Golden finger structure and electronic equipment

Abstract

The embodiment of the utility model provides a golden finger structure and electronic equipment, and relates to the technical field of computer buses. The golden finger structure comprises a plurality of golden fingers arranged on a PCB in parallel, differential signal lines and grounding through holes, at least two golden fingers are connected with a group of differential signal lines, the differential signal lines are routed on the surface layer of the PCB, the included angle between the differential signal lines and the golden fingers in the parallel direction or the vertical direction is 10 degrees, and the grounding through holes are arranged on the surface layer of the PCB. The grounding through holes are arranged above the upper edges of the golden fingers or below the lower edges of the golden fingers, and are arranged between the gaps of the two adjacent golden fingers. Through 10-degree wiring, the position where the differential signal line falls on the base material does not coincide with the warp and the weft of the base material as much as possible, the dielectric constant is more uniform, the signal integrity is further improved, crosstalk caused by signals output by the golden fingers can be reduced through the grounding through holes, and the signal quality is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computer buses, in particular to a gold finger structure and electronic equipment. Background Art

[0002] With the development of communication technology, signal transmission speeds are getting faster and faster, and the PCIE protocol is gradually entering the era of PCIE5.0. According to the latest protocol standard, the transmission speed of PCIE5.0 has increased from the previous 16GT / s to 32GT / s.

[0003] As signal rates increase, the requirements for signal quality become increasingly stringent. In high-speed digital signal links, if 45° routing is still used, the gaps between the fiberglass mesh structure will cause significant local variations in the relative dielectric constant of the dielectric layer. This makes it impossible to ensure the consistency of the equivalent dielectric constant along the high-speed path, and thus the integrity of the signal impedance, which will be affected. Utility Model Content

[0004] In view of this, an object of the embodiments of the present invention is to provide a gold finger structure and an electronic device to at least partially improve the above-mentioned problem.

[0005] In order to achieve the above-mentioned purpose, the technical solutions adopted in the embodiments of the present invention are as follows:

[0006] In a first aspect, an embodiment of the present invention provides a gold finger structure, comprising a plurality of gold fingers, differential signal lines, and ground vias arranged in parallel on a PCB board;

[0007] At least two of the gold fingers are connected to a group of differential signal lines, the differential signal lines are routed on the surface of the PCB board, and the angle between the differential signal lines and the parallel direction or the perpendicular direction of the gold fingers is 10°;

[0008] The grounding through hole is arranged above the upper edge of the gold finger or below the lower edge of the gold finger, and is located between the gaps between two adjacent gold fingers.

[0009] Optionally, the PIN width of the gold finger is greater than the line width of the differential signal line.

[0010] Optionally, the line width of the differential signal line is 20%-50% of the PIN width of the gold finger.

[0011] Optionally, the gold finger includes a grounding gold finger and a non-grounding gold finger;

[0012] The width of the connection line connecting the grounding gold finger to the grounding through hole is the same as the width of the grounding gold finger.

[0013] Optionally, a plurality of the grounding gold fingers are connected through the grounding through holes to form a shared grounding network.

[0014] Optionally, the protocol used by the gold finger is the PCIE 5.0 protocol, and the rate of the differential signal line is 32GT / s.

[0015] Optionally, the PCB board is at least a 6-layer board.

[0016] Optionally, the distances from the center of the grounding through hole to the centers of two adjacent gold fingers on both sides of the grounding through hole are equal.

[0017] Optionally, the aperture and pad diameter of the ground through hole are 8 mil and 14 mil respectively.

[0018] In a second aspect, an embodiment of the present utility model provides an electronic device, comprising the gold finger structure and an electronic component as described above;

[0019] Some of the electronic components are connected via the gold finger structure.

[0020] The present invention provides a gold finger structure and electronic device, comprising a plurality of gold fingers arranged in parallel on a PCB, differential signal lines, and ground vias. At least two gold fingers are connected to a group of differential signal lines, and the differential signal lines are routed on the surface of the PCB. The differential signal lines are arranged at an angle of 10° in a direction parallel to or perpendicular to the gold fingers. The ground vias are arranged above the upper edge of the gold finger or below the lower edge of the gold finger, and are located between two adjacent gold fingers. The 10° routing ensures that the lengths of the differential signal lines on the glass fiber and resin are as uniform as possible, making the dielectric constant more uniform and thereby improving signal integrity. The ground vias reduce crosstalk caused by signals output from non-ground fingers. The width of the connecting trace of the ground via is the same as that of the ground gold finger, which reduces the inductance of the ground connection.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A schematic structural diagram of a gold finger structure provided by an embodiment of the present utility model;

[0024] Figure 2 A schematic diagram of the connection of a grounding gold finger provided in an embodiment of the present utility model;

[0025] Figure 3 A schematic diagram of a shared grounding network provided by an embodiment of the present utility model;

[0026] Figure 4 A schematic diagram of a grounding through-hole arrangement provided in an embodiment of the present utility model.

[0027] Icons: 10-gold finger structure; 11-gold finger; 111-non-grounded gold finger; 112-grounded gold finger; 113-center of the gold finger; 12-differential signal line; 13-ground via; 131-center of the ground via; 14-PCB board; 15-shared ground network. DETAILED DESCRIPTION

[0028] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0031] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the utility model product is usually placed when in use, or are the orientation or position relationship commonly understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] Furthermore, the terms “first,” “second,” “third,” etc., are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0033] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0034] As described in the background, with the advancement of communication technology, signal transmission speeds are increasing. As signal rates increase, the requirements for signal quality are becoming increasingly stringent. In high-speed digital signal links, if 45° routing is still used, the glass fiber effect can cause uneven dielectric constants across the substrate, making it impossible to maintain consistent equivalent dielectric constants across the high-speed path. Consequently, signal impedance integrity cannot be guaranteed, impacting signal integrity.

[0035] In view of this, an embodiment of the present invention provides a gold finger structure 10 and an electronic device. The gold finger structure 10 includes multiple gold fingers 11 arranged in parallel on a PCB board 14, differential signal lines 12, and ground vias 13. At least two gold fingers 11 are connected to a group of differential signal lines 12. The differential signal lines 12 are routed on the surface of the PCB board 14, with the differential signal lines 12 forming a 10° angle with the gold fingers 11 in a parallel or perpendicular direction. The ground vias 13 are arranged above the upper edge of the gold finger 11 or below the lower edge of the gold finger 11, and are located between two adjacent gold fingers 11. The 10° routing ensures that the lengths of the differential signal lines 12 falling on the glass fiber and resin are as uniform as possible, making the dielectric constant more uniform and thereby improving signal integrity.

[0036] The following is an exemplary description of the golden finger structure 10 provided in the embodiment of the present invention:

[0037] See also Figure 1 , Figure 1 This is a structural schematic diagram of a gold finger structure 10 provided in an embodiment of the present invention. The gold finger structure 10 includes multiple gold fingers 11, differential signal lines 12 and ground through-holes 13 arranged in parallel on a PCB board 14. At least two gold fingers 11 are connected to a group of differential signal lines 12. The differential signal lines 12 are routed on the surface of the PCB board 14. The angle between the differential signal lines 12 and the gold fingers 11 in the parallel direction or the perpendicular direction is 10°. The ground through-hole 13 is arranged above the upper edge of the gold finger 11 or below the lower edge of the gold finger 11, and is located between the gaps between two adjacent gold fingers 11.

[0038] Depend on Figure 1 It can be seen that a plurality of gold fingers 11 are arranged in parallel on the PCB board 14. The gold finger 11 is connected to one end of the differential signal line 12, and the other end of the differential signal line 12 can be connected to a connector or a control chip. Optionally, the gold finger 11 can be fixed to the upper edge of the PCB board 14, and the connector or control chip can be fixed to the lower edge or center of the PCB board 14. In addition, the differential signal line 12 is routed on the surface of the PCB board 14. The PCB board 14 is generally a multi-layer board. If the line is routed on the inner layer, it will require additional vias, which will introduce via insertion loss and cause impedance discontinuity and other problems. The routing angle of the differential signal line 12 is 10°, as shown in the figure. Here, the 10° routing means that the angle between the differential signal line 12 and the vertical or horizontal direction is 10°.

[0039] In high-speed digital signal links, if the 45° routing method is still used, the differential signal lines 12 will fall on different positions on the substrate. Some positions will fall on the blank areas of the base material woven by the warp and weft threads, which will cause the problem of uneven dielectric constant. In high-speed digital signal links, the signal transmission rate is very high, and the problem of uneven dielectric constant can no longer be ignored. The uneven dielectric constant of the substrate will cause the transmission rate of the high-speed signal line to vary, thereby affecting the signal integrity. Using 10° routing can make the length of the signal line falling on the glass fiber and resin as consistent as possible, making the dielectric constant more uniform, thereby increasing signal integrity.

[0040] Furthermore, if Figure 1 It can be seen that the grounding via 13 is arranged above the upper edge of the gold finger 11 or below the lower edge of the gold finger 11 and is located between two adjacent gold fingers 11. By providing the grounding via 13, crosstalk caused to the signal output by the gold finger 11 can be reduced.

[0041] The gold finger structure 10 includes multiple gold fingers 11, differential signal lines 12, and ground vias 13 arranged in parallel on a PCB 14. The 10° routing ensures that the lengths of the differential signal lines 12 on the glass fiber and resin are as uniform as possible, making the dielectric constant more uniform and thus improving signal integrity. The ground vias 13 reduce crosstalk on the signals output by the gold fingers 11, thereby improving signal transmission quality.

[0042] Optionally, the PIN width of the gold finger 11 is greater than the line width of the differential signal line 12. The high-speed signal line width is different from the pad width of the gold finger 11. Due to the impedance requirements of the differential signal line 12, according to the stacking impedance design, the width of the differential signal line 12 should be smaller than the pad width of the gold finger 11.

[0043] By setting the PIN width of the gold finger 11 to be greater than the line width of the differential signal line 12, the wider gold finger 11 can provide a larger contact area, which helps to improve the connection reliability with the slot. The wider gold finger 11 causes a sudden change in the differential trace impedance. The reference layer can be appropriately hollowed out according to the stacking to ensure the continuity of the differential trace impedance and the integrity of the signal.

[0044] Preferably, the width of the differential signal line 12 is 20%-50% of the PIN width of the gold finger 11. By adjusting the distance between the gold finger 11 and the reference layer, impedance matching with the differential signal line 12 can be more easily achieved. This is crucial for maintaining signal integrity and reducing signal reflections. Narrower differential traces can reduce crosstalk between adjacent signal lines because the coupling between them decreases as the spacing increases.

[0045] In one possible implementation, see Figure 2 , Figure 2 This is a connection diagram of a grounding gold finger 112 provided in an embodiment of the present invention. The gold finger 11 includes a grounding gold finger 112 and a non-grounding gold finger 111. The width of the connection line connecting the grounding gold finger 112 to the grounding through hole 13 is the same as the width of the grounding gold finger 112.

[0046] The grounding fingers 112 provide a ground path, ensuring a good reference point for the device to reduce noise and interference. The non-grounding fingers 111 are used to transmit signals or power. They can transmit data signals, power voltage, and more.

[0047] The width of the connection line connecting the grounding gold finger 112 to the grounding through hole 13 is set to be the same as the width of the grounding gold finger 112 because the gold finger 11 will be designed with a window and the grounding signal does not need impedance control, which can ensure current flow and is more beautiful.

[0048] Furthermore, in one possible implementation, see Figure 3 , Figure 3 This is a schematic diagram of a shared ground network 15 provided by an embodiment of the present invention. A plurality of ground fingers 112 are connected through ground vias to form the shared ground network 15 .

[0049] The shared ground network 15 can provide a low-impedance ground return path for the circuit, thereby helping to improve signal integrity and reduce noise.

[0050] Optionally, the protocol used by the gold finger 11 is the PCIE 5.0 protocol, and the rate of the differential signal line 12 is 32GT / s.

[0051] Optionally, PCB 14 has at least six layers. The requirement of at least six layers ensures that a reference ground layer is available after hollowing out the second / fifth reference ground layer for gold finger 11. Hollowing out the reference ground layer below gold finger 11 allows the cross-layer reference ground network at gold finger 11 to reference the third / fourth layer to increase impedance, thereby reducing the impedance drop caused by pad width exceeding high-speed trace width and ensuring that the impedance at gold finger 11 is as consistent as possible with the trace impedance. The specific number of layers can be calculated based on the stackup calculation based on board thickness, impedance, and other factors.

[0052] In a possible implementation, the distances from the center 131 of the grounding via to the centers 113 of two adjacent gold fingers on both sides of the grounding via 13 are equal.

[0053] See also Figure 4 , Figure 4 A schematic diagram of the setting of a grounding through hole 13 provided in an embodiment of the present invention. For the return ground treatment of the edge of the gold finger 11, the distance from the center 131 of the grounding through hole to the center 113 of the two adjacent gold fingers on both sides of the grounding through hole 13 is equal, that is, the grounding through hole 13 is located in the center of the two adjacent gold fingers 11 and is arranged above the upper edge of the gold finger 11 or below the lower edge of the gold finger 11.

[0054] Optionally, the pin pitch of the gold finger 11 is 0.4mm, so the horizontal distance between the center point 131 of the ground via and the adjacent gold finger 11 is 0.2mm. Vertically, the ground vias at the top and bottom edges of the gold finger 11 are aligned with the center point 113 of the gold finger. The vertical distance between the upper and lower edges of the ground via 13 and the upper and lower edges of the gold finger 11 does not exceed 0.55mm. Adding such ground vias 13 can reduce crosstalk caused by the signals output by the gold finger 11.

[0055] Optionally, the hole diameter and pad diameter of the ground through hole 13 are 8 mil and 14 mil respectively.

[0056] Furthermore, an embodiment of the present invention also provides an electronic device, comprising the above-mentioned gold finger structure 10 and electronic components; some electronic components are connected through the gold finger structure 10.

[0057] By connecting various electronic components through the gold finger structure 10, the signal transmission of the electronic device can be more complete and the signal quality can be improved.

[0058] In summary, embodiments of the present invention provide a gold finger structure and electronic device. The gold finger structure includes multiple gold fingers arranged in parallel on a PCB, differential signal lines, and ground vias. At least two gold fingers are connected to a differential signal line, which is routed on the surface of the PCB. The differential signal line forms a 10° angle with the gold fingers in a direction parallel or perpendicular to the gold fingers. The ground vias are located above the upper edge of the gold finger or below the lower edge of the gold finger, and are located between two adjacent gold fingers. The 10° routing ensures that the length of the differential signal line on the glass fiber and resin is as uniform as possible, making the dielectric constant more uniform and thereby improving signal integrity. The ground vias reduce crosstalk caused by signals output by non-grounded gold fingers. Multiple grounded gold fingers are connected through the ground vias to form a shared ground network, which provides a low-impedance ground loop for the circuit, helping to improve signal integrity and reduce noise. The width of the connecting trace of the ground via is the same as that of the ground gold finger, which reduces the inductance of the ground connection.

[0059] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A gold finger structure, characterized in that: It includes multiple gold fingers, differential signal lines and grounding through holes arranged in parallel on the PCB board; At least two of the gold fingers are connected to a group of differential signal lines, the differential signal lines are routed on the surface of the PCB board, and the angle between the differential signal lines and the parallel direction or the perpendicular direction of the gold fingers is 10°; The grounding through hole is arranged above the upper edge of the gold finger or below the lower edge of the gold finger, and is located between the gaps between two adjacent gold fingers.

2. The golden finger structure according to claim 1, characterized in that: The PIN width of the gold finger is greater than the line width of the differential signal line.

3. The golden finger structure according to claim 2, characterized in that: The line width of the differential signal line is 20%-50% of the PIN width of the gold finger.

4. The golden finger structure according to claim 1, characterized in that: The gold fingers include grounded gold fingers and non-grounded gold fingers; The width of the connection line connecting the grounding gold finger to the grounding through hole is the same as the width of the grounding gold finger.

5. The golden finger structure according to claim 4, characterized in that: A plurality of the grounding gold fingers are connected through the grounding through holes to form a shared grounding network.

6. The golden finger structure according to claim 1 or 2, characterized in that: The protocol used by the gold finger is the PCIE5.0 protocol, and the rate of the differential signal line is 32GT / s.

7. The gold finger structure according to claim 1, characterized in that: The PCB board is at least a 6-layer board.

8. The gold finger structure according to claim 1, characterized in that: The distances from the center of the grounding through hole to the centers of two adjacent gold fingers on both sides of the grounding through hole are equal.

9. The gold finger structure according to claim 1, characterized in that: The aperture and pad diameter of the ground through hole are 8 mil and 14 mil respectively.

10. An electronic device, characterized in that: Comprising the gold finger structure and electronic components according to any one of claims 1 to 9; Some of the electronic components are connected via the gold finger structure.

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