Carrier

Abstract

The utility model provides a carrier, which is applied to the field of semiconductors and comprises a slide glass, and the slide glass comprises a first side edge and a second side edge which are opposite to each other; the slide glass is provided with at least two through holes, and the two through holes are respectively close to the first side edge and the second side edge, which are opposite to each other, of the slide glass; the slide glass is further provided with at least two other containing grooves, and the two containing grooves are close to the first side edge and the second side edge, opposite to each other, of the slide glass respectively. The through hole and the containing groove are formed in the carrier at the same time, so that the clamp equipment can take and place the cover plate in the fork arm mode and the ejector pin mode at the same time, the problems of cover plate deformation, cover sliding and the like caused by improper operation in a single mode are effectively solved, the carrier can meet the requirements of different equipment manufacturers, and the production efficiency is improved. The independence of the carrier and the equipment is realized.

Description

Technical Field

[0001] The present application relates to the technical field of flexible circuit board carriers, and in particular to a carrier. Background Art

[0002] In the existing technology, there are mainly two types of carrier structures, corresponding to two ways of clamping the cover sheet through the equipment, but each method has its own specific limitations. At the same time, equipment manufacturers need to make specific adaptations and adjustments for different carriers. The carrier and the equipment are not independent. When optimizing or improving the equipment, it is often necessary to consider the compatibility of the carrier at the same time, which limits the innovation and development space of equipment manufacturers and carrier manufacturers in their respective fields.

[0003] On the one hand, the device can use a fork arm method to pick up and place the cover sheet. This method uses the fork-shaped structure of the robotic arm to clamp and move the cover sheet. However, due to the magnetism on the carrier, the fork arm may cause the cover sheet to deform due to excessive magnetism during the clamping process, thereby affecting its sealing or functional integrity. On the other hand, the device may also use an ejector pin method to pick up and place the cover sheet. This method uses an ejector pin structure to apply pressure to a specific part of the cover sheet through the ejector pin hole on the carrier, thereby achieving the detachment and movement of the cover sheet. However, the contact area between the ejector pin and the cover sheet is usually small, resulting in concentrated force during the ejection process, which can easily cause damage to the ejector pin hole and the cover sheet material around it. Over time, this damage may accumulate and affect the reusability of the carrier and the production quality of the product. Utility Model Content

[0004] In order to at least overcome the above-mentioned deficiencies in the prior art, the present application provides a carrier, comprising: a carrier, the carrier comprising a first side and a second side opposite to each other; the carrier is provided with at least two through holes, the two through holes are respectively close to the first side and the second side opposite to each other of the carrier; the carrier is also provided with at least another two accommodating grooves, the two accommodating grooves are respectively close to the first side and the second side opposite to each other of the carrier.

[0005] In a possible implementation, the plurality of accommodating grooves and the plurality of through holes are alternately arranged along the first side, and the plurality of accommodating grooves and the plurality of through holes are alternately arranged along the second side.

[0006] In a possible implementation manner, the location of the accommodating groove and the through hole is no more than 10 mm away from the edge of the carrier.

[0007] In a possible embodiment, the carrier further includes a third side and a fourth side opposite to each other; the carrier has a plurality of the accommodating grooves, and the accommodating grooves are further arranged near the third side and the fourth side opposite to each other of the carrier.

[0008] In a possible implementation, the carrier further includes a cover sheet disposed on the carrier sheet close to a side thereof having the receiving groove.

[0009] In a possible implementation, the cover plate includes an opposite fifth side and a sixth side, and the cover plate is provided with at least two positioning grooves, and the two positioning grooves are respectively close to the opposite fifth side and the sixth side of the cover plate.

[0010] In a possible implementation, the orthographic projection of the positioning groove on the slide is located within the orthographic projection of the through hole on the slide.

[0011] In a possible embodiment, the carrier further includes a substrate placement area, which is arranged on a side of the accommodating groove and the through hole away from the edge of the carrier; the substrate placement area and the accommodating groove are located on the same surface of the carrier.

[0012] In a possible implementation manner, the cover plate further has a substrate covering area, and the substrate covering area is arranged on a side of the positioning groove away from an edge of the cover plate.

[0013] In a possible implementation manner, the orthographic projection of the substrate covering area on the carrier covers the substrate placement area.

[0014] Based on any one of the above aspects, an embodiment of the present application provides a carrier, which simultaneously sets a through hole and a receiving groove on the carrier, so that the clamping device can simultaneously use both fork arms and ejector pins to perform cover plate picking and placing operations. This not only effectively avoids problems such as cover plate deformation and sliding caused by improper operation of a single method, but also enables the carrier to match the needs of different equipment manufacturers, thereby realizing the independence of the carrier and the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 A schematic diagram of a slide provided in an embodiment of the present application;

[0017] Figure 2 A schematic diagram of a cover sheet provided in an embodiment of the present application.

[0018] Icon: 10-carrier; 110-first side; 120-second side; 130-third side; 140-fourth side; 150-substrate placement area; 180-accommodation groove; 190-through hole; 20-cover plate; 210-fifth side; 220-sixth side; 230-positioning groove; 240-substrate covering area. DETAILED DESCRIPTION

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0021] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0022] In the description of this application, it should be noted that the terms "upper" and "lower" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. These are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0023] It should be noted that, in the absence of conflict, the different features in the embodiments of the present application can be combined with each other; at the same time, the "connection" mentioned in the present application represents a connection method in a physical sense, rather than an electrical connection or other connection methods.

[0024] The specific implementation methods of this application are described in detail below with reference to the accompanying drawings.

[0025] The inventors have found through research that in the prior art, there are mainly two ways to take and place the cover sheet 20 , but each way has its own specific limitations.

[0026] In the first gripping method, the gripper device may use a fork arm to pick up and place the cover sheet 20. This method uses the fork-shaped structure of the robotic arm to grip and move the cover sheet 20. However, due to the magnetic properties of the slide 10, the fork arm may deform the cover sheet 20 during gripping. Furthermore, excessive magnetism may cause the cover sheet 20 to slip, resulting in operational interruption or product damage.

[0027] In the second clamping method, the fixture device may also use an ejector pin to remove and place the cover sheet 20. This method uses an ejector pin structure to pass through an ejector pin hole in the slide 10 and apply pressure to a specific portion of the cover sheet 20, thereby achieving detachment and removal of the cover sheet 20. However, the contact area between the ejector pin and the cover sheet 20 is typically small, resulting in concentrated force during the ejection process, which can easily damage the cover sheet 20 material in and around the ejector pin hole.

[0028] Furthermore, carrier designs vary from manufacturer to manufacturer. Due to differences in carrier size, material selection, and structural layout, equipment manufacturers must adapt and adjust specific carriers when designing and implementing the cover sheet 20 access function. This makes the equipment and carriers not independent. Furthermore, when optimizing or improving equipment, carrier compatibility often needs to be considered, requiring simultaneous review and matching.

[0029] This application provides a carrier, please refer to Figure 1 , used in the semiconductor field, including: a carrier 10, the carrier 10 including a first side 110 and a second side 120 opposite to each other; the carrier 10 is provided with at least two through holes 190, and the two through holes 190 are respectively close to the first side 110 and the second side 120 opposite to each other of the carrier 10; the carrier 10 is also provided with at least another two accommodating grooves 180, and the two accommodating grooves 180 are respectively close to the first side 110 and the second side 120 opposite to each other of the carrier 10.

[0030] In this embodiment, a through hole 190 for the ejector pin to pass through and a receiving groove 180 for accommodating a fork arm are provided on the carrier 10. Using the carrier provided in this embodiment, the clamping device can simultaneously use both the fork arm and the ejector pin to perform the pick-up and placement operations of the cover sheet 20, thereby effectively avoiding the problems of deformation and sliding of the cover sheet 20 caused by improper operation of a single method. At the same time, since the force is more uniform and stable, the pick-up and placement process also becomes smoother, thereby improving production efficiency. In addition, by unifying the clamping functional area of ​​the carrier - that is, the design of having both a through hole 190 and a receiving groove 180, the carrier can match the needs of different equipment manufacturers, realizing the independence of the carrier and the equipment. This means that when the equipment or carrier needs to be optimized or improved, it can be reviewed and adjusted independently without the need for simultaneous review, thereby improving the innovation ability and flexibility of equipment manufacturers and carrier manufacturers.

[0031] For some possible implementations, please refer to Figure 2 The carrier further includes a cover sheet 20 disposed on the carrier sheet 10 close to a side thereof having the receiving groove 180 .

[0032] For some possible implementations, please refer to Figure 2 The cover plate 20 includes a fifth side 210 and a sixth side 220 opposite to each other, and the cover plate 20 is provided with at least two positioning grooves 230, and the two positioning grooves 230 are respectively close to the fifth side 210 and the sixth side 220 opposite to the cover plate 20.

[0033] In this embodiment, to ensure that the ejector pin can smoothly pass through the through-hole 190 and achieve precise positioning on the cover sheet 20 when the clamping device is operated in the second clamping mode, while effectively preventing it from sliding and thus avoiding unnecessary damage to the cover sheet 20, positioning grooves 230 are provided on the fifth side 210 and the sixth side 220 of the cover sheet 20. In this way, the ejector pin can stay in the predetermined position after completing the perforation operation, which not only improves the accuracy of the operation but also effectively protects the cover sheet 20 from potential damage caused by sliding.

[0034] In some possible implementations, the orthographic projection of the positioning groove 230 on the slide 10 is located within the orthographic projection of the through hole 190 on the slide 10 .

[0035] In this embodiment, in order to ensure that the ejector pin can be accurately positioned in the positioning groove 230 on the cover plate 20 after passing through the through hole 190 , the orthographic projection of the positioning groove 230 on the carrier plate 10 is located within the orthographic projection of the through hole 190 on the carrier plate 10 .

[0036] For some possible implementations, please refer to Figure 1 , the plurality of accommodating grooves 180 and the plurality of through holes 190 are alternately arranged along the first side 110 of the carrier 10 , and the plurality of accommodating grooves 180 and the plurality of through holes 190 are alternately arranged along the second side 120 of the carrier 10 .

[0037] In this embodiment, the accommodating grooves 180 and the through holes 190 are alternately arranged, so that the carrier can be adapted to two different clamping methods, and the two clamping methods can also be used simultaneously.

[0038] For some possible implementations, please refer to Figure 1The carrier 10 also includes a third side 130 and a fourth side 140 opposite to each other; the carrier 10 has a plurality of the accommodating grooves 180, and the accommodating grooves 180 are also arranged near the third side 130 and the fourth side 140 opposite to each other of the carrier 10.

[0039] In order to ensure the stability of the clamping device when clamping the cover sheet 20, a receiving groove 180 is also provided on the third side 130 and the fourth side 140 opposite to the carrier 10. The receiving grooves 180 on the carrier 10 are jointly designed for the forking operation of the fork arm, and multiple receiving grooves 180 are used to ensure the stability of the fork arm during the clamping process.

[0040] For example, to address the issue of deformation and slippage that can easily occur when using a fork arm to remove and place the cover sheet 20, three accommodating grooves 180 are designed on each of the first side 110 and the second side 120 of the slide 10, with one accommodating groove 180 designed on each short side, for a total of eight accommodating grooves 180. These accommodating grooves 180 are designed specifically for the fork arm's forking operation, ensuring even force distribution when removing and placing the cover sheet 20, thereby effectively preventing deformation of the cover sheet 20 caused by uneven force. The design of multiple accommodating grooves 180 also increases the stability of the forking process and reduces the occurrence of slippage.

[0041] At the same time, to compensate for the drawbacks of a narrow contact surface and excessive force when using ejector pins to remove and place cover sheet 20, four through-holes 190 are designed on each of the first and second sides 110, 120 of the slide 10, for a total of eight through-holes 190. These are used for ejector pin removal. Two positioning slots 230 are also designed on each of the fifth and sixth sides 210, 220 of the cover sheet 20, for a total of four positioning slots 230. These slots are not only used for ejector pin removal but also serve as positioning. By increasing the number of through-holes 190, the contact area between the ejector pins and the cover sheet 20 is expanded, dispersing the force applied, and reducing the risk of damage to the through-holes 190 and the cover sheet 20. Furthermore, the positioning function of the positioning slots 230 ensures stability and accuracy during the removal and placement of the cover sheet 20.

[0042] In some possible implementations, the location of the accommodating groove 180 and the through hole 190 is no more than 10 mm away from the edge of the carrier 10 .

[0043] In this embodiment, in order to standardize the carrier and adapt to the use of different fixture devices, the accommodating groove 180 and the through hole 190 are uniformly set within 10 mm from the edge of the carrier 10.

[0044] For some possible implementations, please refer to Figure 1The carrier 10 also includes a substrate placement area 150, which is arranged on a side of the accommodating groove 180 and the through hole 190 away from the edge of the carrier 10; the substrate placement area 150 and the accommodating groove 180 are located on the same surface of the carrier 10.

[0045] For some possible implementations, please refer to Figure 2 The cover plate 20 further has a substrate covering area 240 , and the substrate covering area 240 is arranged on a side of the positioning groove 230 away from the edge of the cover plate 20 .

[0046] In some possible implementations, the orthographic projection of the substrate covering area 240 on the carrier 10 covers the substrate placement area 150 .

[0047] In this embodiment, during the process of bonding the chip to the substrate, in order to ensure that the substrate maintains flatness and suppresses excessive warping, thereby preventing excessive warping from affecting the chip bonding accuracy, the substrate is placed between the carrier 10 and the cover sheet 20. The constraint of the cover sheet provides a stable and uniform supporting environment for the substrate, thereby minimizing the impact of external stress and temperature changes on the substrate morphology and ensuring the accuracy of chip bonding.

[0048] In summary, the present application provides a carrier for use in the semiconductor field, comprising a carrier 10, wherein the carrier 10 includes a first side 110 and a second side 120 opposite to each other; the carrier 10 is provided with at least two through holes 190, wherein the two through holes 190 are respectively adjacent to the first side 110 and the second side 120 opposite to each other of the carrier 10; and the carrier 10 is further provided with at least another two receiving grooves 180, wherein the two receiving grooves 180 are respectively adjacent to the first side 110 and the second side 120 opposite to each other of the carrier 10. By simultaneously providing the through holes 190 and the receiving grooves 180 on the carrier 10, the present application enables a clamping device to simultaneously use both a fork arm and a ejector pin to perform a pick-up and placement operation on the cover sheet 20. This not only effectively avoids problems such as deformation and sliding of the cover sheet 20 caused by improper operation of a single method, but also enables the carrier to meet the needs of different equipment manufacturers, thereby achieving independence between the carrier and the equipment.

[0049] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0050] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A vehicle, characterized in that: Applications in the semiconductor field include: a slide comprising opposing first and second sides; The slide is provided with at least two through holes, and the two through holes are respectively close to the first side and the second side opposite to each other of the slide; The carrier is further provided with at least another two accommodating grooves, and the two accommodating grooves are respectively close to the first side edge and the second side edge opposite to the carrier.

2. The carrier according to claim 1, characterized in that The plurality of accommodating grooves and the plurality of through holes are alternately arranged along the first side, and the plurality of accommodating grooves and the plurality of through holes are alternately arranged along the second side.

3. The carrier according to claim 1, characterized in that The location of the accommodating groove and the through hole is no more than 10 mm away from the edge of the carrier.

4. The carrier according to claim 1, characterized in that The slide further comprises a third side and a fourth side that are opposite; The carrier has a plurality of the accommodating grooves, and the accommodating grooves are further arranged near the third side and the fourth side opposite to the carrier.

5. The carrier according to claim 1, characterized in that The carrier further includes a cover sheet arranged on the carrier sheet close to a side thereof having the receiving groove.

6. The carrier according to claim 5, characterized in that The cover plate includes a fifth side edge and a sixth side edge that are opposite to each other; The cover plate is provided with at least two positioning grooves, and the two positioning grooves are respectively close to the fifth side and the sixth side opposite to the cover plate.

7. The carrier according to claim 6, characterized in that The orthographic projection of the positioning groove on the slide is located within the orthographic projection of the through hole on the slide.

8. The carrier according to claim 1, characterized in that The carrier also includes a substrate placement area, which is arranged on a side of the accommodating groove and the through hole away from the edge of the carrier; The substrate placement area and the accommodating groove are located on the same surface of the carrier.

9. The carrier according to claim 6, characterized in that: The cover plate also has a substrate covering area, and the substrate covering area is arranged on a side of the positioning groove away from the edge of the cover plate.

10. The carrier according to any one of claims 8 to 9, characterized in that: The orthographic projection of the substrate covering area on the carrier covers the substrate placement area.

Images