FPC board structure capable of being bent at high strength
By designing a baffle and arc-shaped support structure on the FPC board, the problem of FPC board breakage during high-intensity bending is solved, the heat dissipation effect is improved, and the service life is extended.
Patent Information
- Application Number
- CN202422582049.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-25
AI Technical Summary
Existing FPC boards are prone to deformation and breakage after high-intensity bending or stretching, and heat is difficult to dissipate after folding, leading to aging damage.
A structure including a circuit board body, a base plate, a blocking plate and a snap assembly was designed. The blocking plate supported the bending part to avoid direct contact and stacking, and the arc-shaped support plate and the heat dissipation mesh plate were used to improve the bending strength and heat dissipation effect.
The high-strength bending performance of the FPC board is improved to prevent breakage after folding, and the heat is effectively dissipated through the heat dissipation structure to extend the service life.
Smart Images

Figure CN223348924U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to an FPC board structure capable of being bent with high strength. Background Art
[0002] With the development of thin and lightweight mobile electronics, flexible circuit boards (FPC boards for short) have the characteristics of light weight and dense wiring. They are widely used in electronic products such as mobile phones and computers. The use of FPC boards has increased significantly, and the installation space is becoming increasingly narrow. Due to the bendable nature of FPC boards, they are often installed by folding. However, after high-intensity bending or external force stretching, the FPC boards will deform and break in the bending area of the FPC boards. Moreover, when the folded FPC boards are stacked together, the heat is not easily dissipated, which will accelerate the aging and damage of the FPC boards. Therefore, the FPC boards in the existing technology have the disadvantages of poor high-intensity bending performance and poor heat dissipation effect after bending. Utility Model Content
[0003] The purpose of the present invention is to provide a high-strength bendable FPC board structure to solve the above-mentioned problems of poor bending performance and poor heat dissipation effect of the circuit board.
[0004] To achieve the above purpose, the present invention provides the following technical solutions: a high-strength bendable FPC board, comprising
[0005] Circuit board body;
[0006] A bottom plate, wherein the bottom plate is provided with a contoured groove, and the first connecting portion of the circuit board body is disposed in the contoured groove;
[0007] a blocking plate rotatably connected relative to the base plate, the blocking plate being capable of flipping over and pressing the first connection portion, the blocking plate and the base plate being fixed by bolts, one end of the blocking plate being provided with an arcuate support plate, the arcuate support plate being engaged with the bent portion of the circuit board body;
[0008] The second connecting portion of the circuit board body is supported by the blocking plate, and the snap assembly is used to fix the second connecting portion and the blocking plate.
[0009] Preferably, a wing plate is provided on each side of the bottom plate, and a first locking hole is provided on the wing plate.
[0010] Preferably, the movable end of the blocking plate is provided with an L-shaped connecting plate, and the horizontal section of the connecting plate is provided with a second locking hole, and the second locking hole and the first locking hole cooperate therewith.
[0011] Preferably, a connecting piece is further included, which is used to connect the bottom plate and the blocking plate. The connecting piece includes a U-shaped plate and an inserting plate. The blocking plate is rotatably connected to the U-shaped plate, and the inserting plate is telescopically connected to the bottom plate.
[0012] Preferably, an installation space is provided on the bottom plate, a blocking portion is provided at the opening of the installation space, a compression spring is provided in the installation space, and a slider matching the installation space is provided at one end of the insert plate extending into the installation space.
[0013] Preferably, a limit plate is provided on the bottom plate, and the vertical section of the connecting plate cooperates with the limit plate. When the vertical section of the connecting plate abuts against the limit plate, the blocking plate is parallel to the bottom plate.
[0014] Preferably, a heat dissipation mesh plate is provided on both sides of the bottom plate.
[0015] Preferably, the molded cavity is further included, wherein a positioning sticker is provided in the molded cavity, and the positioning sticker may include urethane foam.
[0016] Preferably, the snap assembly includes a pressure plate and a vertical plate. The vertical plate can be inserted into slots provided on both sides of the blocking plate. The pressure plate can press the second connecting portion that is bent and rests against the blocking plate.
[0017] Preferably, one side of the pressing plate is provided with an anti-slip layer.
[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0019] The utility model provides a blocking plate to avoid direct contact with the folded circuit board body, thereby preventing heat from accumulating and being unable to dissipate. The curved support plate is provided to support the bent plate of the circuit board body, so that there is a support at the bent part, which can prevent the bent part from breaking. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is a schematic diagram of the structure of the utility model;
[0021] Figure 2 This is a schematic diagram of the structure of the present invention without the circuit board body;
[0022] Figure 3 This is a front view structural diagram of the present invention with the circuit board body removed;
[0023] Figure 4 It is a cross-sectional view of the local structure of the utility model.
[0024] In the figure: 1. Circuit board body; 2. Bottom plate; 3. Blocking plate; 4. First locking hole; 5. Second locking hole; 6. Imitation groove; 7. Arc-shaped support plate; 8. Wing plate; 9. U-shaped plate; 10. Insert plate; 11. Compression spring; 12. Slider; 13. Connecting plate; 14. Heat dissipation mesh plate; 15. Limiting plate; 16. Pressing plate; 17. Vertical plate; 18. Anti-slip layer; 19. Slot; 20. Wedge plate; 21. Mounting cavity; 22. Reset spring; 23. Limiting groove; 24. Limiting rod; 25. Mounting space. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0026] With the development of thin and lightweight mobile electronics, flexible circuit boards (FPC boards for short) have the characteristics of light weight and dense wiring. They are widely used in electronic products such as mobile phones and computers. The use of FPC boards has increased significantly, and the installation space is becoming increasingly narrow. Due to the bendable nature of FPC boards, they are often installed by folding. However, after high-intensity bending or external force stretching, the FPC boards will deform and break in the bending area of the FPC boards. Moreover, when the folded FPC boards are stacked together, the heat is not easily dissipated, which will accelerate the aging and damage of the FPC boards. Therefore, the FPC boards in the existing technology have the disadvantages of poor high-intensity bending performance and poor heat dissipation effect after bending.
[0027] To solve the above problems, refer to Figures 1 to 4 As shown, the utility model discloses a high-strength bendable FPC board structure, which includes a circuit board body 1, a bottom plate 2, a barrier plate 3, a connector and a snap assembly. Figures 1 to 4 The structure, connection relationship and working principle of the above modules are described in detail.
[0028] For the convenience of description, we define the bending part of the circuit board body 1 as a bending portion, and the parts of the circuit board body 1 connected to the bending portion are respectively referred to as the first connection portion and the second connection portion. In the embodiment, the first connection portion is supported by the base plate 2 and is pressed onto the base plate 2 through the blocking plate 3. The blocking plate 3 is connected to the base plate 2 through a connecting piece to provide support for the second connection portion and the bending portion, which can prevent the bending portion from being damaged by excessive bending, and can separate the first connection portion and the second connection portion to prevent the two from being stacked and causing heat to be difficult to dissipate. The snap assembly is used to fix the second connection portion on the blocking plate 3.
[0029] Preferably, the bottom plate 2 is provided with a contoured groove 6, into which the first connection portion of the circuit board body 1 can be placed. To avoid interference with the bent portion of the circuit board body 1, one end of the contoured groove 6 can be provided with an escape opening to allow the bent portion to be positioned away. Of course, the first connection portion can completely fit within the contoured groove 6 or be smaller than the contoured groove 6.
[0030] See Figures 1 to 3 As shown, the blocking plate 3 is connected to the base plate 2 through a connecting member, and the blocking plate 3 can rotate relative to the base plate 2. Specifically, the connecting member includes a U-shaped plate 9 and an inserting plate 10. The inserting plate 10 is telescopically connected relative to the base plate 2. The U-shaped plate 9 and the blocking plate 3 are rotatably connected via a rotating shaft, that is, the blocking plate 3 can rotate relative to the U-shaped plate 9, and indirectly the blocking plate 3 can rotate relative to the base plate 2.
[0031] Specifically, an installation space 25 is provided on the base plate 2, a blocking portion is provided at the opening of the installation space 25, a compression spring 11 is provided in the cavity of the installation space 25, and one end of the plug-in board 10 extending into the installation space 25 is connected to a slider 12, which matches the installation space 25. The width of the slider 12 is greater than the width of the plug-in board 10. Due to the obstruction of the blocking portion, the slider 12 cannot be moved out of the installation space 25. Applying pressure to the blocking plate 3 can make it tend to move toward the base plate 2, until the first connecting portion of the circuit board body 1 is pressed between the base plate 2 and the blocking plate 3.
[0032] Furthermore, a wing plate 8 is provided on each side of the bottom plate 2, and a first locking hole 4 is provided on the wing plate 8. When assembling the circuit board body 1, the bottom plate 2 can be assembled into the product by bolts, because the circuit board body 1 and the bottom plate 2 are fixed in one place. By assembling the bottom plate 2 relative to the product, the connection between the circuit board body 1 and the product is achieved, which can protect the circuit board structure and avoid direct damage to the circuit board installation. The movable end of the blocking plate 3 is provided with an L-shaped connecting plate 13, and the horizontal section of the connecting plate 13 is provided with a second locking hole 5. When the blocking plate 3 is flipped to be parallel to the bottom plate 2, the locking hole on the horizontal section of the connecting plate 13 and the locking hole on the wing plate 8 can overlap. A bolt can be passed through the two overlapping locking holes, and the blocking plate 3 can be fixed while fixing the bottom plate 2.
[0033] Furthermore, an arc-shaped support plate 7 is provided on one end of the blocking plate 3 close to the avoidance opening. The arc-shaped support plate 7 cooperates with the bending portion of the circuit board body 1 to support the bending portion to prevent the circuit board body 1 from breaking due to improper force when bending; a heat dissipation mesh plate 14 is provided on both sides of the blocking plate 3 to prevent the heat from being unable to dissipate due to the stacking of the circuit board bodies 1.
[0034] Furthermore, a limit plate 15 is provided on the bottom plate 2, and the vertical section of the connecting plate 13 can cooperate with the limit plate 15. When the vertical section of the connecting plate 13 abuts against the limit plate 15, the blocking plate 3 is just parallel to the bottom plate 2. When the connecting plate 13 is fixed, the blocking plate 3 will be pressed down during the process. The limit plate 15 can keep the blocking plate 3 pressed down as a whole synchronously to limit the flipping of the blocking plate 3.
[0035] See Figure 3 As shown, the snap assembly includes a pressure plate 16 and a vertical plate 17. The vertical plates 17 can be inserted into slots 19 provided on both sides of the barrier plate 3. The pressing surface of the pressure plate 16 is provided with an anti-slip layer 18, and the pressure plate 16 can press the second connecting portion that is bent and resting against the barrier plate 3. The vertical plates 17 have grooves on both sides, and the side walls of the slots 19 are provided with retractable wedge plates 20 that can be snapped into the grooves, thereby securing the two together.
[0036] Specifically, a mounting cavity 21 is provided on the side wall of the slot 19, and a return spring 22 is provided in the mounting cavity 21. One end of the wedge plate 20 extends into the mounting cavity 21 and is connected to the return spring 22. Limiting grooves 23 are provided on both sides of the wedge plate 20, and limiting rods 24 are provided on both sides of the wedge plate 20. The limiting rods 24 can extend into the limiting grooves 23 to control the stroke of the wedge plate 20 relative to the mounting cavity 21, so as to prevent the wedge plate 20 from being ejected from the mounting cavity 21 under the action of the return spring 22. During operation, the vertical plate extends into the slot 19, abutting against the oblique cut surface of the wedge plate 20 and continuing to extend into the slot 19. The wedge plate 20 can compress the return spring 22 until the entire wedge plate 20 extends into the installation cavity 21. The vertical plate is blocked by the bottom of the slot 19 and cannot continue to move downward. The wedge plate 20 is facing the groove so that there is no obstruction. Under the action of the return spring 22, the wedge plate 20 extends out of the installation cavity 21. The part of the wedge plate 20 extending out of the installation cavity 21 is stuck in the groove, thereby completing the fixation of the vertical plate relative to the slot 19.
[0037] Preferably, positioning stickers are provided in the profiling cavity and on the blocking plate 3. The positioning stickers may include urethane foam to position the first connecting part and the second connecting part to prevent displacement during the fixing process.
[0038] Working principle: stick the first connecting part of the circuit board body 1 on the base plate 2, flip the blocking plate 3 to be located above the first connecting part, and then install the base plate 2 to the position to be assembled of the product. During the process, the blocking plate 3 is also fixed. At this time, the bending part can be bent, and the bending part is bent close to the arc-shaped support plate 7. After bending, the second connecting part is located above the blocking plate 3. The second connecting part and the blocking plate 3 are temporarily fixed by the positioning sticker, and then the second connecting part is further fixed to the blocking plate 3 by the snap-fit part.
[0039] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.
[0040] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A high-strength bendable FPC board structure, characterized in that: include: Circuit board body; A bottom plate, wherein the bottom plate is provided with a contoured groove, and the first connecting portion of the circuit board body is disposed in the contoured groove; a blocking plate rotatably connected relative to the base plate, the blocking plate being capable of flipping over and pressing the first connection portion, the blocking plate and the base plate being fixed by bolts, one end of the blocking plate being provided with an arcuate support plate, the arcuate support plate being engaged with the bent portion of the circuit board body; The second connecting portion of the circuit board body is supported by the blocking plate, and the snap assembly is used to fix the second connecting portion and the blocking plate.
2. The high-strength bendable FPC board structure according to claim 1, characterized in that: A wing plate is respectively provided on both sides of the bottom plate, and a first locking hole is provided on the wing plate.
3. The high-strength bendable FPC board structure according to claim 2, characterized in that: An L-shaped connecting plate is provided at the movable end of the blocking plate, and a second locking hole is provided at the horizontal section of the connecting plate, and the second locking hole and the first locking hole cooperate with each other.
4. The high-strength bendable FPC board structure according to claim 3, characterized in that: It also includes a connecting piece, which is used to connect the bottom plate and the blocking plate. The connecting piece includes a U-shaped plate and an inserting plate. The blocking plate is rotatably connected to the U-shaped plate, and the inserting plate is telescopically connected to the bottom plate.
5. The high-strength bendable FPC board structure according to claim 4, characterized in that: An installation space is provided on the bottom plate, a blocking portion is provided at the opening of the installation space, a compression spring is provided in the installation space, and a sliding block matching the installation space is provided at one end of the inserting plate extending into the installation space.
6. The high-strength bendable FPC board structure according to claim 5, characterized in that: A limiting plate is provided on the bottom plate, and the vertical section of the connecting plate cooperates with the limiting plate. When the vertical section of the connecting plate abuts against the limiting plate, the blocking plate is parallel to the bottom plate.
7. The high-strength bendable FPC board structure according to claim 1, characterized in that: A heat dissipation mesh plate is respectively provided on both sides of the bottom plate.
8. The high-strength bendable FPC board structure according to claim 1, characterized in that: It also includes an imitation cavity, in which a positioning sticker is provided. The positioning sticker can include urethane foam.
9. The high-strength bendable FPC board structure according to claim 8, characterized in that: The buckle assembly includes a pressing plate and a vertical plate. The vertical plates can be inserted into slots provided on both sides of the blocking plate. The pressing plate can press the second connecting portion that is bent and rests on the blocking plate.
10. The high-strength bendable FPC board structure according to claim 9, characterized in that: One side of the pressing plate is provided with an anti-slip layer.