Power module and vehicle

Abstract

The utility model discloses a power module and a vehicle, relates to the technical field of vehicles, and aims to solve the problems that a plurality of circuit assemblies are reasonably arranged and the occupied space of the plurality of circuit assemblies is reduced. The power module comprises a plurality of circuit components and a packaging component. The packaging assembly comprises a mounting cavity, and the plurality of circuit assemblies are at least partially located in the mounting cavity and connected with the packaging assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, in particular to a power module and a vehicle. Background Art

[0002] In the field of new energy vehicles, new energy vehicles include multiple circuit components inside, which are responsible for managing and controlling various electrical systems and functions of new energy vehicles.

[0003] However, in the related art, each circuit component is placed separately, resulting in multiple circuit components occupying too much space and an unreasonable layout. Utility Model Content

[0004] The purpose of the present utility model is to provide a power module and a vehicle, aiming to solve the problem of how to reasonably arrange multiple circuit components and reduce the space occupied by the multiple circuit components.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] In a first aspect, an embodiment of the present application provides a power module, the power module comprising a plurality of circuit components and a packaging component. The packaging component comprises a mounting cavity, and the plurality of circuit components are at least partially located in the mounting cavity and connected to the packaging component.

[0007] A power module provided in an embodiment of the present application encapsulates multiple circuit components through a packaging component, eliminating the need to individually package each circuit board. This improves the integration of the power module, reduces the space occupied by the power module in the vehicle, improves the rationality of the layout of the power module, and increases the power density.

[0008] In some embodiments, a circuit assembly includes a circuit board, a plurality of electrical components, and connection terminals. The circuit board is positioned within the mounting cavity and includes a first metal layer. The plurality of electrical components are connected to the first metal layer. The connection terminals protrude from and connect to the first metal layer. The connection terminals are inserted into and exposed from the package assembly, and the connection terminals are electrically connected to the plurality of electrical components via the first metal layer.

[0009] A power module provided in an embodiment of the present application realizes the connection between electrical components and connection terminals by providing a first metal layer of a circuit board, reduces wiring arrangement, and increases connection reliability.

[0010] In some embodiments, the circuit board further includes a second metal layer and an insulating layer. The insulating layer is connected between the first metal layer and the second metal layer, and the second metal layer is connected to the packaging component.

[0011] A power module provided in an embodiment of the present application, through the provision of a second metal layer and an insulating layer, the second metal layer can realize the connection between the circuit board and the packaging component, thereby improving the convenience of connection, and the insulating layer realizes insulation between the first metal layer and the second metal layer, thereby improving the reliability of signal transmission of the circuit component.

[0012] In some embodiments, the multiple circuit components include a first circuit component, a second circuit component, and a third circuit component, the first circuit component is arranged in a first plane, the third circuit component is arranged in a second plane, the second circuit component is located in the first plane and / or the second plane, and the second plane is parallel to the first plane.

[0013] A power module provided in an embodiment of the present application arranges multiple circuit components on two parallel planes through the arrangement of a first circuit component, a second circuit component, and a third circuit component, thereby shortening the length of the power module, improving the structural compactness of the power module, and improving the utilization rate of materials.

[0014] In some embodiments, along the thickness direction of the circuit component, the orthographic projection of the circuit component located on the first plane coincides with the orthographic projection of the circuit component located on the second plane.

[0015] The power module provided in the embodiment of the present application can further reduce the volume occupied by multiple circuit components in the installation cavity through the above-mentioned configuration, thereby improving the integration of the power module.

[0016] In some embodiments, the connecting terminal protrudes and is connected to the circuit board and is arranged on the same side as the electrical component. The connecting terminal is inserted and exposed to the packaging component. The protruding direction of the connecting terminal of the circuit component located on the first plane is opposite to the protruding direction of the connecting terminal of the circuit component located on the second plane.

[0017] A power module provided in an embodiment of the present application can facilitate the extension of the connecting terminals from the packaging component to achieve connection by setting the protruding direction of the connecting terminals, and the electrical components and the connecting terminals are arranged on the same side, which can reduce the probability of mutual interference between oppositely arranged circuit components.

[0018] In some embodiments, the inner wall shape of the packaging component matches the shape of the first circuit component, the second circuit component, and the third circuit component located in the mounting cavity, and the inner wall is connected to the circuit board of the first circuit component, the circuit board of the second circuit component, and the circuit board of the third circuit component.

[0019] A power module provided in an embodiment of the present application improves the wrapping of the packaging component for the circuit component by setting the packaging component, thereby improving the shock resistance of the power module during use, and the process is simple.

[0020] In some embodiments, the power module further includes a first heat exchange structure, and the first heat exchange structure is sandwiched between the circuit component located on the first plane and the circuit component located on the second plane.

[0021] A power module provided in an embodiment of the present application can timely exchange heat for circuit components through the setting of a first heat exchange structure, maintain the circuit components within a preset temperature range, protect the circuit components, and reduce the probability of overheating. In addition, the position setting of the first heat exchange structure only requires the use of one first heat exchange structure to achieve heat exchange for circuit components located on both sides of the first heat exchange structure, thereby reducing the space occupied by the first heat exchange structure in the power module and improving the utilization efficiency of the first heat exchange structure.

[0022] In some embodiments, the first heat exchange structure is provided with a heat exchange channel running through it, with both ends of the heat exchange channel exposed to the packaging component.

[0023] A power module provided in an embodiment of the present application can allow a heat exchange medium to flow into the heat exchange channel through the provision of a heat exchange channel, thereby exchanging heat with the circuit board, further improving the heat exchange efficiency.

[0024] In some embodiments, the first heat exchange structure includes a plurality of heat exchange elements located in the heat exchange flow channel and connected to the first heat exchange structure.

[0025] A power module provided in an embodiment of the present application increases the contact area between the heat exchange medium flowing into the heat exchange channel and the internal space of the heat exchange channel through the setting of the heat exchange component, extends the flow path of the heat exchange medium, and facilitates sufficient contact between the heat exchange medium and the space inside the heat exchange channel, thereby improving the heat exchange capacity of the first heat exchange structure.

[0026] In some embodiments, multiple circuit components are disposed in the same plane.

[0027] The power module provided in the embodiment of the present application can facilitate the preparation of the power module and the installation of the power module in the vehicle through the above-mentioned configuration.

[0028] In some embodiments, the packaging assembly includes a base plate and a packaging shell. The circuit board is mounted on the base plate. The packaging shell and the base plate together form a mounting cavity. The connection terminals are inserted and exposed in the packaging shell. At least a portion of the base plate and the packaging shell serves as a second heat exchange structure.

[0029] A power module provided in an embodiment of the present application can facilitate heat exchange of electrical components on a circuit board through a second heat exchange structure, thereby increasing the service life of the circuit board and improving the safety of the circuit board.

[0030] In some embodiments, the electrical components and the connection terminals are located on a side of the circuit board facing away from the bottom plate, and the bottom plate is the second heat exchange structure.

[0031] In a power module provided by an embodiment of the present application, since the connection terminals are inserted into the packaging shell and the bottom plate is in contact with the circuit board, the heat exchange efficiency of the second heat exchange structure to the circuit board can be improved. In addition, since the bottom plate structure is flat, it is convenient to prepare it into the second heat exchange structure, thereby improving the preparation efficiency of the power module.

[0032] In some embodiments, the package case includes a cover plate, an enclosure portion, and a connecting portion. The cover plate and the bottom plate are located on both sides of the enclosure portion, and the cover plate, the bottom plate, and the enclosure portion together form a mounting cavity. The connecting portion is filled between the circuit board and the cover plate and is connected to the circuit board, the cover plate, and the enclosure portion.

[0033] A power module provided in an embodiment of the present application can improve the connection strength among a circuit board, a cover plate, and a surrounding portion by providing a connecting portion, thereby improving connection reliability.

[0034] In some embodiments, the cover plate is provided with a filling hole extending through the cover plate in the thickness direction, and the connecting portion is at least partially located in the filling hole.

[0035] A power module provided in an embodiment of the present application can deliver a connecting portion to the interior of a mounting cavity through a filling hole. A cover plate is first placed on the surrounding portion and then the connecting portion is filled. This can control the height and volume of the entire power module, thereby reducing the space occupied by the power module and improving the compactness of the structure of the power module.

[0036] In some embodiments, the packaging shell further includes a partition portion, which is located in the installation cavity and connected to the surrounding portion, and is used to separate at least two circuit components.

[0037] A power module provided in an embodiment of the present application can isolate circuit components by providing a separator, thereby reducing the probability of interference between adjacent circuit components.

[0038] In some embodiments, the multiple circuit components include an inverter circuit component, a charging circuit component, and a DC circuit component. The charging circuit component and the DC circuit component are arranged in the same direction, and the inverter circuit component is located on one side of the charging circuit component.

[0039] A power module provided in an embodiment of the present application can rationally layout multiple circuit components through the above-mentioned configuration, thereby reducing the length of the long side of the power module, having strong applicability to different scenario requirements, and high space utilization.

[0040] In some embodiments, the inverter circuit assembly includes an inverter input terminal and an inverter output terminal inserted into and exposed outside the enclosure.

[0041] A power module provided in an embodiment of the present application facilitates the connection between the inverter circuit component and other components through the above-mentioned configuration.

[0042] In some embodiments, the inverter input terminal and the inverter output terminal are arranged along the thickness direction of the bottom plate, and at least part of the surrounding portion is sandwiched between the inverter input terminal and the inverter output terminal.

[0043] A power module provided in an embodiment of the present application can, through the above configuration, block the inverter input terminal and the inverter output terminal, thereby reducing the probability of interference between the two.

[0044] In some embodiments, the inverter circuit assembly further includes a driving connection end embedded in and exposed outside the partition portion.

[0045] A power module provided in an embodiment of the present application facilitates the connection between an inverter circuit component and a vehicle drive motor by providing a drive connection terminal.

[0046] In some embodiments, multiple circuit components are arranged along the same direction, and the multiple circuit components include a charging circuit component and a DC circuit component.

[0047] The power module provided in the present application can improve the integration of the charging circuit assembly and the DC circuit assembly through the above-mentioned configuration. In some embodiments, the DC circuit assembly includes a DC primary circuit assembly and a DC secondary circuit assembly. The DC primary circuit assembly is located between the charging circuit assembly and the DC secondary circuit assembly.

[0048] A power module provided in an embodiment of the present application, through the above-mentioned configuration, enables the DC circuit component to be easily connected to other structures of the vehicle and has a reasonable arrangement.

[0049] In some embodiments, the electrical component of the DC secondary circuit assembly includes a first chip, there are multiple first chips, and the first chips correspond to the connection terminals of the DC secondary circuit assembly one by one.

[0050] A power module provided in an embodiment of the present application improves the anti-interference performance between the first chips, reduces the probability of crosstalk between multiple first chips, improves the control accuracy of the on and off of the first chip, and improves the stability of the power module operation by setting the connection terminals of the first chip and the DC secondary circuit component in a one-to-one correspondence.

[0051] In some embodiments, the electrical components of the DC primary circuit assembly include a second chip, and the electrical components of the charging circuit assembly include a third chip, and the second chip and the third chip are arranged in the same direction.

[0052] An embodiment of the present application provides a power module in which the second chip and the third chip are arranged in the same direction, thereby facilitating assembly of the second chip and the third chip. In some embodiments, a direction of the second chip intersecting the arrangement direction of the second chip and the third chip includes a first side and a second side, and the connection terminals of the DC primary circuit assembly include a first drive terminal and a first power terminal respectively connected to the second chip, with the first drive terminal located on the first side and the first power terminal located on the second side.

[0053] A power module provided in an embodiment of the present application can reduce the probability of cross-interference between the drive circuit and the power circuit of the DC primary circuit component by arranging the first drive terminal and the first power terminal on both sides of the second chip.

[0054] In some embodiments, the direction of the third chip intersecting with the arrangement direction of the second chip and the third chip includes a third side and a fourth side, and the connection terminals of the charging circuit assembly include a second drive terminal and a second power terminal respectively connected to the third chip, the second drive terminal is located on the third side, and the second power terminal is located on the fourth side.

[0055] A power module provided in an embodiment of the present application can reduce the probability of cross-interference between the drive circuit and the power circuit of the DC primary circuit component by arranging the second drive terminal and the second power terminal on both sides of the third chip, thereby simplifying the circuit design routing.

[0056] In some embodiments, the first side and the third side are arranged on the same side, and the second side and the fourth side are arranged on the same side.

[0057] A power module provided in an embodiment of the present application can reduce the probability of interference between the drive circuit and the power circuit of the power module through the above-mentioned configuration, thereby improving the stability of the operation of the power module.

[0058] In some embodiments, the distance between the first driving terminal and the second chip is H1, the distance between the first power terminal and the second chip is H2, and H1 is smaller than H2.

[0059] A power module provided in an embodiment of the present application can reduce the value of stray inductance when the first driving terminal is connected to the second chip through the above-mentioned configuration, thereby improving the stability of signal transmission.

[0060] In some embodiments, the distance between the second driving terminal and the third chip is M1, the distance between the second power terminal and the third chip is M2, and M1 is smaller than M2.

[0061] A power module provided in an embodiment of the present application can reduce the value of stray inductance when the second drive terminal is connected to the third chip through the above-mentioned configuration, thereby improving the stability of signal transmission.

[0062] In a second aspect, an embodiment of the present application provides a vehicle, comprising any one of the above-mentioned power modules. By disposing the power module, the space utilization inside the vehicle can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0064] Figure 1 This is a schematic structural diagram of a vehicle in an embodiment of the present application;

[0065] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of a power module in a vehicle is shown;

[0066] Figure 3 for Figure 2 An exploded diagram of the power module shown;

[0067] Figure 4 for Figure 3 A schematic cross-sectional view of a circuit board of the power module shown;

[0068] Figure 5 for Figure 2 A schematic diagram of a three-dimensional structure of a partial structure of a power module shown from one perspective;

[0069] Figure 6 for Figure 5 A schematic top view of the portion of the structure shown;

[0070] Figure 7 for Figure 2 A schematic diagram of the three-dimensional structure of a partial structure of the power module shown in another perspective;

[0071] Figure 8 for Figure 7 A schematic top view of the portion of the structure shown;

[0072] Figure 9 for Figure 1 A perspective schematic diagram of another embodiment of a power module in a vehicle is shown from one perspective;

[0073] Figure 10 for Figure 9 A perspective schematic diagram of another embodiment of the power module shown in another perspective;

[0074] Figure 11 for Figure 9 An exploded diagram of the power module shown;

[0075] Figure 12 for Figure 9 A three-dimensional schematic diagram of a partial structure of the power module shown;

[0076] Figure 13 for Figure 12 A schematic top view of a portion of the structure of the power module shown;

[0077] Figure 14 for Figure 1 A perspective schematic diagram of another embodiment of the power module shown;

[0078] Figure 15 for Figure 14 A schematic top view of a portion of the structure of the power module shown;

[0079] Figure 16 for Figure 12 A schematic side view of a partial structure of the power module from one perspective;

[0080] Figure 17 for Figure 12 A schematic side view of a partial structure of a power module from another perspective is shown.

[0081] Reference numerals:

[0082] 10. Vehicle; 11. Body; 12. Wheel;

[0083] 100. Power module;

[0084] 110, packaging component; A1, mounting cavity;

[0085] 111, bottom plate; B1, second heat exchange structure;

[0086] 112, packaging shell; 1121, cover plate; B2, filling hole; 1122, surrounding portion; 1123, partition;

[0087] More than 120 circuit components;

[0088] 120a, a first circuit assembly; 120b, a second circuit assembly; 120c, a third circuit assembly;

[0089] Z1, circuit board; Z11, first metal layer; Z12, insulation layer; Z13, second metal layer;

[0090] Z2, electrical components;

[0091] Z3, connection terminal;

[0092] 121, inverter circuit assembly; 1211, inverter input terminal; 1212, inverter output terminal; 1213, drive connection terminal;

[0093] 122, charging circuit assembly; C3 third chip; E1 second drive terminal; E2 second power terminal;

[0094] 123, DC circuit assembly; 1231, DC primary circuit assembly; C2, second chip; D1, first drive terminal; D2, first power terminal; 1232, DC secondary circuit assembly; C1, first chip; 130, first heat exchange structure; A2, heat exchange channel; 131, heat exchange component. DETAILED DESCRIPTION

[0095] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0096] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, unless otherwise specified, "plurality" means two or more.

[0097] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," and "communicated" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections. They may be directly connected, indirectly connected through an intermediary, or internally connected between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0098] In the embodiments of the present invention, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, article, or device comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, article, or device comprising the element.

[0099] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0100] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0101] The present application provides a vehicle 10. The vehicle 10 may be a pure electric vehicle 10, a hybrid electric vehicle 10, a plug-in hybrid electric vehicle 10, an extended-range electric vehicle 10, a fuel vehicle, etc. The vehicle 10 may also be a car, a van, a bus, a truck, a trailer, etc.

[0102] like Figure 1 As shown, the vehicle 10 includes a body 11 and wheels 12. The body 11 is used for passengers to sit and carry objects, and the wheels 12 are installed under the body 11 to support the body 11 and can roll on the road to enable the vehicle 10 to travel.

[0103] like Figures 2 to 3 As shown, the vehicle 10 further includes a power module 100, which includes a plurality of circuit components 120 and a package assembly 110. The package assembly 110 includes a mounting cavity A1, and the plurality of circuit components 120 are at least partially located in the mounting cavity A1 and connected to the package assembly 110.

[0104] The packaging assembly 110 may be a packaging shell that is fastened together, or may be formed by injection molding.

[0105] A power module 100 provided in an embodiment of the present application encapsulates multiple circuit components 120 through a packaging component 110, eliminating the need to individually package each circuit board Z1. This improves the integration of the power module 100, reduces the space occupied by the power module 100 in the vehicle 10, improves the layout rationality of the power module 100, and increases the power density.

[0106] like Figure 4 As shown, in some embodiments, the circuit assembly includes a circuit board Z1, multiple electrical components Z2, and a connection terminal Z3. Circuit board Z1 is located in mounting cavity A1 and includes a first metal layer Z11. Multiple electrical components Z2 are connected to first metal layer Z11. Connection terminal Z3 protrudes from and connects to first metal layer Z11. Connection terminal Z3 is inserted into and exposed from package assembly 110. Connection terminal Z3 is electrically connected to multiple electrical components Z2 via first metal layer Z11.

[0107] The electrical components Z2 include but are not limited to chips, thermistors, etc. The chips include but are not limited to silicon carbide chips, silicon-based chips, etc. Optionally, the chip and the first metal layer Z11 are connected by welding, and the welding is performed by nanosilver sintering.

[0108] Optionally, a plurality of mounting slots may be provided on the circuit board Z1, and the electrical components Z2 are embedded in the mounting slots.

[0109] Optionally, the electrical components Z2 are connected via the first metal layer Z11, with connection methods including, but not limited to, welding. Of course, the electrical components Z2 and the components and the connection terminals Z3 can also be connected via bonding wires, including, but not limited to, aluminum wires, gold wires, copper ribbons, and the like. Optionally, the electrical components Z2 are connected via aluminum wires.

[0110] Optionally, the circuit board Z1 includes but is not limited to a DBC board.

[0111] A power module 100 provided in an embodiment of the present application realizes connection between an electrical component Z2 and a connection terminal Z3 by disposing a first metal layer Z11 of a circuit board Z1, thereby reducing wiring arrangement and increasing connection reliability.

[0112] In some embodiments, the circuit board Z1 further includes a second metal layer Z13 and an insulating layer. The insulating layer is connected between the first metal layer Z11 and the second metal layer Z13. The second metal layer Z13 is connected to the package component 110.

[0113] Optionally, the material of the first metal layer Z11 includes copper, and the material of the insulating layer includes but is not limited to silicon nitride, aluminum oxide, aluminum nitride, etc.

[0114] A power module 100 provided in an embodiment of the present application, through the provision of a second metal layer Z13 and an insulating layer, the second metal layer Z13 can realize the connection between the circuit board Z1 and the packaging component 110, thereby improving the convenience of connection. The insulating layer realizes insulation between the first metal layer Z11 and the second metal layer Z13, thereby improving the reliability of signal transmission of the circuit component.

[0115] like Figures 5 to 8 As shown, in some embodiments, the plurality of circuit components 120 include a first circuit component 120a, a second circuit component 120b, and a third circuit component 120c, the first circuit component 120a is disposed in a first plane, the third circuit component 120c is disposed in a second plane, the second circuit component 120b is located in the first plane and / or the second plane, and the second plane is parallel to the first plane.

[0116] Illustratively, the first circuit assembly 120 a includes a compressor circuit assembly, the second circuit assembly 120 b includes a charging circuit assembly 122 , and the third circuit assembly 120 c includes a DC circuit assembly 123 .

[0117] A power module 100 provided in an embodiment of the present application arranges multiple circuit components 120 on two parallel planes through the arrangement of a first circuit component 120a, a second circuit component 120b, and a third circuit component 120c, thereby shortening the length of the power module 100, improving the structural compactness of the power module 100, and improving the utilization rate of materials.

[0118] In some embodiments, along the thickness direction of the circuit component, the orthographic projection of the circuit component located on the first plane coincides with the orthographic projection of the circuit component located on the second plane.

[0119] The power module 100 provided in the embodiment of the present application can further reduce the volume occupied by the multiple circuit components 120 in the installation cavity A1 through the above-mentioned configuration, thereby improving the integration of the power module 100.

[0120] In some embodiments, the connection terminal Z3 protrudes and is connected to the circuit board Z1 and is arranged on the same side as the electrical component Z2. The connection terminal Z3 is inserted into and exposed to the packaging component 110. The protruding direction of the connection terminal Z3 of the circuit component located on the first plane is opposite to the protruding direction of the connection terminal Z3 of the circuit component located on the second plane.

[0121] A power module 100 provided in an embodiment of the present application can facilitate the extension of the connection terminal Z3 from the packaging component 110 to achieve connection by setting the protruding direction of the connection terminal Z3, and the electrical component Z2 and the connection terminal Z3 are arranged on the same side, which can reduce the probability of mutual interference between oppositely arranged circuit components.

[0122] In some embodiments, the inner wall shape of the packaging component 110 matches the shape of the first circuit component 120a, the second circuit component 120b, and the third circuit component 120c located in the mounting cavity A1, and the inner wall is connected to the circuit board Z1 of the first circuit component 120a, the circuit board Z1 of the second circuit component 120b, and the circuit board Z1 of the third circuit component 120c.

[0123] The inner wall shape of the packaging component 110 matches the shape of the circuit board Z1 of the first circuit component 120a and the electrical component Z2 of the first circuit component 120a, the circuit board Z1 of the second circuit component 120b and the electrical component Z2 of the second circuit component 120b, and the circuit board Z1 of the third circuit component 120c and the electrical component Z2 of the third circuit component 120c.

[0124] Optionally, multiple circuit components 120 can be placed in a plastic packaging mold, and then multiple circuit board Z1 components can be wrapped by injection molding, and the packaging component 110 can be produced after drying.

[0125] Optionally, the packaging component 110 is made of an insulating material. The material of the packaging component 110 includes but is not limited to epoxy resin. As a polymer material, epoxy resin has high strength, wear resistance, corrosion resistance, high temperature resistance and high insulation ability.

[0126] A power module 100 provided in an embodiment of the present application improves the wrapping performance of the packaging component 110 for the circuit component by setting the packaging component 110, thereby improving the shock resistance of the power module 100 during use, and the process is simple.

[0127] In some embodiments, the power module 100 further includes a first heat exchange structure 130 . The first heat exchange structure 130 is sandwiched between the circuit component located on the first plane and the circuit component located on the second plane.

[0128] A power module 100 provided in an embodiment of the present application can timely exchange heat for circuit components through the setting of a first heat exchange structure 130, maintain the circuit components within a preset temperature range, protect the circuit components, and reduce the probability of overheating. In addition, the position setting of the first heat exchange structure 130 only requires the use of one first heat exchange structure 130 to achieve heat exchange for circuit components located on both sides of the first heat exchange structure 130, thereby reducing the space occupied by the first heat exchange structure 130 in the power module 100 and improving the utilization efficiency of the first heat exchange structure 130.

[0129] In some embodiments, the first heat exchange structure 130 is provided with a heat exchange channel A2 running through it, with both ends of the heat exchange channel A2 exposed to the packaging component 110 .

[0130] Optionally, the material of the first heat exchange structure 130 includes copper, and a heat exchange medium can flow through the heat exchange channel A2.

[0131] In a power module 100 provided in an embodiment of the present application, a heat exchange channel A2 is provided so that a heat exchange medium can flow into the heat exchange channel A2, thereby exchanging heat with the circuit board Z1, further improving the heat exchange efficiency.

[0132] In some embodiments, the first heat exchange structure 130 includes a plurality of heat exchange elements 131 located in the heat exchange channel A2 and connected to the first heat exchange structure 130 .

[0133] A power module 100 provided in an embodiment of the present application increases the contact area between the heat exchange medium flowing into the heat exchange channel A2 and the internal space of the heat exchange channel A2 through the setting of the heat exchange element 131, extends the flow path of the heat exchange medium, and facilitates sufficient contact between the heat exchange medium and the space inside the heat exchange channel A2, thereby improving the heat exchange capacity of the first heat exchange structure 130.

[0134] In some embodiments, the heat exchange element 131 is cylindrical.

[0135] Optionally, along the thickness direction of the power module 100 , the orthographic projection of the heat exchange element 131 covers the orthographic projection of the electrical component Z2 .

[0136] In a power module 100 provided by an embodiment of the present application, the heat exchange element 131 is cylindrical, which can reduce the flow resistance of the heat exchange medium and improve the heat exchange capacity of the first heat exchange structure 130.

[0137] Please refer to Figures 9 to 15 As shown, in some embodiments, multiple circuit components 120 are disposed in the same plane.

[0138] The power module 100 provided in an embodiment of the present application can facilitate the preparation of the power module 100 and the installation of the power module 100 in the vehicle 10 through the above-mentioned configuration.

[0139] Please refer to Figure 12 、 Figure 15 As shown, in some embodiments, the packaging assembly 110 includes a base plate 111 and a packaging shell 112. The circuit board Z1 is mounted on the base plate 111. The packaging shell 112 and the base plate 111 together enclose a mounting cavity A1. The connection terminal Z3 is inserted into and exposed in the packaging shell 112. At least a portion of the base plate 111 and the packaging shell 112 constitutes the second heat exchange structure B1.

[0140] Part or all of the bottom plate 111 may be the second heat exchange structure B1 , and part or all of the packaging shell 112 may be the second heat exchange structure B1 . Of course, both the bottom plate 111 and the packaging shell 112 may include the second heat exchange structure B1 .

[0141] A power module 100 provided in an embodiment of the present application can facilitate heat exchange of an electrical component Z2 on a circuit board Z1 through a second heat exchange structure B1, thereby increasing the service life of the circuit board Z1 and improving the safety of the circuit board Z1.

[0142] In some embodiments, the electrical component Z2 and the connection terminal Z3 are located on a side of the circuit board Z1 away from the bottom plate 111 , and the bottom plate 111 is the second heat exchange structure B1 .

[0143] In a power module 100 provided in an embodiment of the present application, since the connection terminal Z3 is inserted into the packaging shell 112 and the base plate 111 is in contact with the circuit board Z1, the heat exchange efficiency of the second heat exchange structure B1 on the circuit board Z1 can be improved. In addition, since the base plate 111 has a flat structure, it is convenient to prepare it into the second heat exchange structure B1, thereby improving the preparation efficiency of the power module 100.

[0144] In some embodiments, the package shell 112 includes a cover plate 1121, a surrounding portion 1122, and a connecting portion. The cover plate 1121 and the base plate 111 are located on either side of the surrounding portion 1122. The cover plate 1121, the base plate 111, and the surrounding portion 1122 together form a mounting cavity A1. The connecting portion is located between the circuit board Z1 and the cover plate 1121 and is connected to the circuit board Z1, the cover plate 1121, and the surrounding portion 1122.

[0145] Optionally, the connection portion includes a connection adhesive structure. Optionally, the connection portion includes an insulating material, illustratively, the insulating material includes but is not limited to silicone gel, epoxy resin, etc. The connection portion of the insulating material can improve the insulation between the electrical components Z2.

[0146] The power module 100 provided in the embodiment of the present application can improve the connection strength among the circuit board Z1, the cover plate 1121, and the surrounding portion 1122 through the provision of the connection portion, thereby improving the connection reliability.

[0147] Please refer to Figure 14 As shown, in some embodiments, the cover plate 1121 is provided with a filling hole B2 extending through the cover plate 1121 in the thickness direction, and the connecting portion is at least partially located in the filling hole B2.

[0148] The number of the filling holes B2 includes one, two or even more, and the shape of the filling holes B2 includes columnar, rectangular, or other special-shaped structures.

[0149] Optionally, the fluid connection part can be injected into the interior of the installation cavity A1 through the filling hole B2.

[0150] Optionally, the number of the filling holes B2 is four, and the four filling holes B2 are arranged along the long side direction of the cover plate 1121 , and the intervals between two adjacent filling holes B2 are equal.

[0151] A power module 100 provided in an embodiment of the present application can deliver the connecting portion to the interior of the installation cavity A1 through the filling hole B2. The cover plate 1121 is first placed on the surrounding portion 1122 and then the connecting portion is filled. This can control the height and volume of the entire power module 100, thereby reducing the space occupied by the power module 100 and improving the compactness of the structure of the power module 100.

[0152] Please refer to Figure 12As shown, in some embodiments, the packaging shell 112 further includes a partition 1123 , which is located in the mounting cavity A1 and connected to the surrounding portion 1122 . The partition 1123 is used to separate at least two circuit components.

[0153] In a power module 100 provided in an embodiment of the present application, the separator 1123 is provided to isolate circuit components and reduce the probability of interference between adjacent circuit components.

[0154] Please refer to Figure 12 、 Figure 13 As shown, in some embodiments, the multiple circuit components 120 include an inverter circuit component 121, a charging circuit component 122, and a DC circuit component 123. The charging circuit component 122 and the DC circuit component 123 are arranged in the same direction, and the inverter circuit component 121 is located on one side of the charging circuit component 122.

[0155] The inverter circuit assembly 121 includes multiple sub-inverter circuit assemblies 121, which are arranged in the same direction as the charging circuit assembly 122 and the DC circuit assembly 123. The separator 1123 is located between the inverter circuit assembly 121 and the charging circuit assembly 122 and the DC circuit assembly 123.

[0156] The power module 100 provided in the embodiment of the present application can reasonably arrange multiple circuit components 120 through the above-mentioned configuration, thereby reducing the length of the long side of the power module 100, having strong applicability to different scene requirements and high space utilization.

[0157] Please refer to Figures 16 and 17 As shown, in some embodiments, the inverter circuit assembly 121 includes an inverter input terminal 1211 and an inverter output terminal 1212 inserted into and exposed outside the surrounding portion 1122 .

[0158] The power module 100 provided in an embodiment of the present application facilitates the connection between the inverter circuit component 121 and other components through the above configuration.

[0159] In some embodiments, the inverter input terminal 1211 and the inverter output terminal 1212 are arranged along the thickness direction of the bottom plate 111 , and at least a portion of the surrounding portion 1122 is sandwiched between the inverter input terminal 1211 and the inverter output terminal 1212 .

[0160] The power module 100 provided in the embodiment of the present application can, through the above configuration, block the inverter input terminal 1211 and the inverter output terminal 1212 , thereby reducing the probability of interference between the two.

[0161] In some embodiments, the inverter circuit assembly 121 further includes a driving connection end 1213 embedded in and exposed outside the partition portion 1123 .

[0162] The drive connection end 1213 is used to connect to the drive motor of the vehicle 10 .

[0163] A power module 100 provided in an embodiment of the present application facilitates connection between an inverter circuit assembly 121 and a drive motor of a vehicle 10 by providing a drive connection terminal 1213 .

[0164] Please refer to Figure 15 、 Figure 16 As shown, in some embodiments, multiple circuit components 120 are arranged along the same direction, and the multiple circuit components 120 include a charging circuit component 122 and a DC circuit component 123.

[0165] The power module 100 provided in the embodiments of the present application can improve the integration of the charging circuit assembly 122 and the DC circuit assembly 123 through the above configuration. In some embodiments, the DC circuit assembly 123 includes a DC primary circuit assembly 1231 and a DC secondary circuit assembly 1232. The DC primary circuit assembly 1231 is located between the charging circuit assembly 122 and the DC secondary circuit assembly 1232.

[0166] The power module 100 provided in an embodiment of the present application, through the above configuration, enables the DC circuit assembly 123 to be easily connected to other structures of the vehicle 10 and has a reasonable arrangement.

[0167] Optionally, the orthographic projection of the circuit board Z1 of the DC primary circuit assembly 1231 along the thickness direction is much larger than the orthographic projection area of ​​the second chip C2, which can facilitate replacement of the second chip C2 and facilitate subsequent repair and reassembly.

[0168] In some embodiments, the electrical component Z2 of the DC secondary circuit assembly 1232 includes a first chip C1 . There are multiple first chips C1 , and the first chips C1 correspond one-to-one to the connection terminals Z3 of the DC secondary circuit assembly 1232 .

[0169] The one-to-one correspondence between the first chips C1 and the connection terminals Z3 of the DC secondary circuit component 1232 means that each first chip C1 transmits signals through a separate connection terminal Z3.

[0170] A power module 100 provided in an embodiment of the present application improves the anti-interference performance between the first chips C1, reduces the probability of crosstalk between multiple first chips C1, improves the control accuracy of the on and off of the first chip C1, and improves the stability of the operation of the power module 100 by setting the connection terminal Z3 of the first chip C1 and the DC secondary circuit component 1232 in a one-to-one correspondence.

[0171] In some embodiments, the electrical component Z2 of the DC primary circuit assembly 1231 includes a second chip C2, and the electrical component Z2 of the charging circuit assembly 122 includes a third chip C3, and the second chip C2 and the third chip C3 are arranged in the same direction.

[0172] An embodiment of the present application provides a power module 100 that facilitates assembly of the second chip C2 and the third chip C3 by arranging the second chip C2 and the third chip C3 in the same direction. In some embodiments, a direction of the second chip C2 that intersects the arrangement direction of the second chip C2 and the third chip C3 includes a first side and a second side. The connection terminal Z3 of the DC primary circuit assembly 1231 includes a first drive terminal D1 and a first power terminal D2, respectively connected to the second chip C2. The first drive terminal D1 is located on the first side, and the first power terminal D2 is located on the second side.

[0173] A power module 100 provided in an embodiment of the present application can reduce the probability of cross-interference between the drive circuit and the power circuit of the DC primary circuit component 1231 by arranging the first drive terminal D1 and the first power terminal D2 on both sides of the second chip C2.

[0174] Optionally, the minimum vertical distance between the first drive terminal D1 and the first power terminal D2 is greater than or equal to 10 mm.

[0175] In some embodiments, the direction of the third chip C3 that intersects with the arrangement direction of the second chip C2 and the third chip C3 includes a third side and a fourth side, and the connection terminal Z3 of the charging circuit assembly 122 includes a second drive terminal E1 and a second power terminal E2 respectively connected to the third chip C3, the second drive terminal E1 is located on the third side, and the second power terminal E2 is located on the fourth side.

[0176] A power module 100 provided in an embodiment of the present application can reduce the probability of cross-interference between the drive circuit and the power circuit of the DC primary circuit component 1231 and simplify circuit design routing by arranging the second drive terminal E1 and the second power terminal E2 on both sides of the third chip C3.

[0177] Optionally, the first driving terminal D1 and the second driving terminal E1 include driving pins, and the first power terminal D2 and the second power terminal E2 include at least one of a power pin or a power copper busbar.

[0178] The connection terminal Z3 of the DC secondary circuit component 1232 includes a third drive terminal and a third power terminal, and the third power terminal includes a power copper busbar.

[0179] The first drive terminal D1, the second drive terminal E1, and the third drive terminal can be arranged in two rows, each row extending along the long side of the power module 100. One row is used to lead out gate signals, and the other row is used to lead out source signals. The distance between the two rows is greater than or equal to 3 mm.

[0180] In some embodiments, the first side and the third side are arranged on the same side, and the second side and the fourth side are arranged on the same side.

[0181] The power module 100 provided in an embodiment of the present application can reduce the probability of interference between the drive circuit and the power circuit of the power module 100 through the above configuration, thereby improving the operational stability of the power module 100.

[0182] In some embodiments, the distance between the first driving terminal D1 and the second chip C2 is H1, the distance between the first power terminal D2 and the second chip C2 is H2, and H1 is smaller than H2.

[0183] The power module 100 provided in the embodiment of the present application can reduce the value of the stray inductance when the first driving terminal D1 is connected to the second chip C2 through the above configuration, thereby improving the stability of signal transmission.

[0184] In some embodiments, the distance between the second driving terminal E1 and the third chip C3 is M1, the distance between the second power terminal E2 and the third chip C3 is M2, and M1 is smaller than M2.

[0185] The power module 100 provided in the embodiment of the present application can reduce the value of the stray inductance when the second driving terminal E1 is connected to the third chip C3 through the above configuration, thereby improving the stability of signal transmission.

[0186] The third chip C3 includes an IGBT (Insulated Gate Bipolar Transistor) chip, which is connected to the circuit board Z1 of the charging circuit assembly 122 .

[0187] The power module 100 further includes a Fast Recovery Diode (FRD) chip. The FRD chip and the IGBT chip are located on the same circuit board Z1 , and the FRD chip is located on the fourth side of the IGBT chip.

[0188] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A power module (100), characterized in that: include: a plurality of circuit components (120); as well as A packaging component (110) comprises a mounting cavity (A1), wherein a plurality of circuit components are at least partially located in the mounting cavity (A1) and connected to the packaging component (110).

2. The power module (100) according to claim 1, characterized in that The circuit assembly comprises: A circuit board (Z1) is located in the mounting cavity (A1), and the circuit board (Z1) includes a first metal layer (Z11); A plurality of electrical components (Z2) are connected to the first metal layer (Z11), and each of the electrical components (Z2) is electrically connected; and A connecting terminal (Z3) protrudes from and is connected to the first metal layer (Z11); the connecting terminal (Z3) is inserted into and exposed from the packaging component (110); and the connecting terminal (Z3) is electrically connected to the plurality of electrical components (Z2) through the first metal layer (Z11).

3. The power module (100) according to claim 2, characterized in that The circuit board (Z1) further comprises: a second metal layer (Z13); and An insulating layer (Z12) is connected between the first metal layer (Z11) and the second metal layer (Z13), and the second metal layer (Z13) is connected to the packaging component (110).

4. The power module (100) according to claim 2, characterized in that The plurality of circuit components (120) include a first circuit component (120a), a second circuit component (120b), and a third circuit component (120c), wherein the first circuit component (120a) is arranged in a first plane, the third circuit component (120c) is arranged in a second plane, and the second circuit component (120b) is located in the first plane and / or the second plane, and the second plane is parallel to the first plane.

5. The power module (100) according to claim 4, characterized in that Along the thickness direction of the circuit component, the orthographic projection of the circuit component located on the first plane coincides with the orthographic projection of the circuit component located on the second plane.

6. The power module (100) according to claim 5, characterized in that The connecting terminal (Z3) protrudes and is connected to the circuit board (Z1) and is arranged on the same side as the electrical component (Z2); the connecting terminal (Z3) is inserted and exposed to the packaging component (110); and the protruding direction of the connecting terminal (Z3) of the circuit component located on the first plane is opposite to the protruding direction of the connecting terminal (Z3) of the circuit component located on the second plane.

7. The power module (100) according to claim 6, characterized in that The shape of the inner wall of the packaging component (110) matches the shape of the first circuit component (120a), the second circuit component (120b), and the third circuit component (120c) located in the installation cavity (A1), and the inner wall is connected to the circuit board (Z1) of the first circuit component (120a), the circuit board (Z1) of the second circuit component (120b), and the circuit board (Z1) of the third circuit component (120c).

8. The power module (100) according to claim 6, characterized in that The power module (100) further includes a first heat exchange structure (130), wherein the first heat exchange structure (130) is sandwiched between the circuit component located on the first plane and the circuit component located on the second plane.

9. The power module (100) according to claim 8, characterized in that The first heat exchange structure (130) is provided with a heat exchange channel (A2) running through it, with both ends of the heat exchange channel (A2) exposed to the packaging component (110).

10. The power module (100) according to claim 9, characterized in that The first heat exchange structure (130) includes a plurality of heat exchange components (131) located in the heat exchange channel (A2) and connected to the first heat exchange structure (130).

11. The power module (100) according to claim 2, characterized in that The plurality of circuit components (120) are arranged in the same plane.

12. The power module (100) according to claim 11, characterized in that The plurality of circuit components (120) include at least two of an inverter circuit component (121), a charging circuit component (122), and a DC circuit component (123).

13. The power module (100) according to claim 12, characterized in that The packaging assembly (110) comprises: a bottom plate (111), the circuit board (Z1) being mounted on the bottom plate (111); and The packaging shell (112) and the base plate (111) together enclose the installation cavity (A1), the connection terminal (Z3) is inserted into and exposed in the packaging shell (112), and at least a portion of the base plate (111) and the packaging shell (112) constitutes a second heat exchange structure (B1).

14. The power module (100) according to claim 13, characterized in that The electrical component (Z2) and the connecting terminal (Z3) are located on a side of the circuit board (Z1) away from the bottom plate (111), and the bottom plate (111) is a second heat exchange structure (B1).

15. The power module (100) according to claim 13, characterized in that The packaging shell (112) includes: Cover plate (1121); an enclosing portion (1122), the cover plate (1121) and the bottom plate (111) being distributed on both sides of the enclosing portion (1122), the cover plate (1121), the bottom plate (111) and the enclosing portion (1122) jointly enclosing to form the mounting cavity (A1); and The connecting portion is filled between the circuit board (Z1) and the cover plate (1121), and the connecting portion is connected to the circuit board (Z1), the cover plate (1121), and the surrounding portion (1122).

16. The power module (100) according to claim 15, characterized in that The cover plate (1121) is provided with a filling hole (B2) extending through the cover plate along the thickness direction, and the connecting portion is at least partially located in the filling hole (B2).

17. The power module (100) according to claim 16, characterized in that The packaging shell (112) further comprises a partition (1223), wherein the partition (1223) is located in the installation cavity (A1) and connected to the surrounding portion (1122), and the partition (1223) is used to separate at least two of the circuit components.

18. The power module (100) according to claim 17, characterized in that The plurality of circuit components include an inverter circuit component (121), a charging circuit component (122), and a DC circuit component (123); the charging circuit component (122) and the DC circuit component (123) are arranged in the same direction, and the inverter circuit component (121) is located on one side of the charging circuit component (122).

19. The power module (100) according to claim 18, characterized in that The inverter circuit assembly (121) comprises an inverter input end (1211) and an inverter output end (1212) which are inserted into and exposed outside the surrounding portion (1122).

20. The power module (100) according to claim 19, characterized in that The inverter input end (1211) and the inverter output end (1212) are arranged along the thickness direction of the bottom plate (111), and at least part of the surrounding portion (1122) is sandwiched between the inverter input end (1211) and the inverter output end (1212).

21. The power module (100) according to claim 19, characterized in that The inverter circuit assembly (121) further includes a driving connection end (1213) embedded in and exposed outside the partition (1223).

22. The power module (100) according to claim 12, characterized in that The multiple circuit components (120) are arranged in the same direction, and the multiple circuit components (120) include a charging circuit component (122) and a DC circuit component (123).

23. The power module (100) according to claim 22, characterized in that The DC circuit assembly (123) comprises: DC primary circuit component (1231); and A DC secondary circuit component (1232), wherein the DC primary circuit component (1231) is located between the charging circuit component (122) and the DC secondary circuit component (1232).

24. The power module (100) according to claim 23, characterized in that The electrical component (Z2) of the DC secondary circuit assembly (1232) includes a first chip (C1), the number of the first chips (C1) is multiple, and the first chips (C1) correspond one-to-one to the connection terminals (Z3) of the DC secondary circuit assembly (1232).

25. The power module (100) according to claim 23, characterized in that The electrical component (Z2) of the DC primary circuit assembly (1231) includes a second chip (C2), and the electrical component (Z2) of the charging circuit assembly (122) includes a third chip (C3), and the second chip (C2) and the third chip (C3) are arranged in the same direction.

26. The power module (100) according to claim 25, characterized in that The direction of the second chip (C2) intersecting with the arrangement direction of the second chip (C2) and the third chip (C3) includes a first side and a second side, The connection terminal (Z3) of the DC primary circuit component (1231) includes a first drive terminal (D1) and a first power terminal (D2) respectively connected to the second chip (C2), the first drive terminal (D1) is located on the first side, and the first power terminal (D2) is located on the second side.

27. The power module (100) according to claim 26, characterized in that The distance between the first driving terminal (D1) and the second chip (C2) is H1, the distance between the first power terminal (D2) and the second chip (C2) is H2, and H1 is smaller than H2.

28. The power module (100) according to claim 26, characterized in that The direction of the third chip (C3) intersecting with the arrangement direction of the second chip (C2) and the third chip (C3) includes a third side and a fourth side, The connection terminal (Z3) of the charging circuit assembly (122) includes a second drive terminal (E1) and a second power terminal (E2) respectively connected to the third chip (C3); the second drive terminal (E1) is located on the third side, and the second power terminal (E2) is located on the fourth side.

29. The power module (100) according to claim 28, characterized in that The first side and the third side are arranged on the same side, and the second side and the fourth side are arranged on the same side.

30. The power module (100) according to claim 28, characterized in that The distance between the second driving terminal (E1) and the third chip (C3) is M1, the distance between the second power terminal (E2) and the third chip (C3) is M2, and M1 is smaller than M2.

31. A vehicle (10), characterized in that A power module (100) comprising any one of claims 1 to 30.

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