Heat dissipation structure, electronic module, electronic device and electronic equipment

Abstract

The utility model discloses a heat dissipation structure, an electronic module, an electronic device and electronic equipment. The heat dissipation structure is provided with an installation groove and a clamping groove, the installation groove communicates with the clamping groove, in the thickness direction of the heat dissipation structure, the top wall of the installation groove and the top wall of the clamping groove are spaced, the bottom wall of the installation groove and the bottom wall of the clamping groove are spaced, the clamping groove is used for allowing a part to be cooled to be clamped in, and under the condition that the part to be cooled is clamped in the clamping groove, at least part of the part to be cooled is located in the installation groove. Under the condition that to-be-cooled pieces with different thicknesses are installed on the heat dissipation structure, the relative positions of the circuit board of the to-be-cooled pieces and the top wall and the bottom wall of the heat dissipation structure are kept unchanged, and the storage chip of the to-be-cooled pieces can be located in the interval between the installation groove and the clamping groove. The heat dissipation structure is in contact with the memory chip of the to-be-cooled piece so as to dissipate heat of the to-be-cooled piece According to the heat dissipation structure, the to-be-cooled parts with different thicknesses can be arranged in the heat dissipation structure, heat dissipation can be effectively carried out on the to-be-cooled parts, and the use scenes of the heat dissipation structure are more.

Description

Technical Field

[0001] The present application relates to the field of automotive technology, and more specifically, to a heat dissipation structure, an electronic module, an electronic device, and an electronic device. Background Art

[0002] As memory sticks experience performance improvements, their power consumption and heat generation also increase. As temporary data storage for computers, memory sticks are primarily responsible for loading and exchanging temporary data while the operating system and software are running. As large-scale games increasingly cache larger amounts of data and memory speeds continue to increase, memory sticks generate increasing heat. High temperatures can easily cause memory sticks to throttle, resulting in reduced performance or even system crashes, impacting the user experience. Currently, many consumer-grade memory sticks feature heat dissipation structures. For example, an "n"-type metal heat sink, with a metal body attached to the two sides of the memory stick, enables contact heat exchange. Because the (maximum) thickness of a memory stick with memory chips on both sides is different from that of a memory stick with a memory chip on one side, the "n"-type metal heat sink cannot accommodate memory sticks of varying thicknesses, limiting the use of this heat dissipation structure. Utility Model Content

[0003] Embodiments of the present application provide a heat dissipation structure, an electronic module, an electronic device, and an electronic device.

[0004] The heat dissipation structure of the embodiment of the present application is provided with a mounting groove and a card slot, the mounting groove is connected to the card slot, in the thickness direction of the heat dissipation structure, the top wall of the mounting groove is spaced from the top wall of the card slot, and the bottom wall of the mounting groove is spaced from the bottom wall of the card slot, and the card slot is used for the heat dissipation component to be snapped in. When the heat dissipation component to be snapped into the card slot, at least a portion of the heat dissipation component to be snapped in the mounting groove.

[0005] In some embodiments, the heat dissipation structure includes a first heat dissipation member and a second heat dissipation member, the card slot is provided on the first heat dissipation member, the first heat dissipation member and the second heat dissipation member jointly form the mounting slot, and in the thickness direction of the heat dissipation structure, the bottom wall of the card slot is spaced from the inner surface of the first heat dissipation member, and the top wall of the card slot is spaced from the inner surface of the second heat dissipation member.

[0006] In some embodiments, the second heat sink and the first heat sink are capable of rotating relative to each other so that the heat dissipation structure can switch between an unfolded state and a folded state. The first heat sink is provided with a first connection portion, and the second heat sink is provided with a second connection portion. When the heat dissipation structure is in the folded state, the second connection portion cooperates with the first connection portion to keep the heat dissipation structure in the folded state. When the heat dissipation structure is in the unfolded state, the second connection portion is disengaged from the first connection portion.

[0007] In some embodiments, the first heat sink includes a heat sink body and a mounting member, the mounting member is connected to the heat sink body, and the mounting member forms the slot.

[0008] In some embodiments, the heat sink includes a first end and a second end, the first end and the second end of the heat sink being opposite each other in a first direction. The mounting member is connected to the first end of the heat sink, and / or the mounting member is connected to the second end of the heat sink.

[0009] In some embodiments, the mounting member includes a first mounting portion and a second mounting portion spaced apart from each other. In the thickness direction of the heat dissipation structure, the projection of the first mounting portion and the projection of the second mounting portion at least partially overlap. A first groove is formed between the top wall of the first mounting portion and the second mounting portion, and a second groove is formed on the second mounting portion. The first groove and the second groove are connected to form the card slot.

[0010] In certain embodiments, the first mounting portion includes a first sub-portion and a second sub-portion, the first sub-portion and the second sub-portion being connected, the heat sink body including a first end and a second end, the first end and the second end of the heat sink body being opposite each other in a first direction. The first sub-portion is connected to the first end and / or the second end of the heat sink body, the extension direction of the first sub-portion intersecting the first direction, and the second sub-portion bends and extends from the first sub-portion along the first direction away from the heat sink body, with the first direction being the length direction of the heat dissipation structure.

[0011] In certain embodiments, the second mounting portion includes a first sub-component, a second sub-component, and a third sub-component, the first sub-component, the second sub-component, and the third sub-component being connected in sequence, the heat sink body including a first end and a second end of the heat sink body, the first end and the second end of the heat sink body being opposite in a first direction, the first sub-component being connected to the first end and / or the second end of the heat sink body, the extension direction of the first sub-component intersecting with the first direction, the second sub-component being bent and extended from the first sub-component to form the second groove, the third sub-component extending from the second sub-component along the first direction and toward the first mounting portion, and at least partially corresponding to the first mounting portion, the third sub-component and the second sub-portion of the first mounting portion jointly forming the first groove.

[0012] In some embodiments, the second heat sink includes a first end of the second heat sink and a second end of the second heat sink, the first end of the second heat sink and the second end of the second heat sink are opposite to each other in the first direction, and the first end of the second heat sink and / or the second end of the second heat sink are provided with the second connecting portion; the third sub-component is provided with the first connecting portion, and when the heat dissipation structure is in a folded state, the second connecting portion cooperates with the first connecting portion.

[0013] In some embodiments, the surface of the first connecting portion extends obliquely compared to the thickness direction of the heat dissipation structure, and a gap is formed between the first connecting portion and the bottom wall of the third sub-component. When the heat dissipation structure is in a folded state, the second connecting portion is located in the gap.

[0014] In some embodiments, the third sub-component further includes a toggle portion, which is connected to the first connecting portion. The toggle portion can drive the first connecting portion to deform along the first direction away from the heat dissipation body to release the first connecting portion from the second connecting portion.

[0015] In some embodiments, the third sub-component also includes a first stop portion and a second stop portion, the first stop portion and the second stop portion are spaced apart, the first stop portion is connected to the toggle portion, and the second stop portion is connected to the second sub-component. When the toggle portion drives the first stop portion to deform to a preset position, the first stop portion cooperates with the second stop portion to prevent the toggle portion from excessive deformation.

[0016] In some embodiments, the first heat sink includes a first side and a second side opposite to each other in a second direction, the second heat sink includes a first side and a second side opposite to each other in the second direction, and the second direction is the width direction of the heat dissipation structure; the heat dissipation structure also includes: a connecting member, the opposite ends of the connecting member are respectively connected to the first side of the first heat sink and the first side of the second heat sink, and the first heat sink and the second heat sink can rotate relative to the connecting member.

[0017] In some embodiments, at least two first through holes spaced apart from each other are defined on the first side of the first heat dissipation element.

[0018] In some embodiments, at least two second through holes spaced apart from each other are defined on the first side of the second heat dissipation element.

[0019] In some embodiments, at least two first through holes spaced apart from each other are defined on the first side of the first heat dissipation element; and at least two second through holes spaced apart from each other are defined on the first side of the second heat dissipation element.

[0020] In some embodiments, when the heat dissipation structure is in the expanded state, the first side of the first heat dissipation element is an arc surface that is concave toward the second heat dissipation element.

[0021] In some embodiments, when the heat dissipation structure is in the expanded state, the first side of the second heat dissipation element is an arc surface that is concave toward the first heat dissipation element.

[0022] In some embodiments, when the heat dissipation structure is in the expanded state, the first side of the first heat dissipation element is an arc surface that is concave toward the second heat dissipation element; and the first side of the second heat dissipation element is an arc surface that is concave toward the first heat dissipation element.

[0023] In some embodiments, at least one side of the periphery of the first heat dissipation element is bent and extended to form a first flange.

[0024] In some embodiments, at least one side of the periphery of the second heat dissipation element is bent and extended to form a second flange.

[0025] In some embodiments, at least one side of the periphery of the first heat dissipation element is bent and extended to form a first flange; and at least one side of the periphery of the second heat dissipation element is bent and extended to form a second flange.

[0026] In some embodiments, the heat dissipation structure further includes a heat conducting member, and the heat conducting member is provided on the inner surface of the first heat dissipation member and / or the inner surface of the second heat dissipation member.

[0027] In certain embodiments, the thermally conductive member is a thermally conductive silicone gasket, a thermally conductive graphite gasket, or a thermally conductive phase change gasket.

[0028] In some embodiments, a first groove is provided on the inner surface of the first heat dissipation member, and at least one of the heat conducting members is installed in the first groove.

[0029] In some embodiments, a second groove is provided on the inner surface of the second heat dissipation member, and at least one of the heat conducting members is installed in the second groove.

[0030] In some embodiments, the inner surface of the first heat sink is provided with a first groove, and at least one of the heat conductors is installed in the first groove; the inner surface of the second heat sink is provided with a second groove, and at least one of the heat conductors is installed in the second groove.

[0031] In some embodiments, there are multiple first grooves, and the inner surface of the first heat sink is further provided with a first reinforcement portion, and the first reinforcement portion is located between adjacent first grooves.

[0032] In some embodiments, there are multiple second grooves, and the inner surface of the second heat sink is further provided with a second reinforcement portion, and the second reinforcement portion is located between two adjacent second grooves.

[0033] In some embodiments, there are multiple first grooves and multiple second grooves; the inner surface of the first heat sink is further provided with a first reinforcement portion, the first reinforcement portion is located between two adjacent first grooves; the second reinforcement portion is located between two adjacent second grooves.

[0034] The electronic module of the embodiment of the present application includes the heat dissipation structure and a heat dissipation component described in the above embodiment, and the heat dissipation component is installed on the heat dissipation structure.

[0035] In some embodiments, the heat dissipation components include memory modules and graphics cards.

[0036] In some embodiments, the memory stick includes a memory chip and a circuit board, the circuit board is installed in the card slot, the circuit board includes a first side and a second side opposite to each other, the first side of the circuit board corresponds to the first heat sink of the heat dissipation structure, and the second side of the circuit board corresponds to the second heat sink of the heat dissipation structure; the memory chip is arranged on the first side of the circuit board or the second side of the circuit board, and the heat conductive element of the heat dissipation structure is arranged on the first heat sink or the second heat sink and contacts the memory chip.

[0037] In some embodiments, the memory stick includes a memory chip and a circuit board, the circuit board is installed in the card slot, the circuit board includes a first side and a second side opposite to each other, the first side of the circuit board corresponds to the first heat sink, and the second side of the circuit board corresponds to the second heat sink; the memory chip is arranged on the first side of the circuit board and the second side of the circuit board, and the heat conductive member of the heat dissipation structure is arranged on the first heat sink and the second heat sink, and is in contact with the memory chip.

[0038] The electronic device of the embodiment of the present application includes a mainboard, a connector, and the electronic module described in the above embodiment. The connector is mounted on the mainboard. The electronic module is mounted on the mainboard and electrically connected to the connector.

[0039] The electronic device according to the embodiment of the present application includes the electronic device described in the above embodiment.

[0040] In the heat dissipation structure, electronic module, electronic device and electronic device of the embodiment of the present application, in the thickness direction of the heat dissipation structure, the top wall of the mounting groove is spaced from the top wall of the card slot, and the bottom wall of the mounting groove is spaced from the bottom wall of the card slot. When heat dissipation parts of different thicknesses are installed in the heat dissipation structure, the relative positions between the circuit board of the heat dissipation part and the top and bottom walls of the heat dissipation structure remain unchanged, and the memory chip of the heat dissipation part can be located in the space between the mounting groove and the card slot. The heat dissipation structure contacts the memory chip of the heat dissipation part to be cooled to dissipate heat from the heat dissipation part. The heat dissipation structure of the present application can accommodate heat dissipation parts of different thicknesses to be cooled, and can effectively dissipate heat from the heat dissipation part. The heat dissipation structure has many usage scenarios.

[0041] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0043] Figure 1 is a perspective schematic diagram of an electronic device according to certain embodiments of the present application;

[0044] Figure 2 is a perspective schematic diagram of an electronic device according to certain embodiments of the present application;

[0045] Figure 3 yes Figure 1 A three-dimensional exploded schematic diagram of the electronic device;

[0046] Figure 4 yes Figure 1 A three-dimensional schematic diagram of an electronic module in an electronic device;

[0047] Figure 5 yes Figure 4 A three-dimensional schematic diagram of an opened heat dissipation structure in an electronic module;

[0048] Figure 6 yes Figure 4 A three-dimensional schematic diagram of a heat dissipation structure in an electronic module;

[0049] Figure 7 yes Figure 6 A side view schematic diagram of a heat dissipation structure;

[0050] Figure 8 yes Figure 7 A three-dimensional schematic diagram of a partial structure of a second side of a first heat sink of the heat dissipation structure;

[0051] Figure 9 yes Figure 7A three-dimensional schematic diagram of a partial structure of a first side of a first heat dissipation element of the heat dissipation structure;

[0052] Figure 10 It is a three-dimensional schematic diagram of an electronic device according to certain embodiments of the present application.

[0053] Description of main component symbols:

[0054] 10000, electronic device; 1000, electronic device; 100, electronic module; 300, mainboard; 500, connector; 20, heat dissipation element; 21, memory module; 211, memory chip; 213, circuit board; 10, heat dissipation structure; 101, mounting slot; 11, first heat dissipation element; 111, card slot; 112, first flange; 113, first end of heat dissipation body; 114, second end of heat dissipation body; 115, mounting element; 1151, first mounting portion; 11511, first slot; 11513, first sub-unit; 11515, second sub-unit; 1153, second mounting portion; 11531, second slot; 11533, first sub-unit; 11534, second sub-unit; 1 1535. Third sub-component; 11536. First connecting portion; 11537. Toggle portion; 11538. First stopping portion; 11539. Second stopping portion; 116. First side of the first heat sink; 1161. First through hole; 117. Second side of the first heat sink; 118. First groove; 119. First reinforcing portion; 13. Second heat sink; 131. Second connecting portion; 132. Second flange; 133. First end of the second heat sink; 135. Second end of the second heat sink; 136. First side of the second heat sink; 1361. Second through hole; 137. Second side of the second heat sink; 138. Second groove; 139. Second reinforcing portion; 15. Thermal conductor; 17. Connector. DETAILED DESCRIPTION

[0055] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0056] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0058] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0059] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0060] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0061] As the performance of memory sticks increases, their power consumption and heat generation also increase. As a temporary data storage device for computers, memory sticks are mainly responsible for loading and exchanging temporary data during the operation of operating systems and software. As the cache data of large-scale games becomes larger and larger, the memory rate continues to increase, resulting in higher and higher heat generation of memory sticks. Memory sticks are prone to frequency reduction due to high temperatures, resulting in reduced performance and even freezes, affecting the user experience. Currently, many consumer-grade memory sticks are usually provided with heat dissipation structures. For example, an "n"-type metal heat sink is bonded to the two sides of the memory stick through a metal body to achieve contact heat exchange. Since the (maximum) thickness of a memory stick with memory chips on both sides is different from the (maximum) thickness of a memory stick with a memory chip on one side, the "n"-type metal heat sink cannot take into account memory sticks of different thicknesses, resulting in limited use scenarios for the heat dissipation structure. In order to solve this problem, an embodiment of the present application provides a heat dissipation structure 10( Figure 6 As shown), electronic module 100 ( Figure 4 As shown), electronic device 1000 ( Figure 1 As shown) and electronic device 10000 ( Figure 10 shown).

[0062] See also Figure 4 and Figure 5 The electronic module 100 of the embodiment of the present application includes a heat dissipation structure 10 and a heat dissipation component 20, which is mounted on the heat dissipation structure 10. Specifically, in some embodiments, the heat dissipation component 20 includes a memory module 21 and a graphics card.

[0063] The heat dissipation structure 10 is used to dissipate heat from the heat element 20 to be cooled, preventing the heat element 20 from overheating, which could lead to performance degradation or even damage. In the present application, the heat element 20 to be cooled may be a memory stick 21, which is mounted on the heat dissipation structure 10. When the memory stick 21 generates heat, the heat dissipation structure 10 effectively dissipates the heat from the memory stick 21 to the outside world, preventing the memory stick 21 from overheating.

[0064] See also Figures 1 to 3The electronic device 1000 according to an embodiment of the present application includes a motherboard 300, a connector 500, and the electronic module 100 according to the above embodiment. The connector 500 is mounted on the motherboard 300. The electronic module 100 is mounted on the motherboard 300 and electrically connected to the connector 500. The circuit board 213 of the memory module 21 is provided with gold fingers. When the memory module 21 is connected to the heat dissipation structure 10, the gold fingers of the memory module 21 are exposed and are used to electrically connect to the connector 500.

[0065] See also Figures 4 to 6 The heat dissipation structure 10 of the embodiment of the present application is provided with a mounting groove 101 and a card slot 111. The mounting groove 101 is connected to the card slot 111. In the thickness direction of the heat dissipation structure 10, the top wall of the mounting groove 101 is spaced from the top wall of the card slot 111, and the bottom wall of the mounting groove 101 is spaced from the bottom wall of the card slot 111. The card slot 111 is used for the heat dissipation component 20 to be snapped in. When the heat dissipation component 20 to be snapped into the card slot 111, at least a portion of the heat dissipation component 20 to be snapped in the mounting groove 101.

[0066] The heat dissipation structure 10 has a high thermal conductivity. When the heat dissipation element 20 is in contact with the heat dissipation structure 10, the heat dissipation mechanism 10 can effectively dissipate heat from the heat dissipation element 20. When the heat dissipation element 20 is installed in the heat dissipation structure 10, the heat dissipation element 20 extends into the mounting slot 101, and the ends of the heat dissipation element 20 can be snapped into the snap-in slots 111. The top and bottom walls of the snap-in slots 111 can position and secure the heat dissipation element 20. When the ends of the heat dissipation element 20 are snapped into the snap-in slots 111, the connection between the heat dissipation element 20 and the heat dissipation structure 10 is relatively stable.

[0067] In the heat dissipation structure 10 of the embodiment of the present application, in the thickness direction of the heat dissipation structure 10, the top wall of the mounting groove 101 is spaced from the top wall of the card slot 111, and the bottom wall of the mounting groove 101 is spaced from the bottom wall of the card slot 111. When heat dissipation components 20 to be dissipated of different thicknesses are installed on the heat dissipation structure 10, the relative positions between the circuit board 213 of the heat dissipation component 20 to be dissipated and the top and bottom walls of the heat dissipation structure 10 remain unchanged, and the memory chip 211 of the heat dissipation component 20 to be dissipated can be located in the gap between the mounting groove 101 and the card slot 111. The heat dissipation structure 10 contacts the memory chip 211 of the heat dissipation component 20 to be dissipated to dissipate heat from the heat dissipation component 20. The heat dissipation structure 10 of the present application can accommodate heat dissipation components 20 to be dissipated of different thicknesses, and can effectively dissipate heat from the heat dissipation component 20. The heat dissipation structure 10 has many usage scenarios.

[0068] The heat dissipation structure 10 is further described below with reference to the accompanying drawings.

[0069] See also Figures 5 to 7In some embodiments, the heat dissipation structure 10 includes a first heat dissipation member 11 and a second heat dissipation member 113. The card slot 111 is provided on the first heat dissipation member 11. The first heat dissipation member 11 and the second heat dissipation member 13 jointly form a mounting slot 101. In the thickness direction of the heat dissipation structure 10, the bottom wall of the card slot 111 is spaced from the inner surface of the first heat dissipation member 11, and the top wall of the card slot 111 is spaced from the inner surface of the second heat dissipation member 13.

[0070] Furthermore, in some embodiments, the second heat sink 13 and the first heat sink 11 can rotate relative to each other so that the heat dissipation structure 10 can switch between the unfolded state and the folded state. The first heat sink 11 is provided with a first connection portion 11536, and the second heat sink 13 is provided with a second connection portion 131. When the heat dissipation structure 10 is in the folded state, the second connection portion 131 cooperates with the first connection portion 11536 to keep the heat dissipation structure 10 in the folded state. When the heat dissipation structure 10 is in the unfolded state, the second connection portion 131 is released from the first connection portion 11536.

[0071] Specifically, the memory module 21 includes a first side and a second side that are opposite to each other. When the memory module 21 is installed in the heat dissipation structure 10, the first heat sink 11 is used to dissipate heat from the first side of the memory module 21, and the second heat sink 13 is used to dissipate heat from the second side of the memory module 21. The first heat sink 11 and the second heat sink 13 of the present application can be made of metal materials such as stainless steel, aluminum, copper, and alloys. As a result, the first heat sink 11 and the second heat sink 13 have a good heat dissipation effect on the memory module 21.

[0072] See also Figure 6 and Figure 7 In some embodiments, the heat dissipation structure 10 further includes a connecting member 17. The first heat dissipation member 11 includes a first side 116 and a second side 117 that are opposite to each other in a second direction Y. The second heat dissipation member 13 includes a first side 136 and a second side 137 that are opposite to each other in the second direction Y. The second direction Y is the width direction of the heat dissipation structure 10. The opposite ends of the connecting member 17 are respectively connected to the first side 116 of the first heat dissipation member and the first side 136 of the second heat dissipation member 13 to form a U-shaped structure. The first heat dissipation member 11 and the second heat dissipation member 13 can rotate relative to the connecting member 17, so that the heat dissipation structure 10 can switch between an unfolded state and a folded state.

[0073] Wherein, when the heat dissipation structure 10 is in the folded state ( Figure 4 In the case of the heat dissipation structure 10 being in the unfolded state ( Figure 5 and Figure 6In the case shown in FIG, the inner surface of the second heat dissipation element 13 forms a non-zero angle with the inner surface of the first heat dissipation element 11. For example, the angle between the inner surface of the second heat dissipation element 13 and the inner surface of the first heat dissipation element 11 can be 30°, 45°, 52°, 81°, 120°, or 150°.

[0074] When the first connection portion 11536 and the second connection portion 131 are disengaged, the heat dissipation structure 10 can be in an unfolded state, which facilitates the insertion of the memory module 21 into the slot 111. When the first connection portion 11536 and the second connection portion 131 are engaged, the heat dissipation structure 10 can be in a folded state, in which the connection between the heat dissipation structure 10 and the memory module 21 is more stable, and the first heat sink 11 and the second heat sink 13 can effectively dissipate heat from the memory module 21, preventing the memory module 21 from overheating.

[0075] See also Figure 3 and Figure 5 In some embodiments, the memory bar 21 includes a memory chip 211 and a circuit board 213, and the memory chip 211 is mounted on the circuit board 213. In one embodiment, the memory chip 211 is provided on one side of the circuit board 213. In another embodiment, the memory chips 211 are provided on both sides of the circuit board 213. The thickness of the memory bar 21 in which the memory chip 211 is provided on one side of the circuit board 213 is less than the thickness of the memory bar 21 in which the memory chips 211 are provided on both sides of the circuit board 213. The thickness of the memory bar 21 here refers to the thickness of the memory bar 21 where the memory chip 211 is located, that is, the maximum thickness of the memory bar 21.

[0076] See also Figure 4 and Figure 5When the memory module 21 is installed in the heat dissipation structure 10, the edge of the circuit board 213 is inserted into the slot 111. Since the heat dissipation structure 10 is in the folded state, the bottom wall of the slot 111 is spaced from the inner surface of the first heat sink 11, and the top wall of the slot 111 is spaced from the inner surface of the second heat sink 13. Therefore, when memory modules 21 of different thicknesses are installed in the heat dissipation structure 10, the relative positions of the circuit board 213 and the inner surfaces of the first heat sink 11 and the second heat sink 13 remain unchanged. When a memory chip 211 is provided on the circuit board 213, the memory chip 211 is located within this gap. For example, when a memory chip 211 is provided on the side of the circuit board 213 close to the first heat sink 11, the memory chip 211 is located within the gap between the circuit board 213 and the first heat sink 11, and the first heat sink 11 is used to dissipate heat from the memory chip 211. When a memory chip 211 is provided on the side of the circuit board 213 close to the second heat sink 13, the memory chip 211 is located in the gap between the circuit board 213 and the second heat sink 13, and the second heat sink 13 is used to dissipate heat from the memory chip 211. When a memory chip 211 is provided on both sides of the circuit board 213, the memory chip 211 is located in the gap between the circuit board 213 and the first heat sink 11, and in the gap between the circuit board 213 and the second heat sink 13, and the first heat sink 11 and the second heat sink 13 are used together to dissipate heat from the memory chip 211. The heat dissipation structure 10 of the present application can accommodate memory sticks 21 of different thicknesses, and the heat dissipation structure 10 can dissipate heat from memory sticks 21 of different thicknesses. The heat dissipation structure 10 has many usage scenarios.

[0077] In the current heat dissipation structure 10, some heat sinks are directly connected to the memory chip 211 by gluing. At this time, the heat sink is inconvenient to disassemble and assemble, and is not conducive to reuse. In the heat dissipation structure 10 of the present application, when the heat dissipation structure 10 is in the unfolded state, the memory stick 21 is inserted into the card slot 111, and then the first connection part 11536 is matched with the second connection part 131 to put the heat dissipation structure 10 in the folded state. At this time, the heat dissipation structure 10 can effectively dissipate heat from the memory stick 21. When the memory stick 21 needs to be removed from the heat dissipation structure 10, it is only necessary to uncouple the first connection part 11536 and the second connection part 131. The installation and disassembly of the heat dissipation structure 10 and the memory stick 21 are relatively simple.

[0078] In the heat dissipation structure 10 of the embodiment of the present application, the heat dissipation structure 10 can be switched between a folded state and an unfolded state. When the heat dissipation structure 10 is in the unfolded state, the circuit board 213 of the heat dissipation element 20 can be easily inserted into the slot 111. When the heat dissipation structure 10 is in the folded state, the slot 111 is spaced from the inner surface of the first heat dissipation element 11 and the inner surface of the second heat dissipation element 13. Therefore, when heat dissipation elements 20 of different thicknesses are installed in the heat dissipation structure 10, the relative position of the circuit board 213 of the heat dissipation element 20 and the inner surface of the first heat dissipation element 11 and the inner surface of the second heat dissipation element 13 remains unchanged, and the memory chip 211 of the heat dissipation element 20 is located within this gap. The first heat dissipation element 11 and / or the second heat dissipation element 13 contact the memory chip 211 of the heat dissipation element 20 to dissipate heat from the heat dissipation element 20. The heat dissipation structure 10 of the present application can accommodate heat dissipation elements 20 of different thicknesses and can effectively dissipate heat from the heat dissipation element 20. The heat dissipation structure 10 of the present application can accommodate heat dissipation elements 20 of different thicknesses and can effectively dissipate heat from the heat dissipation element 20. The heat dissipation structure 10 has a wide range of application scenarios.

[0079] See also Figure 3 、 Figure 5 and Figure 6 In some embodiments, the heat dissipation structure further includes a heat conducting member 15 , which is disposed on the inner surface of the first heat dissipation member 11 and / or the inner surface of the second heat dissipation member 13 .

[0080] The heat conducting member 15 is used to contact the memory module 21 to conduct the heat of the memory module 21 to the first heat sink 11 and / or the second heat sink 13. The first heat sink 11 and / or the second heat sink 13 then dissipate the heat to the outside world, thereby quickly and effectively dissipating heat from the memory module 21 and preventing the memory module 21 from overheating. The memory chip 211 is the main heat source on the memory module 21. The heat conducting member 15 of the present application is mainly used to contact the memory chip 211 to transfer the heat of the memory chip 211 to the first heat sink 11 and / or the second heat sink 13, and the first heat sink 11 and / or the second heat sink 13 dissipate the heat to the outside world. The thermal conductivity of the heat conducting member 15 of the present application can be in the range of [2 W / mk, 20 W / mk]. In this case, the thermal conductivity of the heat conducting member 15 is relatively high, and the heat conducting member 15 can quickly transfer the heat of the memory chip 211 to the first heat sink 11 and / or the second heat sink 13. The heat dissipation structure 10 has a good heat dissipation effect on the memory module 21, which can effectively prevent the problem of excessive temperature of the memory module 21. For example, the thermal conductivity of the heat conducting member 15 can be 2 W / mk, 5 W / mk, 7 W / mk, 8 W / mk, 11 W / mk, 12 W / mk, 15 W / mk, 16 W / mk, 18 W / mk, or 20 W / mk.

[0081] Preferably, the hardness of the heat conductor 15 may be low and have a certain proportion of compression. Exemplarily, the heat conductor 15 may be a heat-conducting silicone gasket, a heat-conducting graphite gasket or a heat-conducting phase change gasket, etc. When the heat dissipation structure 10 is in a folded state, there may be a certain amount of extrusion when the heat conductor 15 contacts the storage chip 211, so that the storage chip 211 and the heat conductor 15 can be fully in contact, the contact area between the storage chip 211 and the heat conductor 15 is large, and there is no gap between the storage chip 211 and the heat conductor 15. The heat generated by the storage chip 211 during operation can be quickly conducted to the first heat sink 11 and / or the second heat sink 13 through the heat conductor 15, and the heat of the storage chip 211 can be effectively and quickly dissipated.

[0082] The circuit board 213 includes a first side and a second side opposite to each other. The first side of the circuit board 213 corresponds to the first heat sink 11, and the second side of the circuit board 213 corresponds to the second heat sink 13. In some embodiments, the memory chip 211 is disposed on the first side or the second side of the circuit board 213, and the thermal conductive member 15 is disposed on the first heat sink 11 or the second heat sink 13 and contacts the memory chip 211. In one example, the memory chip 211 is disposed on the first side of the circuit board 213. In this case, the thermal conductive member 15 can be disposed on the inner surface of the first heat sink 11. The thermal conductive member 15 can effectively transfer heat from the memory chip 211 to the first heat sink 11, which can then dissipate the heat to the outside. In another example, the memory chip 211 is disposed on the second side of the circuit board 213. In this case, the thermal conductive member 15 can be disposed on the inner surface of the second heat sink 13. The thermal conductive member 15 can effectively transfer heat from the memory chip 211 to the second heat sink 13, which can then dissipate the heat to the outside. In other embodiments, the memory chip 211 is disposed on the first side and the second side of the circuit board 213, and the heat conducting member 15 is disposed on the inner surface of the first heat sink 11 and the inner surface of the second heat sink 13, and contacts the memory chip 211. The heat conducting member 15 can effectively transfer heat from the memory chip 211 to the first heat sink 11 and the second heat sink 13, and the first heat sink 11 and the second heat sink 13 can dissipate the heat to the outside.

[0083] See also Figures 3 to 6 In some embodiments, the first heat sink 11 includes a heat sink body and a mounting member 115 . The mounting member 115 is connected to the heat sink body, and the mounting member 115 forms a slot 111 .

[0084] Specifically, in some embodiments, the heat dissipation body includes a first end 113 and a second end 114 opposite to each other in the first direction X; the mounting member 115 is connected to the first end 113 of the heat dissipation body, and / or the mounting member 115 is connected to the second end 114 of the heat dissipation body.

[0085] In one embodiment, there is one mounting member 15, one mounting member 115 connected to the first end 113 of the heat sink body. In this case, the mounting member 115 forms a slot 111, which can hold one end of the circuit board of the memory module 21 in place, simplifying the structure of the heat sink structure 10. In another embodiment, there is one mounting member 15, one mounting member 115 connected to the second end 114 of the heat sink body. In this case, the mounting member 115 forms a slot 111, which can hold one end of the circuit board of the memory module 21 in place, simplifying the structure of the heat sink structure 10. In yet another embodiment, there are two mounting members 15, one of which is connected to the first end 113 and the second end 114 of the heat sink body, respectively. In this case, the mounting member 115 forms two slots 111, which can hold both ends of the circuit board of the memory module 21 in place, ensuring a more stable connection between the memory module 21 and the heat sink structure 10. In the embodiment of the present application, there are two mounting members 15 , and the two mounting members 115 are connected to both the first end 113 and the second end 114 of the heat dissipation body.

[0086] The mounting member 115 is used to mount the memory module 21. The slot 111 of the mounting member 115 is designed to receive the circuit board 213 of the memory module 21. Preferably, the thickness of the slot 111 is the same as the thickness of the circuit board 213, so that the circuit board 213 can be securely inserted into the slot 111. This ensures a more stable connection between the memory module 21 and the first heat sink 11, and prevents the memory module 21 from falling off relative to the first heat sink 11. Furthermore, the mounting member 115 effectively positions the circuit board 213. When the heat dissipation structure 10 is folded, the relative positions of the circuit boards 213 and the first and second heat sinks 11, 13 in memory modules 21 of varying thickness remain unchanged. This allows the heat dissipation structure 10 to accommodate memory modules 21 of varying thicknesses (e.g., memory modules 21 with memory chips 211 on one side and memory modules 21 with memory chips 211 on both sides).

[0087] See also Figure 6 and Figure 7 In some embodiments, the mounting member 115 includes a first mounting portion 1151 and a second mounting portion 1153 that are spaced apart. In the thickness direction of the heat dissipation structure 10, the projection of the first mounting portion 1151 and the projection of the second mounting portion 1153 at least partially overlap. A first groove 11511 is formed between the top wall of the first mounting portion 1151 and the second mounting portion 1153, and a second groove 11531 is formed between the second mounting portion 1153. In the thickness direction of the heat dissipation structure 10, the distance between the first groove 11511 and the first heat dissipation member 11 is the same as the distance between the second groove 11531 and the first heat dissipation member 11. The first groove 11511 and the second groove 11531 are connected to form a card slot 111.

[0088] Both the first mounting portion 1151 and the second mounting portion 1153 extend from the inner surface of the first heat sink 11. They are used to jointly mount and position the circuit board 213 of the memory module 21. The thickness of the first groove 11511 can be the same as the thickness of the circuit board 213, and the thickness of the second groove 11531 can also be the same as the thickness of the circuit board 213, so that the circuit board 213 can be securely inserted into the first groove 11511 and the second groove 11531. The first groove 11511 and the second groove 11531 are spaced apart in the second direction Y. The first groove 11511 and the second groove 11531 restrain opposite ends of the circuit board 213, ensuring a secure attachment of the circuit board 213 to the first heat sink 11 and preventing the memory module 21 from becoming loose relative to the first heat sink 11.

[0089] See also Figures 6 to 9 Specifically, in some embodiments, the first mounting portion 1151 includes a first sub-portion 11513 and a second sub-portion 11515, the first sub-portion 11513 and the second sub-portion 11515 are connected, the first sub-portion 11513 is connected to the first end 113 and / or the second end 114 of the heat dissipation body, the extension direction of the first sub-portion 11513 intersects with the first direction, the second sub-portion 11515 bends and extends from the first sub-portion 11513 along the first direction and in a direction away from the heat dissipation body, and the first direction X is the length direction of the heat dissipation structure 10.

[0090] When the first sub-portion 11513 extends from the first heat sink 11 toward the second heat sink 13, the first groove 11511 is spaced from the inner surface of the first heat sink 11, allowing the first mounting portion 1151 to effectively position the circuit board 213. When the second sub-portion 11515 extends perpendicular to the thickness of the heat dissipation structure 10, the second sub-portion 11515 is planar, meaning the bottom wall of the first groove 11511 is also planar. This allows the circuit board 213 to be securely supported by the bottom wall of the first groove 11511, preventing it from becoming loose relative to the first heat sink 11.

[0091] See also Figure 6 、 Figure 8 and Figure 9In some embodiments, the second mounting portion 1153 includes a first sub-component 11533, a second sub-component 11534 and a third sub-component 11535 connected to each other. The first sub-component 11533, the second sub-component 11534 and the third sub-component 11535 are connected in sequence. The first sub-component 11533 is connected to the first end 113 and / or the second end 114 of the heat dissipation body. The extension direction of the first sub-component 11533 intersects with the first direction. The second sub-component 11534 is bent and extended from the first sub-component 11533 to form a second groove 11531. The third sub-component 11535 extends from the second sub-component 11534 along the first direction and toward the direction close to the first mounting portion 1151, and at least partially corresponds to the first mounting portion 1151. The third sub-component 11535 and the second sub-part 11515 of the first mounting portion 1151 jointly form the first groove 11511.

[0092] When the first sub-component 11533 extends from the first heat sink 11 toward the second heat sink 13, the second groove 11531 is spaced from the inner surface of the first heat sink 11, allowing the second mounting portion 1153 to effectively position the circuit board 213. The second sub-component 11534 is bent to form a U-shaped groove (second groove 11531), with the opening of the U-shaped groove facing the heat conductor 15. When the circuit board 213 is mounted in the second groove 11531, the second groove 11531 limits movement of the circuit board 213 in the thickness direction of the heat dissipation structure 10. The second groove 11531 also limits movement of the circuit board 213 in the first direction X, thereby ensuring a more stable connection between the circuit board 213 and the first heat sink 11. The bottom wall of the third sub-component 11535 and the second sub-portion 11515 together form a first groove 11511, which limits movement of the circuit board 213 in the thickness direction of the heat dissipation structure 10.

[0093] See also Figure 6 and Figure 8 In some embodiments, the second heat sink 13 includes a first end 133 and a second end 135 relative to each other in the first direction X, and the first end 133 of the second heat sink and / or the second end 135 of the second heat sink are provided with a second connection portion 131; the third sub-component 11535 is provided with a first connection portion 11536, and the surface of the first connection portion 11536 extends obliquely compared to the thickness direction of the heat dissipation structure 10, and a gap is formed between the first connection portion 11536 and the bottom wall of the third sub-component 11535. When the heat dissipation structure 10 is in a folded state, the second connection portion 131 is located in the gap.

[0094] When there are two mounting members 115, the first end 133 of the second heat sink and the second end 135 of the second heat sink are both provided with a second connection portion 131, that is, the two second connection portions 131 are respectively connected to the two first connection portions 11536, so that the heat dissipation structure 10 can be stably maintained in a folded state.

[0095] When the heat dissipation structure 10 needs to be folded, the user can apply pressure to the first heat sink 11 and the second heat sink 13. The second connection portion 131 can pass through the surface of the first connection portion 11536 and snap into the gap between the first connection portion 11536 and the bottom wall of the third sub-component 11535. The first connection portion 11536 and the second connection portion 131 snap together, allowing the first and second heat sinks 11 and 13 to remain in the folded state. This allows the thermal conductive element 15 to contact the memory chip 211 of the memory module 21, transferring heat from the memory chip 211 to the first heat sink 11 and / or the second heat sink 13. The heat can then be dissipated to the outside through the first heat sink 11 and / or the second heat sink 13. The connection between the first connection portion 11536 and the second connection portion 131 is relatively simple, making operation easier for the user.

[0096] When the heat dissipation structure 10 is in the folded state, the surface of the first connecting portion 11536 extends gradually away from the thermal conductive member 15 in the direction from the first heat dissipation element 11 to the second heat dissipation element 13. The surface of the first connecting portion 11536 can guide the second connecting portion 131. The second connecting portion 131 has a generally L-shaped structure. When the second connecting portion 131 and the surface of the first connecting portion 11536 are engaged, the surface of the first connecting portion 11536 can guide at least a portion of the second connecting portion 131 into the gap, so that the second connecting portion 131 can hook onto the first connecting portion 11536, thereby maintaining the first and second heat dissipation elements 11 and 13 in the folded state.

[0097] See also Figure 6 、 Figure 8 and Figure 9 In some embodiments, the third sub-component 11535 also includes a toggle portion 11537, which is connected to the first connecting portion 11536. The toggle portion 11537 can drive the first connecting portion 11536 to deform along the first direction X in a direction away from the heat dissipation body, so that the first connecting portion 11536 and the second connecting portion 131 are released from engagement.

[0098] To switch the heat dissipation structure 10 from a folded state to an unfolded state, the user can apply an external force to the toggle portion 11537 in the first direction X, away from the thermal conductor 15. The deformation of the toggle portion 11537 can cause the first connection portion 11536 to deform as well, i.e., the first connection portion 11536 can deform in the first direction X, away from the thermal conductor 15. When the first connection portion 11536 and the second connection portion 131 are disengaged, the heat dissipation structure 10 can be switched to the unfolded state. Because the first heat dissipation member 11 is made of metal and has a certain degree of elasticity, the toggle portion 11537 and the first connection portion 11536 can return to their initial positions when the external force applied to the toggle portion 11537 is removed. Disengaging the first connection portion 11536 from the second connection portion 131 is relatively simple, making operation easier for the user. Furthermore, the first connection portion 11536 and the second connection portion 131 can be connected and disconnected multiple times, extending the service life of the heat dissipation structure 10.

[0099] See also Figure 6 and Figure 8 Furthermore, in some embodiments, the third sub-component 11535 also includes a first stop portion 11538 and a second stop portion 11539. The first stop portion 11538 and the second stop portion 11539 are spaced apart, the first stop portion 11538 is connected to the toggle portion 11537, and the second stop portion 11539 is connected to the second sub-component 11534. When the toggle portion 11537 drives the first stop portion 11538 to deform to a preset position, the first stop portion 11538 cooperates with the second stop portion 11539 to prevent the toggle portion 11537 from excessive deformation.

[0100] When the toggle portion 11537 is deformed by an external force, the first stop portion 11538 can deform along with the toggle portion 11537. When the toggle portion 11537 causes the first connecting portion 11536 to deform to release the second connecting portion 131, the first stop portion 11538 deforms to a predetermined position. Because the second stop portion 11539 is connected to the second sub-component 11534, the second stop portion 11539 does not deform. When the first stop portion 11538 deforms to engage with the second stop portion 11539, the second stop portion 11539 prevents the toggle portion 11537 from causing the first connecting portion 11536 and the first stop portion 11538 to further deform, thereby preventing the toggle portion 11537, the first connecting portion 11536, and the first stop portion 11538 from excessively deforming and being unable to return to their initial positions.

[0101] See also Figure 5 and Figure 6In some embodiments, the first side 116 of the first heat sink 11 is provided with at least two first through holes 1161 spaced apart from each other. The number of first through holes 1161 can be two, three, four, or more. Providing first through holes 1161 on the end of the first heat sink 11 near the connector 17 can avoid stress concentration on the first side 116 of the first heat sink, thereby preventing the first side 116 of the first heat sink 11 from applying excessive pressure to the memory stick 21 when the heat dissipation structure 10 is folded, potentially causing damage to the memory stick 21. In other embodiments, the first side 136 of the second heat sink 13 is provided with at least two second through holes 1361 spaced apart from each other. The number of second through holes 1361 can be two, three, four, or more. Providing second through holes 1361 on the end of the second heat sink 13 near the connector 17 can avoid stress concentration on the first side 136 of the second heat sink 13, thereby preventing the first side 136 of the second heat sink 13 from applying excessive pressure to the memory stick 21 when the heat dissipation structure 10 is folded, potentially causing damage to the memory stick 21. In some other embodiments, the first side 116 of the first heat sink is provided with at least two spaced-apart first through holes 1161, and the first side 136 of the second heat sink 13 is provided with at least two spaced-apart second through holes 1361. This effectively prevents the first and second heat sinks 11, 13 from crushing the memory modules 21.

[0102] See also Figure 7In some embodiments, when the heat dissipation structure 10 is in the unfolded state, the first side 116 of the first heat dissipation element is an arcuate surface that is concave toward the second heat dissipation element 13. In this case, when the first connection portion 11536 and the second connection portion 131 cooperate to place the heat dissipation structure 10 in the folded state, the first side 116 of the first heat dissipation element can be naturally flattened. This improves the aesthetics of the heat dissipation structure 10 and prevents the first side 116 of the first heat dissipation element from deforming and potentially damaging the memory module 21. In other embodiments, when the heat dissipation structure 10 is in the unfolded state, the first side 136 of the second heat dissipation element 13 is an arcuate surface that is concave toward the first heat dissipation element 11. In this case, when the first connection portion 11536 and the second connection portion 131 cooperate to place the heat dissipation structure 10 in the folded state, the first side 136 of the second heat dissipation element 13 can be naturally flattened. This improves the aesthetics of the heat dissipation structure 10 and prevents the first side 136 of the second heat dissipation element 13 from deforming and potentially damaging the memory module 21. In some other embodiments, when the heat dissipation structure 10 is in the unfolded state, the first side 116 of the first heat dissipation element is a curved surface that is concave inward toward the second heat dissipation element 13; and the first side 136 of the second heat dissipation element 13 is a curved surface that is concave inward toward the first heat dissipation element 11. In this case, when the first connection portion 11536 and the second connection portion 131 cooperate to fold the heat dissipation structure 10, the first side 116 of the first heat dissipation element and the first side 136 of the second heat dissipation element 13 can be naturally flattened. This improves the aesthetics of the heat dissipation structure 10 and prevents deformation of the heat dissipation structure 10 that could damage the memory module 21.

[0103] See also Figure 5 and Figure 6 In some embodiments, the inner surface of the first heat sink 11 is provided with a first groove 118 that is recessed toward the outer surface of the first heat sink 11, and at least one heat conductor 15 is installed in the first groove 118. The first groove 118 is used to accommodate the heat conductor 15. The first groove 118 can position the heat conductor 15, thereby simplifying the installation of the heat conductor 15 and avoiding the problem of misalignment of the heat conductor 15. The position of the heat conductor 15 attached to the inner surface of the first heat sink 11 corresponds to the position of the memory chip 211 of the memory module 21, so that when the heat dissipation structure 10 is in the folded state, the heat conductor 15 can correspond to the memory chip 211, and the heat conductor 15 can effectively transfer the heat of the memory chip 211 to the first heat sink 11. The number of heat conductors 15 on the inner surface of the first heat sink 11 can be, but is not limited to, one, two, three, or more, and the number of first grooves 118 is the same as the number of first heat sinks 11.

[0104] In other embodiments, the inner surface of the second heat sink 13 is provided with a second groove 138 that is recessed toward the outer surface of the second heat sink 13, and at least one heat conductor 15 is installed in the second groove 138. The second groove 138 is used for the heat conductor 15 to be installed therein. The second groove 138 can position the heat conductor 15, thereby simplifying the installation of the heat conductor 15 and avoiding the problem of the heat conductor 15 being misplaced. The position of the heat conductor 15 attached to the inner surface of the second heat sink 13 corresponds to the position of the memory chip 211 of the memory module 21, so that when the heat dissipation structure 10 is in the folded state, the heat conductor 15 can correspond to the memory chip 211, and the heat conductor 15 can effectively transfer the heat of the memory chip 211 to the second heat sink 13. The number of heat conductors 15 on the inner surface of the second heat sink 13 can be, but is not limited to, one, two, three, or more, and the number of second grooves 138 is the same as the number of second heat sinks 13.

[0105] In some further embodiments, the inner surface of the first heat sink 11 is provided with a first groove 118 that is recessed toward the outer surface of the first heat sink 11, and at least one heat conductor 15 is installed in the first groove 118. The inner surface of the second heat sink 13 is provided with a second groove 138 that is recessed toward the outer surface of the second heat sink 13, and at least one heat conductor 15 is installed in the second groove 138. Both the first groove 118 and the second groove 138 can position the heat conductor 15, thereby simplifying the installation of the heat conductor 15 and avoiding the problem of misalignment of the heat conductor 15.

[0106] See also Figure 5 and Figure 6 In some embodiments, there are multiple first grooves 118, and the inner surface of the first heat sink 11 is further provided with a first reinforcement portion 119, located between two adjacent first grooves 118. The first reinforcement portion 119 serves to enhance the strength of the first heat sink 11, preventing deformation or even damage to the first heat sink 11. In other embodiments, there are multiple second grooves 138, and the inner surface of the second heat sink 13 is further provided with a second reinforcement portion 139, located between two adjacent second grooves 138. The second reinforcement portion 139 serves to enhance the strength of the second heat sink 13, preventing deformation or even damage to the second heat sink 13. In still other embodiments, the inner surface of the first heat sink 11 is further provided with a first reinforcement portion 119, located between two adjacent first grooves 118, and a second reinforcement portion 139 located between two adjacent second grooves 138. The first reinforcement portion 119 serves to enhance the strength of the first heat sink 11, preventing deformation or even damage to the first heat sink 11. The second reinforcing portion 139 is used to enhance the strength of the second heat dissipation element 13 , thereby preventing the second heat dissipation element 13 from being deformed or even damaged.

[0107] See also Figure 4 、 Figure 6 and Figure 8 In some embodiments, at least one side of the periphery of the first heat sink 11 is bent and extended to form a first flange 112. Since the first heat sink 11 is a thin metal sheet, bending the periphery of the first heat sink 11 to form the first flange 112 can ensure the flatness and strength of the first heat sink 11. In one example, the first flange 112 can be bent from the periphery of the first heat sink 11 in a direction away from the second heat sink 13. In another example, the first flange 112 can be bent from the periphery of the first heat sink 11 in a direction closer to the second heat sink 13. The first flange 112 of the present application can be bent from the periphery of the first heat sink 11 in a direction away from the second heat sink 13. In other embodiments, at least one side of the periphery of the second heat sink 13 is bent and extended to form a second flange 132. Since the first heat sink 11 is a thin metal sheet, bending the periphery of the first heat sink 11 to form the first flange 112 can ensure the flatness and strength of the first heat sink 11. In one example, the second flange 132 can be bent from the periphery of the second heat sink 13 in a direction away from the first heat sink 11. In another example, the second flange 132 can be bent from the periphery of the second heat sink 13 in a direction closer to the first heat sink 11. The second flange 132 of the present application can be bent from the periphery of the second heat sink 13 in a direction away from the first heat sink 11. In some other embodiments, at least one side of the periphery of the first heat sink 11 is bent and extended to form the first flange 112; at least one side of the periphery of the second heat sink 13 is bent and extended to form the second flange 132. In this case, the flatness and strength of the first heat sink 11 and the second heat sink 13 are better.

[0108] See also Figure 10 The electronic device 10000 of the embodiment of the present application includes the electronic device 1000 of the above embodiment. The electronic device 10000 includes but is not limited to a computer or a game console.

[0109] In the electronic device 10000 of the embodiment of the present application, in the thickness direction of the heat dissipation structure 10, the top wall of the mounting groove 101 is spaced from the top wall of the card slot 111, and the bottom wall of the mounting groove 101 is spaced from the bottom wall of the card slot 111. When the heat dissipation components 20 to be cooled of different thicknesses are installed on the heat dissipation structure 10, the relative positions between the circuit board 213 of the heat dissipation component 20 to be cooled and the top and bottom walls of the heat dissipation structure 10 remain unchanged, and the memory chip 211 of the heat dissipation component 20 to be cooled can be located in the gap between the mounting groove 101 and the card slot 111. The heat dissipation structure 10 contacts the memory chip 211 of the heat dissipation component 20 to be cooled to dissipate heat from the heat dissipation component 20. The heat dissipation structure 10 of the present application can accommodate heat dissipation components 20 to be cooled of different thicknesses, and can effectively dissipate heat from the heat dissipation component 20. The heat dissipation structure 10 has many usage scenarios.

[0110] The technical features of the above-described embodiments may be combined in any manner. To simplify the description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there are no conflicts in the combination of these technical features, they should be considered to be within the scope of this specification. Furthermore, other implementations can be derived from the above-described embodiments, allowing for structural and logical substitutions and changes without departing from the scope of this disclosure.

[0111] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A heat dissipation structure (10), characterized in that: The heat dissipation structure (10) is provided with a mounting groove (101) and a clamping groove (111); the mounting groove (101) is communicated with the clamping groove (111); in the thickness direction of the heat dissipation structure (10), the top wall of the mounting groove (101) is spaced from the top wall of the clamping groove (111); the bottom wall of the mounting groove (101) is spaced from the bottom wall of the clamping groove (111); the clamping groove (111) is used for the heat dissipation component (20) to be clamped therein; when the heat dissipation component (20) to be clamped therein is clamped in the clamping groove (111), at least a portion of the heat dissipation component (20) to be clamped therein is located within the mounting groove (101).

2. The heat dissipation structure (10) according to claim 1, characterized in that: The heat dissipation structure (10) comprises a first heat dissipation member (11) and a second heat dissipation member (13); the card slot (111) is provided on the first heat dissipation member (11); the first heat dissipation member (11) and the second heat dissipation member (13) jointly form the mounting slot (101); in the thickness direction of the heat dissipation structure (10), the bottom wall of the card slot (111) is spaced from the inner surface of the first heat dissipation member (11); and the top wall of the card slot (111) is spaced from the inner surface of the second heat dissipation member (13).

3. The heat dissipation structure (10) according to claim 2, characterized in that: The second heat sink (13) and the first heat sink (11) can rotate relative to each other so that the heat dissipation structure (10) can switch between an unfolded state and a folded state. The first heat sink (11) is provided with a first connection portion (11536), and the second heat sink (13) is provided with a second connection portion (131). When the heat dissipation structure (10) is in the folded state, the second connection portion (131) cooperates with the first connection portion (11536) to keep the heat dissipation structure (10) in the folded state. When the heat dissipation structure (10) is in the unfolded state, the second connection portion (131) is released from the first connection portion (11536).

4. The heat dissipation structure (10) according to claim 3, characterized in that: The first heat sink (11) comprises a heat sink body and a mounting member (115); the mounting member (115) is connected to the heat sink body; the mounting member (115) forms the slot (111).

5. The heat dissipation structure (10) according to claim 4, characterized in that: The heat dissipation body comprises a first end (113) of the heat dissipation body and a second end (114) of the heat dissipation body, wherein the first end (113) of the heat dissipation body and the second end (114) of the heat dissipation body are opposite to each other in a first direction; the mounting member (115) is connected to the first end (113) of the heat dissipation body, and / or the mounting member (115) is connected to the second end (114) of the heat dissipation body.

6. The heat dissipation structure (10) according to claim 4, characterized in that: The mounting member (115) includes a first mounting portion (1151) and a second mounting portion (1153) that are spaced apart. In the thickness direction of the heat dissipation structure (10), the projection of the first mounting portion (1151) and the projection of the second mounting portion (1153) at least partially overlap. A first groove (11511) is formed between the top wall of the first mounting portion (1151) and the second mounting portion (1153), and a second groove (11531) is formed on the second mounting portion (1153). The first groove (11511) and the second groove (11531) are connected to form the card slot (111).

7. The heat dissipation structure (10) according to claim 6, characterized in that: The first mounting portion (1151) includes a first sub-portion (11513) and a second sub-portion (11515), the first sub-portion (11513) and the second sub-portion (11515) are connected, the heat dissipation body includes a first end (113) and a second end (114) of the heat dissipation body, the first end (113) and the second end (114) of the heat dissipation body are opposite to each other in a first direction, the first sub-portion (11513) is connected to the first end (113) and / or the second end (114) of the heat dissipation body, the extension direction of the first sub-portion (11513) intersects with the first direction, the second sub-portion (11515) bends and extends from the first sub-portion (11513) along the first direction and in a direction away from the heat dissipation body, and the first direction is the length direction of the heat dissipation structure (10).

8. The heat dissipation structure (10) according to claim 6, characterized in that: The second mounting portion (1153) includes a first sub-component (11533), a second sub-component (11534) and a third sub-component (11535), the first sub-component (11533), the second sub-component (11534) and the third sub-component (11535) being connected in sequence, the heat dissipation body includes a first end (113) of the heat dissipation body and a second end (114) of the heat dissipation body, the first end (113) of the heat dissipation body and the second end (114) of the heat dissipation body being opposite in a first direction, the first sub-component (11533) and the first end (113) of the heat dissipation body and / or the second end (114) of the heat dissipation body are connected in sequence, 114), the extension direction of the first sub-component (11533) intersects with the first direction, the second sub-component (11534) is bent and extended from the first sub-component (11533) to form the second groove (11531), the third sub-component (11535) extends from the second sub-component (11534) along the first direction and toward the first mounting portion (1151), and at least partially corresponds to the first mounting portion (1151), and the third sub-component (11535) and the second sub-portion (11515) of the first mounting portion (1151) jointly form the first groove (11511).

9. The heat dissipation structure (10) according to claim 8, characterized in that: The second heat sink (13) comprises a first end (133) of the second heat sink and a second end (135) of the second heat sink, the first end (133) of the second heat sink and the second end (135) of the second heat sink are opposite to each other in the first direction, the first end (133) of the second heat sink and / or the second end (135) of the second heat sink are provided with the second connection portion (131); the third sub-component (11535) is provided with the first connection portion (11536), and when the heat dissipation structure (10) is in a folded state, the second connection portion (131) cooperates with the first connection portion (11536).

10. The heat dissipation structure (10) according to claim 9, characterized in that: The surface of the first connecting portion (11536) extends obliquely relative to the thickness direction of the heat dissipation structure (10), and a gap is formed between the first connecting portion (11536) and the bottom wall of the third sub-component (11535). When the heat dissipation structure (10) is in a folded state, the second connecting portion (131) is located within the gap.

11. The heat dissipation structure (10) according to claim 8, characterized in that: The third sub-component (11535) also includes a toggle portion (11537), which is connected to the first connecting portion (11536). The toggle portion (11537) can drive the first connecting portion (11536) to deform along the first direction away from the heat dissipation body, so that the first connecting portion (11536) and the second connecting portion (131) are released from engagement.

12. The heat dissipation structure (10) according to claim 11, characterized in that: The third sub-component (11535) also includes a first stop portion (11538) and a second stop portion (11539), the first stop portion (11538) and the second stop portion (11539) are arranged at intervals, the first stop portion (11538) is connected to the toggle portion (11537), and the second stop portion (11539) is connected to the second sub-component (11534), and when the toggle portion (11537) drives the first stop portion (11538) to deform to a preset position, the first stop portion (11538) and the second stop portion (11539) cooperate to prevent the toggle portion (11537) from excessive deformation.

13. The heat dissipation structure (10) according to claim 3, characterized in that: The first heat dissipation element (11) comprises a first side (116) and a second side (117) opposite to each other in a second direction; the second heat dissipation element (13) comprises a first side (136) and a second side (137) opposite to each other in the second direction; the second direction is a width direction of the heat dissipation structure (10); the heat dissipation structure (10) further comprises: A connecting member (17), wherein opposite ends of the connecting member (17) are respectively connected to a first side (116) of the first heat dissipation member (11) and a first side (136) of the second heat dissipation member (13), and the first heat dissipation member (11) and the second heat dissipation member (13) are capable of rotating relative to the connecting member (17).

14. The heat dissipation structure (10) according to claim 13, characterized in that: The first side (116) of the first heat dissipation element (11) is provided with at least two first through holes (1161) spaced apart from each other; and / or The first side (136) of the second heat dissipation element (13) is provided with at least two second through holes (1361) spaced apart from each other.

15. The heat dissipation structure (10) according to claim 13, characterized in that: When the heat dissipation structure (10) is in an unfolded state, the first side (116) of the first heat dissipation element (11) is an arc surface that is concave toward the second heat dissipation element (13); and / or When the heat dissipation structure (10) is in an unfolded state, the first side (136) of the second heat dissipation element (13) is an arc surface that is concave toward the first heat dissipation element (11).

16. The heat dissipation structure (10) according to claim 3, characterized in that: At least one side of the periphery of the first heat dissipation element (11) is bent and extended to form a first flange (112); and / or At least one side of the periphery of the second heat dissipation element (13) is bent and extended to form a second flange (132).

17. The heat dissipation structure (10) according to claim 2, characterized in that: The heat dissipation structure (10) further includes: A heat conducting member (15), wherein the heat conducting member (15) is provided on the inner surface of the first heat dissipating member (11) and / or the inner surface of the second heat dissipating member (13).

18. The heat dissipation structure (10) according to claim 17, characterized in that: The heat conducting member (15) is a heat conducting silica gel gasket, a heat conducting graphite gasket or a heat conducting phase change gasket.

19. The heat dissipation structure (10) according to claim 17, characterized in that: The inner surface of the first heat dissipation element (11) is provided with a first groove (118), and at least one of the heat conducting elements (15) is installed in the first groove (118); and / or The inner surface of the second heat dissipation element (13) is provided with a second groove (138), and at least one heat conducting element (15) is installed in the second groove (138).

20. The heat dissipation structure (10) according to claim 19, characterized in that: There are multiple first grooves (118), and the inner surface of the first heat sink (11) is further provided with a first reinforcement portion (119), wherein the first reinforcement portion (119) is located between two adjacent first grooves (118); and / or There are multiple second grooves (138), and the inner surface of the second heat sink (13) is further provided with a second reinforcement portion (139), wherein the second reinforcement portion (139) is located between two adjacent second grooves (138).

21. An electronic module (100), characterized in that The electronic module (100) comprises: The heat dissipation structure (10) according to any one of claims 1 to 20; and A heat dissipation component (20) is installed on the heat dissipation structure (10).

22. The electronic module (100) according to claim 21, characterized in that The heat dissipation component (20) includes a memory bar (21) and a graphics card.

23. The electronic module (100) according to claim 22, characterized in that The memory bar (21) comprises a memory chip (211) and a circuit board (213); the circuit board (213) is installed in the card slot (111); the circuit board (213) comprises a first side and a second side opposite to each other; the first side of the circuit board (213) corresponds to the first heat dissipation element (11) of the heat dissipation structure (10); and the second side of the circuit board (213) corresponds to the second heat dissipation element (13) of the heat dissipation structure (10); The memory chip (211) is provided on the first side of the circuit board (213) or the second side of the circuit board (213), and the heat conducting member (15) of the heat dissipation structure (10) is provided on the first heat dissipation member (11) or the second heat dissipation member (13) and is in contact with the memory chip (211); or The memory chip (211) is arranged on a first side of the circuit board (213) and a second side of the circuit board (213); the heat conducting member (15) of the heat dissipation structure (10) is arranged on the first heat dissipation member (11) and the second heat dissipation member (13), and is in contact with the memory chip (211).

24. An electronic device (1000), characterized in that The electronic device (1000) comprises: Mainboard(300); A connector (500), the connector (500) being mounted on the mainboard (300); and The electronic module (100) according to any one of claims 21 to 23, wherein the electronic module (100) is mounted on the mainboard (300) and electrically connected to the connector (500).

25. An electronic device (10000), characterized in that The electronic device (10000) includes the electronic device (1000) according to claim 24.

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