Three-dimensional radiator with countersunk head type connecting structure
The three-dimensional heat sink with a countersunk connection structure, using a combination of L-shaped bent heat pipes and copper mesh capillary structure, solves the problem of low heat dissipation efficiency of traditional heat sinks in high-power electronic equipment, achieves rapid heat transmission and uniform distribution, and meets the heat dissipation needs of electronic equipment with complex structures and limited space.
Patent Information
- Application Number
- CN202422628719.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-30
AI Technical Summary
Traditional heat sinks have low heat dissipation efficiency in high-power electronic devices, and two-dimensional temperature dispersion plates have limited heat dissipation capacity in three-dimensional space, which cannot meet the heat dissipation needs of electronic devices with complex structures and limited space.
The three-dimensional radiator adopts a countersunk connection structure, which realizes rapid heat transmission and uniform heat distribution through the combination of L-shaped bent heat pipes, copper mesh and capillary structure, and uses the evaporation and condensation cycle of the working fluid to dissipate heat.
It achieves efficient and uniform heat transfer and heat dissipation in a limited space, improves heat dissipation efficiency, and is suitable for the stable operation of high-power electronic equipment.
Smart Images
Figure CN223348959U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiator structures, in particular to a three-dimensional radiator with a countersunk connection structure. Background Art
[0002] With the continuous upgrading of electronic devices, traditional heat sinks used for heat dissipation have gradually shown their limitations, which are as follows:
[0003] (1) Insufficient planar heat dissipation: With the rapid development of the electronics industry, the functions of electronic devices are becoming increasingly powerful, and the heat generation power is constantly increasing, but the surface area design of the devices is getting smaller and smaller. Traditional heat dissipation methods, such as ordinary heat sinks, mainly conduct heat through planar contact, with low heat dissipation efficiency, and it is difficult to meet the heat dissipation needs of high-power electronic devices. For example, in some high-performance smart phones, tablet computers and other small electronic devices, traditional heat dissipation methods seem to be unable to cope with the heat dissipation problem of high-power chips.
[0004] (2) Limitations of heat pipe technology: Although one-dimensional heat pipes can achieve a certain degree of heat transfer, their heat dissipation path is linear and can only conduct heat in a single direction. For situations where heat distribution is uneven and the heat source is more complex, their heat dissipation effect is limited. In addition, the contact area between the heat pipe and the heat source is relatively small, and the efficiency of heat transfer is subject to certain limitations.
[0005] To address the shortcomings of traditional heat dissipation technology, two-dimensional heat spreader technology has emerged. The heat spreader has a capillary structure and working fluid inside. Through the evaporation and condensation process of the working fluid, it can achieve rapid heat transfer and uniform distribution, greatly improving the heat dissipation efficiency. However, two-dimensional heat spreaders still have some problems. For example, their heat dissipation capacity in three-dimensional space is limited. For some electronic devices with complex structures and space constraints, their heat dissipation performance cannot be fully utilized.
[0006] With the rapid development of 5G technology, artificial intelligence, high-performance computing, and other fields, the chip performance of electronic devices continues to improve, and power consumption has also increased accordingly, which places higher demands on heat dissipation technology. For example, the large number of electronic devices in 5G base stations and the CPUs in high-performance servers all require efficient heat dissipation solutions to ensure their stable operation. Furthermore, electronic devices are increasingly trending towards miniaturization and integrated design, which makes the space inside the devices more compact and limits the heat dissipation space. Therefore, a technology that can achieve efficient heat dissipation in a limited space is needed. There is an urgent need to develop a three-dimensional heat sink that can meet the needs of achieving efficient heat dissipation in a limited space. Utility Model Content
[0007] In response to the above problems, the present invention provides a three-dimensional radiator with a countersunk connection structure, which enables rapid, uniform and effective heat transfer and has good heat dissipation performance.
[0008] A three-dimensional heat sink with a countersunk connection structure, characterized in that it comprises:
[0009] A plurality of L-shaped bent heat pipes, each L-shaped bent heat pipe comprising a vertical portion, a bent section, and a horizontal portion;
[0010] Upper cover;
[0011] Copper mesh;
[0012] The capillary structure includes a bottom plate capillary structure and a plurality of upward convex supporting powder columns, wherein the bottom plate capillary structure is provided with a plurality of upward convex supporting powder columns;
[0013] A plurality of copper powder rings, each of which includes an upper convex small-diameter sleeve end and a lower large-diameter stop ring;
[0014] and the lower cover;
[0015] The upper cover is mounted on the upper stopper surface of the lower cover to form a heat dissipation cavity. A working fluid is provided in the heat dissipation cavity. The bottom of the vertical portion of the L-shaped bent heat pipe is inserted into the corresponding heat pipe insertion hole of the upper cover. The copper mesh is located in the heat dissipation cavity. The upper surface of the copper mesh is in contact with the lower surface of the upper cover. The copper mesh is supported by a plurality of upper convex supporting powder columns. The bottom plate capillary structure is arranged in contact with the inner wall of the bottom plate of the lower cover.
[0016] The copper mesh is provided with a through positioning hole at a position corresponding to the heat pipe insertion hole. The lower large-diameter stop ring of each copper powder ring is positioned in the through positioning hole. After the upper convex small-diameter sleeve end of the copper powder ring passes through the through positioning hole, its upper convex outer surface is in close contact with the inner tube wall of the vertical portion of the L-shaped bent heat pipe.
[0017] The horizontal portion of the L-shaped bent heat pipe is arranged toward the periphery of the upper cover surface area.
[0018] It is further characterized by:
[0019] At least one row of heat pipe insertion holes is provided on both sides of the upper cover corresponding to the length direction of the heat dissipation cavity, and the horizontal parts of all L-shaped bent heat pipes on the same side are arranged in parallel and facing outwards;
[0020] Preferably, the horizontal portions of the L-shaped bent heat pipes on both sides are arranged back to back, and the horizontal portion on each side extends outward to the outer space of the upper cover to ensure that the heat dissipation space is reasonably expanded;
[0021] The upper cover is provided with a thickened lower convex portion at a position corresponding to the heat pipe differential perforation. The heat pipe insertion hole includes a countersunk support ring hole and a central through hole. The annular surface of the countersunk support ring hole is used to support the bottom of the vertical portion. The inner wall of the central through hole is arranged in contact with the corresponding outer wall of the upper convex small-diameter sleeve end. The upper convex portion of the upper convex small-diameter sleeve end is in close contact with the inner wall of the vertical portion.
[0022] The through positioning hole includes an upper copper mesh positioning countersunk hole and a lower large-diameter stop ring positioning hole. The copper mesh is sleeved on the outer periphery of the thickened lower convex portion through the upper copper mesh positioning countersunk hole for positioning. The lower large-diameter stop ring is installed in the lower large-diameter stop ring positioning hole, and the radial outer peripheral upper surface of the lower large-diameter stop ring is arranged in close contact with the radial inner lower surface of the thickened lower convex portion.
[0023] The outer periphery of the lower large-diameter stop ring is in close contact with the hole wall of the positioning hole of the lower large-diameter stop ring, so that the flow channel of the liquid working fluid is arranged continuously and reliably.
[0024] After adopting the technology of the present invention, heat is transferred from the heat source to the lower cover, the working fluid evaporates due to the heat to form a gas, the gaseous working fluid rises, a part of it contacts the upper cover, and then condenses along the capillary reflux formed by the copper mesh, several convex supporting powder columns, and the capillary structure of the bottom plate, and circulates back and forth; the other part of the gaseous working fluid enters the inner cavity of the heat pipe, contacts the tube wall of the heat pipe, and condenses along the capillary reflux formed by the inner tube wall, copper powder ring, copper mesh, several convex supporting powder columns, and the capillary structure of the bottom plate, and circulates back and forth; the entire structure dissipates heat through heat conduction and the evaporation and flow of the working fluid; the use of the countersunk structure of the temperature equalizing plate and the heat pipe connection can make the heat transfer of the heating element faster; the unique countersunk structure and the use of copper powder ring to connect to the heat pipe can make the working fluid exchange more sufficient and the heat transfer more uniform and effective; and compared with ordinary two-dimensional heat dissipation products, this product can seamlessly dissipate the heat in the flow channel in two parts, which can have a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0026] Figure 2 This is a schematic diagram of the cross-sectional structure of the main view of the present invention;
[0027] Figure 3 This is an exploded structural diagram of the utility model;
[0028] Figure 4 It is a side view cross-sectional structural diagram of the utility model;
[0029] Figure 5 for Figure 4 A local enlarged schematic diagram of point A;
[0030] The names corresponding to the serial numbers in the figure are as follows:
[0031] L-shaped bent heat pipe 10, vertical part 11, inner tube wall 111, bent section 12, horizontal part 13, upper cover 20, heat pipe insertion hole 21, countersunk support ring hole 211, center through hole 212, thickened lower convex part 22, copper mesh 30, through positioning hole 31, upper copper mesh positioning countersunk hole 311, lower large diameter stop ring positioning hole 312, capillary structure 40, bottom plate capillary structure 41, upper convex supporting powder column 42, copper powder ring 50, upper convex small diameter sleeve end 51, lower large diameter stop ring 52, lower cover 60, upper stop surface 61, heat dissipation cavity 70. DETAILED DESCRIPTION
[0032] A three-dimensional radiator with a countersunk connection structure, see Figure 1-Figure 5 , which includes a plurality of L-shaped bent heat pipes 10, an upper cover 20, a copper mesh 30, a capillary structure 40, a plurality of copper powder rings 50, and a lower cover 60;
[0033] Each L-shaped bent heat pipe 10 includes a vertical portion 11, a bent section 12, and a horizontal portion 13;
[0034] The capillary structure 40 includes a bottom plate capillary structure 41 and a plurality of upward convex supporting powder columns 42. The bottom plate capillary structure 41 is provided with a plurality of upward convex supporting powder columns 42.
[0035] The number of copper powder rings 50 is the same as the number of L-shaped bent heat pipes 10. Each copper powder ring 50 includes an upper convex small-diameter sleeve end 51 and a lower large-diameter stop ring 52.
[0036] The upper cover 10 is mounted on the upper stop surface 61 of the lower cover 60 to form a heat dissipation cavity 70. A working fluid (not shown in the figure, which belongs to the existing mature technology) is provided in the heat dissipation cavity 70. The bottom of the vertical portion 11 of the L-shaped bent heat pipe 10 is inserted into the corresponding heat pipe insertion hole 21 of the upper cover 20. The copper mesh 30 is located in the heat dissipation cavity 70. The upper surface of the copper mesh 30 is in contact with the lower surface of the upper cover 10. The copper mesh 30 is supported by a plurality of upwardly protruding support powder columns 42. The bottom plate capillary structure 41 is arranged in contact with the inner wall of the bottom plate of the lower cover 60.
[0037] A through positioning hole 31 is provided at the position of the copper mesh 30 corresponding to the heat pipe insertion hole 21. The lower large-diameter stop ring 52 of each copper powder ring 50 is positioned in the through positioning hole 31. After the upper convex small-diameter sleeve end 51 of the copper powder ring 50 passes through the through positioning hole 31, its upper convex outer surface is in close contact with the inner tube wall 111 of the vertical portion 11 of the L-shaped bent heat pipe 10; in specific implementation, the inner tube wall 111 is a capillary structure or a groove structure, preferably a capillary structure, so that the capillary flow path is smooth and reliable.
[0038] In a specific implementation, the horizontal portion 13 of the L-shaped bent heat pipe 10 is arranged toward the periphery of the surface area of the upper cover 20 .
[0039] In a specific embodiment, a row of heat pipe insertion holes 21 are respectively provided on both sides of the upper cover 20 corresponding to the length direction of the heat dissipation cavity 70, and the number of heat pipe insertion holes 21 in each row is four. The horizontal parts 13 of the four L-shaped bent heat pipes 10 on the same side are arranged in parallel and facing outward; the horizontal parts 13 of the L-shaped bent heat pipes 10 on both sides are arranged back to back, and the horizontal parts 13 on each side extend to the outer space of the upper cover 20, ensuring that the heat dissipation space is reasonably expanded. The vertical part 11 is reduced according to the height of the heat dissipation space, and the horizontal part 13 is reasonably expanded. The horizontal part 13 can accept heat exchange from cold air in another direction, thereby expanding the heat dissipation space of the entire mechanism.
[0040] In a specific embodiment, the upper cover 20 is provided with a thickened lower convex portion 22 at a position corresponding to the heat pipe differential through-hole 21. The heat pipe insertion hole 21 includes a countersunk support ring hole 211 and a central through-hole 212. The annular surface of the countersunk support ring hole 211 is used to support the bottom of the vertical portion 11. The inner wall of the central through-hole 212 is arranged in contact with the corresponding outer wall of the upper convex small-diameter sleeve end 51. The upper convex portion of the upper convex small-diameter sleeve end 51 is in close contact with the inner tube wall 111 of the vertical portion 11.
[0041] The through positioning hole 31 includes an upper copper mesh positioning countersunk hole 311 and a lower large-diameter stop ring positioning hole 312. The copper mesh 30 is sleeved on the outer periphery of the thickened lower convex part 22 through the upper copper mesh positioning countersunk hole 311 for positioning. The lower large-diameter stop ring 52 is installed in the lower large-diameter stop ring positioning hole 312, and the radial outer peripheral upper surface of the lower large-diameter stop ring 52 is arranged in close contact with the radial inner lower surface of the thickened lower convex part 22; the outer periphery of the lower large-diameter stop ring 52 is in close contact with the hole wall of the lower large-diameter stop ring positioning hole 312, so that the flow channel of the liquid working fluid is continuously and reliably arranged.
[0042] Its working principle is as follows: heat is transferred from the heat source to the lower cover, the working fluid evaporates due to the heat to form a gas, the gaseous working fluid rises, part of it contacts the upper cover, and then condenses along the capillary reflux formed by the copper mesh, several convex supporting powder columns, and the capillary structure of the bottom plate, and the cycle repeats; the other part of the gaseous working fluid enters the inner cavity of the heat pipe, contacts the tube wall of the heat pipe, and condenses along the capillary reflux formed by the inner tube wall, copper powder ring, copper mesh, several convex supporting powder columns, and the capillary structure of the bottom plate, and the cycle repeats; the entire structure dissipates heat through heat conduction and the evaporation and flow of the working fluid; the use of the countersunk structure of the temperature equalizing plate and the heat pipe connection can make the heat pipe positioning more reliable and the heat transfer of the heating element faster; the unique countersunk structure and the use of copper powder rings to closely connect with the heat pipe can make the working fluid exchange more sufficient and the heat transfer more uniform and efficient; and compared with ordinary two-dimensional heat dissipation products, this product can seamlessly dissipate the heat in the flow channel in two parts, which can achieve better heat dissipation effect.
[0043] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
[0044] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.
Claims
1. A three-dimensional heat sink with a countersunk connection structure, characterized in that: It includes: A plurality of L-shaped bent heat pipes, each L-shaped bent heat pipe comprising a vertical portion, a bent section, and a horizontal portion; Upper cover; Copper mesh; The capillary structure includes a bottom plate capillary structure and a plurality of upward convex supporting powder columns, wherein the bottom plate capillary structure is provided with a plurality of upward convex supporting powder columns; A plurality of copper powder rings, each of which includes an upper convex small-diameter sleeve end and a lower large-diameter stop ring; and the lower cover; The upper cover is mounted on the upper stopper surface of the lower cover to form a heat dissipation cavity. A working fluid is provided in the heat dissipation cavity. The bottom of the vertical portion of the L-shaped bent heat pipe is inserted into the corresponding heat pipe insertion hole of the upper cover. The copper mesh is located in the heat dissipation cavity. The upper surface of the copper mesh is in contact with the lower surface of the upper cover. The copper mesh is supported by a plurality of upper convex supporting powder columns. The bottom plate capillary structure is arranged in contact with the inner wall of the bottom plate of the lower cover. The copper mesh is provided with a through positioning hole at a position corresponding to the heat pipe insertion hole. The lower large-diameter stop ring of each copper powder ring is positioned in the through positioning hole. After the upper convex small-diameter sleeve end of the copper powder ring passes through the through positioning hole, its upper convex outer surface is in close contact with the inner tube wall of the vertical portion of the L-shaped bent heat pipe. The horizontal portion of the L-shaped bent heat pipe is arranged toward the periphery of the upper cover surface area.
2. The three-dimensional heat sink with a countersunk connection structure according to claim 1, characterized in that: At least one row of heat pipe insertion holes is provided on both sides of the upper cover corresponding to the length direction of the heat dissipation cavity, and the horizontal parts of all L-shaped bent heat pipes on the same side are arranged in parallel and facing outwards.
3. The three-dimensional heat sink with a countersunk connection structure according to claim 2, characterized in that: The horizontal portions of the L-shaped bent heat pipes on both sides are arranged back to back, and the horizontal portion on each side extends outward to the outer space of the upper cover.
4. The three-dimensional heat sink with a countersunk connection structure according to claim 1, characterized in that: The upper cover is provided with a thickened lower convex portion at a position corresponding to the heat pipe differential perforation. The heat pipe insertion hole includes a countersunk support ring hole and a central through hole. The annular surface of the countersunk support ring hole is used to support the bottom of the vertical part. The inner wall of the central through hole is arranged in contact with the corresponding outer wall of the upper convex small-diameter sleeve end, and the upper convex portion of the upper convex small-diameter sleeve end is in close contact with the inner wall of the vertical part.
5. The three-dimensional heat sink with a countersunk connection structure according to claim 4, characterized in that: The through positioning hole includes an upper copper mesh positioning countersunk hole and a lower large-diameter stop ring positioning hole. The copper mesh is sleeved on the outer periphery of the thickened lower convex part through the upper copper mesh positioning countersunk hole for positioning. The lower large-diameter stop ring is installed in the lower large-diameter stop ring positioning hole, and the radial outer peripheral upper surface of the lower large-diameter stop ring is arranged in close contact with the radial inner lower surface of the thickened lower convex part.
6. The three-dimensional heat sink with a countersunk connection structure according to claim 5, characterized in that: The outer periphery of the lower large-diameter stop ring is in close contact with the hole wall of the positioning hole of the lower large-diameter stop ring.