidou positioning chip body, 8. metal shielding layer, 9. low-pass filter, 10. band-pass filter, 11. controller, 12. thermal pad, 13. radiator, 14. motor, 15. gear, 16. electric push rod. DETAILED DESCRIPTION
[0023] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0024] Example: A Beidou positioning chip guidance structure, see Figures 1-4As shown, it includes a base 1, a support rod 2, a connecting rod 201, a connecting seat 3, a bottom shell 4, a top shell 5, a connection port 6, a Beidou positioning chip body 7, a metal shielding layer 8, a low-pass filter 9 and a band-pass filter 10. The base 1 is located at the bottom layer and serves as the support of the entire structure. The support rod 2 is connected to the top center of the base 1 by welding. The top of the support rod 2 is rotatably connected to the connecting rod 201. The upper end of the connecting rod 201 is rotatably connected to the connecting seat 3 through a universal ball. The top of the connecting seat 3 is connected to the bottom shell 4 by welding. The top edge of the bottom shell 4 is connected to the top shell 5 by bolts, and the surface of the top shell 5 is designed to be an arc shape, which can distribute the external force more evenly, thereby reducing the stress concentration inside the material and improving the overall strength and durability. The bottom shell 4 The position near the edge on the rear side of the top is connected to the connection port 6 by bonding, and the Beidou positioning chip body 7 is connected to the center position of the top by bolts, and the connection port 6 is electrically connected to the Beidou positioning chip body 7. The center position of the top of the bottom shell 4 is connected to a ring-shaped metal shielding layer 8 by bonding, and the metal shielding layer 8 covers the Beidou positioning chip body 7. The position near the edge on the left side of the top of the bottom shell 4 is connected to a low-pass filter 9 by bolts, and the position near the edge on the right side of the top of the bottom shell 4 is connected to a band-pass filter 10 by bolts. It also includes an adjustment component and a heat dissipation component. An adjustment component is arranged between the support rod 2, the connecting rod 201 and the connecting seat 3, and a heat dissipation component is arranged between the Beidou positioning chip body 7 and the connecting seat 3.
[0025] See Figure 1 and Figure 4 As shown, the adjustment assembly includes a motor 14, a gear 15 and an electric push rod 16. The motor 14 is connected to the left side of the upper end of the support rod 2 by bolts, and a gear 15 is connected to the output shaft of the motor 14 by welding. Another gear 15 is connected to the outside of the lower end of the connecting rod 201 by welding, and the two gears 15 have equal thickness and mesh with each other. The electric push rod 16 is connected to the left side of the middle end of the connecting rod 201 by bolts, and the telescopic rod of the electric push rod 16 is fixedly connected to the bottom of the connecting seat 3.
[0026] See Figure 2 and Figure 4 As shown, the heat dissipation component includes a thermal pad 12 and a radiator 13. A plurality of ventilation holes 301 in a ring array are provided on the connecting seat 3. The bottom of the Beidou positioning chip body 7 is connected to the thermal pad 12 by bonding. The inside of the connecting seat 3 is connected to the radiator 13 by bolts, and the bottom surface of the thermal pad 12 is in contact with the top surface of the radiator 13, so that the heat is evenly distributed on the radiator 13, thereby improving the heat dissipation efficiency.
[0027] See Figure 1 and Figure 3As shown, a controller 11 is also included. The controller 11 is connected to the top front side of the bottom shell 4 near the edge by bolts. The controller 11 is electrically connected to the motor 14, the electric push rod 16, the low-pass filter 9 and the band-pass filter 10.
[0028] First, place the base 1 in a suitable place and fix it to ensure the stability of the entire structure, then remove the top shell 5 to expose the bottom shell 4, then operate the controller 11 to turn on the electric push rod 16, and control its telescopic rod to extend or retract, when extending, push the connecting seat 3 to drive the bottom shell 4 to tilt and rotate clockwise, when retracting, pull the connecting seat 3 to drive the bottom shell 4 to tilt and rotate counterclockwise, thereby adjusting the pitch angle of the Beidou positioning chip body 7, after the adjustment is completed, turn off the electric push rod 16, and then turn on the motor 14, the output shaft of the motor 14 drives the left gear 15 to rotate, so that it engages with the right gear 15, and then the right gear 15 drives the connecting rod 201 to rotate horizontally, thereby adjusting the azimuth angle of the Beidou positioning chip body 7, after the adjustment is completed, turn off the motor 14, connect the power cord to the connection port 6, and then turn on the Beidou positioning chip body 7 to make it enter normal working state so that Receive the signal of Beidou satellite and perform positioning, then turn on the low-pass filter 9 and the band-pass filter 10, reinstall the top shell 5 to cover the bottom shell 4, and when the Beidou positioning chip body 7 receives the Beidou satellite signal, the metal shielding layer 8 reduces the impact of external electromagnetic interference on signal reception, the low-pass filter 9 removes high-frequency noise and retains useful signals, and the band-pass filter 10 allows signals within a specific frequency range to pass and excludes signal interference of other frequencies. The Beidou positioning chip body 7 generates heat when working, and the heat is quickly transferred to the thermal pad 12, and then transferred to the radiator 13 by the thermal pad 12. The radiator 13 transfers the heat from the vent 301 to the surrounding air through its large contact surface, thereby reducing the temperature of the Beidou positioning chip body 7, avoiding heat accumulation inside the Beidou positioning chip body 7, and ensuring that the Beidou positioning chip body 7 operates within a safe temperature range.
[0029] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.
Claims
1. A guiding structure for a Beidou positioning chip, comprising a base (1), a support rod (2), a connecting rod (201), a connecting seat (3), a bottom shell (4), a top shell (5), a connection port (6) and a Beidou positioning chip body (7), wherein the base (1) is located at the bottom layer and serves as a support for the entire structure, the support rod (2) is fixedly connected to the top center position of the base (1), the top end of the support rod (2) is rotatably connected to the connecting rod (201), the upper end of the connecting rod (201) is rotatably connected to the connecting seat (3) through a universal ball, the top of the connecting seat (3) is fixedly connected to the bottom shell (4), the top edge position of the bottom shell (4) is installed with the top shell (5), the rear side of the top of the bottom shell (4) near the edge is fixedly connected with the connection port (6), the top center position of the Beidou positioning chip body (7) is installed, and the connection port (6) is electrically connected to the Beidou positioning chip body (7), characterized in that: It also includes an adjustment component and a heat dissipation component. The adjustment component is provided between the support rod (2), the connecting rod (201) and the connecting seat (3), and the heat dissipation component is provided between the Beidou positioning chip body (7) and the connecting seat (3).
2. The Beidou positioning chip guidance structure according to claim 1, characterized in that: The adjustment component comprises a motor (14), a gear (15) and an electric push rod (16); the motor (14) is installed on the left side of the upper end of the support rod (2); a gear (15) is fixedly connected to the output shaft of the motor (14); another gear (15) is fixedly connected to the outside of the lower end of the connecting rod (201), and the two gears (15) are meshed with each other; the electric push rod (16) is installed on the left side of the middle end of the connecting rod (201), and the telescopic rod of the electric push rod (16) is fixedly connected to the bottom of the connecting seat (3).
3. The Beidou positioning chip guidance structure according to claim 2, characterized in that: The heat dissipation component includes a thermal pad (12) and a radiator (13); a plurality of vents (301) in a ring array are provided on the connecting seat (3); the thermal pad (12) is fixedly connected to the bottom of the Beidou positioning chip body (7); the radiator (13) is installed inside the connecting seat (3), and the bottom surface of the thermal pad (12) is in contact with the top surface of the radiator (13).
4. The Beidou positioning chip guidance structure according to claim 3, characterized in that: It also includes a metal shielding layer (8), and the metal shielding layer (8) is fixedly connected to the center position of the top of the bottom shell (4).
5. The Beidou positioning chip guidance structure according to claim 4, characterized in that: A low-pass filter (9) is also included, and the low-pass filter (9) is installed on the left side of the top of the bottom shell (4) near the edge.
6. The Beidou positioning chip guidance structure according to claim 5, characterized in that: A band-pass filter (10) is also included, and the band-pass filter (10) is installed on the right side of the top of the bottom shell (4) near the edge.
7. The Beidou positioning chip guidance structure according to claim 6, characterized in that: The invention also includes a controller (11), which is installed at a position near the edge of the top front side of the bottom shell (4). The controller (11) is electrically connected to the motor (14), the electric push rod (16), the low-pass filter (9) and the band-pass filter (10).