Packaging structure of multi-base-island lead frame

Abstract

The utility model discloses a packaging structure of a multi-base-island lead frame. The packaging structure comprises a frame, a plurality of base islands, a plurality of pins, a chip and a plastic package body, the plurality of base islands are located in the internal area of the frame and are electrically isolated from one another; the plurality of pins are arranged around the frame, and the plurality of pins are arranged at intervals; the chip is arranged on the base island, and the chip is connected with the plurality of pins through a plurality of bonding wires; the plastic package body wraps the frame, the plurality of base islands, the plurality of pins and the chip. Wherein the plurality of base islands comprise a first base island which is provided with a chip and a second base island which is not provided with the chip, a part of the plurality of pins are directly connected with a part of routing areas in the chip through a plurality of bonding wires, and the other part of the plurality of pins are connected with the other part of routing areas in the chip through the second base island. According to the utility model, the bonding difficulty can be reduced, the intersection or touch among a plurality of bonding wires can be avoided, and the yield and reliability of the packaging structure can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a packaging structure of a multi-island lead frame. Background Art

[0002] With the widespread application of multi-chip packaging, more and more complex designs have emerged. Figures 1 to 3 The following are schematic diagrams of three existing packaging structures, especially for large-size chips and chips with complex circuit designs (see Figure 3 ), often with cross-bonding routing designs, which can lead to wire collisions and short circuit risks; or cross-chip routing designs, which can result in excessively long wire loops and unstable tails during bonding. These designs significantly increase the difficulty of wire bonding and affect product yield. Therefore, it is necessary to provide improved technical solutions to address the problem of poor wiring design leading to reduced product yield. Utility Model Content

[0003] In order to address the deficiencies of the prior art, the purpose of this application is to provide a packaging structure of a multi-island lead frame, which can reduce bonding difficulties, avoid crossing or touching between multiple bonding wires, and help improve the yield and reliability of the packaging structure.

[0004] To achieve the above objectives, this application adopts the following technical solutions:

[0005] A packaging structure of a multi-island lead frame comprises a frame, a plurality of islands, a plurality of pins, a chip and a plastic package; the plurality of islands are located in an interior area of ​​the frame and are electrically isolated from each other; the plurality of pins are arranged around the frame and are spaced apart from each other; the chip is disposed on the islands, and the chip is connected to the plurality of pins via a plurality of bonding wires; the plastic package covers the frame, the plurality of islands, the plurality of pins and the chip; the plurality of islands comprises a first island on which the chip is disposed and a second island on which no chip is disposed; a portion of the plurality of pins is directly connected to a portion of the wiring area in the chip via a plurality of bonding wires, and another portion of the plurality of pins is connected to another portion of the wiring area in the chip via the second island.

[0006] Furthermore, two of the multiple chips are connected via bonding wires, wherein part of the bonding areas of the two chips are directly connected via the bonding wires, and another part of the bonding areas on the two chips are connected via adjacent second base islands.

[0007] Furthermore, the bonding wires between the two chips and the bonding wires between the chip and the plurality of pins do not overlap / are different in height direction;

[0008] or / and the bonding wires between the two chips and the bonding wires between the chip and the second base island do not overlap / are different in height direction;

[0009] Or / and the bonding wires between the two chips and the bonding wires between the plurality of pins and the second base island do not overlap in the height direction.

[0010] Furthermore, the bonding areas of the same portion of the chip are connected to the pins of a corresponding portion of the plurality of pins through the same second base island.

[0011] Furthermore, the plurality of base islands include a plurality of second base islands, and the chip on a first base island is electrically connected to a chip on another first base island through the plurality of second base islands.

[0012] Furthermore, at least some of the plurality of base islands have different thicknesses.

[0013] Furthermore, grooves of different depths are etched on the surface of the base island, and the chip is located in the grooves, wherein grooves of different depths are etched on the same base island, and / or the depths of the grooves etched on different base islands are different.

[0014] Furthermore, the plurality of leads include at least one third bonding wire, the plurality of chips include a first chip and a second chip respectively arranged on two first base islands, one end of the third bonding wire is connected to a pad in the first chip, the other end of the third bonding wire crosses the second chip and is connected to a corresponding pin, and the upper surface of the first chip is higher than the upper surface of the second chip.

[0015] Furthermore, a plurality of carrier platforms with different heights are arranged on the plurality of base islands, the plurality of chips are respectively arranged on the plurality of carrier platforms, and the upper surfaces of the plurality of chips have a height difference greater than or equal to a predetermined height.

[0016] Furthermore, the packaging structure of the multi-island lead frame is a QFN packaging structure.

[0017] In the present invention, by connecting the second base island between the chip and multiple pins, or connecting the second base island between the wire bonding areas of two chips, the arc direction of some of the bonding wires is adjusted, which can reduce the bonding difficulty and avoid crossing or touching between multiple bonding wires, which is beneficial to improving the yield and reliability of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a first packaging structure in the prior art;

[0019] Figure 2 is a schematic diagram of a second packaging structure in the prior art;

[0020] Figure 3Schematic diagram of the third packaging structure in the prior art;

[0021] Figure 4 Schematic diagram of the first packaging structure of a multi-island lead frame in an embodiment of the present application;

[0022] Figure 5 This is a side sectional view of the packaging structure in an embodiment of the present application;

[0023] Figure 6 Schematic diagram of a second packaging structure of a multi-island lead frame in an embodiment of the present application;

[0024] Figure 7 This is a schematic diagram of the third packaging structure of the multi-island lead frame in the embodiment of the present application. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation of the present application will be clearly and completely described below in conjunction with the drawings in the implementation of the present application.

[0026] like Figure 4 As shown, the embodiment of the present application provides a package structure 100 of a multi-island lead frame, which includes a frame 11, a plurality of islands 12, a plurality of pins 13, a chip 14 and a plastic package 15 (see Figure 5 ).

[0027] Specifically, multiple base islands 12 are located in the inner area of ​​the frame 11 and fixed on the frame 11, wherein any two base islands among the multiple base islands 12 are electrically isolated to avoid short circuit between the two base islands, or avoid short circuit between several bonding wires respectively connected to the two base islands.

[0028] The plurality of pins 13 are arranged around the frame 11 , and two adjacent pins in the plurality of pins 13 are spaced apart.

[0029] The chip 14 is disposed on a corresponding base island among the plurality of base islands 12 , and the chip 14 is connected to the plurality of pins 13 via a plurality of bonding wires.

[0030] Optionally, the number of chips 14 can be set to multiple, and multiple chips 14 are respectively arranged on the base islands corresponding to the multiple base islands 12. Each base island can be provided with a corresponding chip 14, and the chip 14 arranged on the base island is electrically connected to another chip 14 arranged on another base island; or two or more corresponding chips 14 can be arranged on a base island, and the two or more chips 14 arranged on the base island are electrically connected. This application does not specifically limit the number of chips 14 arranged on the base island. The bonding method of the chip 14 arranged on the base island with other chips 14, or with the multiple pins 13, can be flexibly adjusted according to the arrangement position of the chip 14.

[0031] The plastic package 15 covers the frame 11 , the plurality of base islands 12 , the plurality of pins 13 and the chip 14 .

[0032] In the embodiment of the present application, the plurality of base islands 12 include a first base island 121 on which the chip 14 is mounted, and a second base island 122 on which no chip 14 is mounted. Some of the plurality of pins 13 are directly connected to a portion of the bonding area of ​​the chip 14 via a plurality of bonding wires, while another portion of the plurality of pins 13 is connected to another portion of the bonding area of ​​the chip 14 via the second base island 122.

[0033] Among them, two chips 14 among the multiple chips 14 are connected through some bonding wires among the several bonding wires, some bonding areas of the two chips 14 are directly connected through the bonding wires, and another part of the bonding areas on the two chips 14 are connected through the adjacent second base island 122.

[0034] Figure 4 、 Figure 6 and Figure 7 Schematic diagrams of three types of multi-island lead frame package structures 100 are provided. Figure 4The multiple chips 14 in the embodiment of the present application include a first chip 141 disposed on a first base island 121 and a second chip 142 disposed on another first base island 121, wherein the first chip 141 includes a plurality of bonding pads, and the first chip 141 is electrically connected to a portion of the bonding area of ​​the second chip 142 through some of the bonding pads, and another portion of the bonding area of ​​the second chip 142 is electrically connected to the second base island 122, and the second base island 122 is directly electrically connected to the portion of the bonding area of ​​the first chip 141 through a plurality of bonding wires. In the embodiment of the present application, the plurality of bonding wires connecting the portion of the bonding pads of the first chip 141 and the portion of the bonding area of ​​the second chip 142 are defined as first bonding wires, and the portion of the bonding area of ​​the second chip 142 connected to the portion of the bonding area of ​​the first chip 141 are defined as second bonding wires. The first bonding wires and the second bonding wires do not overlap in the height direction. The second bonding wire includes a portion of the bonding wire connected to the first chip 141 and the second base island 122 and another portion of the bonding wire connected to the second chip 142 and the second base island 122, thereby shortening the arc length of the second bonding wire, avoiding the arc of the second bonding wire being too long and causing instability at the tail of the arc, thereby reducing the risk of bonding short circuit.

[0035] like Figure 6 As shown, in other examples of the embodiments of the present application, the packaging structure 100 includes a chip 14 arranged on a first base island 121, wherein the chip 14 includes a plurality of solder pads, and the chip 14 is connected to the second base island 122 through some of the plurality of solder pads, and is connected to some of the plurality of pins 13 through the second base island 122.

[0036] like Figure 7 As shown, the packaging structure 100 includes a first chip 141 arranged on a first base island 121 and a second chip 142 arranged on another first base island 121, wherein the first chip 141 is connected to the second base island 122 through some of the several pads, and is connected to some of the multiple pins 13 through the second base island 122; the first chip 141 arranged on one first base island 121 is also connected to some of the multiple pins 13 through the second chip 142 arranged on another first base island 121.

[0037] It can be seen that the size, shape, and placement of the first base island 121 and the second base island 122 can be flexibly adjusted according to the size and placement of the chip 14. This prevents crossing or contact between multiple bonding wires, which is beneficial for improving the yield and reliability of the package structure.

[0038] In some embodiments, the bonding wires between the two chips 14 and the bonding wires between the chips 14 and the plurality of leads 13 do not overlap / are different in height direction.

[0039] Optionally, the bonding wires between the two chips 14 and the bonding wires between the chip 14 and the second base island 122 do not overlap / are different in height direction.

[0040] Optionally, the bonding wires between the two chips 14 and the bonding wires between the plurality of leads 13 and the second base island 122 do not overlap / are different in height direction.

[0041] The above arrangement can prevent some bonding wires from overlapping in the height direction, reduce bonding difficulties, and avoid crossing or touching between bonding wires, thereby improving the yield and reliability of the package structure 100.

[0042] In some embodiments, the bonding areas of the same portion of the chip 14 are connected to corresponding portions of the leads of the plurality of leads 13 through the same second base island 122 .

[0043] Optionally, the bonding area of ​​the same portion in a chip 14 is connected to the bonding area of ​​a corresponding portion in another chip 14 through the same second base island 122 .

[0044] It should be noted that the bonding area of ​​the same part receives or sends an enable signal representing the realization of the same function through a plurality of bonding wires.

[0045] In some embodiments, the number of second islands 122 is set to at least two. The chip 14 disposed on one first island 121 is sequentially connected to the at least two second islands 122 via a plurality of bonding wires. The chip 14 disposed on another first island 121 is connected to an adjacent second island 122 of the at least two second islands 122. The directions of the bonding wires connecting the chips 14 of the two first islands 121 are changed by the at least two second islands 122. This prevents the bonding wires from crossing or touching each other, thereby improving the yield and reliability of the package structure 100.

[0046] Furthermore, at least some of the plurality of base islands 12 have different thicknesses, so that there is a certain height difference between the chips 14 arranged on different second base islands 122, thereby preventing some of the bonding wires from overlapping in the height direction.

[0047] In some embodiments, multiple base islands 12 are provided with multiple carrier platforms 123 with different heights, multiple chips 14 are respectively provided on the multiple carrier platforms 123 , and the upper surfaces of the multiple chips 14 have a height difference greater than or equal to a predetermined height.

[0048] In some other embodiments, grooves 124 of different depths are etched on the surfaces of some of the plurality of base islands 12 , and the chips 14 are located in the grooves 124 .

[0049] The depths of the grooves 124 etched on different islands are different.

[0050] Optionally, grooves 124 with different depths are etched on the same base island.

[0051] In some embodiments, the plurality of bonding wires includes at least one third bonding wire ( Figure 4 and Figure 5 The plurality of chips 14 include a first chip 141 and a second chip 142 respectively arranged on two first base islands 121, one end of the third bonding wire is connected to a pad in the first chip 141, and the other end of the third bonding wire crosses the second chip 142 and is connected to the corresponding pin, wherein the upper surface of the first chip 141 is higher than the upper surface of the second chip 142.

[0052] In the embodiment of the present application, the multi-island lead frame packaging structure 100 includes but is not limited to an SOP packaging structure 100 and a QFN packaging structure 100.

[0053] In summary, the embodiment of the present application provides a packaging structure 100 of a multi-base island lead frame, by connecting the second base island 122 between the chip 14 and multiple pins 13, or connecting the second base island 122 between the respective bonding areas of two chips 14, so as to adjust the arc direction of some of the bonding wires, reduce the bonding difficulty, and avoid crossing or touching between multiple bonding wires, which is beneficial to improving the yield and reliability of the packaging structure 100.

[0054] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0055] Finally, it should be noted that the above embodiments are merely examples for the purpose of illustrating the present invention and are not intended to limit the embodiments. Those skilled in the art will readily appreciate that other variations or modifications based on the above description are possible. It is not necessary and impossible to provide an exhaustive list of all embodiments. However, obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A packaging structure of a multi-island lead frame, characterized in that: include: frame; a plurality of base islands, the plurality of base islands being located in an inner area of ​​the frame and electrically isolated from each other; a plurality of pins, the plurality of pins being arranged around the frame and spaced apart from each other; A chip, wherein the chip is disposed on a corresponding base island among the plurality of base islands, and the chip is connected to the plurality of pins via a plurality of bonding wires; A plastic package body, the plastic package body covering the frame, the plurality of base islands, the plurality of pins and the chip; Among them, the multiple base islands include a first base island on which the chip is set and a second base island on which the chip is not set, a part of the multiple pins are directly connected to a part of the wiring area in the chip through the several bonding wires, and another part of the multiple pins are connected to another part of the wiring area in the chip through the second base island.

2. The packaging structure of the multi-island lead frame according to claim 1, wherein: Two of the multiple chips are connected via bonding wires, wherein part of the bonding areas of the two chips are directly connected via the bonding wires, and another part of the bonding areas on the two chips are connected via the adjacent second base islands.

3. The packaging structure of the multi-island lead frame according to claim 2, wherein: The bonding wires between the two chips and the bonding wires between the chip and the plurality of pins do not overlap or are different in height direction; or / and the bonding wire between the two chips and the bonding wire between the chip and the second base island do not overlap / are different in height direction; Or / and the bonding wires between the two chips and the bonding wires between the plurality of pins and the second base island do not overlap in the height direction.

4. The packaging structure of the multi-island lead frame according to claim 1, wherein: The bonding areas in the same portion of the chip are connected to corresponding portions of the plurality of pins through the same second base island.

5. The packaging structure of the multi-island lead frame according to claim 1, wherein: The plurality of base islands include a plurality of second base islands, and the chip on the first base island is electrically connected to the chip on another first base island through the plurality of second base islands.

6. The packaging structure of the multi-island lead frame according to claim 1, wherein: At least some of the plurality of base islands have different thicknesses.

7. The packaging structure of the multi-island lead frame according to claim 1, characterized in that: Grooves of different depths are etched on the surface of the base island, and the chip is located in the grooves. Grooves of different depths are etched on the same base island, and / or the depths of the grooves etched on different base islands are different.

8. The packaging structure of the multi-island lead frame according to claim 1, characterized in that: The plurality of bonding wires include at least one third bonding wire, and the plurality of chips include a first chip and a second chip respectively arranged on two first base islands. One end of the third bonding wire is connected to a pad in the first chip, and the other end of the third bonding wire crosses the second chip and is connected to the corresponding pin. The upper surface of the first chip is higher than the upper surface of the second chip.

9. The packaging structure of the multi-island lead frame according to claim 1, wherein: A plurality of carrying platforms with different heights are provided in the plurality of base islands, the plurality of chips are respectively provided on the plurality of carrying platforms, and a height difference between upper surfaces of the plurality of chips is greater than or equal to a predetermined height.

10. The packaging structure of the multi-island lead frame according to claim 1, wherein: The packaging structure of the multi-island lead frame is a QFN packaging structure.

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