Novel substrate for manufacturing electronic component

Abstract

The utility model relates to the technical field of electronic components, and discloses a novel substrate for manufacturing electronic components, which comprises a plate body, an adjusting mechanism is arranged on one side of the plate body, a measuring mechanism is arranged on the surface of the plate body, and a fixing mechanism is arranged below the plate body. According to the novel substrate for manufacturing the electronic component, through the arrangement of the adjusting mechanism, in the working process of mechanical manufacturing of the novel electronic component by the novel substrate for manufacturing the electronic component, a handle can be rotated firstly, and under the action of the handle, the handle is utilized to drive a rotating shaft to rotate, the rotating shaft drives a gear to rotate, and the gear drives a rack to move; the rack drives the adjusting plate to move, then the size of the plate body can be adjusted, and the situation that the length and the size of the substrate are fixed, so that when different novel electronic elements need to be manufactured, substrates of different sizes need to be found for mechanical manufacturing of the novel electronic elements, and then the practicability of the substrate is greatly reduced is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a new substrate for manufacturing electronic components. Background Art

[0002] Electronic components are the basic elements of electronic circuits, typically packaged individually and having two or more leads or metal contacts. They must be interconnected to form a circuit with a specific function, such as an amplifier, radio receiver, or oscillator. One common way to connect electronic components is by soldering them to a printed circuit board. Electronic components may be individually packaged or grouped together in varying degrees of complexity, such as integrated circuits.

[0003] A search revealed an existing patent (publication number: CN2532580Y) that discloses a novel substrate for electronic component manufacturing. This substrate features a thin film of a conductive alloy attached to the surface of a ceramic plate. This novel substrate is formed by heat-pressing a thin film of nickel-copper alloy or nickel-chromium alloy onto the ceramic plate. This increases the substrate's heat dissipation and simplifies the electronic component manufacturing process.

[0004] However, during the manufacturing process of the existing new electronic component manufacturing substrates, the length and volume of the substrates remain fixed. Therefore, when different new electronic components need to be manufactured, substrates of different sizes need to be found for the new electronic component machinery manufacturing, which will greatly reduce the practicality of the substrates.

[0005] Therefore, in order to solve the above-mentioned problems, a new substrate for manufacturing electronic components has been proposed. Utility Model Content

[0006] (1) Technical problems solved

[0007] In response to the shortcomings of the existing technology, the present invention provides a new substrate for manufacturing electronic components, which solves the problem mentioned in the above background technology that the length and volume of the existing substrate for manufacturing new electronic components are fixed during the working process of mechanical manufacturing of new electronic components. Therefore, when different new electronic components need to be manufactured, it is necessary to find substrates of different sizes to mechanically manufacture the new electronic components, which will greatly reduce the practicality of the substrate.

[0008] (2) Technical solution

[0009] To achieve the above-mentioned object, the present invention provides the following technical solution: a novel substrate for manufacturing electronic components, comprising a plate body, an adjustment mechanism provided on one side of the plate body, a measuring mechanism provided on the surface of the plate body, and a fixing mechanism provided below the plate body;

[0010] The adjustment mechanism includes a slide groove a, which is opened on the surface of the plate body. A slider a is provided inside the slide groove a. A rack is provided on the surface of the slider a. A gear is meshed with one side of the rack. A rotating shaft is provided inside the gear, and a handle is provided on one side of the rotating shaft.

[0011] As a preferred solution, an adjustment plate is provided on one side of the rack, and a spring a is provided on the surface of the adjustment plate.

[0012] As a preferred solution, a limiting rod is provided on one side of the spring a, and a limiting groove is provided on one side of the limiting rod, and the limiting groove is provided on the surface of the plate body.

[0013] As a preferred solution, the measuring mechanism includes a measuring bar, which is arranged on the upper surface of the plate body. A protective pad is arranged above the measuring bar, and the protective pad is arranged on the surface of the mounting plate.

[0014] As a preferred solution, a spring b is provided below the mounting plate, and a hinge is provided on one side of the mounting plate.

[0015] As a preferred solution, the fixing mechanism includes a slide groove b, which is opened below the plate body, and a slider b is provided inside the slide groove b.

[0016] As a preferred solution, a fixing plate is provided on the surface of the slider b, a spring c is provided on one side of the fixing plate, and a connecting block is provided on one side of the spring c.

[0017] The utility model provides a new substrate for manufacturing electronic components. It has the following beneficial effects:

[0018] (1) The substrate for manufacturing new electronic components is provided with an adjustment mechanism. During the process of mechanically manufacturing new electronic components using the substrate for manufacturing new electronic components, the handle can be turned first. Under the action of the handle, the handle drives the shaft to rotate, the shaft drives the gear to rotate, the gear drives the rack to move, and the rack drives the adjustment plate to move, thereby adjusting the size of the plate body to avoid the length and volume of the substrate being fixed. Therefore, when different new electronic components need to be manufactured, substrates of different sizes need to be found for mechanically manufacturing the new electronic components, which greatly reduces the practicality of the substrate. Moreover, under the action of the slide groove a and the slider a, the moving position of the rack can be limited.

[0019] (2) The new electronic component manufacturing substrate is provided with an adjustment mechanism. During the operation of the new electronic component manufacturing substrate for mechanically manufacturing the new electronic component, the spring a can be used to drive the limiting rod into the inner side of the limiting groove under the telescopic reset action of the spring a, so as to fix the position of the adjustment plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a side view of the structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the adjustment mechanism of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the measuring mechanism of the utility model;

[0023] Figure 4 This is a structural diagram of the fixing mechanism of the utility model.

[0024] 1. Plate; 2. Adjustment mechanism; 201. Slide a; 202. Slider a; 203. Rack; 204. Gear; 205. Rotating shaft; 206. Handle; 2031. Adjustment plate; 2032. Spring a; 2033. Limiting rod; 2034. Limiting groove; 3. Measuring mechanism; 301. Measuring bar; 302. Protective pad; 303. Mounting plate; 304. Spring b; 305. Hinge; 4. Fixing mechanism; 401. Slide b; 402. Slider b; 403. Fixing plate; 404. Spring c; 405. Connecting block. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figure 1 and Figure 4 The utility model provides a technical solution: a new substrate for manufacturing electronic components, including a plate body 1, an adjustment mechanism 2 is provided on one side of the plate body 1, a measuring mechanism 3 is provided on the surface of the plate body 1, a fixing mechanism 4 is provided under the plate body 1, and the fixing mechanism 4 includes a slide groove b401, the slide groove b401 is opened under the plate body 1, a slider b402 is provided on the inner side of the slide groove b401, a fixing plate 403 is provided on the surface of the slider b402, a spring c404 is provided on one side of the fixing plate 403, and a connecting block 405 is provided on one side of the spring c404.

[0027] Among them: in the working process of mechanically manufacturing new electronic components using substrates for manufacturing new electronic components, by providing an adjustment mechanism 2, it can be avoided that the length and volume of the substrate remain fixed during the working process of mechanically manufacturing new electronic components. Therefore, when it is necessary to manufacture different new electronic elements, it will be necessary to find substrates of different sizes to mechanically manufacture the new electronic elements, which will greatly reduce the practicality of the substrate.

[0028] See also Figure 2 , a new type of substrate for manufacturing electronic components, the adjustment mechanism 2 includes a slide groove a201, the slide groove a201 is opened on the surface of the plate body 1, a slider a202 is provided on the inner side of the slide groove a201, a rack 203 is provided on the surface of the slider a202, one side of the rack 203 is meshed with a gear 204, a rotating shaft 205 is sleeved on the inner side of the gear 204, a handle 206 is provided on one side of the rotating shaft 205, an adjustment plate 2031 is provided on one side of the rack 203, a spring a2032 is provided on the surface of the adjustment plate 2031, a limiting rod 2033 is provided on one side of the spring a2032, a limiting groove 2034 is provided on one side of the limiting rod 2033, and the limiting groove 2034 is provided on the surface of the plate body 1.

[0029] Among them: in the process of mechanically manufacturing new electronic components using substrates for manufacturing new electronic components, the handle 206 can be rotated first. Under the action of the handle 206, the handle 206 is used to drive the rotating shaft 205 to rotate, the rotating shaft 205 drives the gear 204 to rotate, the gear 204 drives the rack 203 to move, and the rack 203 drives the adjustment plate 2031 to move, so that the size of the plate body 1 can be adjusted to avoid the length and volume of the substrate being fixed. Therefore, when different new electronic elements need to be manufactured, substrates of different sizes will need to be found to mechanically manufacture the new electronic elements, which will greatly reduce the practicality of the substrate. Under the action of the slide groove a201 and the slider a202, the moving position of the rack 203 can be limited. Under the telescopic reset action of the spring a2032, the spring a2032 can be used to drive the limiting rod 2033 to enter the inner side of the limiting groove 2034, so that the position of the adjustment plate 2031 can be fixed.

[0030] See also Figure 3 , a new type of substrate for manufacturing electronic components, the measuring mechanism 3 includes a measuring bar 301, the measuring bar 301 is arranged on the upper surface of the plate body 1, a protective pad 302 is arranged above the measuring bar 301, the protective pad 302 is arranged on the surface of the mounting plate 303, a spring b304 is arranged below the mounting plate 303, and a hinge 305 is arranged on one side of the mounting plate 303.

[0031] Among them: in the process of mechanically manufacturing new electronic components using a substrate for manufacturing new electronic components, by providing a measuring mechanism 3, the size of the electronic components can be measured under the action of the measuring bar 301, and the measuring bar 301 can be easily installed under the action of the mounting plate 303.

[0032] The working principle of the present invention is as follows: in the process of manufacturing a new electronic component using a substrate for manufacturing a new electronic component machine, the handle 206 can be rotated first. Under the action of the handle 206, the handle 206 is used to drive the shaft 205 to rotate, the shaft 205 drives the gear 204 to rotate, the gear 204 drives the rack 203 to move, and the rack 203 drives the adjustment plate 2031 to move, thereby adjusting the size of the plate body 1 to avoid the length and volume of the substrate being fixed. Therefore, when different new electronic components need to be manufactured, substrates of different sizes need to be found for adjustment. The new electronic component machinery manufacturing will greatly reduce the practicality of the substrate, and under the action of the slide groove a201 and the slider a202, the moving position of the rack 203 can be limited, and under the telescopic reset action of the spring a2032, the spring a2032 can be used to drive the limit rod 2033 into the inner side of the limit groove 2034, so as to fix the position of the adjustment plate 2031. Secondly, by providing a measuring mechanism 3, under the action of the measuring bar 301, the size of the electronic component can be measured, and under the action of the mounting plate 303, the measuring bar 301 can be conveniently installed.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel substrate for manufacturing electronic components, comprising a plate body (1), characterized in that: An adjusting mechanism (2) is provided on one side of the plate body (1), a measuring mechanism (3) is provided on the surface of the plate body (1), and a fixing mechanism (4) is provided below the plate body (1); The adjustment mechanism (2) comprises a slide groove a (201), the slide groove a (201) being opened on the surface of the plate body (1), a slider a (202) being provided on the inner side of the slide groove a (201), a rack (203) being provided on the surface of the slider a (202), one side of the rack (203) being meshedly connected with a gear (204), a rotating shaft (205) being sleeved on the inner side of the gear (204), and a handle (206) being provided on one side of the rotating shaft (205).

2. The novel substrate for manufacturing electronic components according to claim 1, characterized in that: An adjustment plate (2031) is provided on one side of the rack (203), and a spring a (2032) is provided on the surface of the adjustment plate (2031).

3. The novel substrate for manufacturing electronic components according to claim 2, characterized in that: A limiting rod (2033) is provided on one side of the spring a (2032), and a limiting groove (2034) is provided on one side of the limiting rod (2033), and the limiting groove (2034) is provided on the surface of the plate body (1).

4. The novel substrate for manufacturing electronic components according to claim 1, characterized in that: The measuring mechanism (3) comprises a measuring bar (301), the measuring bar (301) being arranged on the upper surface of the plate body (1), a protective pad (302) being arranged above the measuring bar (301), and the protective pad (302) being arranged on the surface of the mounting plate (303).

5. The novel substrate for manufacturing electronic components according to claim 4, characterized in that: A spring b (304) is provided below the mounting plate (303), and a hinge (305) is provided on one side of the mounting plate (303).

6. The novel substrate for manufacturing electronic components according to claim 1, characterized in that: The fixing mechanism (4) comprises a slide groove b (401), the slide groove b (401) is opened below the plate body (1), and a slider b (402) is provided inside the slide groove b (401).

7. The novel substrate for manufacturing electronic components according to claim 6, characterized in that: A fixed plate (403) is provided on the surface of the slider b (402), a spring c (404) is provided on one side of the fixed plate (403), and a connecting block (405) is provided on one side of the spring c (404).

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