LED module, LED device and vehicle
By introducing a connection layer into the LED module and optimizing the heat conduction path, the high cost problem in the heat dissipation management of high-power LED chips is solved, efficient heat dissipation and cost reduction are achieved, and the reliability and stability of the product are improved.
Patent Information
- Application Number
- CN202422669989.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-31
AI Technical Summary
The existing technology for heat dissipation management of high-power LED chips has the problem of high cost. In particular, the metal substrate raw material plate is expensive and etching the heat dissipation boss requires a thicker raw material plate, which increases production costs.
The LED module structure is adopted. By setting a connecting layer between the thermal conductive base layer and the circuit layer, the heat generated by the LED chip is directly transferred to the thermal conductive base layer through the solder layer and the connecting layer, replacing the heat dissipation boss on the metal substrate. A thinner thermal conductive base material is used to optimize the heat conduction path.
While maintaining efficient heat dissipation, it reduces production costs, improves heat dissipation efficiency, reduces material usage, and enhances product reliability and stability.
Smart Images
Figure CN223349022U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of optoelectronic technology, and in particular to an LED module, an LED device, and a vehicle. Background Art
[0002] LEDs (Light Emitting Diodes), with their outstanding advantages such as low power consumption and long life, have become a key component of modern lighting and display technology. With the rapid development of the electric vehicle industry, the use of LED lights in automotive lighting has become increasingly prevalent. Furthermore, as demand for lighting brightness continues to increase, the design of high-power LED chips is also moving towards higher power output, which increases the heat generated in a small space. Thermal management has become a key technical challenge to ensure the stable operation and extend the service life of high-power LED chips. If heat dissipation is not properly managed, the LED chip may overheat, affecting performance, shortening lifespan, and in extreme cases, even causing functional failure.
[0003] In the related art, in order to meet the heat dissipation requirements, a direct heat dissipation metal substrate circuit board solution has been designed. This solution involves etching on the raw material plate of the metal substrate to form a metal substrate with a heat dissipation boss, and making a through groove on the circuit board. The circuit board and the metal substrate are then pressed together, and the heat dissipation boss will pass through the through groove. Finally, the LED chip is mounted on the circuit board and soldered to the heat dissipation boss. In this way, the heat generated by the LED chip does not have to pass through the circuit board, but is quickly conducted to the metal substrate through the solder layer and the heat dissipation boss in sequence, and then the metal substrate dissipates the heat, thereby achieving effective heat dissipation of the LED chip. However, the raw material plate of the metal substrate is expensive, and etching the heat dissipation boss requires a thicker raw material plate, which increases production costs. Utility Model Content
[0004] The embodiments of the present application provide an LED module, an LED device, and a vehicle, which reduce production costs while maintaining efficient heat dissipation, so as to at least partially solve the above-mentioned technical problems.
[0005] In order to achieve the above-mentioned object, according to a first aspect of the present application, an LED module is provided, comprising:
[0006] The circuit layer is provided with a first through hole;
[0007] An LED chip is disposed on the circuit layer and covers the first through hole;
[0008] a first solder layer, provided in a region of the LED chip facing the first through hole;
[0009] a heat-conducting base layer, disposed on a side of the circuit layer away from the LED chip; and
[0010] A connection layer is provided in a region of the heat-conducting base layer facing the first through hole, and the connection layer is connected to the first solder layer, so that the LED chip is thermally connected to the heat-conducting base layer.
[0011] Optionally, the connecting layer includes at least one of a plating layer, a magnetron sputtering layer and a coating layer.
[0012] Optionally, the connecting layer is a copper plating layer.
[0013] Optionally, the first solder layer is disposed through the first through hole.
[0014] Optionally, the first solder layer and the hole wall of the first through hole are spaced apart.
[0015] Optionally, the LED module further includes an insulating layer, which is provided between the circuit layer and the heat-conducting base layer. The insulating layer is provided with a second through hole, which is connected to the first through hole, and the connecting layer is provided through the second through hole.
[0016] Optionally, the connection layer and the hole wall of the second through hole are spaced apart.
[0017] Optionally, the thickness of the connecting layer is smaller than the thickness of the insulating layer.
[0018] Optionally, the area of the connection layer is larger than the area of the first solder layer, so that the outer periphery of the connection layer is arranged beyond the outer periphery of the first solder layer.
[0019] Optionally, the distance that the outer periphery of the connecting layer exceeds the outer periphery of the first solder layer is greater than or equal to 0.5 mm.
[0020] Optionally, the LED module further includes a heat dissipation layer, and the heat dissipation layer is provided on a side of the heat conductive base layer away from the circuit layer.
[0021] Optionally, the LED module further includes a heat transfer layer, and the heat transfer layer is provided between the heat conductive base layer and the heat dissipation layer.
[0022] According to a second aspect of the present application, there is provided an LED device, comprising:
[0023] housing, and
[0024] As in any one of the above LED modules, the LED module is disposed in the housing.
[0025] According to a third aspect of the present application, a vehicle is provided, comprising the LED module as described in any one of the above items or the LED device as described above.
[0026] In the LED module of the embodiment of the present application, a connecting layer is arranged in the area of the thermally conductive base layer facing the first through hole, and the connecting layer is connected to the first solder layer, so that the LED chip and the thermally conductive base layer are thermally connected. The heat generated by the LED chip does not need to pass through the circuit layer, but is quickly conducted to the thermally conductive base layer through the first solder layer and the connecting layer in sequence, and then the heat is dissipated by the thermally conductive base layer, thereby optimizing the heat conduction path and improving the heat dissipation efficiency. The connecting layer replaces the heat dissipation boss etched on the metal substrate raw material plate. Since the heat dissipation boss does not need to be set, the thermally conductive base layer can use thinner raw materials, thereby reducing material usage and reducing production costs. That is, by introducing a connecting layer instead of etching the heat dissipation boss on the metal substrate raw material plate, material usage is reduced, thereby reducing production costs while maintaining efficient heat dissipation.
[0027] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.
[0029] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.
[0030] Figure 1 is a schematic structural diagram of an LED module provided in an exemplary embodiment of the present disclosure;
[0031] Figure 2 yes Figure 1 Schematic diagram of the raw material structure of the circuit layer, insulation layer and heat conductive base layer of the LED module;
[0032] Figure 3 yes Figure 1 Schematic diagram of the structure of the thermal conductive base layer and the connecting layer;
[0033] Figure 4 yes Figure 1 Schematic diagram of the structure of the circuit layer, insulation layer, thermal conductive base layer and connection layer;
[0034] Figure 5 FIG. 1 is a schematic structural diagram of a vehicle provided in an exemplary embodiment of the present disclosure.
[0035] Description of reference numerals:
[0036] 10. LED module; 1. Circuit layer; 11. First through hole; 2. LED chip; 3. Thermal conductive base layer; 4. Connection layer; 5. Insulation layer; 51. Second through hole; 6. First solder layer; 7. Heat dissipation layer; 8. Heat transfer layer; 9. Second solder layer; 100. LED device; 1000. Vehicle. DETAILED DESCRIPTION
[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.
[0038] This application provides an LED module, please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of the LED module provided in an embodiment of the present application.
[0039] The LED module 10 includes a circuit layer 1 , an LED chip 2 , a first solder layer 6 , a thermally conductive base layer 3 , and a connection layer 4 .
[0040] The circuit layer 1 is provided with a first through hole 11 , and the first through hole 11 avoids the connection layer 4 and / or the first solder layer 6 .
[0041] The LED chip 2 is arranged on the circuit layer 1 and covered on the first through hole 11. Specifically, the LED chip 2 has an area facing the first through hole 11, and a heat dissipation pad is provided in the area. The heat dissipation pad is connected to the first solder layer 6 to conduct the heat generated by the LED chip 2 to the first solder layer 6. The LED chip 2 is also provided with positive and negative electrode pads, which are connected to the second solder layer 9 to achieve electrical connection with the circuit layer 1.
[0042] The first solder layer 6 is provided in the area of the LED chip 2 facing the first through hole 11 , and can fix the LED chip 2 and the connection layer 4 by soldering.
[0043] The heat-conducting base layer 3 is arranged on the side of the circuit layer 1 away from the LED chip 2 and serves as the main heat dissipation path to dissipate heat.
[0044] The connection layer 4 is disposed on the thermally conductive base layer 3 in the area facing the first through-hole 11. The connection layer 4 is connected to the first solder layer 6, enabling heat conduction between the LED chip 2 and the thermally conductive base layer 3. In this way, the heat generated by the LED chip 2 is rapidly transferred through the first solder layer 6 and the connection layer 4 to the thermally conductive base layer 3, which then dissipates the heat.
[0045] In the technical solution of the present application, the connecting layer 4 is arranged in the area of the thermally conductive base layer 3 facing the first through hole 11, and the connecting layer 4 is connected to the first solder layer 6, so that the LED chip 2 and the thermally conductive base layer 3 are thermally connected. The heat generated by the LED chip 2 does not need to pass through the circuit layer 1, but is quickly conducted to the thermally conductive base layer 3 through the first solder layer 6 and the connecting layer 4 in sequence, and then the heat is dissipated by the thermally conductive base layer 3, thereby optimizing the heat conduction path and improving the heat dissipation efficiency. The connecting layer 4 replaces the heat dissipation boss etched on the metal substrate raw material plate. Since the heat dissipation boss does not need to be set, the thermally conductive base layer 3 can use thinner raw materials, thereby reducing material usage and reducing production costs. That is, by introducing the connecting layer 4 instead of etching the heat dissipation boss on the metal substrate raw material plate, the material usage is reduced, thereby reducing production costs while maintaining efficient heat dissipation.
[0046] This application does not limit the materials used for the circuit layer 1, first solder layer 6, thermally conductive base layer 3, and connection layer 4. The material of the circuit layer 1 can be FR4 board (Fiberglass Reinforced Epoxy Laminate Grade 4), which is the most common PCB substrate with excellent mechanical strength and electrical insulation properties. During the manufacturing process, a conductive pattern is first formed on the FR4 board using photolithography or screen printing technology. Then, an etching process is performed to remove excess copper, leaving the desired circuit pattern, thus forming the circuit layer 1 with the predetermined electrical connection. The circuit layer 1 can also be a flexible PCB (FPC) or ceramic substrate made using polyimide (PI) or polyester (PET) as a substrate. The material of the first solder layer 6 can be a lead-free solder, such as tin-silver-copper alloy (SAC, SnAgCu), tin-silver alloy (SnAg), tin-copper alloy (SnCu), etc. The material of the thermally conductive base layer 3 can be aluminum (Al), copper (Cu), or a copper-aluminum composite material. The material of the thermally conductive base layer 3 can also be aluminum nitride (AlN), aluminum oxide (Al2O3), etc. The material of the connecting layer 4 can be a metal alloy such as copper, silver, gold, etc., which has high thermal conductivity and good welding performance.
[0047] In some embodiments, the connection layer 4 includes at least one of a plating layer, a magnetron sputtering layer, and a coating layer. Specifically, the plating layer is formed by electrochemical deposition of a metal layer on the surface of the thermally conductive base layer 3. Common plating materials include copper, nickel, gold, and silver. During the electroplating process, the thermally conductive base layer 3 serves as the cathode and the metal target serves as the anode. The current in the electrolyte causes the metal ions to be reduced and deposited on the surface of the thermally conductive base layer 3. Magnetron sputtering is a process in which atoms or molecules on the surface of the target material are bombarded by high-energy particles under a vacuum environment, causing them to splash out and deposit onto the surface of the thermally conductive base layer 3 to form a thin film. Common materials include copper, aluminum, silver, and gold. Coating is the application of a thermally conductive material (such as thermally conductive glue, thermally conductive paint, thermally conductive epoxy resin, etc.) to the surface of the thermally conductive base layer 3 by coating, spraying, dipping, etc. In these embodiments, the plating layer, magnetron sputtering layer, and coating layer can all effectively form the connection layer 4. By selecting the appropriate method, efficient heat conduction and reliable connection can be achieved.
[0048] In some embodiments, the connecting layer 4 is a copper plating. In these embodiments, a copper plating is formed on the surface of the heat-conducting base layer 3 by electrochemical deposition. Copper has excellent thermal conductivity, and its thermal conductivity coefficient is about 400W / mK, which can quickly conduct heat. Moreover, the bonding force between the copper plating and the heat-conducting base layer 3, as well as between the copper plating and the first solder layer 6 is very strong and not easy to fall off, which can enhance the reliability of the structure. Copper is a relatively economical metal and helps to reduce costs. In addition, the thickness of the copper plating can be adjusted by controlling the electroplating time and current density. This process is mature and can reduce the difficulty of manufacturing. This copper plating formed by the electrochemical deposition method can significantly improve the heat dissipation performance of the LED module 10, thereby ensuring the stable operation of the LED module 10, extending its service life, and facilitating cost control.
[0049] In some embodiments, see Figure 1, the first solder layer 6 is provided in the first through hole 11. It can be understood that the connection layer 4 is connected to the first solder layer 6, so that the LED chip 2 is thermally connected to the heat conductive base layer 3. When the distance between the LED chip 2 and the heat conductive base layer 3 is constant, the thicker the first solder layer 6 is, the thinner the connection layer 4 can be set. The first solder layer 6 is provided in the first through hole 11, that is, the first solder layer 6 extends into the first through hole 11. The first solder layer 6 is thicker, and accordingly, the connection layer 4 is thinner. The thicker first solder layer 6 can be achieved through conventional welding technology, which is mature and easy to control, while the thinner connection layer 4 can be achieved through electroplating, magnetron sputtering or coating and other methods. These methods are also mature and controllable, which is conducive to simplifying the manufacturing process. Manufacturing process, the solder itself has a certain thermal conductivity. The thicker first solder layer 6 can more effectively transfer the heat generated by the LED chip 2 to the connecting layer 4. Although the connecting layer 4 also needs good thermal conductivity, its main function is to ensure the continuity of the heat conduction path. The thinner connecting layer 4 can reduce the thermal resistance, so that the heat can be transferred from the first solder layer 6 to the thermal conductive base layer 3 faster, thereby ensuring the heat conduction efficiency. In addition, the connecting layer 4 is usually a copper plating layer, a magnetron sputtering layer or a thermal conductive coating, etc. The cost of these materials is relatively high. By thinning the thickness of the connecting layer 4, the use of expensive materials can be reduced while ensuring the thermal conductivity, thereby reducing the overall cost.
[0050] In some embodiments, see Figure 1 , the first solder layer 6 and the hole wall of the first through hole 11 are spaced apart. In these embodiments, there is a gap between the first solder layer 6 and the hole wall of the first through hole 11. This gap avoids contact between the first solder layer 6 and the circuit layer 1, thereby reducing additional thermal resistance. In this way, heat can be transferred directly from the LED chip 2 to the connecting layer 4 via the first solder layer 6 without passing through the circuit layer 1, which improves the efficiency of heat conduction. At the same time, this spacing setting is conducive to enhancing the electrical isolation between the circuit layer 1 and the LED chip 2, and between the circuit layer 1 and the thermal conductive base layer 3, reducing the risk of short circuit. In addition, the gap provides space for the first solder layer 6 and the circuit layer 1 during thermal expansion, alleviates the stress concentration phenomenon caused by thermal expansion, thereby reducing the risk of structural damage and improving the reliability of the product.
[0051] In some embodiments, see Figure 1, the LED module 10 also includes an insulating layer 5, which is arranged between the circuit layer 1 and the thermal conductive base layer 3. The insulating layer 5 is provided with a second through hole 51, which is connected to the first through hole 11, and the connecting layer 4 is passed through the second through hole 51. In these embodiments, the insulating layer 5 is arranged between the circuit layer 1 and the thermal conductive base layer 3 to provide electrical isolation, reduce the risk of short circuit, and improve the safety of the product. The connecting layer 4 is passed through the second through hole 51 of the insulating layer 5 to ensure that heat is mainly conducted through the first solder layer 6 with high thermal conductivity and the connecting layer 4, rather than through the insulating layer 5 with low thermal conductivity, thereby improving the thermal conduction efficiency. The insulating layer 5 can use a material with high insulation performance, such as polyimide (PI), epoxy resin, etc. Specifically, the insulating layer 5 is a PP cured sheet. The full name of the PP cured sheet is Prepreg (prepreg), which is a semi-cured epoxy resin fiber cloth. It is arranged between the circuit layer 1 and the thermal conductive base layer 3 as the insulating layer 5, and can also play a bonding role, so that the thermal conductive base layer 3 and the circuit layer 1 are bonded and fixed. Specifically, as Figure 2 As shown, raw materials of the circuit layer 1, the insulating layer 5 and the heat-conducting base layer 3 are obtained, wherein a connecting layer 4 is provided on the heat-conducting base layer 3 to obtain the following Figure 3 As shown in the structure, a first through hole 11 is opened on the circuit layer 1, and a second through hole 51 is opened on the insulating layer 5. Then, the circuit layer 1, the insulating layer 5 and the thermal conductive base layer 3 are pressed together, and the first through hole 11 and the second through hole 51 avoid the connecting layer 4. Then, a circuit pattern is set on the circuit layer 1 to obtain the following structure: Figure 4 Finally, the LED chip 2 is welded, and a heat transfer layer 8 and a heat dissipation layer 7 are provided to obtain the structure shown in FIG. Figure 1 The LED module 10 shown in FIG. 1 is a schematic diagram showing a heat transfer device 10 in which the LED chip 2 is thermally conductive to the heat conductive base layer 3 via the first solder layer 6 and the connection layer 4 , and the LED chip 2 is electrically connected to the circuit layer 1 via the second solder layer 9 , thereby achieving thermal and electrical separation of the LED module 10 .
[0052] In some embodiments, see Figure 1 , a gap is set between the connecting layer 4 and the hole wall of the second through hole 51. In these embodiments, there is a gap between the connecting layer 4 and the hole wall of the second through hole 51. This gap avoids contact between the connecting layer 4 and the insulating layer 5, thereby reducing additional thermal resistance. In this way, heat can be transferred directly from the first solder layer 6 to the thermal conductive base layer 3 via the connecting layer 4 without passing through the insulating layer 5, which improves the efficiency of heat conduction. In addition, the gap provides space for the connecting layer 4 and the insulating layer 5 to expand thermally, alleviating the stress concentration caused by thermal expansion, thereby reducing the risk of structural damage and improving product reliability.
[0053] In some embodiments, see Figure 1, the thickness of the connecting layer 4 is less than the thickness of the insulating layer 5. It can be understood that the connecting layer 4 is connected to the first solder layer 6 so that the LED chip 2 is thermally connected to the heat-conducting base layer 3. When the distance between the LED chip 2 and the heat-conducting base layer 3 is constant, the thinner the connecting layer 4, the thicker the first solder layer 6. In these embodiments, the thickness of the connecting layer 4 is less than the thickness of the insulating layer 5, that is, the connecting layer 4 is thinner and the first solder layer 6 is thicker. The thicker first solder layer 6 can be achieved through conventional welding processes, which are mature and easy to control, while the thinner connecting layer 4 can be achieved through methods such as electroplating, magnetron sputtering or coating, which are also mature and controllable, and are conducive to simplifying the manufacturing process. The solder itself It has certain thermal conductivity. The thicker first solder layer 6 can more effectively transfer the heat generated by the LED chip 2 to the connecting layer 4. Although the connecting layer 4 also needs good thermal conductivity, its main function is to ensure the continuity of the heat conduction path. The thinner connecting layer 4 can reduce the thermal resistance, so that the heat can be transferred from the first solder layer 6 to the thermal conductive base layer 3 faster, thereby ensuring the heat conduction efficiency. In addition, the connecting layer 4 is usually a copper plating layer, a magnetron sputtering layer or a thermal conductive coating, etc. The cost of these materials is relatively high. By thinning the thickness of the connecting layer 4, the use of expensive materials can be reduced while ensuring the thermal conductivity, thereby reducing the overall cost.
[0054] In some embodiments, see Figure 1 , the area of the connecting layer 4 is larger than the area of the first solder layer 6, so that the outer periphery of the connecting layer 4 is set beyond the outer periphery of the first solder layer 6. In these embodiments, the area of the connecting layer 4 is larger than the area of the first solder layer 6. The larger contact area can reduce thermal resistance, so that heat can be transferred from the first solder layer 6 to the thermal conductive base layer 3 more quickly. The outer periphery of the connecting layer 4 exceeds the outer periphery of the first solder layer 6, which helps to disperse heat more evenly and better transfer heat from the first solder layer 6 to the thermal conductive base layer 3, thereby improving the overall heat dissipation effect. In addition, after the connecting layer 4 is set on the thermal conductive base layer 3, the first solder layer 6 is used to solder the connecting layer 4 to the LED chip 2. Since the first solder layer 6 is operated in the subsequent process, the larger area of the connecting layer 4 can provide a sufficient soldering working surface. This setting reduces the manufacturing difficulty and ensures the stability of the connection, thereby improving the reliability of the product.
[0055] In some embodiments, the outer periphery of the connecting layer 4 extends beyond the outer periphery of the first solder layer 6 by a distance greater than or equal to 0.5 mm. In these embodiments, the outer periphery of the connecting layer 4 extends beyond the outer periphery of the first solder layer 6 by a distance greater than or equal to 0.5 mm. This design helps provide a larger contact area, thereby reducing thermal resistance and accelerating the transfer of heat from the LED chip 2 to the thermally conductive base layer 3. Furthermore, the extended outer periphery of the connecting layer 4 helps to more evenly disperse heat, improving the overall heat dissipation effect. Furthermore, this design provides a more stable soldering interface for the first solder layer 6, reduces manufacturing difficulty, and improves product reliability.
[0056] In some embodiments, see Figure 1 The LED module 10 further includes a heat dissipation layer 7, which is disposed on the side of the thermally conductive base layer 3 facing away from the circuit layer 1. In these embodiments, the heat dissipation layer 7 is disposed on the side of the thermally conductive base layer 3 facing away from the circuit layer 1. This design helps effectively transfer heat generated by the LED chip 2 to the heat dissipation layer 7, and dissipates the heat into the external environment through the heat dissipation layer 7. The heat dissipation layer 7 can be made of a variety of materials and structures, such as metal heat sinks, heat dissipation pads, etc. Specifically, the heat dissipation layer 7 is a plate-shaped heat sink to improve the overall heat dissipation performance of the LED module 10.
[0057] In some embodiments, see Figure 1 , the LED module 10 also includes a heat transfer layer 8, which is arranged between the heat conductive base layer 3 and the heat dissipation layer 7. In these embodiments, the heat transfer layer 8 is located between the heat conductive base layer 3 and the heat dissipation layer 7. The heat transfer layer 8 serves as a heat conduction medium between the two, helping heat to be transferred from the LED chip 2 to the heat dissipation layer 7 better and faster, and finally dissipated into the environment. The heat transfer layer 8 can be made of a variety of materials. For example, the heat transfer layer 8 is thermal grease (Thermal Grease), the heat transfer layer 8 can also be thermal pads (Thermal Pads) or thermal adhesive (Thermal Adhesive). The provision of the heat transfer layer 8 can improve the heat conduction efficiency, reduce thermal resistance, adapt to the surface flatness of the heat conductive base layer 3 and the heat dissipation layer 7, provide mechanical buffering, and improve the long-term stability and reliability of the product. By rationally selecting and using the heat transfer layer 8, the heat dissipation performance of the LED module 10 can be significantly improved, ensuring its stable operation and extending its service life.
[0058] According to a second aspect of the present application, an LED device 100 is provided, comprising a housing and an LED module 10. LED module 10 is disposed within the housing. The structure of LED module 10 is as described above. Because LED device 100 utilizes all of the technical solutions of all of the aforementioned embodiments, it at least exhibits the beneficial effects of the technical solutions of the aforementioned embodiments, which are not further detailed here. This application does not specifically limit the LED device 100; it may be an LED vehicle light, an LED display, or the like.
[0059] According to the third aspect of this application, see Figure 5 , a vehicle 1000 is provided, including an LED module 10 or an LED device 100. The structure of the LED module 10 or the LED device 100 is as described above. Since the LED module 10 or the LED device 100 adopts all the technical solutions of all the above embodiments, it at least has the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. The present application does not specifically limit the vehicle 1000, which can be an electric car, a fuel car, or a hybrid car, etc. The application of the LED module 10 or the LED device 100 in the vehicle 1000 can meet the lighting needs of the vehicle 1000, such as headlights, taillights, turn signals, etc., and can also be used for various indication and decorative functions, such as dashboard indicator lights, atmosphere lights, body contour lights, etc.
[0060] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.
[0061] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0062] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.
[0063] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.
Claims
1. An LED module, characterized in that: include: The circuit layer is provided with a first through hole; An LED chip is disposed on the circuit layer and covers the first through hole; a first solder layer, provided in a region of the LED chip facing the first through hole; a heat-conducting base layer, provided on a side of the circuit layer away from the LED chip; as well as, The connection layer is provided in a region of the heat-conducting base layer facing the first through hole, and the connection layer is connected to the first solder layer, so that the LED chip is thermally connected to the heat-conducting base layer.
2. The LED module according to claim 1, wherein: The connecting layer includes at least one of a plating layer, a magnetron sputtering layer and a coating layer.
3. The LED module according to claim 2, wherein: The connecting layer is a copper plating layer.
4. The LED module according to claim 1, wherein: The first solder layer is disposed through the first through hole.
5. The LED module according to claim 4, characterized in that: The first solder layer and the hole wall of the first through hole are spaced apart.
6. The LED module according to claim 1, wherein: The LED module further includes an insulating layer, which is disposed between the circuit layer and the heat-conducting base layer. The insulating layer is provided with a second through hole, which is connected to the first through hole. The connecting layer is passed through the second through hole.
7. The LED module according to claim 6, characterized in that: The connection layer and the hole wall of the second through hole are spaced apart.
8. The LED module according to claim 6, wherein: The thickness of the connecting layer is smaller than the thickness of the insulating layer.
9. The LED module according to claim 1, wherein: The area of the connection layer is greater than that of the first solder layer, so that the outer periphery of the connection layer is arranged beyond the outer periphery of the first solder layer.
10. The LED module according to claim 9, characterized in that: The distance that the outer periphery of the connecting layer exceeds the outer periphery of the first solder layer is greater than or equal to 0.5 mm.
11. The LED module according to any one of claims 1 to 10, characterized in that: The LED module further includes a heat dissipation layer, which is arranged on a side of the heat conductive base layer away from the circuit layer.
12. The LED module according to claim 11, characterized in that: The LED module further includes a heat transfer layer, which is arranged between the heat conductive base layer and the heat dissipation layer.
13. An LED device, characterized in that: include: housing, and The LED module according to any one of claims 1 to 12, wherein the LED module is disposed in the housing.
14. A vehicle, characterized in that: The method comprises the LED module according to any one of claims 1 to 12 or the LED device according to claim 13.